【０００１】[0001]
【発明の属する技術分野】 本発明は、多層配線基板な
どを作製するための配線基板用絶縁シートと、それを用
いた多層配線基板及びその製造方法に関するものであ
る。TECHNICAL FIELD The present invention relates to an insulating sheet for a wiring board for producing a multilayer wiring board and the like, a multilayer wiring board using the same, and a method for manufacturing the same.
【０００２】[0002]
【従来技術】近年、電子機器は小型化が進んでいるが、
近年携帯情報端末の発達や、コンピューターを持ち運ん
で操作するいわゆるモバイルコンピューティングの普及
によってさらに小型、薄型且つ高精細の多層配線基板が
求められる傾向にある。2. Description of the Related Art Recently, electronic devices have been downsized,
In recent years, with the development of portable information terminals and the spread of so-called mobile computing in which a computer is carried and operated, there is a tendency for a smaller, thinner, and higher-definition multilayer wiring board.
【０００３】また、通信機器に代表されるように、高速
動作が求められる電子機器が広く使用されるようになっ
てきた。高速動作が求められるということは、高い周波
数の信号に対し、正確なスイッチングが可能であるなど
多種な要求を含んでいる。そのような電子機器に対応す
るため、高速な動作に適した多層プリント配線板が求め
られている。In addition, electronic devices which are required to operate at high speed, such as communication devices, have come into wide use. The demand for high-speed operation includes various requirements such as accurate switching for high-frequency signals. In order to support such electronic devices, a multilayer printed wiring board suitable for high-speed operation is required.
【０００４】高速な動作を行うためには、配線の長さを
短くし、電気信号の伝播に要する時間を短縮することが
必要である。配線の長さを短縮するために、配線の幅を
細くし、配線の間隙を小さくするという、小型、薄型且
つ高精細の多層配線基板が求められる傾向にある。In order to operate at high speed, it is necessary to shorten the length of wiring and shorten the time required for electric signal propagation. In order to reduce the length of the wiring, the width of the wiring is made narrower and the gap between the wirings is made smaller, and there is a tendency for a small, thin and high-definition multilayer wiring board.
【０００５】そのような高密度配線の要求に対応するた
め、セラミック多層配線基板の製造工程と同様な工程、
即ちビアホール導体及び配線回路層が形成された複数の
絶縁シートを積層する多層プリント配線板が特開平１０
−２７９５９号などによって提案されている。In order to meet the demand for such high-density wiring, a process similar to the manufacturing process of a ceramic multilayer wiring board,
That is, a multilayer printed wiring board in which a plurality of insulating sheets having via-hole conductors and wiring circuit layers are laminated is disclosed.
-27959 and the like.
【０００６】この方法では、具体的には、絶縁シートに
ビアホールを加工し金属粉末を充填してビアホール導体
を形成した後、予め表面に金属箔からなる配線回路層が
形成された転写シートから、前記配線回路層を転写して
配線回路層を形成して１層の配線シートを作製し、同様
にして作製した複数の配線シートを積層して一体化して
多層化するものである。In this method, specifically, after forming a via hole in an insulating sheet and filling a metal powder to form a via hole conductor, a transfer sheet having a wiring circuit layer made of a metal foil formed on the surface in advance is used. The wiring circuit layer is transferred to form a wiring circuit layer to produce a single wiring sheet, and a plurality of wiring sheets produced in the same manner are laminated and integrated to form a multilayer.
【０００７】[0007]
【発明が解決しようとする課題】上記の特開平１０−２
７９５９号によって提案されている転写法では、絶縁シ
ートエッチング液やメッキ液などの薬品に浸漬しないド
ライプロセスで作製することができるためため絶縁シー
トの劣化が無く、また熱と圧力により配線回路層を絶縁
シート表面に埋設させるため平坦性に優れるなどの長所
を有する。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
In the transfer method proposed by No. 7959, since the insulating sheet can be manufactured by a dry process that is not immersed in a chemical such as an etching solution or a plating solution, the insulating sheet is not deteriorated and the wiring circuit layer is formed by heat and pressure. Since it is embedded in the surface of the insulating sheet, it has advantages such as excellent flatness.
