JP2009087989A - Epitaxial growth film forming method - Google Patents
Epitaxial growth film forming methodDownload PDFInfo
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- 238000010438heat treatmentMethods0.000description4
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/12—Substrate holders or susceptors
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
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Abstract
Translated fromJapaneseDescription
Translated fromJapanese本発明は、エピタキシャル成長膜形成方法に関し、特にエピタキシャル成長膜を効率よく形成する上で問題となる成長膜によるウェハーとサセプタの貼り付き現象を防止することを可能とする膜形成方法に関する。 The present invention relates to an epitaxially grown film forming method, and more particularly to a film forming method that can prevent a wafer and a susceptor from sticking due to a grown film that is a problem in efficiently forming an epitaxially grown film.
エピタキシャル成長装置の一種として枚葉式装置がある。この装置は、横型の加熱炉内に配置された水平円盤型のサセプタの上にウェハーを載せ、これを垂直軸まわりに回転させながら、炉内水平方向に原料ガスを流通させることにより、ウェハーの上面にエピタキシャル膜を形成するものであり、ウェハーの大径化と共に多用されるようになり、３００
ｍｍウェハー対応装置でも主流と目されている。One type of epitaxial growth apparatus is a single wafer type apparatus. In this apparatus, a wafer is placed on a horizontal disk-type susceptor disposed in a horizontal heating furnace, and the wafer gas is circulated in the horizontal direction in the furnace while rotating the wafer around the vertical axis. An epitaxial film is formed on the upper surface, and has come to be frequently used as the diameter of the wafer increases.
It is also regarded as the mainstream in mm wafer compatible devices.
枚葉式エピタキシャル成長装置では、エピタキシャル成長を必要とするウェハーの上面にのみ原料ガスを接触させることを目的として、ウェハーを収容する円形の凹部がサセプタの上面に設けられる。座ぐりと呼ばれるこの凹部内にウェハーを収容してエピタキシャル成長を行うことより、成長膜によるウェハーとサセプタの貼り付き現象が抑制される。 In the single wafer epitaxial growth apparatus, a circular recess for accommodating a wafer is provided on the upper surface of the susceptor for the purpose of bringing the source gas into contact only with the upper surface of the wafer that requires epitaxial growth. Since the wafer is accommodated in this recess called counterbore and epitaxial growth is performed, the phenomenon of sticking of the wafer and the susceptor by the growth film is suppressed.
ところで、エピタキシャル成長を用いるウェハーの用途として、ＩＧＢＴ（Ｉｎｓｕｌａｔｅｄ Ｇａｔｅ Ｂｉｐｏｌａｒ Ｔｒａｎｓｉｓｔｅｒ）に代表されるパワーデバイスがある。パワーデバイス向けエピタキシャルウェハーの製造では、エピタキシャル成長膜の厚みが厚く、１００μｍ程度に達することも少なくない。このような厚膜形成では、サセプタ上のウェハーが凹部内に収容されているにもかかわらず、サセプタ内周面とウェハー外周面との間で、両者に跨がった成長膜による貼り付き現象が発生しやすい。この現象が生じると、エピタキシャル成長後にサセプタからウェハーを取り出すときに、貼り付き部の成長膜を剥がさなければならず、その際にウェハーの外周部分に相当の力が付加されるために、しばしばウェハーにクラックが発生し、割れに至ることもある。 Incidentally, as a use of a wafer using epitaxial growth, there is a power device represented by an IGBT (Insulated Gate Bipolar Transistor). In the production of epitaxial wafers for power devices, the thickness of the epitaxial growth film is large and often reaches about 100 μm. In such a thick film formation, even though the wafer on the susceptor is housed in the recess, the sticking phenomenon due to the growth film straddling the susceptor inner peripheral surface and the wafer outer peripheral surface. Is likely to occur. When this phenomenon occurs, when the wafer is taken out of the susceptor after epitaxial growth, the growth film on the sticking portion must be peeled off, and a considerable force is applied to the outer peripheral portion of the wafer at that time, so the wafer is often applied. Cracks may occur and may lead to cracks.
