JP5662064B2

Movatterモバイル変換

Info

Publication number: JP5662064B2
Application number: JP2010144369A
Authority: JP
Inventors: 真也小田; 田中　健一郎; 健一郎田中
Original assignee: Panasonic Intellectual Property Management Co Ltd
Current assignee: Panasonic Intellectual Property Management Co Ltd
Priority date: 2010-06-25
Filing date: 2010-06-25
Publication date: 2015-01-28
Anticipated expiration: 2030-06-25
Also published as: JP2012009633A

Description

Translated fromJapanese

本発明は、発光素子から出射する光の波長を変換する蛍光体を含有する光変換部材を備えた発光装置に関する。 The present invention relates to a light emitting device including a light conversion member containing a phosphor that converts the wavelength of light emitted from a light emitting element.

発光ダイオード（ＬＥＤ）は、低電力で高輝度の発光が可能であり、表示等や照明器具等の様々な電気機器の光源として使用されている。近年では、赤色ＬＥＤ及び緑色ＬＥＤに加えて、青色ＬＥＤが実用化され、これらＲＧＢ３色のＬＥＤを組み合わせたり、ＬＥＤと、ＬＥＤから出射する光の波長を変換する蛍光体と組み合わせることで、様々な光色を発光することができるようになった。 Light emitting diodes (LEDs) can emit light with high power and high luminance, and are used as light sources for various electric devices such as displays and lighting equipment. In recent years, in addition to red LEDs and green LEDs, blue LEDs have been put into practical use. By combining these RGB three-color LEDs, or combining LEDs with phosphors that convert the wavelength of light emitted from the LEDs, there are various types of LEDs. Light color can be emitted.

また、青色ＬＥＤの光を蛍光体に当てて黄色の光を出力し、青色光と黄色光とを混色させて白色光を作り出す発光装置が知られている。この種の白色光を発光する発光装置においては、青色ＬＥＤを封止するためのシリコーン樹脂等の樹脂材料に蛍光体が混錬されており、ＬＥＤから発する青色光の波長を変換する際に、蛍光体は励起されて発熱する。しかし、蛍光体は、周囲温度が高くなるに従って変換効率が低下することが知られている。そのため、蛍光体が長期間又は高出力の光に曝されると、発光装置の発光効率が低下するだけなく、発光波長が変化し、光色の色合いが変化してしまう虞がある。特に、近年では、ＬＥＤを用いた発光装置が、照明器具用光源として利用され、発光装置の高出力化が進んでおり、蛍光体に対する負荷も大きくなっている。そのため、蛍光体の周囲の温度上昇を抑制することが、発光装置の信頼性を確保する上で必要である。 There is also known a light emitting device that emits yellow light by applying light from a blue LED to a phosphor and generates white light by mixing blue light and yellow light. In a light emitting device that emits this type of white light, a phosphor is kneaded in a resin material such as a silicone resin for sealing a blue LED, and when converting the wavelength of blue light emitted from the LED, The phosphor is excited and generates heat. However, it is known that the conversion efficiency of the phosphor decreases as the ambient temperature increases. Therefore, when the phosphor is exposed to light of a long period or high output, not only the light emission efficiency of the light emitting device is lowered, but also the light emission wavelength is changed, and the light color may be changed. In particular, in recent years, light emitting devices using LEDs have been used as light sources for lighting fixtures, and the output of light emitting devices has been increasing, and the load on the phosphor has also increased. For this reason, it is necessary to suppress the temperature rise around the phosphor in order to ensure the reliability of the light emitting device.

そこで、封止樹脂中に酸化アルミニウム皮膜又は窒化アルミニウム皮膜で被膜されたアルミニウム粉末を充填することにより、樹脂の熱放散性を向上させた樹脂封止半導体装置が知られている（例えば、特許文献１参照）。また、蛍光体が混練されている光変換部材に、冷媒を還流させるための流路を有する放熱部材を設けた発光装置が知られている（例えば、特許文献２参照）。 Therefore, a resin-encapsulated semiconductor device is known in which the heat dissipation of the resin is improved by filling the encapsulating resin with aluminum powder coated with an aluminum oxide film or an aluminum nitride film (for example, Patent Documents). 1). In addition, a light-emitting device is known in which a heat-dissipating member having a flow path for circulating a refrigerant is provided on a light conversion member in which a phosphor is kneaded (see, for example, Patent Document 2).

特開平２−１５６５５５号公報Japanese Patent Laid-Open No. 2-156555特開２００５−２９４１８５号公報JP 2005-294185 A

しかしながら、上記特許文献１には、蛍光体から封止樹脂に伝わった熱を、装置外へ放熱するための経路が示されていない。封止樹脂に伝わった熱が、封止樹脂から、空気中又は実装基板等の部材に効率的に伝達されなければ、封止樹脂内に熱が篭ってしまい、蛍光体の変換効率を低下させることになる。また、上記特許文献２に記載の発光装置は、放熱部材の構造が複雑になるので、装置の高コスト化の原因となり、また、例えば、流路に気泡等が混入すると、発光素子からの光の利用効率を低下させる虞がある。 However,Patent Document 1 does not show a path for radiating heat transferred from the phosphor to the sealing resin to the outside of the apparatus. If the heat transferred to the sealing resin is not efficiently transferred from the sealing resin to the air or a member such as a mounting substrate, the heat is transferred into the sealing resin, thereby reducing the conversion efficiency of the phosphor. It will be. In addition, since the structure of the heat dissipation member is complicated in the light emitting device described inPatent Document 2, the cost of the device increases. For example, if bubbles or the like are mixed in the flow path, the light from the light emitting element is emitted. There is a risk of lowering the use efficiency.

