JP2022027049A - Reflective optical sensor and proximity sensor - Google Patents
Reflective optical sensor and proximity sensorDownload PDFInfo
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- JP2022027049A JP2022027049AJP2020130820AJP2020130820AJP2022027049AJP 2022027049 AJP2022027049 AJP 2022027049AJP 2020130820 AJP2020130820 AJP 2020130820AJP 2020130820 AJP2020130820 AJP 2020130820AJP 2022027049 AJP2022027049 AJP 2022027049A
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/941—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated using an optical detector
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/18—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices and the electric light source share a common body having dual-functionality of light emission and light detection
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/941—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated using an optical detector
- H03K2217/94102—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated using an optical detector characterised by the type of activation
- H03K2217/94108—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated using an optical detector characterised by the type of activation making use of reflection
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Abstract
Translated fromJapaneseDescription
Translated fromJapanese本発明は、反射型光センサ、および、近接センサに関する。 The present invention relates to a reflective optical sensor and a proximity sensor.
スマートフォンにおいて、近接センサ６０１は図７のように使用されている。近接センサ６０１は、基板６０４上に、発光素子６０２と、受光素子６０３とがモールド樹脂６０５で一体封止されている。近接センサ６０１は、スマートフォンのガラスパネル６０６下に配置される。発光素子から出射された光はガラスパネルを通して外部へ照射され、顔、耳などからの反射した光が再びガラスパネルを通して受光素子に戻ることを検知して、タッチパネル画面のオン、オフを制御している。 In the smartphone, the proximity sensor 601 is used as shown in FIG. In the proximity sensor 601, a light emitting element 602 and a light receiving element 603 are integrally sealed on a substrate 604 with a mold resin 605. The proximity sensor 601 is arranged under the glass panel 606 of the smartphone. The light emitted from the light emitting element is irradiated to the outside through the glass panel, and it is detected that the light reflected from the face, ears, etc. returns to the light receiving element through the glass panel, and the touch panel screen is controlled to be turned on and off. There is.
発光素子は、一般的に波長が９４０ｎｍの赤外光のＬＥＤが使用されるが、最近は指向角が狭く、駆動電流を下げられる面発光レーザのＶＣＳＥＬ（Vertical Cavity Surface Emitting LASER）の使用が増えてきている。ＶＣＳＥＬは、垂直共振器面発光レーザと訳される部品であり、微細なレーザ光を基板の垂直方向に射出する。受光素子は、光を電気信号へ変換するフォトダイオード６０７と、光電変換された信号を増幅演算処理する回路とが同一半導体基板上に形成されたＣＭＯＳプロセスで製造される。発光素子と、受光素子とを基板６０４上にダイアタッチして、Ａｕ線（図示せず）による電気接続した上で、トランスファーモールドで樹脂封止することにより、近接センサは製造される。 Infrared light LEDs with a wavelength of 940 nm are generally used as the light emitting element, but recently, the use of VCSEL (Vertical Cavity Surface Emitting LASER), which is a surface emitting laser that has a narrow directivity angle and can reduce the driving current, is increasing. It's coming. The VCSEL is a component translated as a vertical cavity surface emitting laser, and emits fine laser light in the vertical direction of the substrate. The light receiving element is manufactured by a CMOS process in which a photodiode 607 that converts light into an electric signal and a circuit that performs amplification calculation processing of the photoelectrically converted signal are formed on the same semiconductor substrate. A proximity sensor is manufactured by attaching a light emitting element and a light receiving element to a substrate 604, electrically connecting them with an Au line (not shown), and then sealing the resin with a transfer mold.
特許文献１には、垂直共振器型面発光レーザーを用いた光変位計における、戻り光励起雑音の発生について開示されている。また、特許文献２の図９、段落〔０００６〕には、近接センサにおける出射光が筐体に反射されることが開示されている。 Patent Document 1 discloses the generation of return light excitation noise in an optical displacement meter using a vertical resonator type surface emitting laser. Further, FIG. 9, paragraph [0006] of
図６は、発光素子５０１から出射された光の振る舞いの概略を示す図である。発光素子５０１からの出射光５０２は、スマートフォンのガラスパネルを通して外部へ透過光５０３として照射される。 FIG. 6 is a diagram showing an outline of the behavior of the light emitted from the light emitting element 501. The emitted light 502 from the light emitting element 501 is irradiated to the outside as transmitted light 503 through the glass panel of the smartphone.