このように、ウェハーと水平円盤型サセプタの貼り付き現象を防止するための対策として、サセプタ凹部の上面内周部に段差を設け、ウェハー周縁部とサセプタ内周部が接触しないように、ウェハーの位置をサセプタ凹部の中央部寄りに制御する技術は特許文献１に開示されている。 As described above, as a measure for preventing the sticking phenomenon between the wafer and the horizontal disk type susceptor, a step is provided on the inner peripheral portion of the upper surface of the susceptor recess so that the wafer peripheral portion and the susceptor inner peripheral portion do not contact each other. A technique for controlling the position closer to the center of the susceptor recess is disclosed in
一方、枚葉式エピタキシャル成長装置における水平円盤型サセプタの上面に設けられる凹部は基本的に１個であるが、大型の横型加熱炉内に大径の水平円盤型サセプタを配置し、その上面の回転中心回りに複数の凹部を設けて、複数枚のウェハーを同時処理することも考えられている。 On the other hand, the number of recesses provided on the upper surface of a horizontal disk type susceptor in a single wafer epitaxial growth apparatus is basically one, but a large horizontal disk type susceptor is arranged in a large horizontal heating furnace and the upper surface is rotated. It is also considered that a plurality of recesses are provided around the center to simultaneously process a plurality of wafers.
しかしながら、特許文献１に開示されている技術では、水平円盤型サセプタの凹部内でウェハーが径方向にスライドすることによりウェハーの外周面が凹部の内周面に局部的に接触し、その接触部で貼り付き部が形成されやすくなる。このスライドは、サセプタの凹部内にウェハーを自動搬入する際に生じるだけでなく、前述した大型の横型加熱炉内に大径の水平円盤型サセプタを配置し、その上面の回転中心回りに複数の凹部を設けて、複数枚のウェハーを同時処理する技術では、サセプタ凹部内のウェハーに遠心力が作用するため、操業中もウェハーが径方向にスライドし、局部的な接触による貼り付きが生じやすい。従って、特許文献１に示されるサセプタ凹部の上面に段差を設ける技術では、ウェハー外周面とサセプタ内周面との局部的な接触を十分に防止することはできず、ウェハーとサセプタの貼り付き現象が十分に防止されないという問題があった。 However, in the technique disclosed in
本発明は上記の課題に鑑みてなされたものであり、水平円盤型サセプタを使用し、エピタキシャル成長膜を形成する際に、ウェハーとサセプタの貼り付き現象を十分に防止することを可能とするエピタキシャル成長膜形成方法を提供することを目的とする。 The present invention has been made in view of the above problems, and an epitaxial growth film that can sufficiently prevent a wafer-susceptor sticking phenomenon when an epitaxial growth film is formed using a horizontal disk type susceptor. An object is to provide a forming method.
上記課題を解決し目的を達成するために、本発明のエピタキシャル成長膜形成方法は次のように構成されている。 In order to solve the above problems and achieve the object, the epitaxial growth film forming method of the present invention is configured as follows.
（１）本発明にかかるエピタキシャル成長膜形成方法は、水平円盤型のサセプタ上の略中央部に、前記サセプタよりも小径のウェハーをほぼ水平に収容し、前記ウェハー上に気相成長膜を形成する方法であって、前記ウェハーの周縁部よりも内側の底面に隣接する円周状凹部段差と、前記サセプタの周縁部よりも内側の上面円周上に設けられた凸部と、を当接させて、前記ウェハー上に気相成長膜を形成することを特徴とする。 (1) In the epitaxial growth film forming method according to the present invention, a wafer having a diameter smaller than that of the susceptor is accommodated substantially horizontally at a substantially central portion on a horizontal disk type susceptor, and a vapor phase growth film is formed on the wafer. A circumferential concave step adjacent to the bottom surface inside the peripheral edge of the wafer and a convex portion provided on the upper surface circumference inside the peripheral edge of the susceptor are brought into contact with each other. And forming a vapor growth film on the wafer.
