JP2009295309A - Lighting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting system capable of improving the density of a light source without increasing the areas of LED substrates on which LEDs are mounted. <P>SOLUTION: In the lighting system according to the embodiment 1, the first LED substrate 1 on the surface of which the LEDs 4 are mounted and arranged in a lattice shape and the second LED substrate 2 on the surface of which the LEDs 5 are mounted and arranged in a lattice shape, are laid one on top of the other, the LEDs 4 on the first LED substrate 1 and the LEDs 5 on the second LED substrate 2 are mounted and arranged in a staggered manner at alternately crossing positions, optical fibers 7 are passed through through-holes 11 which are formed in positions on the first LED substrate 1 facing the LEDs 5 mounted on the second LED substrate 2, and the LEDs 5 mounted on the second LED substrate 2 are lit via the optical fibers 7 on the surface of the first LED substrate 1. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

Translated fromJapanese

本発明は、ＬＥＤを光源とする照明装置に関する。  The present invention relates to an illumination device using an LED as a light source.

従来では、ＬＥＤ基板に実装された多数のＬＥＤの光を光集約レンズで光ファイバーに集光し、光ファイバーを束ねて光源密度を上げるようにした照明装置が知られている（例えば、特許文献１参照。）。
特開平１１−１２２０００号公報Conventionally, there has been known an illuminating device in which light of a large number of LEDs mounted on an LED substrate is collected on an optical fiber by a light aggregating lens, and the optical fiber is bundled to increase the light source density (see, for example, Patent Document 1). .)
Japanese Patent Laid-Open No. 11-122000

しかしながら、従来例の照明装置にあっては、光ファイバーで光源密度を上げることはできるが、ＬＥＤ基板には多数のＬＥＤを実装する必要があるため、ＬＥＤ基板のサイズが大きくなることと、強いては表示デバイスより、ＬＥＤ基板の方が極めて大きいものとなる等、ユニット全体のレイアウト上の課題（制約）が出てくるという問題点がある。  However, in the illumination device of the conventional example, the light source density can be increased by the optical fiber, but since it is necessary to mount a large number of LEDs on the LED substrate, the size of the LED substrate becomes large, There is a problem that layout problems (constraints) of the entire unit appear such that the LED substrate is much larger than the display device.

更に詳細に説明する。
最近のＨＵＤ（ヘッドアップディスプレイ）用表示器は、ＬＣＤとＬＥＤバックライトの組合せが主流である。ＨＵＤ表示は、フロントガラスまたは、コンバイナと表する別体の透明または透過率７０％以上の反射板に表示する為、光輝度を必要とする。その光源にはＰｏｗｅｒ系２Ｗ・３Ｗレベル）ＬＥＤを使い、光度（光束）を上げるため電流投入も大きく放熱の為パッケージサイズも大きい。Further details will be described.
In recent HUD (head-up display) displays, a combination of LCD and LED backlight is the mainstream. Since the HUD display is displayed on a windshield or a separate reflector represented by a combiner or a reflector having a transmittance of 70% or more, it requires light brightness. As the light source, a Power type 2W / 3W level LED is used. To increase luminous intensity (light flux), a large amount of current is applied and a large package size is required for heat dissipation.

また、従来のＬＣＤバックライト照明構造は、ＬＥＤの光使用率（発光効率）を向上させるため、レンズや導光板、またはライトコントロールフィルムなどを組合せ設計し輝度を向上する。
ただし、ＨＵＤのように超光輝度を求める場合、絶対光量が不足するため、先ずは光源密度を上げることが大前提になる。In addition, the conventional LCD backlight illumination structure is designed to improve brightness by combining a lens, a light guide plate, or a light control film in order to improve the light usage rate (light emission efficiency) of the LED.
However, when the super-light luminance is obtained as in the case of HUD, since the absolute light quantity is insufficient, it is first assumed that the light source density is increased.

ところが、輝度を上げるため、ＬＥＤを基板上に数多く実装したいが、ＬＥＤパッケージサイズ制約と、放熱の為の放熱専用パッドと回路用パターンの配置から、ＬＥＤ配列に制約が存在する。  However, in order to increase the luminance, it is desired to mount a large number of LEDs on the substrate. However, there is a limitation on the LED arrangement due to the LED package size limitation and the arrangement of the heat dissipation dedicated pad and circuit pattern for heat dissipation.