出射光５０２は、発光素子５０１から直上へ基板の垂直方向に出射され、モールド樹脂を透過してモールド樹脂表面からガラスパネル方向へ出射される。出射光５０２が出射されるモールド樹脂表面を「パッケージ出射面」と呼び、同様に、受光素子が光を検知するフォトダイオードの直上のモールド樹脂表面を「パッケージ受光面」と呼ぶ。パッケージ出射面と、パッケージ受光面とは同一平面で、かつ基板に平行な面になるように、金型で成形される。 The emitted light 502 is emitted directly above the light emitting element 501 in the vertical direction of the substrate, passes through the mold resin, and is emitted from the surface of the mold resin toward the glass panel. The surface of the mold resin from which the emitted light 502 is emitted is referred to as a "package emission surface", and similarly, the surface of the mold resin directly above the photodiode in which the light receiving element detects light is referred to as a "package light receiving surface". The package emitting surface and the package light receiving surface are formed by a mold so as to be flush with each other and parallel to the substrate.
出射光はパッケージ（パッケージ出射面）と空間（空気）および空間（空気）とガラスパネルの界面にて、屈折率の違いにより一部が反射散乱される。発光素子からの出射光は内部散乱光５０６、反射散乱光５０４と反射戻り光５０５、および、透過光５０３に大きく分けられる。一般的に、ガラスと、空気との屈折率の差により約５％程度が反射成分になると考えられる。 Part of the emitted light is reflected and scattered at the interface between the package (package emission surface) and the space (air) and the space (air) and the glass panel due to the difference in the refractive index. The light emitted from the light emitting element is roughly divided into internally scattered light 506, reflected scattered light 504, reflected return light 505, and transmitted light 503. Generally, it is considered that about 5% is a reflective component due to the difference in refractive index between glass and air.
先述したとおり、近年は、発光素子として、ＬＥＤよりも、面発光レーザであるＶＣＳＥＬの使用が増えてきている。ＶＣＳＥＬを使用した場合には、反射戻り光５０５により発光特性が変動する問題が生じる。ＶＣＳＥＬはレーザ発振する素子のため、ガラスパネルからの反射戻り光がＶＣＳＥＬ出射端に結合することにより、ＶＣＳＥＬの発振動作自体が不安定化する「戻り光誘起雑音」が発生する。これにより、図８に示すように、出射光波形が変動し、センシングにおけるノイズ成分となるため検出精度が低下する不具合が発生する。 As described above, in recent years, the use of VCSEL, which is a surface emitting laser, is increasing rather than LED as a light emitting element. When VCSEL is used, there arises a problem that the emission characteristics are changed by the reflected return light 505. Since the VCSEL is an element that oscillates with a laser, the reflected return light from the glass panel is coupled to the VCSEL emission end, so that "return light induced noise" that destabilizes the oscillation operation itself of the VCSEL is generated. As a result, as shown in FIG. 8, the emitted light waveform fluctuates and becomes a noise component in sensing, which causes a problem that the detection accuracy is lowered.
また、反射散乱光および内部散乱光についても受光素子側へ向かう成分は、検知物からの反射信号光に対してノイズ成分となるため、検出精度が低下する不具合が発生する。 Further, with respect to the reflected scattered light and the internally scattered light, the component toward the light receiving element side becomes a noise component with respect to the reflected signal light from the detected object, so that there is a problem that the detection accuracy is lowered.
本発明の一態様は、反射型光センサにおいて、発光素子の出射光によるノイズを抑制することを目的とする。 One aspect of the present invention is to suppress noise due to emitted light of a light emitting element in a reflective optical sensor.
上記の課題を解決するために、本発明の一態様に係る反射型光センサは、同一の基板上において、同一方向に実装された発光素子および受光素子と、上記発光素子と、上記受光素子とを覆うパッケージと、を備え、上記パッケージの表面は、上記発光素子の発光側に位置する出射面と、上記受光素子の受光側に位置する受光面と、を含み、上記受光面は、上記基板と平行であり、上記出射面は、上記受光面に対して傾斜して設けられる。 In order to solve the above problems, the reflective optical sensor according to one aspect of the present invention includes a light emitting element and a light receiving element mounted in the same direction on the same substrate, the light emitting element, and the light receiving element. The surface of the package includes an emission surface located on the light emitting side of the light emitting element and a light receiving surface located on the light receiving side of the light receiving element, and the light receiving surface is the substrate. The emission surface is provided so as to be inclined with respect to the light receiving surface.
本発明の一態様によれば、反射型光センサにおいて、発光素子の出射光によるノイズを抑制することができる。 According to one aspect of the present invention, in the reflection type optical sensor, noise due to the emitted light of the light emitting element can be suppressed.
本発明は、赤外光を用いて物体の有無を検知する反射型光センサに関するものである。特に、スマートフォンにおいて通話時にタッチパネルの誤作動を防止するために画面のオン／オフを制御する近接センサとして多く使用されている。 The present invention relates to a reflective optical sensor that detects the presence or absence of an object using infrared light. In particular, in smartphones, it is often used as a proximity sensor that controls the on / off of the screen in order to prevent the touch panel from malfunctioning during a call.
