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JP3053535B2 - Pressurizing and heating equipment for glass substrates for liquid crystal display panels - Google Patents

Pressurizing and heating equipment for glass substrates for liquid crystal display panels

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Publication number
JP3053535B2
JP3053535B2JP6275251AJP27525194AJP3053535B2JP 3053535 B2JP3053535 B2JP 3053535B2JP 6275251 AJP6275251 AJP 6275251AJP 27525194 AJP27525194 AJP 27525194AJP 3053535 B2JP3053535 B2JP 3053535B2
Authority
JP
Japan
Prior art keywords
glass substrates
fixed
surface plate
pressurizing
liquid crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP6275251A
Other languages
Japanese (ja)
Other versions
JPH08136937A (en
Inventor
清男 片桐
一郎 石坂
忠与 大野田
利夫 関川
一栄 内山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Engineering Co Ltd
Original Assignee
Shin Etsu Engineering Co Ltd
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Filing date
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Application filed by Shin Etsu Engineering Co LtdfiledCriticalShin Etsu Engineering Co Ltd
Priority to JP6275251ApriorityCriticalpatent/JP3053535B2/en
Priority to KR1019950039254Aprioritypatent/KR960018655A/en
Publication of JPH08136937ApublicationCriticalpatent/JPH08136937A/en
Application grantedgrantedCritical
Publication of JP3053535B2publicationCriticalpatent/JP3053535B2/en
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Description

Translated fromJapanese

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は液晶表示板用ガラス基板
の加圧加熱装置であって、詳しくはシール材を挟装した
上下のガラス基板をマーク合わせを行って貼り合わせす
ると共に、仮止めした上下のガラス基板を所定のギャッ
プまでシール材を加圧して硬化させる加圧加熱装置に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to anapparatus for pressurizing and heating a glass substrate for a liquid crystal display panel. The presentinvention relates to a pressurizing and heatingdevice that presses and hardens the sealing material on the upper and lower glass substrates to a predetermined gap.

【0002】[0002]

【従来の技術】液晶表示板(LCD)は、透明導電性電
極をコートした2枚のガラス基板間に数μmのスペーサ
を用いて所定の間隔に保ち、シール材で区画した内側の
空間内に液晶を封入したもので、その2枚のガラス基板
は位置合わせマークによって狂いなく貼り合わせられて
いる。
2. Description of the Related Art A liquid crystal display (LCD) is maintained at a predetermined distance between two glass substrates coated with a transparent conductive electrode by using a spacer having a thickness of several μm. Liquid crystal is sealed in, and the two glass substrates are stuck together without misalignment by alignment marks.

【0003】ところで、液晶表示板を構成する2枚のガ
ラス基板は、その一方のガラス基板の上にスペーサを散
在し、他方のガラス基板の内面(一方のガラス基板と対
向する面)には熱硬化性樹脂のシール材が取り付けら
れ、そうした上下のガラス基板が貼り合わせ装置によっ
てマーク合わせを行って貼り合わせられると共に、上下
のガラス基板が分離しないように仮止めされる。そし
て、貼り合わせ仮止めされた2枚1組のガラス基板は加
圧、加熱処理して上下のガラス基板間のギャップをスペ
ーサの粒径までシール材を加圧して該シール材を硬化さ
せる。
Meanwhile, two glass substrates constituting a liquid crystal display panel have spacers scattered on one of the glass substrates, and heat is applied to the inner surface of the other glass substrate (the surface facing the one glass substrate). A sealing material of a curable resin is attached, and the upper and lower glass substrates are marked and bonded by a bonding apparatus, and temporarily fixed so that the upper and lower glass substrates are not separated. Then, the pair of glass substrates temporarily bonded and bonded is pressurized and heat-treated to press the sealing material to the gap between the upper and lower glass substrates to the particle size of the spacer, thereby curing the sealing material.

【0004】その従来のシール材を硬化させる装置は、
貼り合わせを完了した2枚1組のガラス基板を複数組積
み重ねると共に治具にセットして加圧し、それを加熱炉
に入れてシール材を加熱し硬化させるものである。
[0004] The conventional device for curing the sealing material is as follows.
A plurality of sets of two glass substrates that have been bonded together are stacked, set in a jig, pressurized, placed in a heating furnace, and heated to cure the sealing material.

【0005】[0005]

【発明が解決しようとする課題】しかして、2枚1組の
ガラス基板を治具にセットして加圧し、加熱炉に入れガ
ラス基板を加熱した場合、加熱による熱伝導はガラス基
板の周囲と中央部では温度差があり、熱膨張の差によっ
て位置合わせされている上下のガラス基板が水平方向に
移動して狂いが生じるといった問題点を有する。これを
なくす為に、加熱時間、加熱温度を調整しながら行って
いるが、この場合は作業性が低下し、生産性に欠けると
いった問題点を有する。
However, when a set of two glass substrates is set in a jig, pressurized, and placed in a heating furnace to heat the glass substrates, the heat conduction due to the heating is equal to that of the periphery of the glass substrates. There is a problem in that there is a temperature difference in the central portion, and the upper and lower glass substrates aligned with each other due to the difference in thermal expansion move in the horizontal direction to cause a deviation. In order to eliminate this, the heating is performed while adjusting the heating time and the heating temperature. However, in this case, there is a problem that workability is reduced and productivity is lacking.

【0006】又、貼り合わせ仮止めされている2枚1組
のガラス基板は加熱によってシール材が溶融し、硬化さ
れるが、その加熱時に2枚1組のガラス基板は加圧して
ガラス基板間のギャップを所定のギャップ(スペーサの
粒径に相当する)にするが、その加圧は治具にセットし
て機械的手段、例えばシリンダ装置、或いはネジ機構等
を用いて行うため、装置全体が大型化するといった問題
点を有する。しかも、そうした機械的手段では加圧力を
ガラス基板全体に均一に作用させることが困難であり、
したがってギャップを一定にすることが困難であるとい
った問題点を有する。
[0006] Further, the sealing material is melted and hardened by heating the pair of glass substrates that are temporarily bonded, but at the time of heating, the pair of glass substrates is pressurized and pressed between the glass substrates. Is set to a predetermined gap (corresponding to the particle size of the spacer), but the pressurization is performed by using a mechanical means such as a cylinder device or a screw mechanism by setting the device in a jig. There is a problem that the size is increased. Moreover, it is difficult to apply the pressing force uniformly to the entire glass substrate by such mechanical means.
Therefore, there is a problem that it is difficult to make the gap constant.