本発明の解決しようとする課題は、ＬＥＤが実装されるＬＥＤ基板の面積を広げることなしに、光源密度を上げることができる照明装置を提供することにある。  The problem to be solved by the present invention is to provide an illumination device capable of increasing the light source density without increasing the area of the LED substrate on which the LEDs are mounted.

上記課題を解決するため請求項１記載の照明装置は、表面にＬＥＤが格子状に実装配置されたＬＥＤ基板を少なくとも２枚重ね、該各ＬＥＤ基板のＬＥＤの実装位置を千鳥状に互い違いに配置し、一方のＬＥＤ基板に実装された各ＬＥＤと対面するもう一方のＬＥＤ基板の位置に形成した貫通穴に光ファイバーを通し、一方のＬＥＤ基板に実装された各ＬＥＤの光を光ファイバーを介してもう一方のＬＥＤ基板の表面で光らせるように構成したことを特徴とする手段とした。  In order to solve the above-described problem, the lighting device according to claim 1 is configured such that at least two LED boards each having a surface on which LEDs are mounted and arranged are stacked, and the LED mounting positions of the LED boards are alternately arranged in a staggered manner. Then, an optical fiber is passed through a through hole formed at the position of the other LED board facing each LED mounted on one LED board, and the light of each LED mounted on one LED board is already passed through the optical fiber. It was set as the structure characterized by making it shine on the surface of one LED board.

本発明の照明装置では、上述のように、表面にＬＥＤが格子状に実装配置されたＬＥＤ基板を少なくとも２枚重ねることにより、ＬＥＤ基板の厚さ方向は厚くなるが、面積を広げることなしに多数のＬＥＤを実装させることができる。
そして、各ＬＥＤ基板のＬＥＤの実装位置を千鳥状に互い違いに配置し、一方のＬＥＤ基板に実装された各ＬＥＤと対面するもう一方のＬＥＤ基板の位置に形成した貫通穴に光ファイバーを通し、一方のＬＥＤ基板に実装された各ＬＥＤの光を光ファイバーを介してもう一方のＬＥＤ基板の表面で光らせるようにすることで、光源密度を上げることがきるようになる。In the lighting device of the present invention, as described above, by stacking at least two LED substrates on which LEDs are mounted and arranged in a grid pattern, the thickness direction of the LED substrate is increased, but without increasing the area. A large number of LEDs can be mounted.
Then, the LED mounting positions of each LED board are alternately arranged in a zigzag pattern, and the optical fiber is passed through the through hole formed at the position of the other LED board facing each LED mounted on one LED board. The light source density can be increased by causing the light of each LED mounted on the other LED substrate to shine on the surface of the other LED substrate via an optical fiber.

また、光ファイバーを用いることで、両ＬＥＤ基板相互の組み付けのばらつきを光ファイバーのフレキシブル性で吸収することができ、これにより、光損出を最小限度に抑えることができる。  In addition, by using an optical fiber, it is possible to absorb the variation in the assembly of the two LED substrates with the flexibility of the optical fiber, thereby minimizing light loss.

以下にこの発明の実施例を図面に基づいて説明する。  Embodiments of the present invention will be described below with reference to the drawings.

この実施例１の照明装置は、請求項１および２に記載の発明に対応する。
まず、実施例１の照明装置を図面に基づいて説明する。The illuminating device according to the first embodiment corresponds to the invention described in claims 1 and 2.
First, the illuminating device of Example 1 is demonstrated based on drawing.

図１は実施例１の照明装置を示す平面図、図２は図１のＡ１−Ａ１線における縦断断面図、図３は図２のＢ−Ｂ線における横断面図である。  FIG. 1 is a plan view showing the illumination device of Example 1, FIG. 2 is a longitudinal sectional view taken along line A1-A1 in FIG. 1, and FIG. 3 is a transverse sectional view taken along line BB in FIG.

この照明装置は、第１のＬＥＤ基板１と、第２のＬＥＤ基板２と、スペーサー３と、ＬＥＤ４と、ＬＥＤ５と、光集約レンズ６と、光ファイバー７と、を備えている。  The illumination device includes a first LED substrate 1, a second LED substrate 2, aspacer 3, anLED 4, anLED 5, alight collecting lens 6, and anoptical fiber 7.