〔実施形態１〕
以下、本発明の実施形態１について、詳細に説明する。本実施形態では、発光素子の直上に配置されるパッケージの出射面の構造により、ガラスパネルおよび出射面からの反射光成分を制御する。[Embodiment 1]
Hereinafter, Embodiment 1 of the present invention will be described in detail. In the present embodiment, the reflected light component from the glass panel and the emitting surface is controlled by the structure of the emitting surface of the package arranged directly above the light emitting element.
図１は、本実施形態に係る反射型光センサの概略を示す図である。図１に示すように、反射型光センサ１は、基板１０と、発光素子１１と、受光素子１２と、パッケージ７とを備えている。発光素子１１および受光素子１２は、同一の基板１０上において、同一方向に向けて実装されている。パッケージ７は、発光素子１１と、受光素子１２とを覆う。受光素子１２は、基板１０と平行に配置されるフォトダイオード１３を備えている。 FIG. 1 is a diagram showing an outline of a reflection type optical sensor according to the present embodiment. As shown in FIG. 1, the reflection type optical sensor 1 includes a
パッケージ７の表面であるパッケージ表面７１は、発光素子１１の直上（発光側）に位置するパッケージ出射面（出射面）７２と、受光素子１２の直上（受光側）に位置するパッケージ受光面（受光面）７３と、を含んでいる。 The package surface 71, which is the surface of the package 7, has a package exit surface (emission surface) 72 located directly above the light emitting element 11 (light emitting side) and a package light receiving surface (light receiving surface) located directly above the light receiving element 12 (light receiving side). Surface) 73 and.
パッケージ受光面７３は、基板１０と平行に設けられる。これにより、パッケージ受光面７３は、受光素子１２のフォトダイオード１３に効率よく光を入射させることができる。 The package light receiving surface 73 is provided in parallel with the
パッケージ出射面７２は、パッケージ受光面７３に対して傾斜して設けられる。これにより、発光素子１１からの出射光１０２は、パッケージ出射面７２と、空気との界面において外側（左側）へ光軸が曲げられると同時に、内部散乱光１０６も反射角が下方向に変化する。 The package exit surface 72 is provided so as to be inclined with respect to the package light receiving surface 73. As a result, the optical axis of the emitted light 102 from the light emitting element 11 is bent outward (left side) at the interface between the package emitting surface 72 and the air, and at the same time, the reflection angle of the internally scattered light 106 also changes downward. ..
上記によれば、反射型光センサ１において、受光素子１２の表面へ散乱する成分を抑制することができる。なお、パッケージ界面で光軸が曲がった出射光１０２はガラスパネルとの界面において反射されるが、その反射戻り光１０５は反射角により発光素子１１から遠ざかる方向へ進む。そのため、発光素子１１への戻り光を防止し、発光特性の変動を回避することができる。 According to the above, in the reflection type optical sensor 1, the component scattered on the surface of the light receiving element 12 can be suppressed. The emitted light 102 whose optical axis is bent at the interface of the package is reflected at the interface with the glass panel, and the reflected return light 105 travels away from the light emitting element 11 due to the reflection angle. Therefore, it is possible to prevent the return light to the light emitting element 11 and avoid the fluctuation of the light emitting characteristics.
換言すれば、ガラスパネルから発光素子１１への反射戻り光を防止して、発光波形を安定化させると共に、ガラスパネルからの反射散乱光と、パッケージ出射面７２からの内部散乱光との影響を抑制することができる。これにより、受光素子１２への光ノイズ成分回り込みを抑制し、安定動作する反射型光センサ１を実現することができる。このような反射型光センサ１を用いて、スマートフォン向けに高精度の近接センサを提供することができる。 In other words, the reflected return light from the glass panel to the light emitting element 11 is prevented to stabilize the light emission waveform, and the influence of the reflected scattered light from the glass panel and the internally scattered light from the package emission surface 72 is exerted. It can be suppressed. As a result, it is possible to realize a reflective optical sensor 1 that suppresses the wraparound of optical noise components to the light receiving element 12 and operates stably. By using such a reflection type optical sensor 1, a high-precision proximity sensor can be provided for a smartphone.
なお、図１では、パッケージ出射面７２が受光素子１２側に傾斜している構成を示したが、パッケージ出射面７２が外側（受光素子１２側と反対側）に傾斜している構成としてもよい。後者の構成によれば、発光素子１１からの出射光１０２のうち、ガラスパネルに反射して、発光素子１１に戻る光を防止することにより、発光特性の変動を回避することができる。 Although FIG. 1 shows a configuration in which the package emitting surface 72 is inclined toward the light receiving element 12, the package emitting surface 72 may be inclined to the outside (the side opposite to the light receiving element 12 side). .. According to the latter configuration, among the light 102 emitted from the light emitting element 11, the light that is reflected by the glass panel and returned to the light emitting element 11 can be prevented from fluctuating in the light emitting characteristics.
