Movatterモバイル変換


[0]ホーム

URL:


JP2007079325A - Micro lens array - Google Patents

Micro lens array
Download PDF

Info

Publication number
JP2007079325A
JP2007079325AJP2005269363AJP2005269363AJP2007079325AJP 2007079325 AJP2007079325 AJP 2007079325AJP 2005269363 AJP2005269363 AJP 2005269363AJP 2005269363 AJP2005269363 AJP 2005269363AJP 2007079325 AJP2007079325 AJP 2007079325A
Authority
JP
Japan
Prior art keywords
microlens array
lens
light
light wavelength
microlens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005269363A
Other languages
Japanese (ja)
Inventor
Ichiro Osaka
一朗 大坂
Takashi Matsumura
隆史 松村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi LtdfiledCriticalHitachi Ltd
Priority to JP2005269363ApriorityCriticalpatent/JP2007079325A/en
Publication of JP2007079325ApublicationCriticalpatent/JP2007079325A/en
Pendinglegal-statusCriticalCurrent

Links

Images

Landscapes

Abstract

Translated fromJapanese

【課題】
画像撮影用のイメージセンサとマイクロレンズアレイからなる撮像装置において迷光よけマイクロレンズアレイを提供する。
ある焦点位置で精度良く合焦するマイクロレンズアレイのレンズ同士の接合部で迷光が生じる可能性があった。
【解決手段】
マイクロレンズアレイの基板上に印刷技術で透明材料を積層しレンズを形成するとともにレンズ同士の接合部に遮光材料を積層することで迷光が生じるのを防ぐことで実現する。
【選択図】図1
【Task】
A microlens array for preventing stray light is provided in an image pickup apparatus including an image sensor for image capturing and a microlens array.
There is a possibility that stray light may be generated at the joint between the lenses of the microlens array that is focused accurately at a certain focal position.
[Solution]
It is realized by forming a lens by laminating a transparent material on a substrate of a microlens array by a printing technique and preventing a stray light by laminating a light shielding material at a joint portion between the lenses.
[Selection] Figure 1

Description

Translated fromJapanese

本発明は、妨害光を低減した近接撮像用マイクロレンズアレイ及びそれを用いた個人認証装置に関する。  The present invention relates to a microlens array for proximity imaging with reduced interference light and a personal authentication device using the same.

光を受光し、電気信号を出力する受光部が二次元的に配列されているイメージセンサ上に配置されたマイクロレンズアレイにおいて、一般的にはイメージセンサ内に配置された受光素子開口部の上部に、凸レンズ状の透明層を配置することが多い。この透明層は、大きさが小さく受光部毎に凸レンズ形状となっているため、マイクロレンズアレイと呼ばれる。その製造方法としては、半導体プロセスなどを使い、開口部を含む半導体チップ上に、一様な光学的透明な材料の層を生成し、しかる後に、エッチング等により表面を削って凸レンズ形状にする方法や、表面に生成したマスクの親和性などで光学的に透明な材料を、表面張力で水滴のよう盛り上げて凸レンズ形状にする方法などが知られている。この方法では、開口率を向上させる目的で、半導体チップ上にマイクロレンズアレイを構成するのは効果があるが、空間の像を撮影するには材料選択上の制限による屈折率の制限や曲率の制限、また精度的な問題などがあり不適である。それに対し、微細形状を有する金型を用いてレプリカを作製する方法のマイクロレンズアレイ作成方法では、材料選択上の制限による屈折率の制限や曲率の制限が緩くなり空間の像を撮影するに必要充分な精度が得られる。  In a microlens array arranged on an image sensor in which light receiving parts that receive light and output electrical signals are arranged two-dimensionally, generally above the light receiving element opening arranged in the image sensor In addition, a convex lens-shaped transparent layer is often disposed. Since this transparent layer is small in size and has a convex lens shape for each light receiving portion, it is called a microlens array. As a manufacturing method thereof, a method of forming a uniform optically transparent material layer on a semiconductor chip including an opening using a semiconductor process or the like, and then scraping the surface by etching or the like to form a convex lens shape. In addition, there is known a method in which an optically transparent material due to the affinity of a mask generated on the surface is raised to form a convex lens by swelling like a water drop with surface tension. In this method, it is effective to construct a microlens array on a semiconductor chip for the purpose of improving the aperture ratio. However, in order to take an image of a space, the refractive index is limited or the curvature is limited by the material selection. There are limitations and accuracy problems. On the other hand, in the microlens array creation method, which is a method of making a replica using a mold having a fine shape, the restriction of the refractive index and the restriction of the curvature due to the restriction on the material selection are relaxed, and it is necessary to take an image of the space. Sufficient accuracy can be obtained.