【０００８】しかしながら、ビアホールをレーザ、パン
チング、ドリル等により加工する際に絶縁シートに局部
的に加工熱が発生して絶縁層が変質しないように、その
加工条件を制御する、ビアホール中への導電ペーストの
充填性を考慮して導体ペーストの粘度などを管理するこ
とが必要である。ビアホール導体が形成された絶縁シー
トへの配線回路層の転写時にビアホール導体との位置ず
れが発生しないように、厳密な位置合せと積層処理が必
要である、などの工程管理が必要であり、それによって
製品の歩留りが低下しやすいという問題があった。However, when processing the via hole by laser, punching, drilling or the like, the processing conditions are controlled so that the processing heat is not locally generated in the insulating sheet and the insulating layer is not deteriorated. It is necessary to control the viscosity of the conductor paste in consideration of the filling property of the paste. It is necessary to perform process control such as strict alignment and stacking processing so that misalignment with the via hole conductor does not occur during transfer of the wiring circuit layer to the insulating sheet on which the via hole conductor is formed. Therefore, there is a problem that the yield of the product tends to decrease.
【０００９】さらに、近年の高密度配線化で、ビアホー
ルの数が増大することに伴い、加工時のタクトタイムが
増大し、またビアホール加工時に発生する加工屑の除去
にタクトタイムの増加及び工程の増加を伴い、結果とし
てコスト高になる問題があった。Furthermore, due to the increase in the number of via holes due to the recent increase in the density of wiring, the takt time during processing increases, and the takt time and the number of steps for removing the processing scraps generated during the processing of via holes increase. There is a problem that the cost increases as a result of the increase.
【００１０】したがって、本発明は、上記従来の課題を
解決するもので、ビアホールの加工が不要であり、配線
回路層と貫通導体との位置ずれを防止した多層配線基板
作製用の絶縁シート及びその多層配線基板とその製造方
法を提供することである。Therefore, the present invention solves the above-mentioned conventional problems, does not require the processing of via holes, and prevents the positional displacement between the wiring circuit layer and the through conductors, and an insulating sheet for producing a multilayer wiring board and the same. A multilayer wiring board and a method for manufacturing the same are provided.
【００１１】[0011]
【課題を解決するための手段】本発明の配線基板用絶縁
シートは、少なくとも熱硬化性樹脂と、導電性粒子を全
量中５〜３０体積％の割合で含有し、該導電性粒子が
銅、アルミニウム、金、銀のうちから選ばれる少なくと
も１種の金属と、２４０℃以下の融点の低融点半田から
なり、低融点半田の割合が、導電性粒子中において５〜
５０体積％で含まれることを特徴とするものである。な
お、前記導電性粒子は、銅、アルミニウム、金、銀のう
ちから選ばれる少なくとも１種の金属粒子の表面に、前
記低融点半田を被覆してなることが望ましい。The insulating sheet for wiring boards of the present invention contains at least a thermosetting resin and conductive particles in a proportion of 5 to 30% by volume in the total amount, and the conductive particles are copper, At least one metal selected from aluminum, gold, and silver, and low melting point solder having a melting point of 240 ° C. or less, and the proportion of the low melting point solder is 5 to 5 in the conductive particles.
It is characterized in that the content is 50% by volume. The conductive particles are preferably formed by coating the surface of at least one metal particle selected from copper, aluminum, gold, and silver with the low melting point solder.
【００１２】また、本発明の多層配線基板は、少なくと
も熱硬化性樹脂を含有する複数の絶縁層と、複数の配線
回路層とを具備し、前記複数の絶縁層の内、少なくとも
１層の絶縁層が、銅、アルミニウム、金、銀のうちから
選ばれる少なくとも１種の金属と、２４０℃以下の融点
の低融点半田を５〜５０体積％含む導電性粒子を全量中
５〜３０体積％の割合で含有し、該絶縁層の両側に形成
された２つの配線回路層が、一方の配線回路層に設けら
れた導電性突起と、前記導電性粒子による凝集部を通じ
て互いに電気的に接続されてなることを特徴とするもの
である。なお、前記導電性突起の高さが前記絶縁層の厚
みの５０〜９５％であることが導電性突起と導電性粒子
による凝集部を介した電気抵抗を低減する上で望まし
い。Further, the multilayer wiring board of the present invention comprises a plurality of insulating layers containing at least a thermosetting resin and a plurality of wiring circuit layers, and at least one layer of the plurality of insulating layers is insulated. The layer contains at least one metal selected from copper, aluminum, gold, and silver, and 5 to 30% by volume of conductive particles containing 5 to 50% by volume of low melting point solder having a melting point of 240 ° C. or less. The two wiring circuit layers, which are contained in a proportion and are formed on both sides of the insulating layer, are electrically connected to each other through the conductive protrusions provided on one wiring circuit layer and the agglomerates formed by the conductive particles. It is characterized by becoming. The height of the conductive protrusions is preferably 50 to 95% of the thickness of the insulating layer in order to reduce the electric resistance of the conductive protrusions and the agglomerated portions of the conductive particles.