〔実施形態２〕
本発明の実施形態２について、以下に説明する。なお、説明の便宜上、上記の実施形態にて説明した部材と同じ機能を有する部材については、同じ符号を付記し、その説明を繰り返さない。[Embodiment 2]
The second embodiment of the present invention will be described below. For convenience of explanation, the same reference numerals are given to the members having the same functions as the members described in the above-described embodiment, and the description thereof will not be repeated.
本実施形態では、実施形態１を前提にして、反射型光センサ１において、パッケージ出射面７２は、パッケージ受光面７３に対して１０°～１５°の角度で受光素子１２側に傾斜して設けられる。 In the present embodiment, on the premise of the first embodiment, in the reflection type optical sensor 1, the package exit surface 72 is provided so as to be inclined toward the light receiving element 12 at an angle of 10 ° to 15 ° with respect to the package light receiving surface 73. Be done.
図９は、本実施形態に係る、パッケージ出射面７２の傾斜角を変化させたときの、発光面への戻り光量を光学シミュレーションした結果を示す図である。図９に示すように、傾斜角１０°以上で戻り光を略ゼロにできるが、傾斜角が大き過ぎるとパッケージ７から出射される光軸も大きく曲がるため、光検出システム全体の光学利得が減少してしまう。すなわち、傾斜角が大きくなると、検知対象物に照射される光量が減少することになり、信号低下により検知特性が低下する。そこで、検知特性への影響を考慮して設計すると、１５°が実用的な傾斜角の上限値になる。そのため、実装精度公差も考慮して、傾斜角が１０°～１５°であることが最適である。 FIG. 9 is a diagram showing the result of optical simulation of the amount of return light to the light emitting surface when the inclination angle of the package exit surface 72 is changed according to the present embodiment. As shown in FIG. 9, the return light can be reduced to substantially zero when the tilt angle is 10 ° or more, but if the tilt angle is too large, the optical axis emitted from the package 7 also bends significantly, so that the optical gain of the entire photodetection system decreases. Resulting in. That is, when the inclination angle becomes large, the amount of light emitted to the detection object decreases, and the detection characteristics deteriorate due to the signal decrease. Therefore, if the design is made in consideration of the influence on the detection characteristics, 15 ° is the upper limit of the practical tilt angle. Therefore, it is optimal that the inclination angle is 10 ° to 15 ° in consideration of the mounting accuracy tolerance.
図２に示すように、パッケージ出射面７２、および、パッケージ受光面７３には、開口窓２０１、２０２を設けてもよい。開口窓２０１、２０２は、発光素子１１、受光素子１２の直上の、パッケージ表面７１の樹脂を薄く整形して、光の透過をよくしたものである。 As shown in FIG. 2, opening windows 201 and 202 may be provided on the package exit surface 72 and the package light receiving surface 73. The opening windows 201 and 202 are formed by thinly shaping the resin on the package surface 71 directly above the light emitting element 11 and the light receiving element 12 to improve the light transmission.
発光の開口窓２０１を設けた場合、出射光が出射されるモールド樹脂表面は、開口窓２０１の底面であるので、開口窓２０１の底面がパッケージ出射面７２になる。 When the light emitting opening window 201 is provided, the surface of the mold resin from which the emitted light is emitted is the bottom surface of the opening window 201, so that the bottom surface of the opening window 201 becomes the package exit surface 72.
〔実施形態３〕
本発明の実施形態３について、以下に説明する。なお、説明の便宜上、上記の実施形態にて説明した部材と同じ機能を有する部材については、同じ符号を付記し、その説明を繰り返さない。[Embodiment 3]
Embodiment 3 of the present invention will be described below. For convenience of explanation, the same reference numerals are given to the members having the same functions as the members described in the above-described embodiment, and the description thereof will not be repeated.
本実施形態では、反射型光センサ１において、パッケージ出射面７２の開口窓２０１と、パッケージ受光面７３の開口窓２０２とは、トランスファーモールドにより一体成型される。パッケージ出射面７２およびパッケージ受光面７３には、磨き加工が行われる。パッケージ出射面７２およびパッケージ受光面７３以外の、パッケージ表面７１には、光を散乱減衰させる加工が行われる。 In the present embodiment, in the reflection type optical sensor 1, the opening window 201 of the package emitting surface 72 and the opening window 202 of the package light receiving surface 73 are integrally molded by a transfer mold. The package exit surface 72 and the package light receiving surface 73 are polished. The package surface 71 other than the package exit surface 72 and the package light receiving surface 73 is processed to scatter and attenuate light.