特開平6−204443号公報 固体撮像素子およびその製造方法JP, 6-204443, A Solid-state image sensor and its manufacturing method特開2001−352051号公報 固体撮像素子JP, 2001-352051, A Solid-state image sensor特開2005−31460号公報 複眼光学系JP, 2005-31460, A Compound eye optical system

しかしながら、金型でレプリカを作製する方法のマイクロレンズアレイのレンズとレンズの間の接続部は、入射光が、反射,屈折をし迷光の原因となる可能性がある。迷光が撮像素子に入力すると妨害信号となり画像のコントラスト低下、ひどい場合には、撮像が不可能となっていた。  However, there is a possibility that incident light may be reflected and refracted to cause stray light at the connection part between the lenses of the microlens array in the method of producing a replica with a mold. When stray light is input to the image sensor, it becomes a disturbing signal and the contrast of the image is lowered.

また、これに対して、他の遮光板などで遮光することも提案されてはいるが、金型でレプリカを作製する方法では、位置あわせや一体化が難しかった。  On the other hand, it has been proposed to shield the light with another light shielding plate or the like, but it is difficult to align and integrate the replica with the mold.

課題を解決するためには、微細印刷技術を用いて、マイクロレンズアレイをビルドアップ式に堆積して構成する時、レンズ同士の接続部に目的の波長の光を遮光する材質を積層させる。  In order to solve the problem, when a microlens array is deposited and constructed using a fine printing technique, a material that blocks light of a target wavelength is laminated on a connection portion between the lenses.

微細印刷技術を用いて、マイクロレンズアレイをビルドアップ式に堆積して構成し、接続部に目的の波長の光を遮光する材質を積層させる技術を用いれば、マイクロレンズの接続部による迷光の妨害が排除できる。  Using micro printing technology, a microlens array is built up in a build-up manner, and if the technology is used to laminate a material that blocks light of the desired wavelength at the connection, stray light is blocked by the connection of the microlens. Can be eliminated.

本発明では、所望光波長で、前記所望光を透過する基板上に、印刷技術を使い前記所望光を透過する材料を複数回積層し、集光力を持つレンズを形成していく。これと同時にレンズ同士の接合部に前記所望光波長を遮光する材料を印刷する。  In the present invention, on the substrate that transmits the desired light at the desired light wavelength, a material that transmits the desired light is laminated a plurality of times using a printing technique to form a lens having a light collecting power. At the same time, a material that blocks the desired light wavelength is printed on the joint between the lenses.

これによって、前記問題点の排除が可能になる。  Thereby, the problem can be eliminated.

図1,図2を用いて本発明の実施例を説明する。1がレンズアレイ基板、2がイメージセンサである。レンズアレイ基板1は、所望光波長で透過する特性を持たせている。前記レンズアレイ基板1の表面に印刷技術を用いて前記所望光波長で透過する特性の材質10を印刷する。このような手順で次々に印刷を繰り返し図1の11,12のように重ねていく。それとともに、図1の13のように前記所望光波長で遮光する特性の材質13を印刷をする。このように印刷を繰り返して最終的には図2の14のレンズをこのようにして構成する。  An embodiment of the present invention will be described with reference to FIGS. Reference numeral 1 is a lens array substrate, and 2 is an image sensor. The lens array substrate 1 has a characteristic of transmitting at a desired light wavelength. Amaterial 10 having a characteristic of transmitting at the desired light wavelength is printed on the surface of the lens array substrate 1 using a printing technique. In this procedure, printing is repeated one after another and is repeated as indicated by 11 and 12 in FIG. At the same time, amaterial 13 having a characteristic of shielding light at the desired light wavelength is printed as shown in FIG. Thus, the printing is repeated, and finally thelens 14 shown in FIG. 2 is configured in this way.

前記イメージセンサ2には開口部20が図1の10,11,12、図2の14のレンズと1対1で二次元的に配置される。この様子を図3に示す。  In theimage sensor 2, anopening 20 is two-dimensionally arranged in a one-to-one relationship with thelenses 10, 11, 12 in FIG. This is shown in FIG.

