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JP7609107B2 - Circuit board fixing structure - Google Patents

Circuit board fixing structure
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JP7609107B2
JP7609107B2JP2022048960AJP2022048960AJP7609107B2JP 7609107 B2JP7609107 B2JP 7609107B2JP 2022048960 AJP2022048960 AJP 2022048960AJP 2022048960 AJP2022048960 AJP 2022048960AJP 7609107 B2JP7609107 B2JP 7609107B2
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substrate
fixing structure
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positioning
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寛史 柏木
裕二 西尾
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Yokogawa Electric Corp
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Translated fromJapanese

本開示は基板固定構造に関する。This disclosure relates to a substrate fixing structure.

センサと、センサを実装される基板と、基板を固定される被固定部と、基板の第1主面の第1部分を被固定部に固着する固着部と、を有する基板固定構造が知られている。A substrate fixing structure is known that has a sensor, a substrate on which the sensor is mounted, a fixed portion to which the substrate is fixed, and a fixing portion that fixes a first portion of a first main surface of the substrate to the fixed portion.

例えば特許文献1には、センサと、センサを実装される基板と、基板を固定される被固定部と、基板の第1主面の第1部分(中央部分)を被固定部に固着する固着部と、基板の第1主面の第2部分(外周部分)の裏側部分に接する第1表面と第1表面の裏側の第2表面を有する第1弾性部材と、基板の第1主面の第2部分に接する第3表面と第3表面の裏側の第4表面を有する第2弾性部材と、第1主面に垂直な方向において被固定部に対する位置が規制され、第1弾性部材の第2表面に接する規制部と、を有し、被固定部が、第2弾性部材の第4表面に接する、基板固定構造が記載される。このような構成によれば、基板と被固定部の線膨張係数が相違する場合でも、温度変化時に基板の第1主面の第2部分が第1主面に沿う方向に被固定部に対して相対的に変位できるので基板(及び基板上のセンサ関連の回路部品)に生じる応力を抑制でき、もって、センサの測定精度に対する温度変化の影響を抑制できる。For example,Patent Document 1 describes a substrate fixing structure having a sensor, a substrate on which the sensor is mounted, a fixed portion to which the substrate is fixed, a fixing portion that fixes a first portion (central portion) of a first main surface of the substrate to the fixed portion, a first elastic member having a first surface that contacts a rear portion of a second portion (peripheral portion) of the first main surface of the substrate and a second surface on the rear side of the first surface, a second elastic member having a third surface that contacts the second portion of the first main surface of the substrate and a fourth surface on the rear side of the third surface, and a restricting portion whose position with respect to the fixed portion in a direction perpendicular to the first main surface is restricted and which contacts the second surface of the first elastic member, wherein the fixed portion contacts the fourth surface of the second elastic member. With this configuration, even if the linear expansion coefficients of the substrate and the fixed part are different, the second part of the first main surface of the substrate can be displaced relative to the fixed part in a direction along the first main surface when the temperature changes, so stress generated in the substrate (and the sensor-related circuit components on the substrate) can be suppressed, thereby suppressing the effect of temperature changes on the measurement accuracy of the sensor.

特開2006-208078号公報JP 2006-208078 A

しかし、特許文献1に記載されるような構成の基板固定構造は、被固定部への基板の位置決め精度に改善の余地がある。However, the substrate fixing structure described inPatent Document 1 leaves room for improvement in terms of the positioning accuracy of the substrate relative to the fixed portion.

本開示の目的は、被固定部への基板の位置決め精度を改善できる基板固定構造を提供することにある。The objective of this disclosure is to provide a substrate fixing structure that can improve the positioning accuracy of the substrate to the fixed portion.

幾つかの実施形態において、基板固定構造は、センサと、前記センサを実装される基板と、前記基板を固定される被固定部と、前記基板の第1主面の第1部分を前記被固定部に固着する固着部と、前記基板の前記第1主面の第2部分の裏側部分に接する第1表面と第1表面の裏側の第2表面を有する弾性部材と、前記第1主面に垂直な方向において前記被固定部に対する位置が規制され、前記弾性部材の前記第2表面に接する規制部と、を有し、前記被固定部が、前記基板の前記第1主面の前記第2部分に固着されずに接する、基板固定構造である。このような構成によれば、被固定部が基板の第1主面の第2部分に固着されないことにより、基板と被固定部の線膨張係数が相違する場合でも、温度変化時に基板の第1主面の第2部分が第1主面に沿う方向に被固定部に対して相対的に変位できるので基板(及び基板上のセンサ関連の回路部品)に生じる応力を抑制でき、もって、センサの測定精度に対する温度変化の影響を抑制できる。また、被固定部が基板の第1主面の第2部分に接することにより、第1主面に垂直な方向における被固定部への基板の位置決め精度を改善できる。In some embodiments, the substrate fixing structure includes a sensor, a substrate on which the sensor is mounted, a fixed portion to which the substrate is fixed, a fixing portion for fixing a first portion of the first main surface of the substrate to the fixed portion, an elastic member having a first surface in contact with a back portion of the second portion of the first main surface of the substrate and a second surface on the back side of the first surface, and a restricting portion that is in contact with the second surface of the elastic member and whose position relative to the fixed portion in a direction perpendicular to the first main surface is restricted, and the fixed portion is in contact with the second portion of the first main surface of the substrate without being fixed to it. According to this configuration, since the fixed portion is not fixed to the second portion of the first main surface of the substrate, even if the linear expansion coefficients of the substrate and the fixed portion differ, the second portion of the first main surface of the substrate can be displaced relative to the fixed portion in a direction along the first main surface when the temperature changes, so that the stress generated in the substrate (and the sensor-related circuit components on the substrate) can be suppressed, and the effect of temperature changes on the measurement accuracy of the sensor can be suppressed. Furthermore, by having the fixed part contact the second portion of the first main surface of the substrate, the positioning accuracy of the substrate relative to the fixed part in a direction perpendicular to the first main surface can be improved.

