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JP2016046338A - Flexible printed circuit board - Google Patents

Flexible printed circuit board
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Publication number
JP2016046338A
JP2016046338AJP2014168215AJP2014168215AJP2016046338AJP 2016046338 AJP2016046338 AJP 2016046338AJP 2014168215 AJP2014168215 AJP 2014168215AJP 2014168215 AJP2014168215 AJP 2014168215AJP 2016046338 AJP2016046338 AJP 2016046338A
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Prior art keywords
terminal
film
circuit board
flexible printed
printed circuit
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JP2014168215A
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Japanese (ja)
Inventor
池田 貴
Takashi Ikeda
貴 池田
令 江川
Rei Egawa
令 江川
桂一郎 遠藤
Keiichiro Endo
桂一郎 遠藤
晃廣 小林
Akihiro Kobayashi
晃廣 小林
利弘 小林
Toshihiro Kobayashi
利弘 小林
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Nippon Seiki Co Ltd
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Nippon Seiki Co Ltd
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Priority to JP2014168215ApriorityCriticalpatent/JP2016046338A/en
Publication of JP2016046338ApublicationCriticalpatent/JP2016046338A/en
Pendinglegal-statusCriticalCurrent

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Abstract

PROBLEM TO BE SOLVED: To provide a flexible printed circuit board which responds flexibly to change in the relation of connection.SOLUTION: A flexible printed circuit board F includes a film-like insulating substrate 1, a first terminal 3 formed at one end of the film-like insulating substrate 1, a second terminal 4 formed at the other end of the film-like insulating substrate 1, a conductor pattern 2 formed on the film-like insulating substrate 1, and connecting the first terminal 3 and second terminal 4 electrically, and a film-like insulation coating 6 covering a predetermined part of the conductor pattern 2. The first terminal 3 and second terminal 4 are formed on both sides of the film-like insulating substrate 1, terminals on the front and back are electrically interconnected by the conductor pattern 2 via a through hole 5 boring the film-like insulating substrate 1, and the film-like insulation coating 6 covers any one, not used, of the first terminal 3 and second terminal 4 on the front and back.SELECTED DRAWING: Figure 2

Description

Translated fromJapanese

本発明は、フレキシブルプリント基板に関する。  The present invention relates to a flexible printed circuit board.

従来、例えば特許文献1に開示されるように、屈曲性に優れ配線の取り回しが良いフレキシブル回路基板が開示されている。  Conventionally, as disclosed inPatent Document 1, for example, a flexible circuit board having excellent flexibility and good wiring is disclosed.

特開2005−39052号公報JP-A-2005-39052

しかしながら、フレキシブルプリント基板によって接続される互いの回路基板の位置関係が設計変更されて変わってしまうと、予め設計したフレキシブルプリント基板では端子の接点方向が合わずフレキシブルプリント基板の取り回しができなくなってしまう場合があった。この場合、フレキシブルプリント基板を再設計する必要があり、設計者の作業負担が増大してしまう。  However, if the positional relationship between the circuit boards connected by the flexible printed circuit board changes due to a design change, the contact direction of the terminals does not match with the pre-designed flexible printed circuit board, and the flexible printed circuit board cannot be handled. There was a case. In this case, it is necessary to redesign the flexible printed circuit board, which increases the work load on the designer.

本発明は、上述した課題を鑑みてなされたものであり、接続関係の変更に柔軟に対応可能なフレキシブルプリント基板を提供することを目的とする。  The present invention has been made in view of the above-described problems, and an object thereof is to provide a flexible printed circuit board that can flexibly cope with a change in connection relation.

本発明に係るフレキシブルプリント基板は、
フィルム状絶縁基材と、
前記フィルム状絶縁基材の一端に形成される第1の端子と、前記フィルム状絶縁基材の他端に形成される第2の端子と、
前記フィルム状絶縁基材に形成され、前記第1の端子と前記第2の端子を電気的に接続する導体パターンと、
前記導体パターンの所定箇所を覆うフィルム状絶縁被覆と、
を備えたフレキシブルプリント基板であって、
前記第1の端子および前記第2の端子は、前記フィルム状絶縁基材の両面に形成されると共に、前記フィルム状絶縁基材を穿つスルーホールを介して表裏の端子同士が前記導体パターンで互いに電気的に接続され、
前記フィルム状絶縁被覆は、前記第1の端子および前記第2の端子の表裏の端子のいずれか一方を覆う。
The flexible printed circuit board according to the present invention is
A film-like insulating substrate;
A first terminal formed at one end of the film-like insulating base; a second terminal formed at the other end of the film-like insulating base;
A conductor pattern formed on the film-like insulating base material and electrically connecting the first terminal and the second terminal;
A film-like insulating coating covering a predetermined portion of the conductor pattern;
A flexible printed circuit board comprising:
The first terminal and the second terminal are formed on both surfaces of the film-like insulating base material, and the terminals on the front and back sides are connected to each other in the conductor pattern through a through hole that penetrates the film-like insulating base material. Electrically connected,
The film-like insulating coating covers either one of the first terminal and the front and back terminals of the second terminal.