本発明は、上記課題に鑑みてなされたものであり、蛍光体の熱を、簡易な構成で、効率的に放熱することができる発光装置を提供することを目的とする。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a light-emitting device that can efficiently dissipate heat of a phosphor with a simple configuration.

上記課題を解決するため、本発明に係る発光装置は、発光素子と、前記発光素子が実装される基板と、前記発光素子から出射する光の波長を変換する蛍光体を含有する光変換部材と、を備えた発光装置であって、前記発光素子の近傍に配置され、放熱性及び絶縁性を有する金属又は金属粉を含有する樹脂から形成される絶縁性放熱部材と、前記絶縁性放熱部材と接し、放熱性を有する金属又は金属粉を含有する樹脂から形成される金属含有放熱部材と、を有し、前記絶縁性放熱部材及び金属含有放熱部材の両方が前記光変換部材及び前記基板と接していることを特徴とする。In order to solve the above-described problems, a light-emitting device according to the present invention includes a light-emitting element,a substrate on which the light-emitting element is mounted, and a light conversion member that includes a phosphor that converts the wavelength of light emitted from the light-emitting element. An insulating heat radiating member that is disposed in the vicinity of the light emitting element and is formed from a resin having a heat radiating property and an insulating property or a metal powder, and the insulating heat radiating member. A metal-containing heat dissipation member formed from a resin containing metal or metal powder having heat dissipation properties, andboth the insulating heat dissipation member and the metal-containing heat dissipation memberare in contact with the light conversion memberand the substrate. It is characterized by.

また、前記絶縁性放熱部材は、前記発光素子の側面に接していることが望ましい。 Moreover, it is desirable that the insulating heat dissipation member is in contact with a side surface of the light emitting element.

好ましくは、前記発光素子は、前記基板に形成された凹部に実装され、前記発光素子と前記凹部との間に前記絶縁性放熱部材が配置されている。Preferably, the light emitting element is mounted in a recess formed inthe substrate, the insulating heat dissipating member between said light emitting element and the recess is disposed.

また、前記凹部は、前記発光素子からの光が入射する面が光反射性を有することが望ましい。 Moreover, as for the said recessed part, it is desirable for the surface into which the light from the said light emitting element injects has light reflectivity.

前記発光素子は、複数個が基板上に実装されていてもよい。 A plurality of the light emitting elements may be mounted on a substrate.

本発明によれば、光変換部材に含有される蛍光体の熱が、絶縁性放熱部材及び金属含有放熱部材の両方といった複数の伝達経路を介して伝達されるので、簡易な構成で、効率的に放熱することができる。According to the present invention, since the phosphor of the heat contained in the light conversion member is transmitted via a plurality of transmission paths, such asboth insulating heat dissipation member and the metal-containing heat radiating member, a simple configuration, efficiency Heat can be released.

（ａ）は本発明の第１の実施形態に係る発光装置の一部分解斜視図、（ｂ）は同発光装置の側断面図。(A) is a partial exploded perspective view of the light-emitting device concerning the 1st Embodiment of this invention, (b) is a sectional side view of the light-emitting device.（ａ）は本発明の第２の実施形態に係る発光装置の一部分解斜視図、（ｂ）は同発光装置の側断面図。(A) is a partial exploded perspective view of the light-emitting device concerning the 2nd Embodiment of this invention, (b) is a sectional side view of the light-emitting device.（ａ）は本発明の第３の実施形態に係る発光装置の一部分解斜視図、（ｂ）は同発光装置の側断面図。(A) is a partial exploded perspective view of the light-emitting device concerning the 3rd Embodiment of this invention, (b) is a sectional side view of the light-emitting device.

本発明の第１の実施形態に係る発光装置について、図１（ａ）（ｂ）を参照して説明する。本実施形態の発光装置１は、実装基板２上に実装された発光素子３と、この発光素子３から出射する光の波長を変換する蛍光体を含有する光変換部材４と、を備える。発光素子３の近傍には、放熱性及び絶縁性を有する金属又は金属粉を含有する樹脂から形成される絶縁性放熱部材５が配置される。また、放熱性を有する金属又は金属粉を含有する樹脂から形成される金属含有放熱部材６が、絶縁性放熱部材５の外周と接するように配置される。 A light emitting device according to a first embodiment of the present invention will be described with reference to FIGS. Thelight emitting device 1 of this embodiment includes alight emitting element 3 mounted on amounting substrate 2 and alight conversion member 4 containing a phosphor that converts the wavelength of light emitted from thelight emitting element 3. In the vicinity of thelight emitting element 3, an insulatingheat radiating member 5 formed from a resin containing metal or metal powder having heat radiating properties and insulating properties is disposed. Further, the metal-containingheat radiating member 6 formed of a metal having heat radiating property or a resin containing metal powder is disposed so as to be in contact with the outer periphery of the insulatingheat radiating member 5.

絶縁性放熱部材５は、発光素子３の側面に接していることが望ましい。また、絶縁性放熱部材５及び金属含有放熱部材６は、いずれか一方が光変換部材４と接していればよいが、それらの上面が同一平面となるように形成され、絶縁性放熱部材５及び金属含有放熱部材６の両方が光変換部材４と接していることが望ましい。なお、光変換部材４は、絶縁性放熱部材５及び金属含有放熱部材６だけでなく、発光素子３とも接するように配置されることが望ましい。 The insulatingheat dissipation member 5 is preferably in contact with the side surface of thelight emitting element 3. Further, any one of the insulatingheat radiating member 5 and the metal-containingheat radiating member 6 may be in contact with thelight conversion member 4, but the upper surfaces thereof are formed in the same plane, and the insulatingheat radiating member 5 and It is desirable that both of the metal-containingheat dissipation members 6 are in contact with thelight conversion member 4. Thelight conversion member 4 is preferably disposed so as to be in contact with thelight emitting element 3 as well as the insulatingheat radiating member 5 and the metal-containingheat radiating member 6.