また、図2のよう、前記イメージセンサ2の前記開口部20には、前記レンズ14により3−1,3−2,3−3の位置の像が結像するようになっている。このようにして、空間の像をサンプリングすることが可能である。  Further, as shown in FIG. 2, an image at positions 3-1, 3-2 and 3-3 is formed by thelens 14 in theopening 20 of theimage sensor 2. In this way, it is possible to sample an image of the space.

図4を用いて本発明の他の一実施例を説明する。図1,図2,図3と同様の構成例には同符号を付してある。  Another embodiment of the present invention will be described with reference to FIG. Configuration examples similar to those in FIGS. 1, 2, and 3 are denoted by the same reference numerals.

図1に示す手順で、レンズアレイ基板1の表面に図4の14のよう集光力のあるレンズ14を構成すると同時に各レンズ同士の接合部に所望光波長で遮光する遮光部13を構成する。さらに他のレンズアレイ基板4の表面にも図1のような手順を使い図4の44のようにレンズを構成すると同時に各レンズ同士の接合部に所望光波長で遮光する遮光部43を構成する。以上のように構成した前記レンズアレイ基板1と前記レンズ14とを前記レンズアレイ基板4と前記レンズ44とを図4の如く前記レンズ14と前記レンズ44とが正対させるよう構成する。これによって、光学的な収差などの影響を少なくする構成が可能となる。  In the procedure shown in FIG. 1, alens 14 having a condensing power is formed on the surface of the lens array substrate 1 as shown in FIG. 4, and at the same time, a light-shielding portion 13 that shields light at a desired light wavelength is formed at the joint between the lenses. . Further, on the surface of anotherlens array substrate 4, the procedure shown in FIG. 1 is used to construct a lens as shown in 44 in FIG. 4, and at the same time, alight shielding portion 43 that shields light at a desired light wavelength is constructed at the junction between the lenses. . The lens array substrate 1 and thelens 14 configured as described above are configured such that thelens array substrate 4 and thelens 44 are opposed to each other as shown in FIG. This makes it possible to reduce the influence of optical aberrations and the like.

図5を用いて本発明のさらに他の一実施例を説明する。図1,図2,図3,図4と同様の構成例には同符号を付してある。  Another embodiment of the present invention will be described with reference to FIG. Configuration examples similar to those of FIGS. 1, 2, 3, and 4 are denoted by the same reference numerals.

図1では、レンズを構成する部分を印刷する際に遮光材料13を印刷していたが、本実施例では、前記遮光材料13と印刷すると同時に、所望光波長で透過する材料を15のように印刷し、その上部に所望光波長で透過する材料を16,17のように積層し、しかる後に所望光波長で透過する材料を10,11,12のよう積層しレンズを構成する。以上のようにレンズ同士の接合部から離れた構成も可能である。  In FIG. 1, thelight shielding material 13 is printed when the portion constituting the lens is printed. However, in this embodiment, the material that transmits at the desired light wavelength at the same time as thelight shielding material 13 is printed as 15. The material is printed, and a material that transmits at the desired light wavelength is laminated on the upper portion thereof as 16 and 17, and then a material that is transmitted at the desired light wavelength is laminated as 10, 11, and 12 to form a lens. As described above, a configuration away from the joint between the lenses is also possible.

以上、実施例を説明したが、図1,図5での所望光波長での透過材料10,11,12,14,15,16,17は、同じ材料でも、屈折率や分散の値の異なる材料でも本発明の意図からはずれない。  Although the embodiments have been described above, thetransmissive materials 10, 11, 12, 14, 15, 16, and 17 at the desired light wavelengths in FIGS. 1 and 5 are the same material but have different refractive indexes and dispersion values. Even the material does not depart from the intent of the present invention.

以上説明したマイクロレンズアレイは、静脈などを利用し個人を認証する認証装置などに用いることができる。  The microlens array described above can be used in an authentication device that authenticates an individual using a vein or the like.

本発明は、イメージセンサとマイクロレンズアレイを独立して製作した、マイクロレンズアレイの迷光対策として有効である。  The present invention is effective as a countermeasure against stray light in a microlens array in which an image sensor and a microlens array are independently manufactured.