【0007】 本発明は上述したような従来の技術が有
する問題点に鑑みてなされたもので、その目的とすると
ころは、ガラス基板全体に均一な分布荷重を付与すると
共に上下ガラス基板の位置ずれを防止してガラス基板間
に介在されたシール材が所定のギャップになるまで潰す
ことができる加圧加熱装置を提供することにある。
The present invention has been made in view of the above-described problems of the conventional technology, and has as its objectto apply a uniform distributed load to the entire glass substrate.
Both prevent the displacement of the upper and lower glass substrates and
To provide a pressurizing and heatingdevice capable ofcrushing a sealing material interposed between the pressure membersuntil a predetermined gap is reached.

【0008】[0008]

【課題を解決するための手段】上記の目的を達成する為
に本発明のうち請求項1記載の発明は、固定定盤と可動
定盤との合着によって形成される密閉空間内に、前もっ
て位置合せし且つ仮止めされた2枚1組のガラス基板を
保持し、この密閉空間内の減圧により大気圧が作用して
上記ガラス基板を加圧し、且つガラス基板間に介在され
たシール材を加熱して硬化させる液晶表示板用ガラス基
板の加圧加熱装置において、前記固定定盤と可動定盤
は、環状の枠体にその開口を閉鎖する如く可撓性の薄板
が張設固定されて形成され、密閉空間内の減圧により大
気圧が作用した可撓性の薄板は、2枚1組のガラス基板
を加圧することを特徴とする。
In order to achieve the above object, the invention accordingto claim 1 of the presentinvention comprises afixed platen and a movable platen.
In the enclosed space formed by joining with the surface plate,
A pair of two glass substrates that are aligned and temporarily fixed
Hold, atmospheric pressure acts due to the reduced pressure in this enclosed space
Pressing the above glass substrate, and interposed between the glass substrates
Glass base for liquid crystal display panel, which heats and cures the sealing material
In the plate pressurizing and heating apparatus, the fixed surface plate and the movable surface plate
Is a thin plate that is flexible so as to close its opening in an annular frame
Is stretched and fixed.
A flexible thin plate subjected to atmospheric pressure is a set of two glass substrates
Is pressurized .

【0009】[0009]

【0010】固定定盤及び可動定盤の枠体に張設する薄
板としては、板厚が30μm乃至 200μmの金属製薄板
(例えばステンレス薄板)、或いはヤング率の高い合成
樹脂製薄板(例えばポリカーボネート製薄板)、ゴム薄
板等が挙げられる。更に、上記した固定定盤と可動定盤
の合着によって区画形成される密閉空間内を減圧する減
圧手段は定盤の何れか一方、例えば固定定盤の枠体に該
密閉空間内と連通する通孔を開設し、その通孔に真空ポ
ンプを接続して形成する。又、本発明に係る加熱装置は
ガラス基盤を水平状に支持して定盤を垂直方向に上下さ
せる縦型、或いはガラス基板の平面を横方向に向け定盤
を水平横方向に移動させる横型とするなど何れでもよい
ものである。
The thin plate to be stretched on the frame of the fixed platen and the movable platen is a thin metal plate (for example, a stainless steel plate) having a thickness of 30 μm to 200 μm or a thin synthetic resin plate having a high Young's modulus (for example, a polycarbonate thin plate). Thin plate) and a rubber thin plate. Further, the decompression means for decompressing the inside of the sealed space defined by the joining of the fixed surface plate and the movable surface plate communicates with any one of the surface plates, for example, the frame of the fixed surface plate and the inside of the closed space. A through hole is opened, and a vacuum pump is connected to the through hole to form the hole. Further, the heating device according to the present invention may be a vertical type in which the glass base is horizontally supported and the surface plate is vertically moved up and down, or a horizontal type in which the surface of the glass substrate is horizontally moved and the surface plate is horizontally moved. Any of these may be used.

【0011】[0011]

【作用】 上記の手段によれば、環状の枠体に可撓性の
薄板を張設した構造であるため、密閉空間内を減圧する
と大気圧が作用して、ガラス基板は弾性体で加圧される
かたちとなり、ガラス基板に均一な分布荷重が作用し、
ガラス基板間に介在されたシール材が所定のギャップに
なるまで潰される。しかも、その荷重はガラス基板の面
に対して垂直方向にのみ作用し、上下ガラス基板の位置
ずれを防止して2枚のガラス基板間のギャップは均一に
形成される。
According to the above-described means, theannular frame is made of a flexible material.
Due to the structure in which the thin plate is stretched , when the pressure in the enclosed space is reduced, atmospheric pressure acts andthe glass substrate is pressed by the elastic body
As a result, a uniform distributed load acts on the glass substrate,
The sealing material interposed between the glass substrates is crushed until a predetermined gap is reached. In addition, the load acts only perpendicularly to the surface of theglass substrate, and the position of theupper andlower glass substrates
The gap between the two glass substrates is formed uniformlyby preventing the displacement .

【0012】[0012]

【実施例】以下、本発明の一実施例を図面に基づき説明
すると、加圧加熱装置Aは機枠1と、その機枠1内の下
側に固定された固定定盤2と、その固定定盤2の上方に
配置された可動定盤3と、その可動定盤3を上下動させ
る駆動手段4と、所定位置まで下降された可動定盤3を
固定定盤2に合着し、固定定板2上に載せられた2枚1
組の貼り合わせ仮止めされたガラス基板a,bを密閉空
間内に保持し、その密閉空間内を減圧する減圧手段5と
で構成され、装置全体としては縦型に形成されている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. A pressurizing and heating apparatus A comprises a machine frame 1, a fixed surface plate 2 fixed to the lower side of the machine frame 1, and a fixed A movable surface plate 3 disposed above the surface plate 2, a driving means 4 for moving the movable surface plate 3 up and down, and the movable surface plate 3 lowered to a predetermined position are attached to the fixed surface plate 2 and fixed. 2 sheets placed on the plate 2
The pair of temporarily bonded glass substrates a and b are held in a sealed space, and the pressure reducing means 5 for reducing the pressure in the sealed space is provided. The entire apparatus is formed vertically.