一実施形態において、基板固定構造は、前記第1部分が、前記第1主面に沿う第1方向において前記基板の一端部に位置し、前記第2部分が、前記第1方向において前記基板の他端部に位置し、前記センサが、前記第1方向における前記基板の前記一端部と前記他端部との間に位置する、基板固定構造である。このような構成によれば、センサの測定精度に対する温度変化の影響を抑制できる。In one embodiment, the substrate fixing structure is a substrate fixing structure in which the first portion is located at one end of the substrate in a first direction along the first main surface, the second portion is located at the other end of the substrate in the first direction, and the sensor is located between the one end and the other end of the substrate in the first direction. With this configuration, the effect of temperature changes on the measurement accuracy of the sensor can be suppressed.

一実施形態において、基板固定構造は、前記被固定部が、前記基板を前記第1主面に沿う方向に位置決めするように前記基板に接する第1位置決め部を有する、基板固定構造である。このような構成によれば、被固定部への基板の位置決め精度を向上できる。In one embodiment, the substrate fixing structure is a substrate fixing structure in which the fixed portion has a first positioning portion that contacts the substrate so as to position the substrate in a direction along the first main surface. With this configuration, it is possible to improve the positioning accuracy of the substrate to the fixed portion.

一実施形態において、基板固定構造は、前記第1位置決め部が、前記基板を前記第1方向に位置決めする、基板固定構造である。このような構成によれば、被固定部への基板の位置決め精度を向上できる。In one embodiment, the substrate fixing structure is a substrate fixing structure in which the first positioning portion positions the substrate in the first direction. With this configuration, the positioning accuracy of the substrate to the fixed portion can be improved.

一実施形態において、基板固定構造は、前記第1位置決め部が、前記基板の側面に接することで前記基板を位置決めする、基板固定構造である。このような構成によれば、簡単な構造によって被固定部への基板の位置決め精度を向上できる。In one embodiment, the substrate fixing structure is a substrate fixing structure in which the first positioning portion contacts the side surface of the substrate to position the substrate. With this configuration, the positioning accuracy of the substrate to the fixed portion can be improved with a simple structure.

一実施形態において、基板固定構造は、前記第1位置決め部が、前記基板に設けられる穴の側面に接することで前記基板を位置決めする、基板固定構造である。このような構成によれば、簡単な構造によって被固定部への基板の位置決め精度を向上できる。In one embodiment, the substrate fixing structure is a substrate fixing structure in which the first positioning portion contacts the side of a hole provided in the substrate to position the substrate. With this configuration, the positioning accuracy of the substrate to the fixed portion can be improved with a simple structure.

一実施形態において、基板固定構造は、前記被固定部が、前記第1主面に沿い前記第1方向に垂直な第2方向に前記基板を位置決めする第2位置決め部を有する、基板固定構造である。このような構成によれば、被固定部への基板の位置決め精度を向上できる。In one embodiment, the substrate fixing structure is a substrate fixing structure in which the fixed portion has a second positioning portion that positions the substrate in a second direction perpendicular to the first direction along the first main surface. With this configuration, it is possible to improve the positioning accuracy of the substrate to the fixed portion.

一実施形態において、基板固定構造は、前記第2位置決め部が、前記基板の側面に接することで前記基板を位置決めする、基板固定構造である。このような構成によれば、簡単な構造によって被固定部への基板の位置決め精度を向上できる。In one embodiment, the substrate fixing structure is a substrate fixing structure in which the second positioning portion contacts the side surface of the substrate to position the substrate. With this configuration, the positioning accuracy of the substrate to the fixed portion can be improved with a simple structure.

一実施形態において、基板固定構造は、前記第2位置決め部が、前記基板に設けられる前記第1方向に細長い長穴の側面に接することで前記基板を位置決めする、基板固定構造である。このような構成によれば、簡単な構造によって被固定部への基板の位置決め精度を向上できる。In one embodiment, the substrate fixing structure is a substrate fixing structure in which the second positioning portion contacts the side of a long hole that is elongated in the first direction and provided in the substrate, thereby positioning the substrate. With this configuration, the positioning accuracy of the substrate to the fixed portion can be improved with a simple structure.

一実施形態において、基板固定構造は、前記第2位置決め部が、少なくとも前記基板における前記第1方向の前記他端側の部分を位置決めする、基板固定構造である。このような構成によれば、被固定部への基板の位置決め精度を向上できる。In one embodiment, the substrate fixing structure is a substrate fixing structure in which the second positioning portion positions at least the portion of the substrate on the other end side in the first direction. With this configuration, it is possible to improve the positioning accuracy of the substrate to the fixed portion.

一実施形態において、基板固定構造は、前記固着部が、基板と被固定部を締結するボルト又はリベットなどの締結具によって形成される、基板固定構造である。このような構成によれば、固着部を簡単に形成できる。In one embodiment, the substrate fixing structure is a substrate fixing structure in which the fastening portion is formed by a fastener such as a bolt or rivet that fastens the substrate and the fixed portion. With this configuration, the fastening portion can be easily formed.

一実施形態において、基板固定構造は、前記固着部が接着部又は溶着部によって形成される、基板固定構造である。このような構成によれば、固着部を簡単に形成できる。In one embodiment, the substrate fixing structure is a substrate fixing structure in which the fixing portion is formed by an adhesive portion or a welded portion. With this configuration, the fixing portion can be easily formed.

一実施形態において、基板固定構造は、前記第1位置決め部が凸状をなす、基板固定構造である。このような構成によれば、第1位置決め部を簡単に形成できる。In one embodiment, the substrate fixing structure is a substrate fixing structure in which the first positioning portion is convex. With this configuration, the first positioning portion can be easily formed.

一実施形態において、基板固定構造は、前記第2位置決め部が凸状をなす、基板固定構造である。このような構成によれば、第2位置決め部を簡単に形成できる。In one embodiment, the substrate fixing structure is a substrate fixing structure in which the second positioning portion is convex. With this configuration, the second positioning portion can be easily formed.

本開示によれば、被固定部への基板の位置決め精度を改善できる基板固定構造を提供することができる。The present disclosure provides a substrate fixing structure that can improve the positioning accuracy of the substrate relative to the fixed portion.