本発明によれば、接続関係の変更に柔軟に対応可能なフレキシブルプリント基板を提供できる。  ADVANTAGE OF THE INVENTION According to this invention, the flexible printed circuit board which can respond flexibly to the change of a connection relationship can be provided.

本発明の第1実施形態に係るフレキシブルプリント基板の上面図、下面図、および、端部拡大図である。(a)が上面図であり、(b)が下面図であり、(c)が下面図における一端部拡大図であり、(d)が下面図における他端部拡大図である。It is the top view, bottom view, and end part enlarged view of the flexible printed circuit board concerning 1st Embodiment of this invention. (A) is a top view, (b) is a bottom view, (c) is an enlarged view of one end of the bottom view, and (d) is an enlarged view of the other end of the bottom view.本発明の第1実施形態に係るフレキシブルプリント基板のA−Aにおける断面図である。It is sectional drawing in AA of the flexible printed circuit board concerning 1st Embodiment of this invention.本発明の第1実施形態に係るフレキシブルプリント基板の回路基板への接続図である。It is a connection figure to the circuit board of the flexible printed circuit board concerning a 1st embodiment of the present invention.本発明の第2実施形態に係るフレキシブルプリント基板の回路基板への接続図である。It is a connection figure to the circuit board of the flexible printed circuit board concerning a 2nd embodiment of the present invention.

(第1実施形態)
以下、添付図面に基づいて、本発明の第1実施形態を説明する。
(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the accompanying drawings.

本発明に係るフレキシブルプリント基板Fは、フィルム状絶縁基材1に、導体パターン2と端子3,4を形成し、導体パターン2の所定箇所をフィルム状絶縁被覆6で覆って形成され、フレキシブルプリント基板Fの一端に形成された第1の端子3と、他端に形成された第2の端子4とを電気的に接続するものである。  A flexible printed circuit board F according to the present invention is formed by forming aconductor pattern 2 andterminals 3 and 4 on a film-likeinsulating base material 1 and covering a predetermined portion of theconductor pattern 2 with a film-likeinsulating coating 6. Thefirst terminal 3 formed at one end of the substrate F is electrically connected to thesecond terminal 4 formed at the other end.

フィルム状絶縁基材1は、例えばポリミイド等の電気絶縁性に優れた絶縁材料をフィルム状にしたものからなる。  The film-likeinsulating base material 1 is made of, for example, a film-like insulating material having excellent electrical insulation properties such as polyimide.

フィルム状絶縁基材1の一端部には、表端子3aと裏端子3bからなる第1の端子3が両面に形成されており、他端部には、表端子4aと裏端子4bからなる第2の端子4が両面に形成されている。これら端子3,4は、例えば銅箔等に金メッキを施した導電性金属で構成する。  Afirst terminal 3 composed of afront terminal 3a and aback terminal 3b is formed on one surface of one end of the film-likeinsulating substrate 1, and a second terminal composed of afront terminal 4a and aback terminal 4b is formed on the other end. Twoterminals 4 are formed on both sides. Theseterminals 3 and 4 are made of, for example, a conductive metal obtained by plating a copper foil or the like with gold.

第1の端子3と第2の端子4とは、例えば銅箔等の導電性金属からなる導体パターン2によって電気的に接続される。導体パターン2は、フィルム状絶縁基材1の両面に形成されると共に、フィルム状絶縁基材1を穿ち表面がメッキ処理されたスルーホール5を介して表面と裏面に形成された導体パターン2同士を電気的に接続している。  The1st terminal 3 and the2nd terminal 4 are electrically connected by theconductor pattern 2 which consists of electroconductive metals, such as copper foil, for example. Theconductor pattern 2 is formed on both surfaces of the film-likeinsulating base material 1, and theconductor patterns 2 formed on the front and back sides through the through-holes 5 that have been perforated through the film-likeinsulating base material 1 and are plated. Are electrically connected.