（２）上記（１）に記載のエピタキシャル成長膜形成方法において、前記ウェハーの周縁部よりも内側の底面に隣接する円周状凹部段差の高さは、２０μｍ以上であることを特徴とする。 (2) In the epitaxial growth film forming method according to the above (1), the height of the circumferential concave step adjacent to the bottom surface on the inner side than the peripheral edge of the wafer is 20 μm or more.
（３）上記（１）に記載のエピタキシャル成長膜形成方法において、前記ウェハーの周縁部よりも内側の底面に隣接する円周状凹部段差の高さは、前記ウェハーの中央部厚みの３０％以下であることを特徴とする。 (3) In the epitaxial growth film forming method according to (1) above, the height of the circumferential concave step adjacent to the bottom surface inside the peripheral edge of the wafer is 30% or less of the thickness of the central portion of the wafer. It is characterized by being.
（４）上記（１）に記載のエピタキシャル成長膜形成方法において、前記ウェハーの周縁部よりも内側の底面に隣接する円周状凹部段差の高さは、前記サセプタの周縁部よりも内側の上面円周上に設けられた凸部の高さより高いことを特徴とする。 (4) In the epitaxially grown film forming method according to (1), the height of the circumferential concave step adjacent to the bottom surface inside the peripheral edge portion of the wafer is the upper surface circle inside the peripheral edge portion of the susceptor. It is characterized by being higher than the height of the convex part provided on the circumference.
（５）上記（１）に記載のエピタキシャル成長膜形成方法において、前記ウェハーの周縁部よりも内側の底面に隣接する円周状凹部段差の直径は、前記ウェハーの上側平面と、円弧形状を成すベベル面と、の境界部の直径に等しいことを特徴とする。 (5) In the epitaxially grown film forming method according to (1) above, the diameter of the circumferential concave step adjacent to the bottom surface on the inner side of the peripheral edge of the wafer is a bevel that forms an arc shape with the upper plane of the wafer. It is characterized by being equal to the diameter of the boundary between the surface and the surface.
水平円盤形サセプタの上面に設けられた凸部と、ウェハー底面に隣接した凹部段差を当接させる構成を有することにより、水平円盤型サセプタを使用し、エピタキシャル成長膜を形成する際に、ウェハーとサセプタの両者に跨って形成される貼り付き現象を十分に防止するという効果を奏する。 By forming a protrusion provided on the upper surface of the horizontal disk-shaped susceptor and a recess step adjacent to the bottom surface of the wafer, the wafer and the susceptor are formed when an epitaxial growth film is formed using a horizontal disk-type susceptor. There is an effect of sufficiently preventing the sticking phenomenon formed across the two.
以下、本発明にかかるエピタキシャル成長膜形成方法の実施の形態につき、添付図面に基づき説明する。 Embodiments of an epitaxially grown film forming method according to the present invention will be described below with reference to the accompanying drawings.