【0013】機枠1内の下側に設置固定される固定定盤
2は、平面形状が矩形環状をした金属製の枠体6にその
開口を閉鎖する如く薄板7が張設固定されて形成されて
いる。そして、その薄板7の表面には発熱体8が貼り付
け固定されており、且つ枠体6の外周縁6′は薄板7の
張設面よりも上方に突出させ、それによって薄板7と枠
体6の外周縁6′とで凹部9が区画され、その凹部9内
に2枚1組のガラス基板が収容されるようになってい
る。又、外周縁6′には前記凹部9内と連通する通孔10
が開設され、その通孔10の外側開口は減圧手段5の真空
ポンプPに連結し、通孔10の内側開口は薄板7を囲むよ
うに形成した環状溝14に連絡し、後述する可動定盤3が
固定定盤2に合着されて密閉される凹部9内を減圧して
前記薄板7を合わせ面側に膨出し得るようになってい
る。更に、外周縁6′の上面には可動定盤3との合着に
よって密閉状態が確立されるように固定しOリング等の
パッキン15が取り付けられている。
The fixed surface plate 2 installed and fixed on the lower side of the machine frame 1 is formed by fixing a thin plate 7 to a metal frame 6 having a rectangular shape in plan view so as to close an opening thereof. Have been. A heating element 8 is attached and fixed to the surface of the thin plate 7, and the outer peripheral edge 6 'of the frame 6 is projected above the stretched surface of the thin plate 7, whereby the thin plate 7 and the frame A concave portion 9 is defined by an outer peripheral edge 6 ′ of the glass substrate 6, and a pair of glass substrates is accommodated in the concave portion 9. Further, a through hole 10 communicating with the inside of the recess 9 is formed in the outer peripheral edge 6 ′.
The outside opening of the through hole 10 is connected to the vacuum pump P of the pressure reducing means 5, and the inside opening of the through hole 10 communicates with an annular groove 14 formed so as to surround the thin plate 7, and a movable platen to be described later. 3 is attached to the fixed surface plate 2, and the inside of the recess 9 which is hermetically sealed is reduced in pressure so that the thin plate 7 can bulge toward the mating surface. Further, a packing 15 such as an O-ring is fixed on the upper surface of the outer peripheral edge 6 ′ so that a sealed state is established by joining with the movable surface plate 3.

【0014】枠体6に取り付けられる薄板7は板厚が30
μ〜 200μのステンレス製薄板を用い、枠体6に溶接又
は接着剤によって張設固定されている。薄板7の表面に
貼り付け固定される発熱体8は、耐熱性を有する絶縁
物、例えばセラミック、石英、合成樹脂材等の薄板(板
厚 100μ〜 300μ)に導電体、例えば炭素を印刷した面
状発熱体の形態に形成されており、導電体に電源が接続
されて通電されることで該導電体が発熱するように構成
されている。
The thin plate 7 attached to the frame 6 has a thickness of 30.
A stainless steel plate of μ to 200 μ is used, and is stretched and fixed to the frame 6 by welding or an adhesive. The heating element 8 attached and fixed to the surface of the thin plate 7 is a surface on which a conductor, for example, carbon is printed on a thin plate (thickness of 100 μm to 300 μm) of an insulating material having heat resistance, for example, ceramic, quartz, synthetic resin material or the like. The conductor is formed in the form of a heating element, and is configured so that the conductor generates heat when a power is connected to the conductor and energized.

【0015】固定定盤2の上方に配置され鉛直方向に上
下動する可動定盤3は、前記した固定定盤2と同様、平
面形状が矩形環状をした金属製の枠体11にその開口を閉
鎖する如く薄板12が張設固定されて形成されている。そ
して、その薄板12の表面には発熱体13が貼り付け固定さ
れており、且つ枠体11の外周は前記した固定定盤2の枠
体6に嵌合合着するように段付きに形成されている。更
に、可動定盤3の枠体11には薄板12を囲むように環状溝
16が形成され、それによって真空ポンプを作動させての
減圧作用がガラス基板を囲む外周部分に均等に働くよう
にしてある。
The movable platen 3 which is disposed above the fixed platen 2 and which moves up and down in the vertical direction has an opening formed in a metal frame 11 having a rectangular shape in plan view, like the fixed platen 2 described above. A thin plate 12 is stretched and fixed so as to be closed. A heating element 13 is adhered and fixed to the surface of the thin plate 12, and the outer periphery of the frame 11 is formed with a step so as to fit and fit with the frame 6 of the fixed platen 2. ing. Further, the frame 11 of the movable platen 3 has an annular groove so as to surround the thin plate 12.
16 is formed, so that the depressurizing action by operating the vacuum pump works evenly on the outer peripheral portion surrounding the glass substrate.

【0016】枠体11に取り付けられる薄板12は板厚が30
μ〜 200μのステンレス製薄板を用い、枠体11に溶接又
は接着剤によって張設固定されている。薄板12の表面に
貼り付け固定される発熱体13は、耐熱性を有する絶縁
物、例えばセラミック、石英、合成樹脂材等の薄板(板
厚 100μ〜 300μ)に導電体、例えば炭素を印刷した面
状発熱体の形態に形成されており、導電体に電源が接続
されて通電されることで該導電体が発熱するように構成
されている。尚、固定定盤2に装備される発熱体8及び
可動定盤3に装備される発熱体13はガラス基板の全面を
均一に加熱し得るように導電体が絶縁物の薄板に対して
配設されることは言うまでもないことである。
The thin plate 12 attached to the frame 11 has a thickness of 30
A thin stainless steel plate of μ to 200 μ is used and stretched and fixed to the frame body 11 by welding or an adhesive. The heating element 13 attached and fixed to the surface of the thin plate 12 is a surface on which a conductor, for example, carbon is printed on a thin plate (thickness of 100 μm to 300 μm) of an insulating material having heat resistance, for example, ceramic, quartz, synthetic resin material or the like. The conductor is formed in the form of a heating element, and is configured so that the conductor generates heat when a power is connected to the conductor and energized. The heating element 8 mounted on the fixed surface plate 2 and the heating element 13 mounted on the movable surface plate 3 are arranged on a thin plate made of an insulating material so as to uniformly heat the entire surface of the glass substrate. It goes without saying that this is done.