図２は、本実施形態に係る反射型光センサ１の概略を示す図である。図２に示すように、トランスファーモールドによって、図１のパッケージ出射面７２に発光の開口窓２０１を設け、図１のパッケージ受光面７３に受光の開口窓２０２を設けて、樹脂封止成型される。次に、発光の開口窓２０１および受光の開口窓２０２を磨いて、出射光および反射信号光の散乱損失を抑える。それ以外のパッケージ表面７１については、光を散乱減衰させる状態に加工する。 FIG. 2 is a diagram showing an outline of the reflection type optical sensor 1 according to the present embodiment. As shown in FIG. 2, by transfer molding, a light emitting opening window 201 is provided on the package emitting surface 72 of FIG. 1, and a light receiving opening window 202 is provided on the package light receiving surface 73 of FIG. 1, and resin-sealed molding is performed. .. Next, the light emitting opening window 201 and the light receiving opening window 202 are polished to suppress the scattering loss of the emitted light and the reflected signal light. The other package surface 71 is processed so as to scatter and attenuate light.
発光素子１１からの出射光の一部がガラスパネルで反射して、反射散乱光２０４としてパッケージ７へ戻ってくる。その反射散乱光をパッケージ表面にて散乱減衰させることで、内部の受光素子への反射散乱光の影響を抑制することができる。 A part of the light emitted from the light emitting element 11 is reflected by the glass panel and returned to the package 7 as reflected scattered light 204. By scattering and attenuating the reflected scattered light on the surface of the package, the influence of the reflected scattered light on the internal light receiving element can be suppressed.
図３は、本実施形態に係るパッケージ成型後の状態例を示す図である。同一モールド樹脂で成型された後で、開口窓２０１、２０２を磨く。これにより、開口窓２０１、２０２周辺のパッケージ表面７１の状態よりも、光の散乱損失を抑制することができる。 FIG. 3 is a diagram showing an example of a state after packaging molding according to the present embodiment. After being molded with the same mold resin, the opening windows 201 and 202 are polished. As a result, the light scattering loss can be suppressed more than the state of the package surface 71 around the opening windows 201 and 202.
〔実施形態４〕
本発明の実施形態４について、以下に説明する。なお、説明の便宜上、上記の実施形態にて説明した部材と同じ機能を有する部材については、同じ符号を付記し、その説明を繰り返さない。[Embodiment 4]
Embodiment 4 of the present invention will be described below. For convenience of explanation, the same reference numerals are given to the members having the same functions as the members described in the above-described embodiment, and the description thereof will not be repeated.
図４は、本実施形態に係る反射型光センサ１の概略を示す図である。本実施形態では、反射型光センサ１は、図２に対して、パッケージ表面７１のうち、パッケージ出射面７２と、パッケージ受光面７３との間に、段差スリット３０１をさらに備える。段差スリット３０１は、モールド金型で成型される。 FIG. 4 is a diagram showing an outline of the reflection type optical sensor 1 according to the present embodiment. In the present embodiment, the reflection type optical sensor 1 further includes a step slit 301 between the package exit surface 72 and the package light receiving surface 73 of the package surface 71 with respect to FIG. 2. The step slit 301 is molded with a mold.
反射散乱光３０２はパッケージ表面７１にて反射散乱されるが、一部はモールド内部へ透過され、受光素子１２のフォトダイオード１３へ向かうノイズ光成分となる。この光経路に段差スリット３０１を形成することにより、モールド樹脂と、空気との界面が加わり、この界面でノイズ光成分は反射散乱される。 The reflected scattered light 302 is reflected and scattered on the package surface 71, but a part of the reflected scattered light is transmitted to the inside of the mold and becomes a noise light component toward the photodiode 13 of the light receiving element 12. By forming the step slit 301 in this optical path, an interface between the mold resin and air is added, and the noise light component is reflected and scattered at this interface.
この段差スリット３０１により、ガラスパネルからの反射散乱光３０２およびパッケージ７内部の発光素子１１からの内部散乱光３０３の、受光素子１２のフォトダイオード１３への回り込みを抑制することができる。段差スリット３０１の位置および深さは、反射散乱光３０２の入射角、および、内部散乱光３０３の光路シミュレーションにより設計される。その場合、モールド金型を使用することにより、段差スリット３０１を高精度に成型することができる。 With this step slit 301, it is possible to suppress the wraparound of the reflected scattered light 302 from the glass panel and the internally scattered light 303 from the light emitting element 11 inside the package 7 to the photodiode 13 of the light receiving element 12. The position and depth of the step slit 301 are designed by the incident angle of the reflected scattered light 302 and the optical path simulation of the internally scattered light 303. In that case, the step slit 301 can be molded with high accuracy by using the mold mold.