以下、本実施の形態にかかるエピタキシャル成長膜形成方法について詳細に説明する。図１は、本実施の形態にかかるエピタキシャル成長膜形成方法に実用する膜形成装置の概要図である。膜形成装置１は、ウェハーＷ上に気相成長膜を形成する装置であり、チャンバ２と、ガス供給管３と、整流板４と、サセプタ５と、サセプタ凹部５aと、回転胴６と、ガス排気管７と、ヒーター８と、ウェハーＷと、を備えている。 Hereinafter, the epitaxially grown film forming method according to the present embodiment will be described in detail. FIG. 1 is a schematic diagram of a film forming apparatus that is practically used in the epitaxial growth film forming method according to the present embodiment. The
ガス供給管３は、チャンバ２内の上部、水平方向の略中央部に配設され、ガス（原料ガスもしくはキャリアガス）がチャンバ２内に供給されるように、チャンバ２が外部のガス供給制御装置（図示省略）と接続されている。そして、ガス供給制御装置（図示省略）からは、膜形成装置１において形成する薄膜の種類に応じて、原料ガス（例えば、厚膜の場合はＳｉＨＣｌ３など）、もしくはキャリアガス（例えばＨ2など）等が図１のＡ方向に供給される。The
ガス排気管７は、チャンバ２内の下部、図１の左右に分かれて２箇所に配設され、チャンバ２内部で気相成長に使用された後のガスをチャンバ２外部に排出するように、チャンバ２が外部のガス排気制御装置（図示省略）と接続されている。そして、ガス排気制御装置（図示省略）と接続されていることにより、図１のＢ方向に排出されたガスは、排気ガスとして廃棄される。 The
更に、チャンバ２は、その内部に整流板４と、サセプタ５と、回転胴６と、ヒーター８と、を備えている。 Further, the
整流板４は、ガス供給管３から流入してきた原料ガスの流速を調整するものであり、石英やステンレス等で形成され、ガス供給管３とサセプタ５の間の空間にチャンバ２内の側面に固定されている。また、ウェハーＷに対向する範囲の全域にわたって多数の開口部が設けられており、ウェハーＷ全域にわたってガス流速が均一になるように開口面積が調整されている。 The rectifying
回転胴６は、サセプタ５を回転させる回転体であり、ウェハーＷ上の薄膜が均一に生成されるように、図１のＣ方向に一定の回転速度で高速回転させる駆動機能を有する。なお、回転速度は、本実施の形態にかかる膜形成方法を使用することにより、膜均一性の高い膜を効率的に形成するためには、５００ｒｐｍ以上の速度で回転させることが好ましい。 The rotating
ヒーター８は、サセプタ５上に固定されたウェハーＷを背面側から所定温度（例えば１１００℃程度）に熱する加熱器であり、チャンバ２の外部に備えられた加熱回路（図示省略）から供給される定電流によって所定温度に加熱する。 The
サセプタ５は、気相成長により薄膜を生成するウェハーＷを支持するものであり、ウェハーＷを所定の位置に固定する機能を有する。サセプタ５は、ウェハーＷを保持することから、ホルダとも呼称される。更に、サセプタ５を回転胴６が支持している。サセプタ５には、凹部５ａが設けられており、凹部５ａの位置にあわせてウェハーＷが保持される。 The
以下、サセプタ５上のウェハーＷの保持状態を拡大図で詳細に説明する。図２は、本実施の形態にかかるサセプタ５上のウェハーＷの保持状態を示す拡大断面図である。図２において、ウェハーＷの底面部に隣接して設けられた円周状凹部段差の高さをＨとし、サセプタ５上面に設けられた凸部の高さをＤとする。 Hereinafter, the holding state of the wafer W on the
ウェハーＷ底面部に隣接する凹部段差の高さＨがサセプタ５の凸部の高さＤよりも低い場合、ウェハーＷは周縁部のみでサセプタ５上に支えられることになり、ウェハーＷが破損しやすい。また、周縁部の接触面積が大きくなるため、ウェハーＷとサセプタ５の両者に跨って成膜されることによって貼り付き部が発生しやすいという問題も発生する。従って、ウェハーＷの凹部段差の高さＨはサセプタ５の凸部の高さＤよりも高い方が好ましい。 When the height H of the concave step adjacent to the bottom surface portion of the wafer W is lower than the height D of the convex portion of the
一方、ウェハーＷの凹部段差の高さＨが高すぎると、ウェハーＷと整流板４との距離が近くなり、気相成長が制御しにくくなる。従って、ウェハーＷの凹部段差の高さＨは、２０μｍ以上からウェハーＷの中央部厚みの３０％程度までが適切な範囲である。また、ウェハーＷの凹部段差の高さＨが高すぎると、ウェハーＷとサセプタ５の空間が広くなってしまい、原料ガスが回り込むことでウェハーＷの周縁部に貼り付き部が発生しやすいといった問題が発生するため、ウェハーＷの凹部段差の高さＨはサセプタ５の凸部の高さＤと同等、もしくはわずかに高い程度が好ましい。 On the other hand, if the height H of the concave step of the wafer W is too high, the distance between the wafer W and the rectifying
同様に、原料ガスが回りこむ空間が極力狭い方が貼り付き現象の防止という観点で好ましいという理由から、ウェハーＷ底面部に隣接する凹部段差の直径Ｒｂは、ウェハーＷの上面部と円弧形状のベベル面（傾斜面）の境界部の直径と等しく、直径ＲｂはウェハーＷの外周直径Ｒａの９９．６％程度であることが好ましい。 Similarly, the diameter Rb of the recess step adjacent to the bottom surface of the wafer W is the same as that of the top surface of the wafer W because of the reason that the space in which the source gas flows is as narrow as possible from the viewpoint of preventing the sticking phenomenon. It is equal to the diameter of the boundary portion of the bevel surface (inclined surface), and the diameter Rb is preferably about 99.6% of the outer peripheral diameter Ra of the wafer W.