第1参考例に係る基板固定構造を示す斜視図である。FIG. 1 is a perspective view showing a substrate fixing structure according to a first reference example.第2参考例に係る基板固定構造を示す斜視図である。FIG. 11 is a perspective view showing a substrate fixing structure according to a second reference example.第1実施形態に係る基板固定構造を示す斜視図である。1 is a perspective view showing a substrate fixing structure according to a first embodiment;図3に示す基板固定構造の上面図であり、規制部を省略して示す。4 is a top view of the substrate fixing structure shown in FIG. 3, with the restricting portion omitted.図4のA-A線に沿って示す一部断面側面図であり、規制部も示す。FIG. 5 is a partial cross-sectional side view taken along line AA in FIG. 4, and also shows the restricting portion.第2実施形態に係る基板固定構造を示す斜視図である。FIG. 11 is a perspective view showing a substrate fixing structure according to a second embodiment.

以下、図面を参照して本開示の実施形態を詳細に例示説明する。Embodiments of the present disclosure are described in detail below with reference to the drawings.

実施形態を説明する前に、まず第1参考例について説明する。Before describing the embodiment, we will first describe the first reference example.

図1に示す第1参考例に係る基板固定構造1は、センサ2と、センサ2を実装される基板3と、基板3を固定される被固定部4と、基板3の第1主面3aの第1部分5を被固定部4に固着する第1固着部6aと、基板3の第1主面3aの第2部分7を被固定部4に固着する第2固着部6bと、基板3の第1主面3aの第3部分8を被固定部4に固着する第3固着部6cと、基板3の第1主面3aの第4部分9を被固定部4に固着する第4固着部6dと、を有する。Thesubstrate fixing structure 1 according to the first reference example shown in FIG. 1 includes asensor 2, asubstrate 3 on which thesensor 2 is mounted, afixed portion 4 to which thesubstrate 3 is fixed, afirst fixing portion 6a that fixes afirst portion 5 of the firstmain surface 3a of thesubstrate 3 to thefixed portion 4, asecond fixing portion 6b that fixes asecond portion 7 of the firstmain surface 3a of thesubstrate 3 to thefixed portion 4, athird fixing portion 6c that fixes a third portion 8 of the firstmain surface 3a of thesubstrate 3 to the fixedportion 4, and afourth fixing portion 6d that fixes a fourth portion 9 of the firstmain surface 3a of thesubstrate 3 to thefixed portion 4.

第1部分5と第3部分8は、第1主面3aに沿う第1方向D1において基板3の一端部3bに位置し、第2部分7と第4部分9は、第1方向D1において基板3の他端部3cに位置し、センサ2は、第1方向D1における基板3の一端部3bと他端部3cとの間に位置する。Thefirst portion 5 and the third portion 8 are located at oneend 3b of thesubstrate 3 in the first direction D1 along the firstmain surface 3a, thesecond portion 7 and the fourth portion 9 are located at theother end 3c of thesubstrate 3 in the first direction D1, and thesensor 2 is located between the oneend 3b and theother end 3c of thesubstrate 3 in the first direction D1.

第1部分5と第2部分7は、第1主面3aに沿い第1方向D1に垂直な第2方向D2において基板3の一端部3dに位置し、第3部分8と第4部分9は、第2方向D2において基板3の他端部3eに位置し、センサ2は、第2方向D2における基板3の一端部3dと他端部3eとの間に位置する。Thefirst portion 5 and thesecond portion 7 are located at oneend 3d of thesubstrate 3 in the second direction D2 perpendicular to the first direction D1 along the firstmain surface 3a, the third portion 8 and the fourth portion 9 are located at theother end 3e of thesubstrate 3 in the second direction D2, and thesensor 2 is located between the oneend 3d and theother end 3e of thesubstrate 3 in the second direction D2.

第1固着部6a、第2固着部6b、第3固着部6c及び第4固着部6dはそれぞれ、基板3と被固定部4を締結する締結具10によって形成される。なお、図1は締結具10を締結する前の状態を示す。Thefirst fixing portion 6a, thesecond fixing portion 6b, thethird fixing portion 6c, and thefourth fixing portion 6d are each formed by afastener 10 that fastens thesubstrate 3 and the fixedportion 4. Note that FIG. 1 shows the state before thefastener 10 is fastened.

本参考例の構成によると、基板3と被固定部4の線膨張係数が相違する場合、温度変化時に、第1方向D1における一端部3bと他端部3cとの間で第1方向D1の応力が、また第2方向D2における一端部3dと他端部3eとの間で第2方向D2の応力が、基板3(及び基板3上のセンサ2関連の回路部品)に生じる。このため、温度変化がセンサ2の測定精度に影響し易い。According to the configuration of this reference example, if the linear expansion coefficients of thesubstrate 3 and thefixed portion 4 are different, stress in the first direction D1 occurs between oneend 3b and theother end 3c in the first direction D1, and stress in the second direction D2 occurs between oneend 3d and theother end 3e in the second direction D2 in the substrate 3 (and the circuit components related to thesensor 2 on the substrate 3) during temperature changes. For this reason, temperature changes are likely to affect the measurement accuracy of thesensor 2.

次に、第2参考例について説明する。Next, we will explain the second reference example.

図2に示す第2参考例に係る基板固定構造1は、センサ2と、センサ2を実装される基板3と、基板3を固定される被固定部4と、基板3の第1主面3aの全体を被固定部4に固着し、接着部によって形成される固着部6を有する。Thesubstrate fixing structure 1 according to the second reference example shown in FIG. 2 includes asensor 2, asubstrate 3 on which thesensor 2 is mounted, afixed portion 4 to which thesubstrate 3 is fixed, and afixing portion 6 formed by an adhesive portion that fixes the entire firstmain surface 3a of thesubstrate 3 to thefixed portion 4.