実装基板２は、電気絶縁性を有し、且つ熱伝導率の高い基板であり、例えば、酸化アルミニウム（Ａｌ_２Ｏ_３）や窒化アルミニウム（ＡｌＮ）等の金属酸化物（セラミックスを含む）、金属窒化物、又は金属、樹脂等の材料から構成される。実装基板２の一表面には、金（Ａｕ）又は銀（Ａｇ）等の導電性金属から成る配線パターン２１が設けられ、この配線パターン２１が発光素子３と電気的に接続される。配線パターン２１の一端側には、Ａｕ、半田等の金属材料から成るバンプ（不図示）を介して接合される素子端子部（不図示）が形成され、他端側に外部接続用端子部２１ａが形成される（図１（ａ）参照）。なお、図１（ｂ）は配線パターン２１の図示を省略している。配線パターン２１は、素子端子部及び外部接続用端子部２１ａを除き、絶縁層によって覆われている。外部接続用端子部２１ａは、発光装置１の平面視において、絶縁性放熱部材５及び金属含有放熱部材６よりも外側の実装基板２上に配置される。なお、実装基板２中にビアホールを形成し、このビアホールに導電性金属等から成る配線を挿通させることにより、実装基板２表面ではなく、実装基板２裏面に配線パターン２１を設けてもよい（不図示）。Themounting substrate 2 is a substrate having electrical insulation and high thermal conductivity. For example, metal oxides (including ceramics) such as aluminum oxide (Al₂ O₃ ) and aluminum nitride (AlN), metal It is made of a material such as nitride, metal, or resin. Awiring pattern 21 made of a conductive metal such as gold (Au) or silver (Ag) is provided on one surface of themounting substrate 2, and thewiring pattern 21 is electrically connected to thelight emitting element 3. An element terminal portion (not shown) to be joined via a bump (not shown) made of a metal material such as Au or solder is formed on one end side of thewiring pattern 21, and an externalconnection terminal portion 21a is formed on the other end side. Is formed (see FIG. 1A). In FIG. 1B, thewiring pattern 21 is not shown. Thewiring pattern 21 is covered with an insulating layer except for the element terminal portion and the externalconnection terminal portion 21a. The externalconnection terminal portion 21 a is disposed on themounting substrate 2 outside the insulatingheat radiating member 5 and the metal-containingheat radiating member 6 in the plan view of thelight emitting device 1. Note that awiring pattern 21 may be provided not on the surface of themounting substrate 2 but on the back surface of themounting substrate 2 by forming a via hole in themounting substrate 2 and inserting a wiring made of a conductive metal or the like into the via hole. (Illustrated).

発光素子３は、光変換部材４へ光を出射することにより、発光装置１として所望の光色の発光を可能とする光源であれば特に限定されないが、好ましくは、青色光を放射するＧａＮ系青色ＬＥＤチップが用いられる。本実施形態においては、発光素子３として矩形板状のチップを示すが、発光素子３の形状はこれに限られず、発光装置１の用途等に応じたものが用いられる。発光素子３は、具体構成として、ｐ形窒化物半導体層、発光層及びｎ形窒化物半導体層の積層構造から成る発光部と、ｎ形窒化物半導体層に電気的に接続されたカソード電極と、ｐ形窒化物半導体層に電気的に接続されたアノード電極とを備える。カソード電極及びアノード電極は、素子の下面側に形成され、これらカソード電極及びアノード電極がバンプを介して配線パターン２１の素子端子部に接合されることにより、発光素子３は実装基板２に実装される。なお、ここでは、発光素子３の実装方法として、フェイスダウン式の発光素子３をフリップチップ実装する例を示したが、発光素子３はフェイスアップ式のチップであってもよく、この場合、例えば、ダイスボンドとワイヤを用いて接続する方法等が用いられる。 Thelight emitting element 3 is not particularly limited as long as thelight emitting device 1 can emit light of a desired light color by emitting light to thelight converting member 4, but preferably a GaN-based material that emits blue light. A blue LED chip is used. In the present embodiment, a rectangular plate-like chip is shown as thelight emitting element 3, but the shape of thelight emitting element 3 is not limited to this, and alight emitting device 1 according to the application of thelight emitting device 1 or the like is used. As a specific configuration, the light-emitting element 3 includes a p-type nitride semiconductor layer, a light-emitting portion having a stacked structure of a light-emitting layer and an n-type nitride semiconductor layer, a cathode electrode electrically connected to the n-type nitride semiconductor layer, And an anode electrode electrically connected to the p-type nitride semiconductor layer. The cathode electrode and the anode electrode are formed on the lower surface side of the element, and thelight emitting element 3 is mounted on themounting substrate 2 by bonding the cathode electrode and the anode electrode to the element terminal portion of thewiring pattern 21 via the bump. The Here, as an example of the mounting method of thelight emitting element 3, the face-down typelight emitting element 3 is flip-chip mounted. However, thelight emitting element 3 may be a face-up type chip. A method of connecting with a die bond and a wire is used.

