【０００１】[0001]
【産業上の利用分野】本考案は、プリント基板の反り防
止用治具に関し、特に辺縁部に先付け可能なリード端子
付部品を挿入したプリント基板のはんだディップ時の反
りを防止するプリント基板の反り防止治具に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for preventing warpage of a printed circuit board, and more particularly to a jig for preventing a printed circuit board from being warped at the time of solder dip. The present invention relates to a warp prevention jig.
【０００２】[0002]
【従来の技術】従来、プリント基板の辺縁部に先付け可
能なリード端子付部品（リード線付部品を含む）が挿入
されている場合は、はんだディップ時の反り防止が不可
能になるか、又はリード端子付部品を後付けにしてコテ
はんだ付けになっている。2. Description of the Related Art Conventionally, when a component with lead terminals (including a component with a lead wire) is inserted into the periphery of a printed circuit board, it becomes impossible to prevent warpage during solder dip. Alternatively, the components with lead terminals are attached later and soldered with iron.
【０００３】[0003]
【考案が解決しようとする課題】この従来の技術では、
反り防止が不可能な場合、はんだディップ時の熱により
プリント基板の反りが発生し、その修理に工数が多くか
かり、品質上にも問題となっている。[Problem to be solved by the invention] In this conventional technique,
If the warpage cannot be prevented, the printed circuit board will be warped due to the heat generated during solder dip, which requires a lot of man-hours for repair, and also poses a quality problem.
【０００４】又、プリント基板の反り防止をするために
リード端子付部品を後付けにする場合、リード端子付部
品はコテはんだ付けとなるため、組立工数が多くかかる
という欠点がある。[0004] Further, when components with lead terminals are retrofitted to prevent warpage of the printed circuit board, the components with lead terminals are soldered to the iron, so that there is a disadvantage that the number of assembly steps is increased.
【０００５】そこで、本考案は、辺縁部に挿入されるリ
ード端子付部品の先付けによる自動はんだディップを可
能とし、かつ自動はんだディップ時の熱によるプリント
基板の反りを防止し得、ひいてははんだ付けの品質を安
定させ、製造工数を削減し得るプリント基板の反り防止
用治具の提供を目的とする。Therefore, the present invention enables automatic solder dip by pre-adhering a component with a lead terminal inserted into a peripheral portion, and can prevent warpage of a printed circuit board due to heat at the time of automatic solder dip, and thus soldering. It is an object of the present invention to provide a jig for preventing warpage of a printed circuit board, which can stabilize the quality of a printed circuit board and reduce the number of manufacturing steps.
【０００６】[0006]
【課題を解決するための手段】本考案のプリント基板の
反り防止用治具は、プリント基板の辺縁部に挿入された
リード端子付部品の下面及び側面を前記辺縁部の長手方
向の全長に沿って遮蔽する遮蔽部と、前記遮蔽部に設け
られ、前記辺縁部を部分的に挟み込むクランプ部とを備
え、前記クランプ部が少なくとも前記遮蔽部の両端部及
び前記リード端子付部品の挿入位置を避けた中間部に設
けられていることを特徴とする。The jig for preventing warpage of a printed circuit board according to the present inventionis inserted into the periphery of theprinted circuit board.
The lower and side surfaces of the component with lead terminals
A shielding portion that shields along the length of the direction,provided in the shielding portion
And a clamp portion for partially sandwiching the peripheral portion.
In addition, theclamp part is at least at both ends of the shielding part.
And the middle part of the part with the lead terminal
It is characterized in that
【０００７】遮蔽部は、矩形状の水平板と、この水平板
の一側縁に沿って立設した垂直板と、水平板と垂直板の
両端縁をそれぞれ連結する端板とからなるのが好まし
い。The shielding portion includes arectangular horizontal plate and the horizontal plate.
The vertical plate erected along one side edge of the horizontal plate and the vertical plate
It is preferableto include an end plate connecting both end edges .
【０００８】又、遮蔽部は、はんだに対する非ぬれ性を
有する金属とするのが好ましい。[0008] Further, theshielding portion has a non-wetting property to solder.
It is preferableto use a metal having the same .
【０００９】[0009]
【作用】上記手段においては、遮蔽部により、はんだデ
ィップ時にプリント基板上のリード端子付部品に対する
フラックス及びはんだの付着が防止される一方、クラン
プ部により、プリント基板の辺縁部が遮蔽部に一体的に
固定される。In the above means, the shield prevents the flux and the solder from adhering to the components with lead terminals on the printed circuit board during the dipping of the solder, while the edge of the printed circuit board is integrated with the shield by the clamp. Fixed.
【００１０】[0010]
【実施例】次に、本考案の実施例について図面を参照し
て説明する。Next, an embodiment of the present invention will be described with reference to the drawings.