本参考例の構成によると、基板3と被固定部4の線膨張係数が相違する場合、温度変化時に、第1主面3aに沿う方向の応力が、第1主面3aのほぼ全体に亘って基板3(及び基板3上のセンサ2関連の回路部品)に生じる。このため、温度変化がセンサ2の測定精度に影響し易い。In the configuration of this reference example, if the linear expansion coefficients of thesubstrate 3 and thefixed portion 4 are different, stress in the direction along the firstmain surface 3a occurs in the substrate 3 (and the circuit components related to thesensor 2 on the substrate 3) over almost the entire firstmain surface 3a when the temperature changes. For this reason, temperature changes are likely to affect the measurement accuracy of thesensor 2.

第1参考例と第2参考例に比較し、後述する本開示の実施形態に係る基板固定構造1によれば、センサ2の測定精度に対する温度変化の影響を抑制できる。また、本開示の実施形態に係る基板固定構造1によれば、被固定部4への基板3の良好な位置決め精度も実現できる。Compared to the first and second reference examples, thesubstrate fixing structure 1 according to the embodiment of the present disclosure described below can suppress the effect of temperature changes on the measurement accuracy of thesensor 2. Furthermore, thesubstrate fixing structure 1 according to the embodiment of the present disclosure can also achieve good positioning accuracy of thesubstrate 3 to the fixedportion 4.

本開示の一実施形態として、まず第1実施形態について説明する。As an embodiment of the present disclosure, we will first describe the first embodiment.

図3~図5に示す第1実施形態に係る基板固定構造1は、センサ2と、センサ2を実装される基板3と、基板3を固定される被固定部4と、基板3の第1主面3aの第1部分5を被固定部4に固着する固着部6と、基板3の第1主面3aの第2部分7の裏側部分11に接する第1表面12aと第1表面12aの裏側の第2表面12bを有する弾性部材12と、第1主面3aに垂直な方向において被固定部4に対する位置が規制され、弾性部材12の第2表面12bに接する規制部13と、を有する。また被固定部4は、基板3の第1主面3aの第2部分7に固着されずに接する。Thesubstrate fixing structure 1 according to the first embodiment shown in Figures 3 to 5 includes asensor 2, asubstrate 3 on which thesensor 2 is mounted, afixed portion 4 to which thesubstrate 3 is fixed, afixing portion 6 that fixes afirst portion 5 of the firstmain surface 3a of thesubstrate 3 to thefixed portion 4, anelastic member 12 having afirst surface 12a that contacts aback portion 11 of thesecond portion 7 of the firstmain surface 3a of thesubstrate 3 and asecond surface 12b on the back side of thefirst surface 12a, and a restrictingportion 13 that is restricted in position relative to the fixedportion 4 in a direction perpendicular to the firstmain surface 3a and contacts thesecond surface 12b of theelastic member 12. Thefixed portion 4 contacts thesecond portion 7 of the firstmain surface 3a of thesubstrate 3 without being fixed thereto.

第1部分5は、第1主面3aに沿う第1方向D1において基板3の一端部3bに位置し、第2部分7は、第1方向D1において基板3の他端部3cに位置し、センサ2は、第1方向D1における基板3の一端部3bと他端部3cとの間に位置する。Thefirst portion 5 is located at oneend 3b of thesubstrate 3 in the first direction D1 along the firstmain surface 3a, thesecond portion 7 is located at theother end 3c of thesubstrate 3 in the first direction D1, and thesensor 2 is located between the oneend 3b and theother end 3c of thesubstrate 3 in the first direction D1.

固着部6は、基板3と被固定部4を締結する締結具10によって形成される。締結具10は、図示するようにボルトであってもよいし、リベットなどであってもよい。なお、図3は締結具10を締結する前の状態を示す。固着部6は、締結具10に限らず、接着部又は溶着部などによって形成してもよい。Thefixing portion 6 is formed by afastener 10 that fastens thesubstrate 3 and the fixedportion 4. Thefastener 10 may be a bolt as shown in the figure, or may be a rivet, etc. Note that FIG. 3 shows the state before thefastener 10 is fastened. Thefixing portion 6 is not limited to being formed by thefastener 10, and may be formed by an adhesive part, a welded part, etc.

被固定部4は、基板3を第1主面3aに沿う方向に位置決めするように基板3に接する第1位置決め部14を有する。第1位置決め部14は、基板3を第1方向D1に位置決めする。より具体的には、第1位置決め部14は、基板3の側面3fに接することで基板3を位置決めする。第1位置決め部14は凸状をなす。第1位置決め部14は単一の凸部で形成してもよいし、複数の凸部で形成してもよいし、凸部の形状は適宜設定できる。The fixedportion 4 has afirst positioning portion 14 that contacts thesubstrate 3 so as to position thesubstrate 3 in a direction along the firstmain surface 3a. Thefirst positioning portion 14 positions thesubstrate 3 in the first direction D1. More specifically, thefirst positioning portion 14 positions thesubstrate 3 by contacting theside surface 3f of thesubstrate 3. Thefirst positioning portion 14 is convex. Thefirst positioning portion 14 may be formed of a single convex portion or multiple convex portions, and the shape of the convex portions can be set as appropriate.

被固定部4は、第1主面3aに沿い第1方向D1に垂直な第2方向D2に基板3を位置決めする第2位置決め部15を有する。第2位置決め部15は、基板3の側面3fに接することで基板3を位置決めする。第2位置決め部15は、少なくとも基板3における第1方向D1の他端側の部分を位置決めする。第2位置決め部15は凸状をなす。第2位置決め部15は単一の凸部で形成してもよいし、複数の凸部で形成してもよいし、凸部の形状は適宜設定できる。The fixedportion 4 has asecond positioning portion 15 that positions thesubstrate 3 in a second direction D2 perpendicular to the first direction D1 along the firstmain surface 3a. Thesecond positioning portion 15 positions thesubstrate 3 by contacting theside surface 3f of thesubstrate 3. Thesecond positioning portion 15 positions at least the portion of thesubstrate 3 on the other end side in the first direction D1. Thesecond positioning portion 15 is convex. Thesecond positioning portion 15 may be formed of a single convex portion or multiple convex portions, and the shape of the convex portions can be set as appropriate.