光変換部材４は、シリコーン樹脂、エポキシ樹脂又はアクリル樹脂等の透光性を有する樹脂材料に蛍光体を混練させ、この蛍光体含有樹脂材料をシート状に形成された部材であり、発光素子３上に配置される。また、光変換部材４は、発光素子３上に上記樹脂材料を、例えば、印刷、インクジェット、ボッティング等の塗布方法により塗布することによって形成されてもよい。なお、樹脂材料には、熱伝導率を上げるために、フィラーを含有させてもよい。 Thelight conversion member 4 is a member in which a phosphor is kneaded with a translucent resin material such as a silicone resin, an epoxy resin, or an acrylic resin, and the phosphor-containing resin material is formed into a sheet shape. Placed on top. Thelight conversion member 4 may be formed by applying the resin material on thelight emitting element 3 by an application method such as printing, ink jetting, or botting. The resin material may contain a filler in order to increase the thermal conductivity.

蛍光体には、発光装置１に求められる演色性等の発光性能、及び発光素子３の発光波長等の発光特性に応じた種類のものが用いられ、所定の含有濃度となるよう樹脂材料に混練される。例えば、発光素子３がＧａＮ系青色ＬＥＤチップである場合、黄色蛍光体として汎用されるＹＡＧ系蛍光体が樹脂材料に混練され、所定形状の光変換部材４が作成される。なお、光変換部材４は、蛍光体の含有濃度を、例えば、発光素子３の近傍側ほど漸次濃くなるように形成されてもよい。また、蛍光体の含有濃度が異なる複数の樹脂層を積層させてもよい。更に、絶縁性放熱部材５の近傍の蛍光体の含有濃度が濃くなるようにしてもよく、こうすれば、波長変換時に生じる熱を効率的に絶縁性放熱部材５に伝達することができる。 As the fluorescent material, a fluorescent material of a kind corresponding to light emitting performance such as color rendering required for thelight emitting device 1 and light emitting characteristics such as the light emitting wavelength of thelight emitting element 3 is used, and kneaded into a resin material so as to have a predetermined concentration. Is done. For example, when thelight emitting element 3 is a GaN blue LED chip, a YAG phosphor widely used as a yellow phosphor is kneaded with a resin material, and thelight conversion member 4 having a predetermined shape is created. In addition, thelight conversion member 4 may be formed so that the concentration of the phosphor is gradually increased toward thelight emitting element 3, for example. Moreover, you may laminate | stack the several resin layer from which the content density | concentration of fluorescent substance differs. Furthermore, the phosphor concentration in the vicinity of the insulatingheat radiating member 5 may be increased, whereby heat generated during wavelength conversion can be efficiently transferred to the insulatingheat radiating member 5.

絶縁性放熱部材５は、例えば、酸化アルミニウム（Ａｌ_２Ｏ_３）、窒化アルミニウム（ＡｌＮ）又は酸化チタン（ＴｉＯ_２）等の絶縁性を有する金属酸化物又は金属窒化物等の粒状材料を、シリコーン樹脂、エポキシ樹脂等の樹脂材料に含有させて作成される。なお、樹脂に含有される粒状材料又は粉状材料は、光反射性の高い材料が好ましい。こうすれば、発光素子３から出射された光を光変換部材４側へ反射することができるので、絶縁性放熱部材５に吸収又は拡散等して損失する光が少なくなり、光利用効率が向上する。The insulatingheat dissipation member 5 is made of, for example, a granular material such as metal oxide or metal nitride having insulation properties such as aluminum oxide (Al₂ O₃ ), aluminum nitride (AlN), or titanium oxide (TiO₂ ). It is made to contain in resin materials, such as resin and an epoxy resin. The granular material or powdery material contained in the resin is preferably a highly light reflective material. By so doing, the light emitted from thelight emitting element 3 can be reflected to thelight conversion member 4 side, so that light lost by absorption or diffusion to the insulatingheat radiating member 5 is reduced, and light utilization efficiency is improved. To do.

絶縁性放熱部材５は、予め発光素子３を実装基板２上に実装すると共に、発光素子３との間に隙間をあけて金属含有放熱部材６を配置しておき、発光素子３と金属含有放熱部材６との隙間に、上述の樹脂材料をポッティングすることにより配置される。また、金属酸化物等を含有させた樹脂材料から成るペーストを、スクリーン印刷を用いて塗布することにより、絶縁性放熱部材５を発光素子３上に配置してもよい。更に、絶縁性放熱部材５の形状を、その内周側面が発光素子３の外周側面に適合するように形成しておき、形成された絶縁性放熱部材５を発光素子３の外周に嵌め込んでもよい。 The insulatingheat dissipating member 5 has thelight emitting element 3 mounted on the mountingsubstrate 2 in advance, and the metal-containingheat dissipating member 6 is disposed with a gap between the light emittingelement 3 and thelight emitting element 3 and the metal-containing heat dissipating member. It arrange | positions by potting the above-mentioned resin material in the clearance gap between themembers 6. FIG. Alternatively, the insulatingheat radiating member 5 may be disposed on thelight emitting element 3 by applying a paste made of a resin material containing a metal oxide or the like using screen printing. Furthermore, even if the shape of the insulatingheat radiating member 5 is formed so that the inner peripheral side surface thereof matches the outer peripheral side surface of thelight emitting element 3 and the formed insulatingheat radiating member 5 is fitted on the outer periphery of thelight emitting element 3. Good.