【００１１】図１は本考案の一実施例のプリント基板の
反り防止用治具の斜視図、図２，図３はそれぞれ上記反
り防止用治具とプリント基板との嵌合状態を示す要部の
断面図である。FIG. 1 is a perspective view of a jig for preventing warpage of a printed circuit board according to an embodiment of the present invention, and FIGS. 2 and 3 are main parts showing a fitting state of the jig for preventing warpage and the printed circuit board, respectively. FIG.
【００１２】本実施例の反り防止用治具１は、プリント
基板２の１つの辺縁部から飛び出してこの辺縁部のスル
ーホール（図示せず）に挿入されたリード端子付部品３
の下面及び側面を上記辺縁部の長手方向の全長に沿って
遮蔽する遮蔽部４を備えている。遮蔽部４は、はんだに
対する非ぬれ性を有する金属製の矩形状の水平板５、こ
の水平板５の一側縁（図１においては上側縁）に沿って
立設した垂直板６、及び水平板５と垂直板６の両端縁を
それぞれ連結する端板７，８とからなり、横断面Ｌ字状
に設けられている。The jig 1 for preventing warpage of this embodiment is a component 3 with a lead terminal which protrudes from one edge of a printed circuit board 2 and is inserted into a through hole (not shown) in this edge.
And a shielding portion 4 for shielding the lower surface and side surfaces of the peripheral portion along the entire length of the peripheral portion in the longitudinal direction. The shielding part 4 includes a metal-made rectangular horizontal plate 5 having a non-wetting property to solder, a vertical plate 6 erected along one side edge (the upper edge in FIG. 1) of the horizontal plate 5, and a horizontal plate. The plate 5 is composed of end plates 7 and 8 for connecting both end edges of the vertical plate 6, respectively, and is provided in an L-shaped cross section.
【００１３】遮蔽部４の両端部及び中間部には、プリン
ト基板２の前記辺縁部の両端部及びリード端子付部品３
の挿入位置を避けた中間部を部分的に挟み込む端部クラ
ンプ部９，１０及び中間部クランプ部１１が設けられて
いる。端部クランプ部９，１０は、遮蔽部４の水平板５
における両端部の他側縁（図１においては下側縁）にそ
れぞれ一体に延在させた矩形状の底板１２，１３と、遮
蔽部４の垂直板６における両端部の内側に取り付けたＬ
字状にしてかつそれぞれの底板１２，１３と対応する部
分を下方に凸の円弧状に湾曲したクランプ片１４，１５
とから構成されている。一方、中間部クランプ部１１
は、遮蔽部４の水平板５における中間部の他側縁に一体
に延在させた方形状の底板１６と、同様に遮蔽部４の水
平板５における中間部の上面に取り付けたＬ字状にして
かつ底板１６と対応する部分を下方に凸の円弧状に湾曲
したクランプ片１７とから構成されている。そして、遮
蔽部４の両端板７，８における前記各底板１２，１３と
対応する部分には、プリント基板２の挿入を可能とする
矩形状の切欠部１８，１９が設けられている。At both ends and an intermediate portion of the shielding portion 4, both ends of the peripheral portion of the printed circuit board 2 and the component 3 with lead terminals are provided.
End clamps 9 and 10 and an intermediate clamp 11 are provided to partially sandwich the intermediate part avoiding the insertion position. The end clamps 9 and 10 are connected to the horizontal plate 5 of the shield 4.
, Rectangular bottom plates12 and13 extending integrally with the other side edges (lower edge in FIG. 1) of both ends, and L attached inside both ends of the vertical plate 6 of the shielding portion 4.
The clamp pieces 14 and 15 which are formed in a U-shape and the portions corresponding to the respective bottom plates12 and13 are curved downwardly in an arc shape.
It is composed of On the other hand, the intermediate clamp 11
Is a rectangular bottom plate 16 integrally extending to the other side edge of the intermediate portion of the horizontal plate 5 of the shielding portion 4, and an L-shape similarly attached to the upper surface of the intermediate portion of the horizontal plate 5 of the shielding portion 4 And a portion corresponding to the bottom plate 16 is formed of a clamp piece 17 which is curved in an arc shape convex downward. In addition, rectangular cutouts 18 and 19 that allow the printed circuit board 2 to be inserted are provided in portions corresponding to the bottom plates 12 and 13 in both end plates 7 and 8 of the shielding unit 4.
【００１４】上記構成の反り防止用治具１は、図２，図
３に示すように、先付け可能なリード端子付部品３を挿
入したプリント基板２の辺縁部に、両端部クランプ部
９，１０及び中間部クランプ部１１により取り付け、プ
リント基板２の自動はんだディップをを行う。As shown in FIGS. 2 and 3, the warp preventing jig 1 having the above-described structure is provided at both ends of a printed circuit board 2 into which a pre-attached component 3 with lead terminals is inserted. The printed circuit board 2 is subjected to an automatic solder dip by mounting the printed circuit board 2 by the clamp unit 10 and the intermediate clamp unit 11.