基板3は、第1方向D1の幅と第2方向D2の幅が何れも第1主面3aに垂直な方向の幅よりも大きい板状をなす。換言すれば、基板3は、第1主面3aとその反対側の第2主面3gがその他の面よりも大きい板状をなす。なお、説明の便宜上、第1主面3aに垂直な方向を上下方向ともいい、第1主面3aから第2主面3gに向かう側を上側ともいい、その反対側を下側ともいう。Thesubstrate 3 is in the form of a plate in which the width in the first direction D1 and the width in the second direction D2 are both greater than the width in the direction perpendicular to the firstmain surface 3a. In other words, thesubstrate 3 is in the form of a plate in which the firstmain surface 3a and the secondmain surface 3g on the opposite side are greater than the other surfaces. For ease of explanation, the direction perpendicular to the firstmain surface 3a is also referred to as the up-down direction, the side from the firstmain surface 3a toward the secondmain surface 3g is also referred to as the upper side, and the opposite side is also referred to as the lower side.

基板3は、第1方向D1に沿って延びる2つの側面3fと、第2方向D2に沿って延びる2つの側面3fと、を有する。つまり、基板3は、上面視で矩形状をなす矩形板状をなす。なお、基板3は矩形板状に限らず、例えば円板状などに構成してもよい。Thesubstrate 3 has twoside surfaces 3f extending along the first direction D1 and twoside surfaces 3f extending along the second direction D2. In other words, thesubstrate 3 has a rectangular plate shape that is rectangular when viewed from above. Note that thesubstrate 3 is not limited to a rectangular plate shape, and may be configured, for example, in a disk shape.

基板3は平板状をなし、被固定部4は、平面状の第1主面3aに沿うように平面状をなす被固定面4aを有する。被固定面4aは、基板3の第1主面3aの第1部分5と第2部分7に接する。なお、基板3は平板状に限らず、例えば上側又は下側に突出する球面状又は円柱面状などの曲面状板状に構成してもよく、この場合、被固定面4aの形状は基板3の形状に合わせて適宜設定できる。Thesubstrate 3 is flat, and the fixedportion 4 has a flat fixedsurface 4a that is aligned with the flat firstmain surface 3a. The fixedsurface 4a contacts thefirst portion 5 and thesecond portion 7 of the firstmain surface 3a of thesubstrate 3. Thesubstrate 3 is not limited to being flat, and may be configured as a curved plate, such as a spherical or cylindrical surface that protrudes upward or downward. In this case, the shape of the fixedsurface 4a can be appropriately set to match the shape of thesubstrate 3.

弾性部材12は、例えばゴム又はエラストマーなどによって形成される。弾性部材12の形状は、基板3の第1主面3aの第2部分7の裏側部分11に接する第1表面12a(下面)と第1表面12aの裏側の第2表面12b(上面)を有する範囲で適宜設定でき、図示するような板状に限らない。組み立て性を考慮し、弾性部材12を基板3と規制部13の何れか一方に固着することが好ましい。なお、弾性部材12を基板3と規制部13の何れにも固着しない構成としてもよいし、弾性部材12を基板3と規制部13の両方に固着する構成としてもよい。Theelastic member 12 is formed of, for example, rubber or elastomer. The shape of theelastic member 12 can be set appropriately within the range of having afirst surface 12a (lower surface) that contacts theback side portion 11 of thesecond portion 7 of the firstmain surface 3a of thesubstrate 3 and asecond surface 12b (upper surface) on the back side of thefirst surface 12a, and is not limited to a plate shape as shown in the figure. In consideration of ease of assembly, it is preferable to fix theelastic member 12 to either thesubstrate 3 or the regulatingportion 13. Note that theelastic member 12 may be configured not to be fixed to either thesubstrate 3 or the regulatingportion 13, or may be configured to be fixed to both thesubstrate 3 and the regulatingportion 13.

本実施形態では、規制部13が、第1主面3aに垂直な方向において被固定部4に対する位置が規制され、弾性部材12の第2表面12bに接し、弾性部材12の第1表面12aが、基板3の第1主面3aの第2部分7の裏側部分11に接し、被固定部4が、基板3の第1主面3aの第2部分7に固着されずに接する。In this embodiment, the position of the regulatingportion 13 relative to the fixedportion 4 in a direction perpendicular to the firstmain surface 3a is regulated, the regulatingportion 13 contacts thesecond surface 12b of theelastic member 12, thefirst surface 12a of theelastic member 12 contacts theback portion 11 of thesecond portion 7 of the firstmain surface 3a of thesubstrate 3, and the fixedportion 4 contacts thesecond portion 7 of the firstmain surface 3a of thesubstrate 3 without being fixed thereto.

したがって本実施形態によれば、基板3の第1主面3aの第2部分7を、第1主面3aに垂直な方向において、被固定部4の被固定面4aに接する位置に精度良く位置決めできる。またこの状態で、基板3の第1主面3aの第2部分7は被固定部4の被固定面4aに対して相対的に第1方向D1に容易に変位できるため、本実施形態によれば、基板3と被固定部4の線膨張係数が相違する場合でも、温度変化時に基板3(及び基板3上のセンサ2関連の回路部品)に生じる応力を抑制でき、もって、センサ2の測定精度に対する温度変化の影響を抑制できる。Therefore, according to this embodiment, thesecond portion 7 of the firstmain surface 3a of thesubstrate 3 can be accurately positioned at a position where it contacts the fixedsurface 4a of thefixed part 4 in a direction perpendicular to the firstmain surface 3a. Furthermore, in this state, thesecond portion 7 of the firstmain surface 3a of thesubstrate 3 can be easily displaced in the first direction D1 relative to the fixedsurface 4a of thefixed part 4. Therefore, according to this embodiment, even if the linear expansion coefficients of thesubstrate 3 and thefixed part 4 are different, the stress generated in the substrate 3 (and the circuit components related to thesensor 2 on the substrate 3) during temperature changes can be suppressed, and the effect of temperature changes on the measurement accuracy of thesensor 2 can be suppressed.