また、図３は、本実施の形態にかかるサセプタ５上のウェハーＷの保持状態変形例を示す拡大断面図である。図３は、サセプタ９の形状がサセプタ５と異なる構成を示している。サセプタ９は、高さＤの突起部を設けた構成となっている。 FIG. 3 is an enlarged sectional view showing a modified example of the holding state of the wafer W on the
なお、ウェハーＷ底面部に隣接する円周状凹部段差の形状とサセプタ５上面の凸部の形状は、前述のように当接することにより、サセプタ５上のウェハーＷの横ずれを防止する構成を有することが本実施の形態にかかるエピタキシャル成長膜形成方法の主旨であり、本実施の形態記載の構成に限定されるものではない。 Incidentally, the shape of the circumferential concave step adjacent to the bottom surface of the wafer W and the shape of the convex portion of the upper surface of the
以下、本実施の形態にかかるエピタキシャル成長膜形成方法の膜形成手順を詳細に説明する。図４は、本実施の形態にかかるエピタキシャル成長膜形成方法の膜形成手順を示すフローチャートである。図４に従って、膜形成手順を説明する。 Hereinafter, a film forming procedure of the epitaxially grown film forming method according to the present embodiment will be described in detail. FIG. 4 is a flowchart showing a film forming procedure of the epitaxially grown film forming method according to the present embodiment. The film formation procedure will be described with reference to FIG.
最初に、ウェハーＷをサセプタ５上に設置する（ステップＳ１００）。サセプタ５を高速回転させる（ステップＳ１０１）。ウェハーＷ上に気相成長膜を形成する（ステップＳ１０２）。他のウェハーに気相成長膜を形成する場合（ステップＳ１０３：Ｙｅｓ）、ステップＳ１００に戻る。一方、他のウェハーに気相成長膜を形成しない場合（ステップＳ１０３：Ｎｏ）、作業を終了する。 First, the wafer W is set on the susceptor 5 (step S100). The
以上述べたように、本実施の形態にかかる膜形成方法によれば、ウェハーＷ底面部に隣接する円周状凹部段差とサセプタ５上面円周上に設けられた凸部を当接させる構成としたことにより、気相成長膜を形成するウェハーＷを保持するサセプタ５を高速回転させても、ウェハーＷの横ずれがなく、かつウェハーＷとサセプタ５に跨った貼り付き現象の発生を防止して、ウェハーＷをサセプタ５から取り外す際にウェハーＷを破損させることのないエピタキシャル成長膜形成方法を提供する。 As described above, according to the film forming method according to the present embodiment, the circumferential concave step adjacent to the bottom surface of the wafer W and the convex provided on the upper surface of the
なお、本実施の形態においては、サセプタ５上面に設けられた凸部は、円周状に設けられた構成を図示して詳細を説明したが、円周の仮想線上に等間隔に配置された複数の突起部（例えば、ピン等）となる形状であってもよい。 In the present embodiment, the convex portions provided on the upper surface of the
更に、本実施の形態によれば、常温におけるウェハー洗浄の際にも外周ガイドを不要とし、ガイドによる洗浄液の局所的な流れの変化を起こすことなく、全面の洗浄が可能となる。また、ウェハーを置いてあるだけなので、取り外しおよび設置に手間もかからない。 Furthermore, according to the present embodiment, the outer periphery guide is not required even when cleaning the wafer at normal temperature, and the entire surface can be cleaned without causing a change in the local flow of the cleaning liquid by the guide. Moreover, since only the wafer is placed, it does not take time to remove and install.