さらに詳述すると、第１のＬＥＤ基板１と、第２のＬＥＤ基板２は、図２に示すように、第２のＬＥＤ基板２の上面（以後、表面と記す）にスペーサー３を介装させた状態で第１のＬＥＤ基板１を重ねた状態に組み付けられている。  More specifically, as shown in FIG. 2, the first LED substrate 1 and the second LED substrate 2 are provided with aspacer 3 on the upper surface (hereinafter referred to as the surface) of the second LED substrate 2. In this state, the first LED substrate 1 is assembled in a stacked state.

第１のＬＥＤ基板の表面には、図１に示すように、多数のＬＥＤ４が格子状に実装配置され、第２のＬＥＤ基板２の上面（以後、表面と記す）には、図２に示すように、同じく格子状であるが、第１のＬＥＤ基板１のＬＥＤ４とは千鳥状に互い違いに多数のＬＥＤ５が実装配置されている。  As shown in FIG. 1, a large number ofLEDs 4 are mounted and arranged in a lattice pattern on the surface of the first LED substrate, and the upper surface (hereinafter referred to as the surface) of the second LED substrate 2 is shown in FIG. Thus, although it is also a grid | lattice form, many LED5 is mounted and arrange | positioned alternately with LED4 of the 1st LED board 1 at zigzag form.

第２のＬＥＤ基板２に実装された各ＬＥＤ５と対面する第１のＬＥＤ基板１の位置には、図１、２に示すように、貫通穴１１が形成されている。
また、第２のＬＥＤ基板２に実装された各ＬＥＤ５の発光部５１との間に光集約レンズ６を介装させた状態で光ファイバー７がそれぞれ接続されている。
光集約レンズ６としては断面大径のコリメートレンズが用いられる。As shown in FIGS. 1 and 2, a through hole 11 is formed at the position of the first LED substrate 1 facing eachLED 5 mounted on the second LED substrate 2.
Theoptical fibers 7 are connected to thelight emitting portions 51 of therespective LEDs 5 mounted on the second LED substrate 2 with thelight collecting lens 6 interposed therebetween.
As thelight collecting lens 6, a collimating lens having a large cross section is used.

そして、この各光ファイバー７の先端側を第１のＬＥＤ基板１に形成された各貫通穴１１に通し、第１のＬＥＤ基板１に実装されたＬＥＤ４の発光部４１とほぼ同一面になるように配置させることにより、第２のＬＥＤ基板２に実装された各ＬＥＤ５の発光部５１から発する光を第１のＬＥＤ基板１の表面で、かつ、各ＬＥＤ４の発光部４１から発する光とほぼ同一平面において光らせるようにしている。  Then, the front end side of eachoptical fiber 7 is passed through each through hole 11 formed in the first LED substrate 1 so as to be substantially flush with thelight emitting portion 41 of theLED 4 mounted on the first LED substrate 1. By arranging the light, the light emitted from thelight emitting portion 51 of eachLED 5 mounted on the second LED substrate 2 is substantially flush with the light emitted from thelight emitting portion 41 of eachLED 4 on the surface of the first LED substrate 1. I am trying to make it shine.

次に、実施例１の作用を説明する。  Next, the operation of the first embodiment will be described.

<光源密度向上作用>
第２のＬＥＤ基板２に実装された各ＬＥＤ５の光を光ファイバー７を介して第１のＬＥＤ基板１の表面で光らせることで、光源密度が向上する。
ＨＵＤなどの車両用の表示器では、ＬＣＤ（液晶表示器）などの光源を必要とするものの大きさは、レイアウトや、規格等から制約されたものとなり、その背後の投光に割り当てられるスペースは、制限されたものとなる。実施例では、このように制限されたスペースであっても光源から投光する輝度を高くするので、環境や用い方により従来よりもさらに輝度を高くする要求に対応が可能となる。<Light source density enhancement effect>
The light source density is improved by causing the light of eachLED 5 mounted on the second LED substrate 2 to shine on the surface of the first LED substrate 1 through theoptical fiber 7.
In a display for a vehicle such as an HUD, the size of an LCD (liquid crystal display) or the like that requires a light source is limited by layout, standards, etc., and the space allocated for light projection behind it is , Become limited. In the embodiment, since the luminance emitted from the light source is increased even in such a limited space, it is possible to meet the demand for further increasing the luminance depending on the environment and usage.