また本実施形態では第1位置決め部14と第2位置決め部15により、被固定部4への基板3の位置決め精度を向上できる。In addition, in this embodiment, thefirst positioning portion 14 and thesecond positioning portion 15 can improve the positioning accuracy of thesubstrate 3 relative to the fixedportion 4.

なお規制部13は、被固定部4を形成する部材と一体に設けてもよいし、別体に設けて組み付けてもよい。規制部13によって弾性部材12を基板3に押し付ける押し付け力の大きさは、位置決め精度と測定精度のバランスを考慮して適宜設定できる。押し付け力をゼロに設定してもよい。The restrictingportion 13 may be provided integrally with the member forming the fixedportion 4, or may be provided separately and then assembled. The magnitude of the pressing force with which the restrictingportion 13 presses theelastic member 12 against thesubstrate 3 can be set appropriately, taking into consideration the balance between positioning accuracy and measurement accuracy. The pressing force may be set to zero.

次に、第2実施形態について説明する。Next, we will explain the second embodiment.

図6に示す第2実施形態に係る基板固定構造1は、第1位置決め部14と第2位置決め部15の構成が第1実施形態の場合とは異なり、その他の構成は第1実施形態の場合と同様である。なお、図6は締結具10を締結する前の状態を示す。Thesubstrate fixing structure 1 according to the second embodiment shown in FIG. 6 differs from the first embodiment in the configuration of thefirst positioning portion 14 and thesecond positioning portion 15, but the other configurations are the same as those of the first embodiment. Note that FIG. 6 shows the state before thefastener 10 is fastened.

本実施形態では、第1位置決め部14は、基板3に設けられる穴3hの側面に接することで基板3を第1方向D1に位置決めする。穴3hは基板3を上下方向に貫通する底面視円形の貫通穴からなり、第1位置決め部14は穴3hに挿入される上面視円形の凸状をなす。なお、穴3hは貫通穴に限らず、凹状をなす構成としてもよく、穴3hの形状は底面視円形に限らない。また、第1位置決め部14の形状は上面視円形に限らず、適宜設定できる。In this embodiment, thefirst positioning portion 14 positions thesubstrate 3 in the first direction D1 by contacting the side of ahole 3h provided in thesubstrate 3. Thehole 3h is a through hole that is circular when viewed from the bottom and penetrates thesubstrate 3 in the vertical direction, and thefirst positioning portion 14 has a circular convex shape when viewed from the top and is inserted into thehole 3h. Note that thehole 3h is not limited to being a through hole, but may be configured to have a concave shape, and the shape of thehole 3h is not limited to being circular when viewed from the bottom. Furthermore, the shape of thefirst positioning portion 14 is not limited to being circular when viewed from the top, and can be set as appropriate.

本実施形態では、第2位置決め部15は、基板3に設けられる第1方向D1に細長い長穴3iの側面に接することで基板3を第2方向D2に位置決めする。長穴3iは基板3を上下方向に貫通する貫通穴からなり、第1位置決め部14は穴に挿入される上面視円形の凸状をなす。なお、長穴3iは貫通穴に限らず、凹状をなす構成としてもよい。第1位置決め部14の形状は上面視円形に限らず、適宜設定できる。第2位置決め部15は、基板3における第1方向D1の他端側の部分を位置決めする。In this embodiment, thesecond positioning portion 15 positions thesubstrate 3 in the second direction D2 by contacting the side of a long andnarrow slot 3i in the first direction D1 provided in thesubstrate 3. Theslot 3i is a through hole that penetrates thesubstrate 3 in the vertical direction, and thefirst positioning portion 14 has a circular convex shape when viewed from above and is inserted into the hole. Note that theslot 3i is not limited to a through hole, and may be configured to have a concave shape. The shape of thefirst positioning portion 14 is not limited to a circular shape when viewed from above, and can be set as appropriate. Thesecond positioning portion 15 positions the other end side of thesubstrate 3 in the first direction D1.

本実施形態によれば、第1実施形態の場合と同様に、センサ2の測定精度に対する温度変化の影響を抑制でき、被固定部4への基板3の良好な位置決め精度も実現できる。According to this embodiment, as in the first embodiment, the effect of temperature changes on the measurement accuracy of thesensor 2 can be suppressed, and good positioning accuracy of thesubstrate 3 to the fixedportion 4 can be achieved.

本開示は前述した実施形態に限定されず、その要旨を逸脱しない範囲で種々変更可能である。This disclosure is not limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present disclosure.

したがって、前述した実施形態に係る基板固定構造1は、センサ2と、センサ2を実装される基板3と、基板3を固定される被固定部4と、基板3の第1主面3aの第1部分5を被固定部4に固着する固着部6と、基板3の第1主面3aの第2部分7の裏側部分11に接する第1表面12aと第1表面12aの裏側の第2表面12bを有する弾性部材12と、第1主面3aに垂直な方向において被固定部4に対する位置が規制され、弾性部材12の第2表面12bに接する規制部13と、を有し、被固定部4が、基板3の第1主面3aの第2部分7に固着されずに接する、基板固定構造1である限り、種々変更可能である。Therefore, thesubstrate fixing structure 1 according to the embodiment described above can be modified in various ways as long as it is asubstrate fixing structure 1 that includes asensor 2, asubstrate 3 on which thesensor 2 is mounted, a fixedportion 4 to which thesubstrate 3 is fixed, a fixingportion 6 that fixes afirst portion 5 of the firstmain surface 3a of thesubstrate 3 to the fixedportion 4, anelastic member 12 having afirst surface 12a that contacts aback portion 11 of thesecond portion 7 of the firstmain surface 3a of thesubstrate 3 and asecond surface 12b on the back side of thefirst surface 12a, and a restrictingportion 13 that is restricted in position relative to the fixedportion 4 in a direction perpendicular to the firstmain surface 3a and contacts thesecond surface 12b of theelastic member 12, and the fixedportion 4 is in contact with thesecond portion 7 of the firstmain surface 3a of thesubstrate 3 without being fixed thereto.