【0017】上記の如く構成された可動定盤3を上下動
させる駆動手段4は、機枠1の上部に定位置で回転可能
に取り付けられたナット部材17と、そのナット部材17に
螺合すると共に回転止めされている螺杆18と、前記ナッ
ト部材17を回転させるモータ19とで構成され、モータ19
の回転はチェーン或いはベルト等の動力伝達部材を介し
てナット部材17に伝達され、それにより該ナット部材17
と螺合する螺杆18が軸方向に上下動するように形成され
ている。又、上記螺杆18の下部は可動定盤3の枠体11上
面に固着取り付けた吊り枠20に掛け止め、掛け外し自在
に形成されている。更に、前記したナット部材17と螺杆
18の吊り機構は可動定盤3を水平状態で上下し得るよう
に該定盤3の角部に設置されている。
The driving means 4 for vertically moving the movable platen 3 constructed as described above is screwed to the nut member 17 rotatably mounted at a fixed position on the upper portion of the machine frame 1. And a motor 19 for rotating the nut member 17.
Is transmitted to the nut member 17 via a power transmission member such as a chain or a belt, whereby the nut member 17 is rotated.
The screw 18 is screwed up and down in the axial direction. Further, the lower portion of the screw rod 18 is hung on a suspension frame 20 fixedly attached to the upper surface of the frame 11 of the movable platen 3, and is formed so as to be freely detachable. Further, the nut member 17 and the screw
The suspension mechanism 18 is provided at a corner of the movable platen 3 so that the movable platen 3 can move up and down in a horizontal state.

【0018】従って、モータ19を駆動させてナット部材
17を定位置で回転させると回転止めされている螺杆18は
軸方向に沿って下方に繰り出され、吊り枠20を介して吊
り下げられた可動定盤3は固定定盤2に嵌合合着し、固
定定盤2の発熱体8上に載せられている2枚1組のガラ
ス基板は密閉空間内に収容保持されることになる。尚、
図示した実施例は可動定盤3が固定定盤2と合着する
時、該可動定盤3の薄板12がガラス基板の上面に接触す
るようにしたが、可動定盤3の薄板12とガラス基板の上
面とは接触しない状態で定盤同志が合着するようにして
も勿論よいものである。そして、更に螺杆18を下方に繰
り出すと該螺杆18と吊り枠20との係合が解除され、可動
定盤3は自由状態でガラス基板の上に載る形となり、固
定定盤2と可動定盤3とはパッキン15で密閉状態に合着
される。
Therefore, the motor 19 is driven to rotate the nut member.
When the 17 is rotated in a fixed position, the screw 18 which has been stopped from rotating is extended downward along the axial direction, and the movable platen 3 suspended via the suspension frame 20 is fitted to the fixed platen 2. Then, a pair of glass substrates placed on the heating element 8 of the fixed base 2 is housed and held in the closed space. still,
In the illustrated embodiment, the thin plate 12 of the movable platen 3 is in contact with the upper surface of the glass substrate when the movable platen 3 is joined with the fixed platen 2. Of course, it is also good that the surface plates come together in a state where they do not come into contact with the upper surface of the substrate. When the screw 18 is further extended downward, the engagement between the screw 18 and the suspension frame 20 is released, and the movable platen 3 is placed on the glass substrate in a free state. 3 is sealed by packing 15 in a sealed state.

【0019】可動定盤3を固定定盤2に対して上下させ
る機構は上記した図示の構成に限られるものではなく、
他の手段でも勿論良く、更に上記した固定定盤2及び可
動定盤3に装備した発熱体8,13の熱がガラス基板側に
作用するように該発熱体と反対側に断熱材を取り付ける
ことは任意である。尚、発熱体8,13が薄板7,12の裏
側に貼り付け固定された構造の場合は、前記断熱材は発
熱体の裏側に貼り付けるようにする。
The mechanism for moving the movable platen 3 up and down with respect to the fixed platen 2 is not limited to the above-described configuration.
Other means may of course be used, and a heat insulating material may be attached to the opposite side of the heating elements 8 and 13 provided on the fixed surface plate 2 and the movable surface plate 3 so as to act on the glass substrate side. Is optional. In the case where the heating elements 8 and 13 are attached and fixed to the backside of the thin plates 7 and 12, the heat insulating material is attached to the backside of the heating elements.