〔実施形態５〕
本発明の実施形態５について、以下に説明する。なお、説明の便宜上、上記の実施形態にて説明した部材と同じ機能を有する部材については、同じ符号を付記し、その説明を繰り返さない。[Embodiment 5]
Embodiment 5 of the present invention will be described below. For convenience of explanation, the same reference numerals are given to the members having the same functions as the members described in the above-described embodiment, and the description thereof will not be repeated.
本実施形態では、図４に対して、段差スリット４０１の表面の全体に遮光体４０４が施される。なお、段差スリット４０１の凹部に遮光体４０４が埋め込まれてもよい。 In the present embodiment, the light-shielding body 404 is applied to the entire surface of the step slit 401 with respect to FIG. The light-shielding body 404 may be embedded in the recess of the step slit 401.
図５は、本実施形態に係る反射型光センサ１の概略を示す図である。図５に示すように、段差スリット４０１の中に遮光体４０４が追加される。これにより、図４では段差スリット３０１の空気面を透過して受光素子１２のフォトダイオード１３へ向かっていた光ノイズ成分を透過させることなく、ブロックすることで、受光素子１２のフォトダイオード１３への回り込みをさらに抑制できる。遮光体４０４の追加方法は、段差スリット４０１に遮光樹脂を塗布して硬化させることで形成できる。さらに、遮光樹脂を用いて２重トランスファーモールドすることにより、精度よく均一に成型することができる。 FIG. 5 is a diagram showing an outline of the reflection type optical sensor 1 according to the present embodiment. As shown in FIG. 5, a light-shielding body 404 is added in the step slit 401. As a result, in FIG. 4, the light noise component that has passed through the air surface of the step slit 301 and directed toward the photodiode 13 of the light receiving element 12 is blocked without being transmitted to the photodiode 13 of the light receiving element 12. The wraparound can be further suppressed. The method of adding the light-shielding body 404 can be formed by applying a light-shielding resin to the step slit 401 and curing it. Further, by double transfer molding using a light-shielding resin, it is possible to mold accurately and uniformly.
〔実施形態６〕
本発明の実施形態６について、以下に説明する。なお、説明の便宜上、上記の実施形態にて説明した部材と同じ機能を有する部材については、同じ符号を付記し、その説明を繰り返さない。[Embodiment 6]
Embodiment 6 of the present invention will be described below. For convenience of explanation, the same reference numerals are given to the members having the same functions as the members described in the above-described embodiment, and the description thereof will not be repeated.
本実施形態では、発光素子１１は、面発光レーザＶＣＳＥＬ（Vertical Cavity Surface Emitting LASER）によるものであり、発光素子１１の電流狭窄層９０５がインプラ方式で形成される。 In the present embodiment, the light emitting element 11 is based on a surface emitting laser VCSEL (Vertical Cavity Surface Emitting LASER), and the
図１０は、本実施形態に係るＶＣＳＥＬ発光素子の断面構造を示す図である。ＶＣＳＥＬは、垂直方向にレーザ発振を行い、表面からレーザ光が出射される。活性層９０３で発光した光を上下の反射ミラーＰ－ＤＢＲ９０４とＮ－ＤＢＲ９０２で増幅を行う。バイアス電流は、上部電極から下部電極へ印加されるが、活性層の発光領域に電流を集中させるため、電流狭窄層９０５、９０６が設けられている。 FIG. 10 is a diagram showing a cross-sectional structure of the VCSEL light emitting device according to the present embodiment. The VCSEL oscillates the laser in the vertical direction, and the laser beam is emitted from the surface. The light emitted by the active layer 903 is amplified by the upper and lower reflection mirrors P-DBR904 and N-DBR902. The bias current is applied from the upper electrode to the lower electrode, but the current constriction layers 905 and 906 are provided in order to concentrate the current in the light emitting region of the active layer.
電流狭窄層９０５、９０６を形成する方法として、上部からプロトン注入によるインプラ方式と、横方向から水蒸気で酸化させる酸化膜方式の２種類がある。発明者らは、ＶＣＳＥＬ発光部へ光を戻した場合の戻り光耐量特性として、インプラ方式のＶＣＳＥＬを使用する方が、酸化膜方式よりも、反射戻り光に対して安定動作を確保しやすいことを実験的に確認した。 There are two types of methods for forming the current constriction layers 905 and 906: an implanter method in which protons are injected from above and an oxide film method in which water vapor is used to oxidize from the lateral direction. The inventors have found that it is easier to secure stable operation against reflected return light when using the Impla method VCSEL as the return light withstand characteristic when the light is returned to the VCSEL light emitting part, as compared with the oxide film method. Was confirmed experimentally.