例えば、被固定部4に第1位置決め部14と第2位置決め部15の何れか一方又は両方を設けない構成としてもよい。基板3上のセンサ2の配置は適宜設定できる。For example, the fixedportion 4 may be configured without either or both of thefirst positioning portion 14 and thesecond positioning portion 15. The arrangement of thesensor 2 on thesubstrate 3 can be set as appropriate.

なお、前述した実施形態に係る基板固定構造1は、第1部分5が、第1主面3aに沿う第1方向D1において基板3の一端部3bに位置し、第2部分7が、第1方向D1において基板3の他端部3cに位置し、センサ2が、第1方向D1における基板3の一端部3bと他端部3cとの間に位置する、基板固定構造1であることが好ましい。Thesubstrate fixing structure 1 according to the above-described embodiment is preferably asubstrate fixing structure 1 in which thefirst portion 5 is located at oneend 3b of thesubstrate 3 in the first direction D1 along the firstmain surface 3a, thesecond portion 7 is located at theother end 3c of thesubstrate 3 in the first direction D1, and thesensor 2 is located between the oneend 3b and theother end 3c of thesubstrate 3 in the first direction D1.

前述した実施形態に係る基板固定構造1は、被固定部4が、基板3を第1主面3aに沿う方向に位置決めするように基板3に接する第1位置決め部14を有する、基板固定構造1であることが好ましい。Thesubstrate fixing structure 1 according to the above-described embodiment is preferably asubstrate fixing structure 1 in which the fixedportion 4 has afirst positioning portion 14 that contacts thesubstrate 3 so as to position thesubstrate 3 in a direction along the firstmain surface 3a.

前述した実施形態に係る基板固定構造1は、第1位置決め部14が、基板3を第1方向D1に位置決めする、基板固定構造1であることが好ましい。Thesubstrate fixing structure 1 according to the above-described embodiment is preferably asubstrate fixing structure 1 in which thefirst positioning portion 14 positions thesubstrate 3 in the first direction D1.

前述した実施形態に係る基板固定構造1は、第1位置決め部14が、基板3の側面3fに接することで基板3を位置決めする、基板固定構造1であることが好ましい。Thesubstrate fixing structure 1 according to the above-described embodiment is preferably asubstrate fixing structure 1 in which thefirst positioning portion 14 positions thesubstrate 3 by contacting theside surface 3f of thesubstrate 3.

前述した実施形態に係る基板固定構造1は、第1位置決め部14が、基板3に設けられる穴3hの側面に接することで基板3を位置決めする、基板固定構造1であることが好ましい。Thesubstrate fixing structure 1 according to the above-described embodiment is preferably asubstrate fixing structure 1 in which thefirst positioning portion 14 positions thesubstrate 3 by contacting the side of thehole 3h provided in thesubstrate 3.

前述した実施形態に係る基板固定構造1は、被固定部4が、第1主面3aに沿い第1方向D1に垂直な第2方向D2に基板3を位置決めする第2位置決め部15を有する、基板固定構造1であることが好ましい。Thesubstrate fixing structure 1 according to the above-described embodiment is preferably asubstrate fixing structure 1 in which the fixedportion 4 has asecond positioning portion 15 that positions thesubstrate 3 in a second direction D2 perpendicular to the first direction D1 along the firstmain surface 3a.

前述した実施形態に係る基板固定構造1は、第2位置決め部15が、基板3の側面3fに接することで基板3を位置決めする、基板固定構造1であることが好ましい。Thesubstrate fixing structure 1 according to the above-described embodiment is preferably asubstrate fixing structure 1 in which thesecond positioning portion 15 positions thesubstrate 3 by contacting theside surface 3f of thesubstrate 3.

前述した実施形態に係る基板固定構造1は、第2位置決め部15が、基板3に設けられる第1方向D1に細長い長穴3iの側面に接することで基板3を位置決めする、基板固定構造1であることが好ましい。Thesubstrate fixing structure 1 according to the above-described embodiment is preferably asubstrate fixing structure 1 in which thesecond positioning portion 15 positions thesubstrate 3 by contacting the side of anelongated hole 3i in the first direction D1 provided in thesubstrate 3.

前述した実施形態に係る基板固定構造1は、第2位置決め部15が、少なくとも基板3における第1方向D1の他端側の部分を位置決めする、基板固定構造1であることが好ましい。Thesubstrate fixing structure 1 according to the above-described embodiment is preferably asubstrate fixing structure 1 in which thesecond positioning portion 15 positions at least the portion of thesubstrate 3 on the other end side in the first direction D1.

前述した実施形態に係る基板固定構造1は、固着部6が、基板3と被固定部4を締結するボルト又はリベットなどの締結具10によって形成される、基板固定構造1であることが好ましい。Thesubstrate fixing structure 1 according to the above-mentioned embodiment is preferably asubstrate fixing structure 1 in which the fixingportion 6 is formed by afastener 10 such as a bolt or rivet that fastens thesubstrate 3 and the fixedportion 4.

前述した実施形態に係る基板固定構造1は、固着部6が接着部又は溶着部によって形成される、基板固定構造1であることが好ましい。Thesubstrate fixing structure 1 according to the above-mentioned embodiment is preferably asubstrate fixing structure 1 in which the fixingportion 6 is formed by an adhesive portion or a welded portion.

前述した実施形態に係る基板固定構造1は、第1位置決め部14が凸状をなす、基板固定構造1であることが好ましい。Thesubstrate fixing structure 1 according to the above-mentioned embodiment is preferably asubstrate fixing structure 1 in which thefirst positioning portion 14 is convex.

前述した実施形態に係る基板固定構造1は、第2位置決め部15が凸状をなす、基板固定構造1であることが好ましい。Thesubstrate fixing structure 1 according to the above-mentioned embodiment is preferably asubstrate fixing structure 1 in which thesecond positioning portion 15 is convex.