【0020】上記の如く構成した加圧加熱装置に供給さ
れる2枚1組のガラス基板23は前もって貼り合せ装置で
ガラス基板a,bがマーク合せされて貼り合せられ、且
つそのガラス基板間には数μmのスペーサ21が挿入され
ると共に、ガラス基板の周囲に沿って熱硬化性樹脂から
成るシール材22が取り付けられ、両ガラス基板a,bは
ギャップが約15μmに加圧されて仮止め固定されてい
る。そして、上記の2枚1組のガラス基板23を加圧加熱
装置の固定定盤2の上に載せ、次に駆動手段4を作動さ
せて可動定盤3を降下させ、該可動定盤3を固定定盤2
に嵌合合着させると共に、可動定盤3の発熱体13をガラ
ス基板aの上面に接触させ、更に駆動手段4を作動させ
て螺杆18と吊り枠20との係合を解除し、可動定盤3が自
由状態でガラス基板aの上に載るようにする(図7参
照)。次に減圧手段5の真空ポンプPを作動させて密閉
された固定定盤2の凹部9内を減圧すると、大気圧が作
用していた固定定盤2の薄板7及び可動定盤3の薄板12
は夫々合わせ面側に膨出して挟持された2枚1組のガラ
ス基板23を加圧すると同時に発熱体8,13に通電し、シ
ール材22をスペーサ21の粒径まで潰すと共に、該シール
材22を加熱して硬化させ、ガラス基板a,b間のギャッ
プを約5μmにする(図8参照)。その加熱処理は約 1
40℃〜 180℃で10分間位である。ここで、固定定盤2及
び可動定盤3は上記したように環状の枠体に可撓性の薄
板を張設した構造をなしているため、ガラス基板a,b
は弾性体で加圧されるかたちとなり、ガラス基板には均
一な分布荷重が作用し、シール材22は均一に潰され、そ
の結果ガラス基板a,b間のギャップは一定に保たれ、
高品質の製品が完成される。尚、上記した実施例は縦型
について説明したが、本発明の加圧加熱装置は横型でも
良く、また本装置は1台で使用しても勿論良いが、上記
したように加熱処理の時間が約10分間かかることもあっ
て本装置を複数台(例えば10台)環状に配置しチェーン
等によって移動するようにすれば作業能率、生産性を向
上出来る利点を有する。
The pair of glass substrates 23 supplied to the pressurizing and heating apparatus constructed as described above are bonded in advance by bonding the glass substrates a and b with a bonding apparatus by marking the glass substrates a and b. A spacer 21 of several μm is inserted, and a sealing material 22 made of a thermosetting resin is attached along the periphery of the glass substrate. The gap between the two glass substrates a and b is pressurized to about 15 μm and temporarily fixed. Fixed. Then, the set of two glass substrates 23 is placed on the fixed surface plate 2 of the pressurizing and heating device, and then the driving means 4 is operated to lower the movable surface plate 3. Fixed surface plate 2
And the heating element 13 of the movable platen 3 is brought into contact with the upper surface of the glass substrate a, and the driving means 4 is operated to release the engagement between the threaded rod 18 and the suspension frame 20 to move the movable platen 3. The board 3 is placed on the glass substrate a in a free state (see FIG. 7). Next, the vacuum pump P of the pressure reducing means 5 is operated to depressurize the inside of the recess 9 of the fixed fixed surface plate 2, and the thin plate 7 of the fixed surface plate 2 and the thin plate 12
Presses a pair of glass substrates 23 swelled and clamped to the mating surface side, respectively, and at the same time, energizes the heating elements 8 and 13 to crush the sealing material 22 to the particle size of the spacer 21, and 22 is heated and cured to make the gap between the glass substrates a and b approximately 5 μm (see FIG. 8). The heat treatment is about 1
It takes about 10 minutes at 40 ° C to 180 ° C. Here, the fixed platen 2 and the movable platen 3 have a structure in which a flexible thin plate is stretched on an annular frame as described above, and therefore, the glass substrates a and b
Is pressed by an elastic body, a uniform distributed load acts on the glass substrate, the sealing material 22 is crushed uniformly, and as a result, the gap between the glass substrates a and b is kept constant,
High quality products are completed. Although the above embodiment has been described with reference to the vertical type, the pressurizing and heating apparatus of the present invention may be of a horizontal type, and the apparatus may be used alone. Since it may take about 10 minutes, a plurality of (for example, 10) devices are arranged in a ring and moved by a chain or the like, which has the advantage of improving work efficiency and productivity.

【0021】[0021]

【発明の効果】 本発明の液晶表示板用ガラス基板の加
圧加熱装置は、環状の枠体に可撓性の薄板を張設した構
造であるため、密閉空間内を減圧すると大気圧が作用し
て、ガラス基板は弾性体で加圧されるかたちとなり、
ラス基板全体に均一な分布荷重を付与できて、ガラス基
板間に介在されたシール材が所定のギャップになるまで
潰されると共に、その荷重はガラス基板の面に対して垂
直方向にのみ作用するため、上下ガラス基板の位置ずれ
を防止してギャップを一定に保って成形することが出来
る。
The pressurizing and heatingapparatus for a glass substrate for a liquid crystal display panel according to the present inventionhas a structure in which a flexible thin plate is stretched over an annular frame.
When the pressure inside the enclosed space is reduced, atmospheric pressure acts.
Te glass substrate becomes a form of pressurized with an elastic body,and can give a uniform distribution load to the entire glasssubstrate, a glass base
Until the sealing material interposed between the plates reaches the specified gap
Crushed Rutotomoni, the load isto act only in a direction perpendicular to the plane of the glasssubstrate, it is possible to prevent displacement of the upper and lower glass substrates forming kept constant gap.

【0022】 又ガラス基板を加圧する機構を従来の
機械的手段に比べて大幅に簡略化且つ小型化することが
できる。
Further, the mechanism for pressingthe glass substrate can be greatly simplified and reduced in size as compared with conventional mechanical means.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る加圧加熱装置の一実施例を示す縦
断正面図である。
FIG. 1 is a vertical sectional front view showing an embodiment of a pressure heating device according to the present invention.

【図2】図1の2−2線矢視に沿う平底面図である。FIG. 2 is a flat bottom view taken along line 2-2 of FIG. 1;

【図3】可動定盤の部分拡大断面図である。FIG. 3 is a partially enlarged sectional view of a movable surface plate.

【図4】固定定盤の部分拡大断面図である。FIG. 4 is a partially enlarged sectional view of a fixed surface plate.

【図5】固定定盤に可動定盤を合着した状態の縦断正面
図である。
FIG. 5 is a vertical sectional front view showing a state in which a movable surface plate is attached to a fixed surface plate.

【図6】可動定板を上下させる駆動機構が取り付けられ
た機枠上面を示す平面図である。
FIG. 6 is a plan view showing the upper surface of the machine frame to which a drive mechanism for moving the movable platen up and down is attached.

【図7】両定板を合着した状態の部分拡大断面図であ
る。
FIG. 7 is a partially enlarged cross-sectional view of a state where both stools are attached.