金属含有放熱部材６は、例えば、アルミニウム（Ａｌ）や銀（Ａｇ）等の金属又はＡｌやＡｇの金属粒子を、シリコーン樹脂、エポキシ樹脂又はアクリル樹脂等の樹脂材料に含有させて作成される。金属含有放熱部材６は、その内周面と発光素子３との間に隙間ができる形状となるように形成され、実装基板２上に配置される。また、予め発光素子３の外周側面に適合するように形成された絶縁性放熱部材５を実装基板２上に配置し、絶縁性放熱部材５の外周に、スクリーン印刷を用いてペースト状の金属粒子が混入された樹脂を塗布してもよい。 The metal-containingheat radiating member 6 is made by, for example, containing a metal such as aluminum (Al) or silver (Ag) or metal particles of Al or Ag in a resin material such as a silicone resin, an epoxy resin, or an acrylic resin. The metal-containingheat radiating member 6 is formed so as to have a gap between the inner peripheral surface and thelight emitting element 3, and is disposed on the mountingsubstrate 2. Further, an insulatingheat radiating member 5 formed in advance so as to conform to the outer peripheral side surface of thelight emitting element 3 is arranged on the mountingsubstrate 2, and paste-like metal particles are formed on the outer periphery of the insulatingheat radiating member 5 using screen printing. A resin mixed with may be applied.

この発光装置１においては、発光素子３から出射する光の波長が、蛍光体を含有する光変換部材４によって変換され、波長を変換された光が光変換部材４から出射される。このとき、光変換部材４に含まれる蛍光体は、励起されて発熱する。この熱は、光変換部材４と接する絶縁性放熱部材５又は金属含有放熱部材６に伝達される。また、絶縁性放熱部材５又は金属含有放熱部材６のうちの一方の放熱部材に伝達された熱は、他方の放熱部材に熱を伝達され、それらの熱は実装基板２へ伝達される。 In thelight emitting device 1, the wavelength of the light emitted from thelight emitting element 3 is converted by thelight conversion member 4 containing a phosphor, and the light whose wavelength is converted is emitted from thelight conversion member 4. At this time, the phosphor contained in thelight conversion member 4 is excited and generates heat. This heat is transmitted to the insulatingheat radiating member 5 or the metal-containingheat radiating member 6 in contact with thelight conversion member 4. The heat transmitted to one of the insulatingheat radiating member 5 or the metal-containingheat radiating member 6 is transmitted to the other heat radiating member, and the heat is transmitted to the mountingsubstrate 2.

ここで、光変換部材４が、絶縁性放熱部材５及び金属含有放熱部材６の両方並びに発光素子３に接する構成における熱の伝達経路について説明する。光変換部材４のうち、発光素子３の発光面に面する箇所は、蛍光体の励起に伴い、最も温度が高くなる。この箇所で発生した熱は、発光素子３に伝達され、更に、発光素子３から実装基板２に伝達される。また、発光素子３の発光面に面する箇所で発生した熱は、光変換部材４の外側へ放射状に広がると共に、絶縁性放熱部材５に伝達され、この熱は、直接的に実装基板２に、又は絶縁性放熱部材５の外周と接する金属含有放熱部材６を介して実装基板２に伝達される。また、光変換部材４から金属含有放熱部材６に伝達された熱は、直接的に実装基板２に、又は絶縁性放熱部材５を介して実装基板２に伝達される。金属含有放熱部材６に伝達された熱は、空気中へも放熱される。 Here, the heat transfer path in the configuration in which thelight conversion member 4 is in contact with both the insulatingheat radiating member 5 and the metal-containingheat radiating member 6 and thelight emitting element 3 will be described. The portion of thelight conversion member 4 that faces the light emitting surface of thelight emitting element 3 has the highest temperature as the phosphor is excited. The heat generated at this point is transmitted to thelight emitting element 3 and further transmitted from thelight emitting element 3 to the mountingsubstrate 2. Further, the heat generated at the location facing the light emitting surface of thelight emitting element 3 spreads radially to the outside of thelight conversion member 4 and is transmitted to the insulatingheat radiating member 5, and this heat is directly applied to the mountingsubstrate 2. Or, it is transmitted to the mountingsubstrate 2 through the metal-containingheat radiating member 6 in contact with the outer periphery of the insulatingheat radiating member 5. Further, the heat transmitted from thelight conversion member 4 to the metal-containingheat dissipation member 6 is directly transmitted to the mountingsubstrate 2 or via the insulatingheat dissipation member 5 to the mountingsubstrate 2. The heat transmitted to the metal-containingheat radiating member 6 is also radiated into the air.

このように、絶縁性放熱部材５及び金属含有放熱部材６の２種類の放熱部材を備えたことにより、光変換部材４で発生した熱が、複数の伝達経路を介して伝達されるので、光変換部材４の熱が効率的に放熱される。従って、本実施形態の発光装置１によれば、光変換部材４に含まれる蛍光体の熱を、簡易な構成で、効率的に放熱することができ、光変換部材４の温度上昇を防ぐと共に、蛍光体の発光効率の低下を抑制することができる。 As described above, by providing two types of heat radiating members, the insulatingheat radiating member 5 and the metal-containingheat radiating member 6, heat generated in thelight conversion member 4 is transmitted through a plurality of transmission paths. The heat of theconversion member 4 is efficiently radiated. Therefore, according to thelight emitting device 1 of the present embodiment, the heat of the phosphor included in thelight conversion member 4 can be efficiently radiated with a simple configuration, and the temperature increase of thelight conversion member 4 is prevented. The decrease in the luminous efficiency of the phosphor can be suppressed.