これは、Ｈ＋イオンを打ち込むことにより電流通路を制限するインプラ方式では、ＶＣＳＥＬの戻り光雑音の主要因となるマルチモード競合において、より高次の横マルチモードが受ける光学ロスが大きいことが作用しているためと考えられる。 This is because in the impla method that limits the current path by driving H + ions, the optical loss that the higher-order lateral multimode receives is large in the multimode competition that is the main cause of the return light noise of the VCSEL. It is thought that this is because.
なお、近接センサは、本発明の実施形態１から６の何れかの反射型光センサ１を用いる。これにより、ガラスパネルからの反射戻り光および反射散乱光の影響を抑制できるため、ユーザのガラスパネル実装条件に対して検知特性を安定させることができる。 As the proximity sensor, the reflective optical sensor 1 according to any one of the first to sixth embodiments of the present invention is used. As a result, the influence of the reflected return light and the reflected scattered light from the glass panel can be suppressed, so that the detection characteristics can be stabilized with respect to the user's glass panel mounting conditions.
〔まとめ〕
本発明の態様１に係る反射型光センサは、同一の基板上において、同一方向に実装された発光素子および受光素子と、上記発光素子と、上記受光素子とを覆うパッケージと、
を備え、上記パッケージの表面は、上記発光素子の発光側に位置する出射面と、上記受光素子の受光側に位置する受光面と、を含み、上記受光面は、上記基板と平行であり、上記出射面は、上記受光面に対して傾斜して設けられる。〔summary〕
The reflection type optical sensor according to the first aspect of the present invention includes a light emitting element and a light receiving element mounted in the same direction on the same substrate, a light emitting element, and a package covering the light emitting element and the light receiving element.
The surface of the package includes an emission surface located on the light emitting side of the light emitting element and a light receiving surface located on the light receiving side of the light receiving element, and the light receiving surface is parallel to the substrate. The emission surface is provided so as to be inclined with respect to the light receiving surface.
上記の構成によれば、受光素子の表面へ散乱する成分を抑制することができる。また、発光素子への戻り光を防止することにより、発光特性の変動を回避することができる。したがって、反射型光センサにおいて、発光素子の出射光によるノイズを抑制することができる。 According to the above configuration, the component scattered on the surface of the light receiving element can be suppressed. Further, by preventing the return light to the light emitting element, it is possible to avoid fluctuations in the light emitting characteristics. Therefore, in the reflection type optical sensor, noise due to the emitted light of the light emitting element can be suppressed.
本発明の態様２に係る反射型光センサは、上記態様１において、上記出射面が、上記受光面に対して１０°～１５°の角度で上記受光素子側に傾斜して設けられることとしてもよい。 In the reflection type optical sensor according to the second aspect of the present invention, in the first aspect, the emission surface may be provided so as to be inclined toward the light receiving element at an angle of 10 ° to 15 ° with respect to the light receiving surface. good.
上記の構成によれば、傾斜角を１０°以上にすることにより、戻り光を略ゼロにすることができる。また、傾斜角を１５°以下にすることにより、出射光の軸の曲がりを抑えることができる。 According to the above configuration, the return light can be made substantially zero by setting the inclination angle to 10 ° or more. Further, by setting the inclination angle to 15 ° or less, it is possible to suppress the bending of the axis of the emitted light.
本発明の態様３に係る反射型光センサは、上記態様１または２において、上記出射面と、上記受光面とが、トランスファーモールドにより一体成型され、上記出射面および上記受光面には、磨き加工が行われ、上記出射面および上記受光面以外の、上記パッケージの表面には、光を散乱減衰させる加工が行われることとしてもよい。 In the reflection type optical sensor according to the third aspect of the present invention, in the first or second aspect, the emission surface and the light receiving surface are integrally molded by a transfer mold, and the emission surface and the light receiving surface are polished. The surface of the package other than the emission surface and the light receiving surface may be processed to scatter and attenuate light.
上記の構成によれば、出射面および受光面における磨き加工により、出射面および受光面の周辺の表面よりも、散乱損失を抑制することができる。また、出射面および受光面以外の、パッケージの表面における、光を散乱減衰させる加工により、内部の受光素子への反射散乱光の影響を抑制することができる。 According to the above configuration, by polishing the emitting surface and the light receiving surface, it is possible to suppress the scattering loss more than the surface around the emitting surface and the light receiving surface. Further, the influence of the reflected scattered light on the internal light receiving element can be suppressed by the processing of scattering and attenuating the light on the surface of the package other than the emitting surface and the light receiving surface.
本発明の態様４に係る反射型光センサは、上記態様３において、上記出射面と、上記受光面との間に、段差スリットをさらに備えることとしてもよい。 The reflective optical sensor according to the fourth aspect of the present invention may further include a step slit between the exit surface and the light receiving surface in the third aspect.