【図8】図7の状態から密閉空間内を減圧してガラス基
板を加圧した状態を示す同断面図である。
8 is a sectional view showing a state in which the pressure in the closed space is reduced and the glass substrate is pressurized from the state of FIG. 7;

【符号の説明】[Explanation of symbols]

A…加圧加熱装置 1…機枠 2…固定定盤 3…可動定盤 4…駆動手段 5…減圧手段(真空ポン
プ) 6,11…枠体 7,12…薄板 8,13…発熱体 9…凹部 22…シール材 23…2枚1組のガラス基
A: Pressurizing and heating device 1: Machine frame 2: Fixed surface plate 3: Movable surface plate 4: Driving means 5: Decompression means (vacuum pump) 6, 11: Frame body 7, 12: Thin plate 8, 13: Heating element 9 ... recesses 22 ... sealing material 23 ... a pair of glass substrates

───────────────────────────────────────────────────── フロントページの続き (72)発明者 関川 利夫 東京都千代田区神田錦町2丁目9番地 信越エンジニアリング株式会社内 (72)発明者 内山 一栄 東京都千代田区神田錦町2丁目9番地 信越エンジニアリング株式会社内 (56)参考文献 特開 平4−355432(JP,A) 特開 平1−292316(JP,A) 特開 平2−282218(JP,A) 特開 平6−34983(JP,A) (58)調査した分野(Int.Cl.7,DB名) G02F 1/1339 G02F 1/1333──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Toshio Sekikawa 2-9-9 Kandanishikicho, Chiyoda-ku, Tokyo Shin-Etsu Engineering Co., Ltd. (72) Inventor Kazuei Uchiyama 2-9-9 Kandanishikicho, Chiyoda-ku, Tokyo Shin-Etsu Engineering Stock In-company (56) References JP-A-4-355432 (JP, A) JP-A-1-292316 (JP, A) JP-A-2-282218 (JP, A) JP-A-6-34983 (JP, A) (58) Fields surveyed (Int.Cl.7 , DB name) G02F 1/1339 G02F 1/1333

Claims (1)

Translated fromJapanese
(57)【特許請求の範囲】(57) [Claims]【請求項1】固定定盤(2)と可動定盤(3)との合
着によって形成される密閉空間内に、前もって位置合せ
し且つ仮止めされた2枚1組のガラス基板(a,b)を
保持し、この密閉空間内の減圧により大気圧が作用して
上記ガラス基板(a,b)を加圧し、且つガラス基板
(a,b)間に介在されたシール材(22)を加熱して硬
化させる液晶表示板用ガラス基板の加圧加熱装置におい
て、前記固定定盤(2)と可動定盤(3)は、環状の枠
体(7,11)にその開口を閉鎖する如く可撓性の薄板
(7,12)が張設固定されて形成され、密閉空間内の減
圧により大気圧が作用した可撓性の薄板(7,12)は、
2枚1組のガラス基板(23)を加圧することを特徴とす
る液晶表示板用ガラス基板の加圧加熱装置。
1.A combination of a fixed surface plate (2) and a movable surface plate (3).
Alignment in advance in the enclosed space formed by clothing
And a pair of temporarily fixed glass substrates (a, b)
Hold, atmospheric pressure acts due to the reduced pressure in this enclosed space
Pressing the glass substrate (a, b), and
The sealing material (22) interposed between (a, b) is heated and hardened.
Of pressure and heating equipment for glass substrates for liquid crystal display panels
The fixed surface plate (2) and the movable surface plate (3) are annular frames.
Flexible sheets so as to close their openings in the body (7, 11)
(7, 12) is formed by being stretched and fixed, reducing the
The flexible thin plates (7, 12) to which atmospheric pressure was applied by pressure,
Characterized by pressing a pair of glass substrates (23).
Pressurizing and heating equipment for glass substrates for liquid crystal display panels.
JP6275251A1994-11-091994-11-09 Pressurizing and heating equipment for glass substrates for liquid crystal display panelsExpired - LifetimeJP3053535B2 (en)

Priority Applications (2)

Application NumberPriority DateFiling DateTitle
JP6275251AJP3053535B2 (en)1994-11-091994-11-09 Pressurizing and heating equipment for glass substrates for liquid crystal display panels
KR1019950039254AKR960018655A (en)1994-11-091995-11-01 Pressurized heating method and apparatus for glass substrate for liquid crystal display panel

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP6275251AJP3053535B2 (en)1994-11-091994-11-09 Pressurizing and heating equipment for glass substrates for liquid crystal display panels

Publications (2)

Publication NumberPublication Date
JPH08136937A JPH08136937A (en)1996-05-31
JP3053535B2true JP3053535B2 (en)2000-06-19

Family

ID=17552808

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP6275251AExpired - LifetimeJP3053535B2 (en)1994-11-091994-11-09 Pressurizing and heating equipment for glass substrates for liquid crystal display panels

Country Status (2)

CountryLink
JP (1)JP3053535B2 (en)
KR (1)KR960018655A (en)