1 基板固定構造
2 センサ
3 基板
3a 第1主面
3b 第1方向の一端部
3c 第1方向の他端部
3d 第2方向の一端部
3e 第2方向の他端部
3f 側面
3g 第2主面
3h 穴
3i 長穴
4 被固定部
4a 被固定面
5 第1部分
6 固着部
6a 第1固着部
6b 第2固着部
6c 第3固着部
6d 第4固着部
7 第2部分
8 第3部分
9 第4部分
10 締結具
11 裏側部分
12 弾性部材
12a 第1表面
12b 第2表面
13 規制部
14 第1位置決め部
15 第2位置決め部
D1 第1方向
D2 第2方向
REFERENCE SIGNSLIST 1Substrate fixing structure 2Sensor 3Substrate 3a Firstmain surface 3b One end in thefirst direction 3c Other end in thefirst direction 3d One end in thesecond direction 3e Other end in thesecond direction 3fSide surface 3g Secondmain surface 3hHole 3i Slottedhole 4Fixed portion 4a Fixedsurface 5First portion 6Fixing portion 6aFirst fixing portion 6bSecond fixing portion 6cThird fixing portion 6dFourth fixing portion 7 Second portion 8 Third portion 9Fourth portion 10Fastener 11Back portion 12Elastic member12a First surface12b Second surface 13 Restrictingportion 14First positioning portion 15 Second positioning portion D1 First direction D2 Second direction

Claims (9)

Translated fromJapanese
センサと、
前記センサを実装される基板と、
前記基板を固定される被固定部と、
前記基板の第1主面の第1部分を前記被固定部に固着する固着部と、
前記基板の前記第1主面の第2部分の裏側部分に接する第1表面と第1表面の裏側の第2表面を有する弾性部材と、
前記第1主面に垂直な方向において前記被固定部に対する位置が規制され、前記弾性部材の前記第2表面に接する規制部と、を有し、
前記被固定部が、前記基板の前記第1主面の前記第2部分に固着されずに接し、
前記第1部分が、前記第1主面に沿う第1方向において前記基板の一端部に位置し、
前記第2部分が、前記第1方向において前記基板の他端部に位置し、
前記センサが、前記第1方向における前記基板の前記一端部と前記他端部との間に位置する、基板固定構造。
A sensor;
A substrate on which the sensor is mounted;
A fixed portion to which the substrate is fixed;
a fixing portion that fixes a first portion of the first main surface of the substrate to the fixed portion;
an elastic member having a first surface in contact with a back portion of the second portion of the first main surface of the substrate and a second surface on the back side of the first surface;
a restricting portion whose position with respect to the fixed portion is restricted in a direction perpendicular to the first main surface and which contacts the second surface of the elastic member;
the fixed portion isin contact with the second portion of the first main surface of the substrate without being fixed thereto;
the first portion is located at one end of the substrate in a first direction along the first main surface,
the second portion is located at the other end of the substrate in the first direction,
A substrate fixing structure, wherein the sensor is located between the one end and the other end of the substrate in the first direction .
前記被固定部が、前記基板を前記第1主面に沿う方向に位置決めするように前記基板に接する第1位置決め部を有する、請求項に記載の基板固定構造。 The substrate fixing structure according to claim1 , wherein the fixed portion has a first positioning portion that contacts the substrate so as to position the substrate in a direction along the first main surface. 前記第1位置決め部が、前記基板を前記第1方向に位置決めする、請求項に記載の基板固定構造。 The substrate fixing structure according to claim2 , wherein the first positioning portion positions the substrate in the first direction. 前記第1位置決め部が、前記基板の側面に接することで前記基板3を位置決めする、請求項に記載の基板固定構造。 The substrate fixing structure according to claim3 , wherein the first positioning portion positions the substrate by contacting a side surface of the substrate. 前記第1位置決め部が、前記基板に設けられる穴の側面に接することで前記基板3を位置決めする、請求項に記載の基板固定構造。 The substrate fixing structure according to claim3 , wherein the first positioning portion positions the substrate by contacting a side surface of a hole provided in the substrate. 前記被固定部が、前記第1主面に沿い前記第1方向に垂直な第2方向に前記基板を位置決めする第2位置決め部を有する、請求項に記載の基板固定構造。 The substrate fixing structure according to claim3 , wherein the fixed portion has a second positioning portion that positions the substrate in a second direction perpendicular to the first direction along the first main surface. 前記第2位置決め部が、少なくとも前記基板における前記第1方向の前記他端側の部分を位置決めする、請求項に記載の基板固定構造。 The substrate fixing structure according to claim6 , wherein the second positioning portion positions at least a portion of the substrate on the other end side in the first direction. 前記第2位置決め部が、前記基板の側面に接することで前記基板を位置決めする、請求項に記載の基板固定構造。 The substrate fixing structure according to claim6 , wherein the second positioning portion positions the substrate by contacting a side surface of the substrate. 前記第2位置決め部が、前記基板に設けられる前記第1方向に細長い長穴の側面に接することで前記基板を位置決めする、請求項に記載の基板固定構造。 The substrate fixing structure according to claim6 , wherein the second positioning portion positions the substrate by contacting a side surface of a slot that is elongated in the first direction and is provided in the substrate.
JP2022048960A2022-03-242022-03-24 Circuit board fixing structureActiveJP7609107B2 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP2006208078A (en)2005-01-262006-08-10Matsushita Electric Ind Co Ltd Gas sensor
JP2014240675A (en)2013-06-112014-12-25トヨタ自動車株式会社Structure for fastening control board to metallic case of on-vehicle power control unit
JP2015023087A (en)2013-07-172015-02-02三菱電機株式会社Substrate fixing structure
JP2019204930A (en)2018-05-252019-11-28株式会社SokenElectrical machine
JP2021132131A (en)2020-02-202021-09-09株式会社デンソーElectronic device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP2006208078A (en)2005-01-262006-08-10Matsushita Electric Ind Co Ltd Gas sensor
JP2014240675A (en)2013-06-112014-12-25トヨタ自動車株式会社Structure for fastening control board to metallic case of on-vehicle power control unit
JP2015023087A (en)2013-07-172015-02-02三菱電機株式会社Substrate fixing structure
JP2019204930A (en)2018-05-252019-11-28株式会社SokenElectrical machine
JP2021132131A (en)2020-02-202021-09-09株式会社デンソーElectronic device

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