レンズアレイ構造,イメージセンサ断面図。Lens array structure, image sensor sectional view.レンズアレイ,イメージセンサ断面図。Lens array and image sensor sectional view.レンズアレイ,イメージセンサ斜視図。The lens array and an image sensor perspective view.他のレンズアレイ構成,イメージセンサ断面図。Other lens array composition, image sensor sectional view.他のレンズアレイ構造,イメージセンサ断面図。Other lens array structure, image sensor sectional drawing.

符号の説明Explanation of symbols

1,4…レンズアレイ、2…イメージセンサ、3…像位置、10,11,12,15,16,17…透過材料、13,43…遮光材料、14,44…レンズ、20…開口部。
DESCRIPTION OFSYMBOLS 1,4 ... Lens array, 2 ... Image sensor, 3 ...Image position 10, 11, 12, 15, 16, 17 ... Transmission material, 13, 43 ... Light-shielding material, 14, 44 ... Lens, 20 ... Opening.

Claims (5)

Translated fromJapanese
所望光波長で透過する材料の積層を繰り返してレンズを構成するマイクロレンズアレイであって、レンズ同士の接合部を他の所望光波長で遮光する材料を積層して配置することを特徴とするマイクロレンズアレイ。  A microlens array in which a lens is configured by repeatedly laminating materials that transmit at a desired light wavelength, and the microlens is formed by laminating and arranging a material that shields a junction between lenses at another desired light wavelength. Lens array. 請求項1において、マイクロレンズアレイを構成する積層を印刷で行うことを特徴とするマイクロレンズアレイ。  2. The microlens array according to claim 1, wherein the layers constituting the microlens array are printed. 請求項1のマイクロレンズアレイを2枚、レンズ側を正対して配置することを特徴とするマイクロレンズアレイ。  A microlens array comprising two microlens arrays according to claim 1 and the lens side facing each other. 所望光波長で透過する材料で出来た基板上に同様に所望光波長で透過する材料の積層を繰り返してレンズを構成するマイクロレンズアレイであって、レンズ同士の接合部の基板側に他の所望光波長で遮光する材料をあらかじめ積層して配置することを特徴とするマイクロレンズアレイ。  A microlens array in which a lens is configured by repeatedly laminating a material that transmits light at a desired light wavelength on a substrate made of a material that transmits light at the desired light wavelength. A microlens array characterized in that materials that block light at a light wavelength are laminated in advance. 請求項1〜4のいずれか記載のマイクロレンズアレイを備え、個人の認証を行う個人認証装置。
A personal authentication device comprising the microlens array according to claim 1 and performing personal authentication.
JP2005269363A2005-09-162005-09-16 Micro lens arrayPendingJP2007079325A (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP2005269363AJP2007079325A (en)2005-09-162005-09-16 Micro lens array

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP2005269363AJP2007079325A (en)2005-09-162005-09-16 Micro lens array

Publications (1)

Publication NumberPublication Date
JP2007079325Atrue JP2007079325A (en)2007-03-29

Family

ID=37939674

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP2005269363APendingJP2007079325A (en)2005-09-162005-09-16 Micro lens array

Country Status (1)

CountryLink
JP (1)JP2007079325A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
EP2165315B1 (en)*2007-07-042014-09-10Bundesdruckerei GmbHDocument recording system, and document recording method
EP3358618B1 (en)*2015-09-292021-08-11Dai Nippon Printing Co., Ltd.Imaging module and imaging device
CN113703182A (en)*2020-05-222021-11-26北京芯海视界三维科技有限公司Method for manufacturing lenticular grating
CN113703183A (en)*2020-05-222021-11-26北京芯海视界三维科技有限公司Lens grating, display module, display screen and display