Families Citing this family (96)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP3884908B2 (en)*2000-11-292007-02-21株式会社日立製作所 Manufacturing method of liquid crystal panel
US7230670B2 (en)2001-10-052007-06-12Lg.Philips Lcd Co., Ltd.Method for fabricating LCD
US6819391B2 (en)2001-11-302004-11-16Lg. Philips Lcd Co., Ltd.Liquid crystal display panel having dummy column spacer with opened portion
KR100685948B1 (en)2001-12-142007-02-23엘지.필립스 엘시디 주식회사 LCD and its manufacturing method
KR100652045B1 (en)2001-12-212006-11-30엘지.필립스 엘시디 주식회사 LCD and its manufacturing method
KR100685949B1 (en)2001-12-222007-02-23엘지.필립스 엘시디 주식회사 LCD and its manufacturing method
KR100652046B1 (en)2001-12-222006-11-30엘지.필립스 엘시디 주식회사 LCD and its manufacturing method
KR100510718B1 (en)2002-02-042005-08-30엘지.필립스 엘시디 주식회사manufacturing device for manufacturing of liquid crystal device
JP2003233080A (en)2002-02-052003-08-22Lg Phillips Lcd Co Ltd Coupling device and method of manufacturing liquid crystal display device using the same
KR100469353B1 (en)2002-02-062005-02-02엘지.필립스 엘시디 주식회사bonding device for liquid crystal display
US7410109B2 (en)2002-02-072008-08-12Lg Display Co., Ltd.Liquid crystal dispensing apparatus with nozzle protecting device
KR100672640B1 (en)2002-02-072007-01-23엘지.필립스 엘시디 주식회사 UVRadiation device and manufacturing method of liquid crystal display device using same
KR100532083B1 (en)2002-02-202005-11-30엘지.필립스 엘시디 주식회사A liquid crystal dispensing apparatus having an integrated needle sheet
US7365822B2 (en)2002-02-202008-04-29Lg.Philips Lcd Co., Ltd.Method for fabricating LCD
KR100505180B1 (en)2002-02-202005-08-01엘지.필립스 엘시디 주식회사A liquid crystal dispensing apparatus with a nozzle cleaning device and a method of dispensing liquid crystal using thereof
KR100672641B1 (en)2002-02-202007-01-23엘지.필립스 엘시디 주식회사 LCD and its manufacturing method
KR100469360B1 (en)2002-02-222005-02-02엘지.필립스 엘시디 주식회사bonding device for liquid crystal display and operation method thereof
US8074551B2 (en)2002-02-262011-12-13Lg Display Co., Ltd.Cutting wheel for liquid crystal display panel
KR100720414B1 (en)2002-02-272007-05-22엘지.필립스 엘시디 주식회사 Manufacturing Method Of Liquid Crystal Display
US6784970B2 (en)2002-02-272004-08-31Lg.Philips Lcd Co., Ltd.Method of fabricating LCD
US7270587B2 (en)2002-03-052007-09-18Lg.Philips Lcd Co., Ltd.Apparatus and method for manufacturing liquid crystal display devices, method for using the apparatus, and device produced by the method
KR100798320B1 (en)2002-03-062008-01-28엘지.필립스 엘시디 주식회사 Inspection device and method of liquid crystal panel
KR100662495B1 (en)2002-03-072007-01-02엘지.필립스 엘시디 주식회사 Manufacturing method of liquid crystal display device
JP2003270652A (en)2002-03-082003-09-25Lg Phillips Lcd Co Ltd Liquid crystal diffusion control device and liquid crystal display device manufacturing method
US7416010B2 (en)2002-03-082008-08-26Lg Display Co., Ltd.Bonding apparatus and system for fabricating liquid crystal display device
KR100720417B1 (en)*2002-03-202007-05-22엘지.필립스 엘시디 주식회사 Vacuum bonding device for liquid crystal display device
KR100807587B1 (en)2002-03-092008-02-28엘지.필립스 엘시디 주식회사 Cutting method of liquid crystal panel
US7027122B2 (en)2002-03-122006-04-11Lg.Philips Lcd Co., Ltd.Bonding apparatus having compensating system for liquid crystal display device and method for manufacturing the same
KR100817130B1 (en)2002-03-132008-03-27엘지.필립스 엘시디 주식회사 Polishing detection pattern of liquid crystal panel and polishing failure determination method using the same
US6885427B2 (en)2002-03-152005-04-26Lg.Philips Lcd Co., Ltd.Substrate bonding apparatus for liquid crystal display device having alignment system with one end provided inside vacuum chamber
KR100870661B1 (en)2002-03-152008-11-26엘지디스플레이 주식회사 Board storage cassette
US6782928B2 (en)2002-03-152004-08-31Lg.Philips Lcd Co., Ltd.Liquid crystal dispensing apparatus having confirming function for remaining amount of liquid crystal and method for measuring the same
KR100817131B1 (en)2002-03-152008-03-27엘지.필립스 엘시디 주식회사 Inspection device and method of liquid crystal panel
US7698833B2 (en)2002-03-152010-04-20Lg Display Co., Ltd.Apparatus for hardening a sealant located between a pair bonded substrates of liquid crystal display device
US7102726B2 (en)2002-03-152006-09-05Lg. Philips Lcd Co., Ltd.System for fabricating liquid crystal display and method of fabricating liquid crystal display using the same
KR100817132B1 (en)2002-03-152008-03-27엘지.필립스 엘시디 주식회사 LCD Dropping Device
KR100720416B1 (en)2002-03-162007-05-22엘지.필립스 엘시디 주식회사 Bonding device for liquid crystal display device
KR100685952B1 (en)2002-03-192007-02-23엘지.필립스 엘시디 주식회사 Substrate for liquid crystal display device, liquid crystal display device and manufacturing method thereof
US7341641B2 (en)2002-03-202008-03-11Lg.Philips Lcd Co., Ltd.Bonding device for manufacturing liquid crystal display device
KR100652050B1 (en)2002-03-202006-11-30엘지.필립스 엘시디 주식회사 LCD and its manufacturing method
KR100798322B1 (en)2002-03-212008-01-28엘지.필립스 엘시디 주식회사 Polishing amount correction device and method of liquid crystal panel
KR100885840B1 (en)2002-03-232009-02-27엘지디스플레이 주식회사 Liquid crystal panel structure capable of compensating cell gap
US7244160B2 (en)2002-03-232007-07-17Lg.Philips Lcd Co., Ltd.Liquid crystal display device bonding apparatus and method of using the same
KR100860522B1 (en)2002-03-232008-09-26엘지디스플레이 주식회사 Liquid Crystal Panel Transfer Device
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KR100817134B1 (en)2002-03-252008-03-27엘지.필립스 엘시디 주식회사 Liquid crystal panel manufacturing apparatus and method
KR100685923B1 (en)2002-03-252007-02-23엘지.필립스 엘시디 주식회사 Bonding device and manufacturing method of liquid crystal display device using the same
KR100500693B1 (en)*2002-04-192005-07-12비오이 하이디스 테크놀로지 주식회사Hot press apparatus for fabrication of liquid crystal display cell