<レイアウト性向上作用>
表面にＬＥＤ４が格子状に実装配置された第１のＬＥＤ基板１と、表面にＬＥＤ５が格子状に実装配置された第２のＬＥＤ基板２を重ね、該第１のＬＥＤ基板１のＬＥＤ４と第２のＬＥＤ基板２のＬＥＤ５の実装位置を千鳥状に互い違いに配置することで、ＬＥＤ基板の厚さ方向は厚くなるが、面積を広げることなしに多数のＬＥＤを実装させることができる。<Layout improvement effect>
The first LED board 1 on which theLEDs 4 are mounted and arranged in a grid pattern on the surface and the second LED board 2 on which theLEDs 5 are mounted and arranged in a grid pattern are stacked, and theLED 4 on the first LED board 1 and the first LED board 1 are stacked. By arranging the mounting positions of theLEDs 5 on the two LED substrates 2 in a staggered manner, the thickness direction of the LED substrate becomes thick, but a large number of LEDs can be mounted without increasing the area.

<組み付けのばらつき吸収作用>
光ファイバー７はフレキシブル性を有するため、第１のＬＥＤ基板１と第２のＬＥＤ基板２相互の組み付けのばらつきがあっても、光ファイバー７のフレキシブル性で吸収されるので、光損出が最小限度に抑えられる。<Assembly variation absorption action>
Since theoptical fiber 7 has flexibility, even if there is a variation in the assembly of the first LED substrate 1 and the second LED substrate 2, theoptical fiber 7 is absorbed by the flexibility of theoptical fiber 7, so that light loss is minimized. It can be suppressed.

<光損出低減作用>
第２のＬＥＤ基板２に実装された各ＬＥＤ５の発光部５１と光ファイバー７との間に光集約レンズ６が介装されているので、光を絞る際の損失分を防ぎ、照明効率が高められる。<Light loss reduction effect>
Since thelight aggregating lens 6 is interposed between thelight emitting portion 51 of eachLED 5 mounted on the second LED substrate 2 and theoptical fiber 7, the loss when the light is reduced is prevented and the illumination efficiency is improved. .

次に、この実施例１の効果を説明する。  Next, the effect of the first embodiment will be described.

実施例１の照明装置では、上述のように、表面にＬＥＤ４が格子状に実装配置された第１のＬＥＤ基板１と、表面にＬＥＤ５が格子状に実装配置された第２のＬＥＤ基板２を重ね、該第１のＬＥＤ基板１のＬＥＤ４と第２のＬＥＤ基板２のＬＥＤ５の実装位置を千鳥状に互い違いに配置し、第２のＬＥＤ基板２に実装された各ＬＥＤ５と対面する第１のＬＥＤ基板１の位置に形成した貫通穴１１に光ファイバー７を通し、第２のＬＥＤ基板２に実装された各ＬＥＤ５の光を光ファイバー７を介して第１のＬＥＤ基板１の表面で光らせるように構成されている。これにより、両ＬＥＤ基板の厚さ方向は厚くなるが、面積を広げることなしに多数のＬＥＤ４、５を実装させることができ、これにより、光源密度を上げることができるようになる。  In the illumination device of the first embodiment, as described above, the first LED substrate 1 in which theLEDs 4 are mounted and arranged in a grid pattern on the surface and the second LED substrate 2 in which theLEDs 5 are mounted and arranged in a grid pattern on the surface are provided. First, the mounting positions of theLEDs 4 of the first LED board 1 and theLEDs 5 of the second LED board 2 are alternately arranged in a staggered manner, and the first LEDs facing therespective LEDs 5 mounted on the second LED board 2 are arranged. Theoptical fiber 7 is passed through the through hole 11 formed at the position of the LED substrate 1, and the light of eachLED 5 mounted on the second LED substrate 2 is emitted on the surface of the first LED substrate 1 via theoptical fiber 7. Has been. Thereby, although the thickness direction of both LED boards becomes thick, many LED4, 5 can be mounted without expanding an area, and it becomes possible to raise a light source density by this.