Citations (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPH01213080A (en)*1988-02-221989-08-25Sony CorpSolid state image pickup device
JPH09307697A (en)*1996-05-141997-11-28Ricoh Opt Ind Co LtdMicrolens array, image sensor and optical image transmission element
JP2000227506A (en)*1999-02-082000-08-15Dainippon Printing Co Ltd Optical element and manufacturing method thereof
JP2001330709A (en)*2000-05-242001-11-30Dainippon Ink & Chem Inc Shielding unit integrated microlens array and method of forming light-shielding film
JP2003006627A (en)*2001-06-182003-01-10Nec CorpFingerprint input device
JP2003240911A (en)*2002-02-222003-08-27Seiko Epson Corp Microlens manufacturing method, microlens, optical film, projection screen, and projector system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPH01213080A (en)*1988-02-221989-08-25Sony CorpSolid state image pickup device
JPH09307697A (en)*1996-05-141997-11-28Ricoh Opt Ind Co LtdMicrolens array, image sensor and optical image transmission element
JP2000227506A (en)*1999-02-082000-08-15Dainippon Printing Co Ltd Optical element and manufacturing method thereof
JP2001330709A (en)*2000-05-242001-11-30Dainippon Ink & Chem Inc Shielding unit integrated microlens array and method of forming light-shielding film
JP2003006627A (en)*2001-06-182003-01-10Nec CorpFingerprint input device
JP2003240911A (en)*2002-02-222003-08-27Seiko Epson Corp Microlens manufacturing method, microlens, optical film, projection screen, and projector system

Cited By (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
EP2165315B1 (en)*2007-07-042014-09-10Bundesdruckerei GmbHDocument recording system, and document recording method
EP3358618B1 (en)*2015-09-292021-08-11Dai Nippon Printing Co., Ltd.Imaging module and imaging device
EP3937246A3 (en)*2015-09-292022-04-20Dai Nippon Printing Co., Ltd.Lens sheet, lens sheet unit, imaging module, imaging device
US11333802B2 (en)2015-09-292022-05-17Dai Nippon Printing Co., Ltd.Lens sheet, lens sheet unit, imaging module, imaging device
CN113703182A (en)*2020-05-222021-11-26北京芯海视界三维科技有限公司Method for manufacturing lenticular grating
CN113703183A (en)*2020-05-222021-11-26北京芯海视界三维科技有限公司Lens grating, display module, display screen and display

Similar Documents

PublicationPublication DateTitle
US11323608B2 (en)Image sensors with phase detection auto-focus pixels
JP5009209B2 (en) Wafer-like optical device and manufacturing method thereof, electronic element wafer module, sensor wafer module, electronic element module, sensor module, and electronic information device
JP6196911B2 (en) Solid-state imaging device and imaging device
KR101688307B1 (en)Back side illumination image sensor with non-planar optical interface
JP6082794B2 (en) Image sensor device, CIS structure, and formation method thereof
CN111160325A (en)Optical fingerprint identification device, preparation method thereof and touch terminal
KR102801193B1 (en) Optical elements, imaging elements and imaging devices
CN101826542A (en)Solid-state imaging device, method of manufacturing the same, and electronic apparatus
JP2014187160A (en)Solid-state imaging device and portable information terminal
JP2006319329A (en) Image sensor with embedded lens
CN110555367B (en) Optical fingerprint sensor module
KR100640972B1 (en) CMOS image sensor and its manufacturing method
JP2012065021A (en)Solid state imaging device
US20240120358A1 (en)Solid-state imaging device, method for manufacturing solid-state imaging device, and electronic apparatus
JP5918938B2 (en) Lens array plate and erecting equal-magnification lens array plate manufacturing method
WO2006046396A1 (en)Camera module
US9543352B2 (en)CMOS image sensor with embedded micro-lenses
US10868945B2 (en)Light-field camera and method using wafer-level integration process
CN111353478A (en)Micro-lens array and manufacturing method thereof, biological identification module and electronic equipment thereof
KR102831769B1 (en) Optical elements, imaging elements and imaging devices
JP2007079325A (en) Micro lens array
US20060145056A1 (en)Image sensor having diffractive lens and method for fabricating the same
JP2012190926A (en)Imaging device, and biological information acquisition device having the same
CN211787124U (en)Biometric imaging apparatus and electronic apparatus
JP2005223716A (en)Image sensor module and lens unit therefor

Legal Events

DateCodeTitleDescription
A621Written request for application examination

Free format text:JAPANESE INTERMEDIATE CODE: A621

Effective date:20071129

A711Notification of change in applicant

Free format text:JAPANESE INTERMEDIATE CODE: A712

Effective date:20091222

A131Notification of reasons for refusal

Free format text:JAPANESE INTERMEDIATE CODE: A131

Effective date:20100601

A977Report on retrieval

Free format text:JAPANESE INTERMEDIATE CODE: A971007

Effective date:20100601

A02Decision of refusal

Free format text:JAPANESE INTERMEDIATE CODE: A02

Effective date:20101012


[8]ページ先頭

©2009-2025 Movatter.jp