これら導体パターン2、端子3,4,スルーホール5が形成されたフィルム状絶縁基材1を、例えばポリミイド等の電気絶縁性に優れた絶縁材料をフィルム状にした表絶縁被覆6aと裏絶縁被覆6bからなるフィルム状絶縁被覆6で覆う。第1実施形態におけるフレキシブルプリント基板Fにおいては、第1の端子3の表端子3aと第2の端子4の表端子4aは表絶縁被覆6aによって覆われ、裏端子3b,4bは裏絶縁被覆6bは覆われず露出する。つまり、第1の端子3の表端子3aと第2の端子4の表端子4aはフィルム状絶縁被覆6で覆われるため、接続端子として使用されない。  The film-likeinsulating base material 1 in which theconductor pattern 2,terminals 3, 4 and through-holes 5 are formed is made of asurface insulating coating 6a and a back insulating coating in which an insulating material excellent in electrical insulation such as polyimide is formed into a film. It is covered with a film-like insulatingcoating 6 made of 6b. In the flexible printed circuit board F in the first embodiment, thefront terminal 3a of thefirst terminal 3 and thefront terminal 4a of thesecond terminal 4 are covered with the front insulatingcoating 6a, and theback terminals 3b and 4b are covered with theback insulating coating 6b. Exposed without being covered. That is, since thefront terminal 3a of thefirst terminal 3 and thefront terminal 4a of thesecond terminal 4 are covered with the film-likeinsulating coating 6, they are not used as connection terminals.

当該フレキシブルプリント基板Fは、図3に示すようにコネクタC3を有する回路基板C同士を互いに電気的に接続するために用いられる。
回路基板Cは、硬質基材C1上に電気回路C2が実装されると共に、電気回路C2と電気的に接続している接点C30を有するコネクタC3が実装されている。
回路基板C同士は、フレキシブルプリント基板Fの端子3,4をそれぞれコネクタC3に挿通して接点C30に押圧して回路基板Cの電気回路C2同士を電気的に接続する。つまり、第1実施形態におけるフレキシブルプリント基板Fにおいては、第1の端子3の裏端子3bと第2の端子4の裏端子4bがそれぞれ回路基板Cの接点C30に押圧されて回路基板Cの電気回路C2同士を電気的に接続する。
The flexible printed circuit board F is used for electrically connecting circuit boards C having connectors C3 to each other as shown in FIG.
In the circuit board C, the electric circuit C2 is mounted on the hard base material C1, and the connector C3 having the contact C30 electrically connected to the electric circuit C2 is mounted.
The circuit boards C are electrically connected to the electric circuits C2 of the circuit boards C by inserting theterminals 3 and 4 of the flexible printed circuit board F into the connectors C3 and pressing the terminals C4 to the contacts C30, respectively. That is, in the flexible printed circuit board F in the first embodiment, theback terminal 3b of thefirst terminal 3 and theback terminal 4b of thesecond terminal 4 are pressed against the contact C30 of the circuit board C, respectively. The circuits C2 are electrically connected to each other.

(第2実施形態)
次に、設計変更等によって図3に示した回路基板Cの一方の表裏の位置関係を逆にする場合において、第1実施形態におけるフレキシブルプリント基板Fの導体パターン2を再設計することなく、回路基板C同士を電気的に接続する第2実施形態を図4に基づいて説明する。
(Second Embodiment)
Next, when the positional relationship between one front and back of the circuit board C shown in FIG. 3 is reversed due to a design change or the like, the circuit without redesigning theconductor pattern 2 of the flexible printed circuit board F in the first embodiment. A second embodiment in which the substrates C are electrically connected will be described with reference to FIG.

図3に示した回路基板Cの一方の表裏の位置関係を逆にする場合、第1実施形態におけるフレキシブルプリント基板Fのフィルム状絶縁被覆6で覆う箇所を変更するだけで良い。つまり、第1の端子3の表端子3aを露出し第2の端子4の4aを覆うように表絶縁被覆6aを形成し、第1の端子4の裏端子3bを覆い第2の端子4の裏端子4bを露出するように裏絶縁被覆6bを形成する。
これにより、第1の端子3の表端子3aと第2の端子4の裏端子4bがそれぞれ回路基板Cの接点C30に押圧されることによって、回路基板Cの電気回路C2同士を電気的に接続することができる。
In order to reverse the positional relationship of one front and back of the circuit board C shown in FIG. 3, it is only necessary to change the location covered with the film-likeinsulating coating 6 of the flexible printed board F in the first embodiment. That is, thefront terminal 3a of thefirst terminal 3 is exposed and the front insulatingcoating 6a is formed so as to cover thesecond terminal 4a, theback terminal 3b of thefirst terminal 4 is covered, and thesecond terminal 4 of thesecond terminal 4 is covered. A back insulatingcoating 6b is formed so as to expose theback terminal 4b.
As a result, thefront terminal 3a of thefirst terminal 3 and theback terminal 4b of thesecond terminal 4 are each pressed against the contact C30 of the circuit board C, thereby electrically connecting the electric circuits C2 of the circuit board C to each other. can do.