また、光ファイバー７を用いることで、第１のＬＥＤ基板１と第２のＬＥＤ基板２相互の組み付けのばらつきを光ファイバー７のフレキシブル性で吸収することができ、これにより、光損出を最小限度に抑えることができる。  Further, by using theoptical fiber 7, the variation in the assembly of the first LED board 1 and the second LED board 2 can be absorbed by the flexibility of theoptical fiber 7, thereby minimizing the light loss. Can be suppressed.

また、第２のＬＥＤ基板２に実装された各ＬＥＤ４の発光部４１と光ファイバー７との間に光集約レンズ６が介装されている構成としたことで、光を絞る際の損失分を防ぎ、照明効率を高めることができる。
また、光集約レンズ６として断面台形のコリメートレンズが用いられることで、照明効率をさらに高めることができる。In addition, since thelight collecting lens 6 is interposed between thelight emitting portion 41 of eachLED 4 mounted on the second LED substrate 2 and theoptical fiber 7, a loss when the light is reduced is prevented. , Can increase the lighting efficiency.
Further, the use of a collimating lens having a trapezoidal cross section as thelight aggregating lens 6 can further increase the illumination efficiency.

以上本実施例を説明してきたが、本発明は上述の実施例に限られるものではなく、本発明の要旨を逸脱しない範囲の設計変更等があっても、本発明に含まれる。  Although the present embodiment has been described above, the present invention is not limited to the above-described embodiment, and design changes and the like within a scope not departing from the gist of the present invention are included in the present invention.

例えば、実施例１では、ＬＥＤ基板を２枚だけ重ねたが、２枚以上重ねるようにしてもよい。
また、実施例１では、光集約レンズ６として断面台形のコリメートレンズを用いたが、断面台形でなくてもよい。
また、光ファイバー７はその外周に反射体を備えることにより、光の伝達効率を高めることができる。For example, in Example 1, only two LED substrates are stacked, but two or more LED substrates may be stacked.
In the first embodiment, a collimating lens having a trapezoidal cross section is used as thelight aggregating lens 6.
Moreover, theoptical fiber 7 can improve the light transmission efficiency by providing a reflector on the outer periphery thereof.

実施例１の照明装置を示す平面図である。It is a top view which shows the illuminating device of Example 1. FIG.図１のＡ１−Ａ１線における縦断断面図である。It is a longitudinal cross-sectional view in the A1-A1 line of FIG.図２のＢ−Ｂ線における横断面図である。It is a cross-sectional view in the BB line of FIG.

符号の説明Explanation of symbols

１ 第１のＬＥＤ基板
１１ 貫通穴
２ 第２のＬＥＤ基板
３ スペーサー
４ ＬＥＤ
４１ 発光部
５ ＬＥＤ
５１ 発光部
６ 光集約レンズ
７ 光ファイバーDESCRIPTION OF SYMBOLS 1 1st LED board 11 Through-hole 22nd LED board 3Spacer 4 LED
41 Light-emittingpart 5 LED
51Light Emitting Unit 6Light Condensing Lens 7 Optical Fiber

Claims (2)

Translated fromJapanese

表面にＬＥＤが格子状に実装配置されたＬＥＤ基板を少なくとも２枚重ね、
該各ＬＥＤ基板のＬＥＤの実装位置を千鳥状に互い違いに配置し、
前記一方のＬＥＤ基板に実装された各ＬＥＤと対面するもう一方のＬＥＤ基板の位置に形成した貫通穴に光ファイバーを通し、
前記一方のＬＥＤ基板に実装された各ＬＥＤの光を前記光ファイバーを介して前記もう一方のＬＥＤ基板の表面で光らせるように構成したことを特徴とする照明装置。At least two LED substrates on which LEDs are mounted and arranged in a grid pattern are stacked,
Arrange the mounting positions of the LEDs on each LED substrate in a staggered manner,
Passing the optical fiber through a through hole formed at the position of the other LED substrate facing each LED mounted on the one LED substrate,
An illuminating device configured to emit light of each LED mounted on the one LED substrate on the surface of the other LED substrate via the optical fiber. 請求項１に記載の照明装置において、前記一方のＬＥＤ基板に実装された各ＬＥＤの発光部と前記光ファイバーとの間に光集約レンズが介装されていることを特徴とする照明装置。  The lighting device according to claim 1, wherein a light collecting lens is interposed between a light emitting portion of each LED mounted on the one LED substrate and the optical fiber.

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