また、発光素子３の近傍に絶縁性放熱部材５が配置されているので、金属含有放熱部材６と発光素子３との間の絶縁性を確保することができる。更に、発光素子３と金属含有放熱部材６との間に、樹脂材料から成る絶縁性放熱部材５が配置され、この絶縁性放熱部材５が緩衝材として機能するので、発光装置１の寸法安定性を向上させることができる。また、金属含有放熱部材６に、ＡｌやＡｇのような光反射率の高い金属材料を用いることにより、絶縁性放熱部材５を透過して金属含有放熱部材６に入射した光を光変換部材４側へ反射することができるので、光利用効率を向上させることができる。 Moreover, since the insulatingheat radiating member 5 is disposed in the vicinity of thelight emitting element 3, the insulation between the metal-containingheat radiating member 6 and thelight emitting element 3 can be ensured. Further, an insulatingheat radiating member 5 made of a resin material is disposed between the light emittingelement 3 and the metal-containingheat radiating member 6, and this insulatingheat radiating member 5 functions as a buffer material. Can be improved. Further, by using a metal material having a high light reflectance such as Al or Ag for the metal-containingheat radiating member 6, the light that has passed through the insulatingheat radiating member 5 and entered the metal-containingheat radiating member 6 is converted into thelight conversion member 4. Since the light can be reflected to the side, the light utilization efficiency can be improved.

また、金属含有放熱部材６の熱伝導性が、絶縁性放熱部材５の熱伝導性よりも高くなるように、絶縁性放熱部材５及び金属含有放熱部材６に含有される金属材料等の種類及び濃度、樹脂の組成等が調整されていてもよい。こうすれば、光変換部材４の熱がより効率的に絶縁性放熱部材５から金属含有放熱部材６へ伝達されるので、放熱性能を向上させることができる。また、発光素子３の近傍に配置される絶縁性放熱部材５の温度上昇を抑制できるので、発光素子３で発生した熱も効率的に放熱することができる。更に、発光装置１の正面視における金属含有放熱部材６及び光変換部材４の形状が、略同形状となるよう、それらが形成されることが望ましい。こうすれば、金属含有放熱部材６上に光変換部材４を配置して固定することにより、発光装置１のパッケージングが容易となる。 Further, the types of metal materials and the like contained in the insulatingheat radiating member 5 and the metal-containingheat radiating member 6 so that the heat conductivity of the metal-containingheat radiating member 6 is higher than the heat conductivity of the insulatingheat radiating member 5 and The concentration, resin composition, and the like may be adjusted. By so doing, the heat of thelight conversion member 4 is more efficiently transferred from the insulatingheat radiating member 5 to the metal-containingheat radiating member 6, so that the heat radiating performance can be improved. Moreover, since the temperature rise of the insulatingheat radiating member 5 arrange | positioned in the vicinity of thelight emitting element 3 can be suppressed, the heat which generate | occur | produced in thelight emitting element 3 can also be thermally radiated efficiently. Furthermore, it is desirable that the metal-containingheat dissipation member 6 and thelight conversion member 4 in the front view of thelight emitting device 1 are formed so as to have substantially the same shape. If it carries out like this, the packaging of the light-emittingdevice 1 will become easy by arrange | positioning and fixing thelight conversion member 4 on the metal containingheat radiating member 6. FIG.

次に、本実施形態の第２の実施形態に係る発光装置について、図２（ａ）（ｂ）を参照して説明する。本実施形態に係る発光装置１は、発光素子３が、実装基板２に形成された凹部２２に実装され、発光素子３と凹部２２との間に絶縁性放熱部材５が配置されているものである。本実施形態においては、凹部２２が形成された実装基板２が、上記第１の実施形態における金属含有放熱部材６として機能する。 Next, a light emitting device according to a second embodiment of the present embodiment will be described with reference to FIGS. In thelight emitting device 1 according to the present embodiment, thelight emitting element 3 is mounted in therecess 22 formed in the mountingsubstrate 2, and the insulatingheat dissipation member 5 is disposed between the light emittingelement 3 and therecess 22. is there. In the present embodiment, the mountingsubstrate 2 in which therecesses 22 are formed functions as the metal-containingheat dissipation member 6 in the first embodiment.

本実施形態の実装基板２は、発光素子３の厚みを収容できる凹部２２、発光素子３が実装される実装面２３及び配線パターン２１の形成することができるだけの厚みを有する。凹部２２は、光出射方向に形成される開口部２４が広く、実装面２３へ向けて狭くなるように形成されたテーパ状の傾斜面２５を有する。また、凹部２２は、実装面２３上に発光素子３を実装したときの発光素子３の上面の高さと、実装基板２の上面の高さとがほぼ等しくなるように形成される。これにより、発光素子３と凹部２２との間に絶縁性放熱部材５が配置（充填）され、発光素子３上に光変換部材４が配置されたときに、発光素子３、絶縁性放熱部材５及び実装基板２の上面が光変換部材４と接する。 The mountingsubstrate 2 of the present embodiment has a thickness that can form therecess 22 that can accommodate the thickness of thelight emitting element 3, the mountingsurface 23 on which thelight emitting element 3 is mounted, and thewiring pattern 21. Therecess 22 has a taperedinclined surface 25 formed so that theopening 24 formed in the light emitting direction is wide and narrows toward the mountingsurface 23. Therecess 22 is formed such that the height of the upper surface of thelight emitting element 3 when thelight emitting element 3 is mounted on the mountingsurface 23 is substantially equal to the height of the upper surface of the mountingsubstrate 2. Thereby, when the insulatingheat radiating member 5 is disposed (filled) between the light emittingelement 3 and therecess 22, and thelight conversion member 4 is disposed on thelight emitting element 3, thelight emitting element 3 and the insulatingheat radiating member 5 are disposed. And the upper surface of the mountingsubstrate 2 is in contact with thelight conversion member 4.