第1実施形態と第2実施形態のように構成することで、設計変更等によって、互いに裏面側に露出している第1の端子3と第2の端子4のどちらか一方を表面側で接続するように変更を余儀なくされた場合においても、フレキシブルプリント基板Fの導体パターン2を再設計することなく、フィルム状絶縁被覆6で覆う箇所を適宜変更するだけで対応が可能となる。
これにより、設計者の作業負荷を軽減する効果に加え、再設計に係る費用も低減することができる。
By configuring as in the first embodiment and the second embodiment, one of thefirst terminal 3 and thesecond terminal 4 exposed on the back surface side is connected on the front surface side by design change or the like. Even when the change is unavoidable, it is possible to cope with the problem by simply changing the portion covered with the film-likeinsulating coating 6 without redesigning theconductor pattern 2 of the flexible printed circuit board F.
Thereby, in addition to the effect of reducing the designer's workload, the cost for redesign can also be reduced.

また、表面と裏面に形成された導体パターン2同士を電気的に接続するスルーホール5は、第1の端子3と第2の端子4とを電気的に接続するための導体パターン2を共通化するために、端子3,4に近い箇所に設けることが好ましい。  Also, thethrough hole 5 for electrically connecting theconductor patterns 2 formed on the front surface and the back surface has acommon conductor pattern 2 for electrically connecting thefirst terminal 3 and thesecond terminal 4. Therefore, it is preferable to provide it at a location close to theterminals 3 and 4.

また、スルーホール5同士は、互いに近接して配置するために、フィルム状絶縁基材1の短手方向に互い違いに配置することが好ましい。  Moreover, in order to arrange | position through-holes 5 mutually close, it is preferable to arrange | position alternately in the transversal direction of the film-forminsulating base material 1. FIG.

以上の説明では、本発明の理解を容易にするために、重要でない公知の技術的事項の説明を適宜省略した。  In the above description, in order to facilitate the understanding of the present invention, the description of known unimportant technical matters is appropriately omitted.

F :フレキシブルプリント基板
1 :フィルム状絶縁基材
2 :導体パターン
3 :第1の端子
3a :表端子
3b :裏端子
4 :第2の端子
4a :表端子
4b :裏端子
5 :スルーホール
6 :フィルム状絶縁被覆
6a :表絶縁被覆
6b :裏絶縁被覆
F: Flexible printed circuit board 1: Film-like insulating base material 2: Conductive pattern 3:First terminal 3a:Front terminal 3b: Back terminal 4:Second terminal 4a:Front terminal 4b: Back terminal 5: Through hole 6: Film-like insulation coating 6a:Front insulation coating 6b: Back insulation coating

Claims (1)

Translated fromJapanese
フィルム状絶縁基材と、
前記フィルム状絶縁基材の一端に形成される第1の端子と、前記フィルム状絶縁基材の他端に形成される第2の端子と、
前記フィルム状絶縁基材に形成され、前記第1の端子と前記第2の端子を電気的に接続する導体パターンと、
前記導体パターンの所定箇所を覆うフィルム状絶縁被覆と、
を備えたフレキシブルプリント基板であって、
前記第1の端子および前記第2の端子は、前記フィルム状絶縁基材の両面に形成されると共に、前記フィルム状絶縁基材を穿つスルーホールを介して表裏の端子同士が前記導体パターンで互いに電気的に接続され、
前記フィルム状絶縁被覆は、前記第1の端子および前記第2の端子の表裏の端子のいずれか一方を覆う
ことを特徴とするフレキシブルプリント基板。
A film-like insulating substrate;
A first terminal formed at one end of the film-like insulating base; a second terminal formed at the other end of the film-like insulating base;
A conductor pattern formed on the film-like insulating base material and electrically connecting the first terminal and the second terminal;
A film-like insulating coating covering a predetermined portion of the conductor pattern;
A flexible printed circuit board comprising:
The first terminal and the second terminal are formed on both surfaces of the film-like insulating base material, and the terminals on the front and back sides are connected to each other in the conductor pattern through a through hole that penetrates the film-like insulating base material. Electrically connected,
The film-like insulating coating covers either one of the first terminal and the front and back terminals of the second terminal. A flexible printed board.
JP2014168215A2014-08-212014-08-21Flexible printed circuit boardPendingJP2016046338A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP2018093101A (en)*2016-12-062018-06-14三菱電機株式会社Flexible print circuit board and image display unit
JP2018157128A (en)*2017-03-212018-10-04株式会社東海理化電機製作所Circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP2018093101A (en)*2016-12-062018-06-14三菱電機株式会社Flexible print circuit board and image display unit
JP2018157128A (en)*2017-03-212018-10-04株式会社東海理化電機製作所Circuit board

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