【００１５】この自動はんだディップに際し、反り防止
用治具１の遮蔽部４により、プリント基板２の辺縁部か
ら飛び出したリード端子付部品３に対するプリント基板
２の下部からのフラックス及びはんだの付着が防止され
る一方、各クランプ部９，１０，１１により、プリント
基板２の辺縁部が遮蔽部４に一体的に固定される。At the time of this automatic solder dip, the shielding part 4 of the jig 1 for preventing warpage prevents the flux and solder from the lower part of the printed board 2 from adhering to the parts3 with lead terminals protruding from the edge of the printed board 2. On the other hand, the edge portions of the printed circuit board 2 are integrally fixed to the shielding portion 4 by the clamp portions 9, 10 and 11.
【００１６】[0016]
【考案の効果】以上説明したように本考案は、プリント
基板の辺縁部に挿入されたリード端子付部品の下面及び
側面を上記辺縁部の長手方向に沿って遮蔽する遮蔽部を
備えることにより、プリント基板の辺縁部に挿入されて
いるリード端子付部品に対するフラックス及びはんだの
付着が防止されるので、リード端子付部品の先付けによ
る自動はんだディップが可能となる一方、この遮蔽部に
設けられ、前記辺縁部を部分的に挟み込むクランプ部を
備えることにより、自動はんだディップ時の熱によるプ
リント基板の反りを防止でき、ひいてははんだ付けの品
質が安定し、製造工数も削減できる効果を有する。As described above, the present invention is provided with a shielding portion for shielding the lower surface and the side surface of the component with the lead terminal inserted into the peripheral portion of the printed circuit board along the longitudinal direction of the peripheral portion. This prevents flux and solder from adhering to the components with lead terminals that are inserted into the periphery of the printed circuit board. By providing a clamp portion that partially sandwiches the peripheral portion, warpage of the printed circuit board due to heat at the time of automatic solder dip can be prevented, and as a result, the quality of soldering can be stabilized and the number of manufacturing steps can be reduced. .
【図１】本考案の一実施例のプリント基板の反り防止用
治具の斜視図である。FIG. 1 is a perspective view of a jig for preventing warpage of a printed circuit board according to an embodiment of the present invention.
【図２】図１の反り防止用治具とプリント基板との嵌合
状態を示す要部の断面図である。FIG. 2 is a sectional view of a main part showing a fitting state between the warp preventing jig of FIG. 1 and a printed board.
【図３】図１の反り防止用治具とプリント基板との嵌合
状態を示す要部の断面図である。FIG. 3 is a sectional view of a main part showing a fitting state between the warp preventing jig of FIG. 1 and a printed board.
１ 反り防止用治具 ２ プリント基板 ３ リード端子付部品 ４ 遮蔽部 ９ 端部クランプ部 １０ 端部クランプ部 １１ 中間クランプ部 DESCRIPTION OF SYMBOLS 1 Warp prevention jig 2 Printed circuit board 3 Component with lead terminal 4 Shielding part 9 End clamp part 10 End clamp part 11 Intermediate clamp part
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991072798UJP2553104Y2 (en) | 1991-09-11 | 1991-09-11 | Jig for preventing warpage of printed circuit boards |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991072798UJP2553104Y2 (en) | 1991-09-11 | 1991-09-11 | Jig for preventing warpage of printed circuit boards |
| Publication Number | Publication Date |
|---|---|
| JPH0525775U JPH0525775U (en) | 1993-04-02 |
| JP2553104Y2true JP2553104Y2 (en) | 1997-11-05 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991072798UExpired - LifetimeJP2553104Y2 (en) | 1991-09-11 | 1991-09-11 | Jig for preventing warpage of printed circuit boards |
| Country | Link |
|---|---|
| JP (1) | JP2553104Y2 (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200452844Y1 (en)* | 2008-11-27 | 2011-04-01 | 주식회사 테트라 | Reinforcement plate for FPC |
| JP2014110331A (en)* | 2012-12-03 | 2014-06-12 | Denso Corp | Warpage prevention jig and method of manufacturing circuit board |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57194776U (en)* | 1981-05-30 | 1982-12-10 |
| Publication number | Publication date |
|---|---|
| JPH0525775U (en) | 1993-04-02 |
| Publication | Publication Date | Title |
|---|---|---|
| JPH0432778Y2 (en) | ||
| JP2553104Y2 (en) | Jig for preventing warpage of printed circuit boards | |
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