また、本実施形態においては、凹部２２が形成された基板２を、金属含有放熱部材６として機能させるため、実装基板２には金属製又は金属を分散した絶縁材料から成る基板が用いられ、発光素子３の実装面２３には絶縁層２６が設けられる。なお、非金属製の基板を用いる場合、この基板に上述した凹部２２と略同形状の凹部を形成し、この凹部に金属材料から成る碗状部材を嵌め込む、又は非金属製の基板に形成された凹部に金属材料をコーティングすることにより、これらを金属含有放熱部材６として機能させてもよい。また、金属材料として、ＡｌやＡｇのような光反射率の高い材料を用いることにより、凹部２２の発光素子３からの光が入射する面が、光反射性を有するように構成することができる。こうすれば、凹部２２の傾斜面２５が、絶縁性放熱部材５を透過して傾斜面２５に入射した光を光変換部材４側へ反射する反射部材として機能するので、光利用効率を向上させることができる。 Further, in the present embodiment, in order to cause thesubstrate 2 in which therecess 22 is formed to function as the metal-containingheat radiating member 6, a substrate made of an insulating material made of metal or metal is used for the mountingsubstrate 2 to emit light. An insulatinglayer 26 is provided on the mountingsurface 23 of theelement 3. When a non-metallic substrate is used, a concave portion having substantially the same shape as theconcave portion 22 described above is formed in the substrate, and a hook-shaped member made of a metal material is fitted into the concave portion, or formed on the non-metallic substrate. These may be made to function as the metal-containingheat radiating member 6 by coating the recessed portions with a metal material. Further, by using a material having a high light reflectance such as Al or Ag as the metal material, the surface on which the light from thelight emitting element 3 of therecess 22 is incident can be configured to have light reflectivity. . By so doing, theinclined surface 25 of therecess 22 functions as a reflecting member that reflects the light that has passed through the insulatingheat radiating member 5 and entered theinclined surface 25 toward thelight conversion member 4, thereby improving light utilization efficiency. be able to.

実装面２３には、発光素子３のカソード電極及びアノード電極に対応する位置に、ビアホール２７が形成され、また、実装基板２の裏面側に配線パターン２１を敷くための配線路２８が形成される（図２（ｂ）参照）。これらビアホール２７及び配線路２８には、実装面２３と同様に、絶縁層２６が被覆され、絶縁層２６で被覆されたビアホール２７及び配線路２８に配線パターン２１が施される。このように、配線パターン２１を立体的に設けることにより、発光装置１の小型化を実現することができる。 A viahole 27 is formed on the mountingsurface 23 at a position corresponding to the cathode electrode and the anode electrode of thelight emitting element 3, and awiring path 28 for laying thewiring pattern 21 on the back surface side of the mountingsubstrate 2 is formed. (See FIG. 2 (b)). Similar to the mountingsurface 23, the via holes 27 and thewiring paths 28 are covered with an insulatinglayer 26, and thewiring patterns 21 are applied to the via holes 27 and thewiring paths 28 covered with the insulatinglayer 26. In this manner, thelight emitting device 1 can be reduced in size by providing thewiring patterns 21 three-dimensionally.

このように、金属製の実装基板２を加工して凹部２２を形成する、又は非金属製の実装基板２に形成された凹部２２を金属材料で加工することにより、実質的に金属含有放熱部材６を容易に形成することができる。また、発光素子３と凹部２２との間に樹脂材料を充填することにより、絶縁性放熱部材５を容易に形成することができる。更に、凹部２２を形成した実装基板２上に光変換部材４を配置して固定することにより、発光装置１のパッケージングも容易となる。従って、本実施形態の発光装置１によれば、蛍光体の発光効率の低下を抑制することができるだけでなく、発光装置１の製造効率を向上させることができると共に、製造コストを低減することができる。 In this way, themetal mounting board 2 is processed to form therecesses 22, or therecesses 22 formed on thenonmetal mounting board 2 are processed with a metal material, thereby substantially including a metal-containing heat dissipation member. 6 can be formed easily. Insulatingheat dissipation member 5 can be easily formed by filling a resin material between light emittingelement 3 andrecess 22. Furthermore, by arranging and fixing thelight conversion member 4 on the mountingsubstrate 2 in which therecesses 22 are formed, thelight emitting device 1 can be easily packaged. Therefore, according to thelight emitting device 1 of the present embodiment, not only can the decrease in the luminous efficiency of the phosphor be suppressed, but also the manufacturing efficiency of thelight emitting device 1 can be improved and the manufacturing cost can be reduced. it can.

次に、本実施形態の第３の実施形態に係る発光装置について、図３（ａ）（ｂ）を参照して説明する。本実施形態に係る発光装置１は、発光素子３が、その複数個が基板上に実装されているものである。また、各発光素子３の側面には、個別に絶縁性放熱部材５が配置され、夫々の絶縁性放熱部材５の外周をカバーするように、金属含有放熱部材６が配置されている。なお、図例では、４個の発光素子３が実装されている構成を示しているが、発光素子３の個数は、発光装置１のパッケージサイズ及び所用出力等に応じて適宜に選択される。また、配線パターン２１も、発光素子３の個数、及び実装位置に応じた適宜のパターンに形成される。 Next, a light emitting device according to a third embodiment of the present embodiment will be described with reference to FIGS. In thelight emitting device 1 according to this embodiment, a plurality oflight emitting elements 3 are mounted on a substrate. Further, the insulatingheat radiating members 5 are individually disposed on the side surfaces of the respectivelight emitting elements 3, and the metal-containingheat radiating members 6 are disposed so as to cover the outer circumferences of the respective insulatingheat radiating members 5. In the example shown in the figure, four light-emittingelements 3 are mounted. However, the number of light-emittingelements 3 is appropriately selected according to the package size and required output of the light-emittingdevice 1. Thewiring pattern 21 is also formed in an appropriate pattern according to the number oflight emitting elements 3 and the mounting position.