なお、本実施の形態においては、中央に開口部を有する所謂略ドーナツ型形状のサセプタ５と、サセプタ５に収容されるウェハーＷから構成される膜形成装置１を図１に示した。しかし、中央に開口部を有さない所謂略皿形状のサセプタ形状においても、本発明と同様の効果を得られるものである。 In the present embodiment, a
１ 膜形成装置
２ チャンバ
３ ガス供給管
４ 整流板
５ サセプタ
５a サセプタ凹部
６ 回転胴
７ ガス排気管
８ ヒーター
９ サセプタ
Ｗ ウェハー
Ａ ガス供給方向
Ｂ ガス排気方向
Ｃ 回転胴回転方向
Ｈ ウェハーＷの円周状凹部段差の高さ
Ｄ サセプタ５およびサセプタ９の上面部凸部の高さ
Ｒａ ウェハーＷの外周直径
Ｒｂ ウェハーＷの円周状凹部段差の直径
DESCRIPTION OF
Claims (5)
Translated fromJapanese前記ウェハーの周縁部よりも内側の底面に隣接する円周状凹部段差と、前記サセプタの周縁部よりも内側の上面円周上に設けられた凸部と、を当接させて、前記ウェハー上に気相成長膜を形成することを特徴とするエピタキシャル成長膜形成方法。In a substantially central part on a horizontal disk type susceptor, a wafer having a diameter smaller than that of the susceptor is accommodated substantially horizontally, and a vapor phase growth film is formed on the wafer,
A circumferential concave step adjacent to the bottom surface inside the peripheral edge of the wafer and a convex portion provided on the upper surface circumference inside the peripheral edge of the susceptor are brought into contact with each other on the wafer. A method for forming an epitaxially grown film, comprising forming a vapor grown film on the substrate.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004327761A (en)* | 2003-04-25 | 2004-11-18 | Sumitomo Mitsubishi Silicon Corp | Susceptor for epitaxial growth |
| US8021484B2 (en)* | 2006-03-30 | 2011-09-20 | Sumco Techxiv Corporation | Method of manufacturing epitaxial silicon wafer and apparatus therefor |
| WO2009020024A1 (en)* | 2007-08-03 | 2009-02-12 | Shin-Etsu Handotai Co., Ltd. | Susceptor and method for manufacturing silicon epitaxial wafer |
| JP5283370B2 (en)* | 2007-11-29 | 2013-09-04 | 株式会社ニューフレアテクノロジー | Vapor growth apparatus and vapor growth method |
- 2007
- 2007-09-27JPJP2007252062Apatent/JP2009087989A/enactivePending
- 2008
- 2008-09-25USUS12/237,499patent/US8404044B2/ennot_activeExpired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011119336A (en)* | 2009-12-01 | 2011-06-16 | Mitsubishi Electric Corp | Manufacturing method of semiconductor device and semiconductor substrate to be used therefor |
| CN108987304A (en)* | 2017-05-30 | 2018-12-11 | Asm知识产权私人控股有限公司 | Substrate processing apparatus, substrate processing method using same and baseplate support device |
| CN108987304B (en)* | 2017-05-30 | 2022-07-05 | Asm知识产权私人控股有限公司 | Substrate supporting device |
Also Published As
| Publication number | Publication date |
|---|---|
| US8404044B2 (en) | 2013-03-26 |
| US20090087560A1 (en) | 2009-04-02 |
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