上記の構成によれば、反射散乱光および内部散乱光の、受光素子への回り込みを抑制することができる。 According to the above configuration, it is possible to suppress the wraparound of the reflected scattered light and the internally scattered light to the light receiving element.
本発明の態様５に係る反射型光センサは、上記態様４において、上記段差スリットの表面には遮光体が施されることとしてもよい。 In the reflection type optical sensor according to the fifth aspect of the present invention, a light-shielding body may be provided on the surface of the step slit in the fourth aspect.
上記の構成によれば、反射散乱光および内部散乱光の、受光素子への回り込みをさらに抑制することができる。 According to the above configuration, it is possible to further suppress the wraparound of the reflected scattered light and the internally scattered light to the light receiving element.
本発明の態様６に係る反射型光センサは、上記態様１から５の何れかにおいて、上記発光素子は、面発光レーザＶＣＳＥＬ（Vertical Cavity Surface Emitting LASER）によるものであり、当該発光素子の電流狭窄層がインプラ方式で形成されることとしてもよい。 In the reflection type optical sensor according to the sixth aspect of the present invention, in any one of the above aspects 1 to 5, the light emitting element is based on a surface emitting laser VCSEL (Vertical Cavity Surface Emitting LASER), and the current narrowing of the light emitting element. The layer may be formed by an impla method.
上記の構成によれば、反射戻り光に対して、発光素子を安定して動作させることができる。 According to the above configuration, the light emitting element can be stably operated with respect to the reflected return light.
本発明の態様７に係る近接センサは、上記態様１から６の何れかの反射型光センサを用いる。 As the proximity sensor according to the seventh aspect of the present invention, the reflective optical sensor according to any one of the above aspects 1 to 6 is used.
上記の構成によれば、ユーザのガラスパネル実装条件に対して検知特性を安定させることができる。 According to the above configuration, the detection characteristics can be stabilized with respect to the user's glass panel mounting conditions.
本発明は上述した各実施形態に限定されるものではなく、請求項に示した範囲で種々の変更が可能であり、異なる実施形態にそれぞれ開示された技術的手段を適宜組み合わせて得られる実施形態についても本発明の技術的範囲に含まれる。さらに、各実施形態にそれぞれ開示された技術的手段を組み合わせることにより、新しい技術的特徴を形成することができる。 The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and the embodiments obtained by appropriately combining the technical means disclosed in the different embodiments. Is also included in the technical scope of the present invention. Further, by combining the technical means disclosed in each embodiment, new technical features can be formed.
１ 反射型光センサ
７ パッケージ
１０ 基板
１１ 発光素子
１２ 受光素子
７１ パッケージ表面
７２ パッケージ出射面（出射面）
７３ パッケージ受光面（受光面）
３０１、４０１ 段差スリット
４０４ 遮光体
９０５ 電流狭窄層1 Reflective optical sensor 7
73 Package light receiving surface (light receiving surface)
301, 401 Step slit 404
Claims (7)
Translated fromJapanese上記発光素子と、上記受光素子とを覆うパッケージと、
を備え、
上記パッケージの表面は、
上記発光素子の発光側に位置する出射面と、
上記受光素子の受光側に位置する受光面と、
を含み、
上記受光面は、上記基板と平行であり、
上記出射面は、上記受光面に対して傾斜して設けられる
ことを特徴とする反射型光センサ。Light emitting elements and light receiving elements mounted in the same direction on the same substrate,
A package that covers the light emitting element and the light receiving element,
Equipped with
The surface of the above package is
The emission surface located on the light emitting side of the light emitting element and
The light receiving surface located on the light receiving side of the light receiving element and
Including
The light receiving surface is parallel to the substrate and is parallel to the substrate.
The reflection type optical sensor is characterized in that the emission surface is provided so as to be inclined with respect to the light receiving surface.
ことを特徴とする請求項１に記載の反射型光センサ。The reflective optical sensor according to claim 1, wherein the emission surface is provided so as to be inclined toward the light receiving element at an angle of 10 ° to 15 ° with respect to the light receiving surface.
上記出射面および上記受光面には、磨き加工が行われ、
上記出射面および上記受光面以外の、上記パッケージの表面には、光を散乱減衰させる加工が行われることを特徴とする請求項１または２に記載の反射型光センサ。The emission surface and the light receiving surface are integrally molded by a transfer mold.
The emitting surface and the light receiving surface are polished to be polished.
The reflective optical sensor according to claim 1 or 2, wherein the surface of the package other than the emission surface and the light receiving surface is processed to scatter and attenuate light.
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| Publication number | Publication date |
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| JP7467270B2 (en) | 2024-04-15 |
| CN114068756A (en) | 2022-02-18 |
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