KR100698039B1 (en)2002-06-142007-03-23엘지.필립스 엘시디 주식회사 Cleaning jig
US7225917B2 (en)2002-06-152007-06-05Lg.Philips Lcd Co., Ltd.Conveyor system having width adjustment unit
US7295279B2 (en)2002-06-282007-11-13Lg.Philips Lcd Co., Ltd.System and method for manufacturing liquid crystal display devices
KR100488535B1 (en)2002-07-202005-05-11엘지.필립스 엘시디 주식회사Apparatus for dispensing Liquid crystal and method for dispensing thereof
KR100724474B1 (en)2002-10-222007-06-04엘지.필립스 엘시디 주식회사Device for cutting liquid crystal display panel and method for cutting the same
KR100489050B1 (en)*2002-11-062005-05-16코닉시스템 주식회사Pressure apparatus for manufacture of LCD panel
KR100493384B1 (en)2002-11-072005-06-07엘지.필립스 엘시디 주식회사structure for loading of substrate in substrate bonding device for manucturing a liquid crystal display device
KR100618576B1 (en)2002-11-132006-08-31엘지.필립스 엘시디 주식회사 Dispenser of liquid crystal display panel and dispensing method using the same
KR100724476B1 (en)2002-11-132007-06-04엘지.필립스 엘시디 주식회사 Dispenser of liquid crystal display panel and method for detecting residual amount of dispensing material using same
KR100724475B1 (en)2002-11-132007-06-04엘지.필립스 엘시디 주식회사 Seal dispenser of liquid crystal display panel and disconnection detection method of seal pattern using the same
KR100618577B1 (en)2002-11-132006-08-31엘지.필립스 엘시디 주식회사 Dispenser of liquid crystal display panel and dispensing method using the same
KR100720422B1 (en)2002-11-152007-05-22엘지.필립스 엘시디 주식회사 Liquid crystal display device manufacturing apparatus and manufacturing method using the same
US7275577B2 (en)2002-11-162007-10-02Lg.Philips Lcd Co., Ltd.Substrate bonding machine for liquid crystal display device
TWI257515B (en)2002-11-162006-07-01Lg Philips Lcd Co LtdSubstrate bonding apparatus for liquid crystal display device
KR100662497B1 (en)2002-11-182007-01-02엘지.필립스 엘시디 주식회사 Substrate bonding device for liquid crystal display device manufacturing process
KR100724477B1 (en)2002-11-192007-06-04엘지.필립스 엘시디 주식회사 Dispenser of liquid crystal display panel and dispensing method using same
KR100710163B1 (en)2002-11-282007-04-20엘지.필립스 엘시디 주식회사method for manufacturing of LCD
KR100710162B1 (en)2002-11-282007-04-20엘지.필립스 엘시디 주식회사 Seal pattern forming method of liquid crystal display
KR100832297B1 (en)2002-12-172008-05-26엘지디스플레이 주식회사 Polishing amount measuring device and measuring method of liquid crystal display panel
KR100618578B1 (en)2002-12-202006-08-31엘지.필립스 엘시디 주식회사 Dispenser of liquid crystal display panel and dispensing method using the same
KR100996576B1 (en)2003-05-092010-11-24주식회사 탑 엔지니어링 Liquid crystal dropping device and liquid crystal dropping method
KR20040104037A (en)2003-06-022004-12-10엘지.필립스 엘시디 주식회사Dispenser for liquid crystal display panel
KR100939629B1 (en)2003-06-022010-01-29엘지디스플레이 주식회사 Syringe of liquid crystal display panel
KR100996554B1 (en)2003-06-242010-11-24엘지디스플레이 주식회사 Liquid crystal dropping device with detachable liquid crystal discharge pump
KR100557500B1 (en)2003-06-242006-03-07엘지.필립스 엘시디 주식회사 Liquid crystal dropping device which can read information of liquid crystal container and liquid crystal dropping method using the same
KR100566455B1 (en)2003-06-242006-03-31엘지.필립스 엘시디 주식회사 Liquid crystal dropping device and liquid crystal dropping method using spacer information
KR100966451B1 (en)2003-06-252010-06-28엘지디스플레이 주식회사 LCD Dropping Device
KR100495476B1 (en)2003-06-272005-06-14엘지.필립스 엘시디 주식회사Liquid crystal dispensing system
US6892769B2 (en)2003-06-302005-05-17Lg.Philips Lcd Co., Ltd.Substrate bonding apparatus for liquid crystal display device panel
KR20050041697A (en)2003-10-312005-05-04엘지.필립스 엘시디 주식회사Apparatus for rubbing liquid crystal display panel
CN100362399C (en)2003-11-172008-01-16Lg.菲利浦Lcd株式会社Liquid crystal dispensing method and apparatus
KR100689313B1 (en)2003-11-222007-03-08엘지.필립스 엘시디 주식회사 Silver-Silent Hybrid Dispenser and Dispensing Method of Liquid Crystal Display Panel Using Same Dispenser
KR100987897B1 (en)2003-11-252010-10-13엘지디스플레이 주식회사 Dispenser of liquid crystal display panel and dispensing method using the same
KR100689314B1 (en)2003-11-292007-03-08엘지.필립스 엘시디 주식회사 Cutting Method of LCD Panel
US8146641B2 (en)2003-12-012012-04-03Lg Display Co., Ltd.Sealant hardening apparatus of liquid crystal display panel and sealant hardening method thereof
US7349060B2 (en)2003-12-022008-03-25Lg.Philips Lcd Co., Ltd.Loader and bonding apparatus for fabricating liquid crystal display device and loading method thereof
KR20050056799A (en)2003-12-102005-06-16엘지.필립스 엘시디 주식회사Seal pattern structure for liquid crystal display panel
KR101003666B1 (en)2003-12-102010-12-23엘지디스플레이 주식회사 Aligner
US8203685B2 (en)2003-12-102012-06-19Lg Display Co., Ltd.Liquid crystal display panel having seal pattern for minimizing liquid crystal contamination and method of manufacturing the same
KR101025067B1 (en)2003-12-132011-03-25엘지디스플레이 주식회사 Liquid crystal display panel manufacturing device
KR101010450B1 (en)2003-12-172011-01-21엘지디스플레이 주식회사 LCD Dropping Device
CN100359393C (en)2003-12-172008-01-02Lg.菲利浦Lcd株式会社 Liquid crystal distribution device
KR100710169B1 (en)2003-12-262007-04-20엘지.필립스 엘시디 주식회사 Manufacturing Line and Manufacturing Method of Liquid Crystal Display
KR101003603B1 (en)2003-12-302010-12-23엘지디스플레이 주식회사 Dispenser of liquid crystal display panel and dispensing method using the same
KR100972502B1 (en)2003-12-302010-07-26엘지디스플레이 주식회사 Grade display automation device of LCD and its operation method
KR100666530B1 (en)*2004-11-262007-01-09두산디앤디 주식회사 Glass Heating Device and Heating Method
JP4417432B1 (en)*2009-02-172010-02-17信越エンジニアリング株式会社 Work transfer device and vacuum bonding method
JP5737927B2 (en)*2010-12-212015-06-17株式会社日立製作所 Board assembly equipment

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