光変換部材４は、図示したように、金属含有放熱部材６に対応する一部材であってもよいし、各発光素子３に対応する複数の部材であってもよい。なお、光変換部材４を一部材とすれば、複数の発光素子３から出射された光が、光変換部材４内で混光されるので、光変換部材４の出射面から面一な発光が可能となる。 As illustrated, thelight conversion member 4 may be a single member corresponding to the metal-containingheat dissipation member 6, or may be a plurality of members corresponding to the respectivelight emitting elements 3. If thelight conversion member 4 is a single member, the light emitted from the plurality oflight emitting elements 3 is mixed in thelight conversion member 4, so that the light emission from thelight conversion member 4 is flush with the light emission surface. It becomes possible.

本実施形態の発光装置１によれば、複数個の発光素子３を実装させることにより、発光装置１の用途等に応じた高出力化が可能になる。また、光変換部材４の蛍光体が高出力の光に曝されても、各発光素子３の側面に配置された絶縁性放熱部材５及び金属含有放熱部材６によって効率的に放熱されるので、光変換部材４の温度上昇を防ぐと共に、蛍光体の発光効率の低下を抑制することができる。 According to thelight emitting device 1 of the present embodiment, by mounting a plurality oflight emitting elements 3, it becomes possible to increase the output according to the use of thelight emitting device 1. Further, even if the phosphor of thelight conversion member 4 is exposed to high output light, it is efficiently radiated by the insulatingheat radiating member 5 and the metal-containingheat radiating member 6 disposed on the side surface of each light emittingelement 3, While preventing the temperature rise of thelight conversion member 4, the fall of the luminous efficiency of fluorescent substance can be suppressed.

なお、本発明は、上記実施形態に限らず、種々の変形が可能である。例えば、実装基板２に複数の凹部２２を形成し、各凹部２２に発光素子３を実装する共に、夫々の凹部２２と発光素子３との間に、絶縁性放熱部材５を配置してもよい。 In addition, this invention is not restricted to the said embodiment, A various deformation | transformation is possible. For example, a plurality ofrecesses 22 may be formed in the mountingsubstrate 2, and thelight emitting element 3 may be mounted in eachrecess 22, and the insulatingheat dissipation member 5 may be disposed between eachrecess 22 and thelight emitting element 3. .

１発光素子
２実装基板（基板）
２２凹部
３発光素子
４光変換部材
５絶縁性放熱部材
６金属含有放熱部材1 Light-EmittingElement 2 Mounting Board (Board)
22 recessedpart 3light emitting element 4light conversion member 5 insulatingheat radiating member 6 metal containing heat radiating member

Claims

Translated fromJapanese

発光素子と、前記発光素子が実装される基板と、前記発光素子から出射する光の波長を変換する蛍光体を含有する光変換部材と、を備えた発光装置であって、
前記発光素子の近傍に配置され、放熱性及び絶縁性を有する金属又は金属粉を含有する樹脂から形成される絶縁性放熱部材と、
前記絶縁性放熱部材と接し、放熱性を有する金属又は金属粉を含有する樹脂から形成される金属含有放熱部材と、を有し、
前記絶縁性放熱部材及び金属含有放熱部材の両方が前記光変換部材及び前記基板と接していることを特徴とする発光装置。A light emitting devicecomprising: a light emitting element; a substrate on which the light emitting element is mounted ; and a light conversion member containing a phosphor that converts a wavelength of light emitted from the light emitting element.
An insulating heat dissipating member which is disposed in the vicinity of the light emitting element and is formed from a resin containing metal or metal powder having heat dissipation and insulation;
A metal-containing heat dissipation member formed from a resin containing metal or metal powder having heat dissipation properties in contact with the insulating heat dissipation member;
Both the insulating heat radiating member and the metal-containing heat radiating memberare in contact with the light conversion memberand the substrate .

前記絶縁性放熱部材は、前記発光素子の側面に接していることを特徴とする請求項１に記載の発光装置。 The light-emitting device according to claim 1, wherein the insulating heat dissipation member is in contact with a side surface of the light-emitting element.

前記発光素子は、前記基板に形成された凹部に実装され、前記発光素子と前記凹部との間に前記絶縁性放熱部材が配置されていることを特徴とする請求項１又は請求項２に記載の発光装置。The said light emitting element is mounted in the recessed part formed in thesaid board| substrate, The said insulating heat radiating member is arrange | positioned between the said light emitting element and the said recessed part, The Claim 1 or Claim 2 characterized by the above-mentioned. Light-emitting device.

前記凹部は、前記発光素子からの光が入射する面が光反射性を有することを特徴とする請求項３に記載の発光装置。 The light-emitting device according to claim 3, wherein a surface of the concave portion on which light from the light-emitting element is incident has light reflectivity.

前記発光素子は、複数個が基板上に実装されていることを特徴とする請求項１乃至請求項４のいずれか一項に記載の発光装置。 The light emitting device according to any one of claims 1 to 4, wherein a plurality of the light emitting elements are mounted on a substrate.