【００１３】さらに、かかる多層配線基板の製造方法と
しては、（ａ）転写シートの表面に、所定の高さの導電
性突起が形成された配線回路層を形成する工程と、
（ｂ）少なくとも熱硬化性樹脂と、導電性粒子を全量中
５〜３０体積％の割合で含有し、該導電性粒子が、銅、
アルミニウム、金、銀のうちから選ばれる少なくとも１
種の金属と、２４０℃以下の融点の低融点半田からな
り、該低融点半田を導電性粒子中に５〜５０体積％の割
合で含む絶縁シートの表面に、前記転写シートを積層圧
着した後、転写シートを剥離して、前記導電性突起が形
成された配線回路層を前記絶縁シートに転写形成すると
共に、前記導電性突起を前記絶縁シート内に埋没させる
ことによって絶縁シート中の導電性粒子を凝縮させる工
程と、（ｃ）前記（ｂ）によって得られた絶縁シートを
配線回路層が形成された他の絶縁シートと積層し、加熱
硬化させる工程とを具備することを特徴とするものであ
り、前記導電性突起の高さが、前記絶縁シートの厚みの
５０〜９５％であることが望ましい。Further, as a method for manufacturing such a multilayer wiring board, (a) a step of forming a wiring circuit layer having conductive projections of a predetermined height formed on the surface of the transfer sheet,
(B) At least a thermosetting resin and conductive particles are contained in a proportion of 5 to 30% by volume in the total amount, and the conductive particles are copper,
At least one selected from aluminum, gold, and silver
After laminating and press-bonding the transfer sheet on the surface of an insulating sheet which is made of a seed metal and a low melting point solder having a melting point of 240 ° C. or lower, and which contains the low melting point solder in conductive particles in a proportion of 5 to 50% by volume. , The transfer sheet is peeled off, the wiring circuit layer on which the conductive protrusions are formed is transferred and formed on the insulating sheet, and the conductive protrusions are embedded in the insulating sheet to thereby form conductive particles in the insulating sheet. And (c) laminating the insulating sheet obtained in (b) above with another insulating sheet having a wiring circuit layer formed thereon, and heating and curing the same. It is preferable that the height of the conductive protrusion is 50 to 95% of the thickness of the insulating sheet.
【００１４】本発明の配線基板用絶縁シートによれば、
絶縁シートに所定量の導電成分を含有することにより、
所定の導電性突起を強制的に押し込むことによって絶縁
シート間を垂直に通過する導電路を容易に形成すること
ができるために、従来のビアホールに導電性ペーストを
充填するなどのように、絶縁層にレーザ、パンチング、
ドリル等のビアホール加工をすることなく、即ち加工時
に発生する熱や応力による樹脂変性や寸法変動を防止す
ることができる。According to the insulating sheet for a wiring board of the present invention,
By containing a predetermined amount of conductive component in the insulating sheet,
Since it is possible to easily form a conductive path that vertically passes between the insulating sheets by forcibly pressing a predetermined conductive protrusion, the insulating layer can be formed by, for example, filling a conventional via hole with a conductive paste. Laser, punching,
It is possible to prevent resin modification and dimensional variation due to heat and stress generated during processing without processing via holes such as a drill.
【００１５】また、本発明の多層配線基板によれば、上
記の絶縁シートを用いて転写法によって配線回路層を形
成するにあたり、転写シート表面において配線回路層と
ともに貫通導体を形成する個所に予め導電性突起を形成
しておくことによって、転写シートの配線回路層を前記
絶縁性シートに圧着した際に、導電性突起が絶縁シート
中の導電性粒子を凝縮化させることによって容易に貫通
導体を形成することができる。しかも、転写フィルムを
剥離する際に、前記導電性突起がアンカーとして作用し
ている為に配線回路層の剥がれ、即ち、転写不良の発生
を防止することができる。Further, according to the multilayer wiring board of the present invention, when the wiring circuit layer is formed by the transfer method using the above-mentioned insulating sheet, the conductive sheet is preliminarily electrically conductive on the surface of the transfer sheet where the through conductor is formed together with the wiring circuit layer. By forming the conductive protrusions, when the wiring circuit layer of the transfer sheet is pressure-bonded to the insulating sheet, the conductive protrusions easily condense the conductive particles in the insulating sheet to form a through conductor easily. can do. Moreover, when the transfer film is peeled off, peeling of the wiring circuit layer, that is, transfer failure can be prevented because the conductive protrusions act as anchors.
【００１６】さらに、本発明によれば、導電性粒子中
に、低融点半田を含有することによって、前記導電性粒
子の凝集部における粒子間を低融点半田によって強固に
接続することができるために、凝集部を介した２つの配
線回路層間の電気的接続信頼性を高めることができる。Furthermore, according to the present invention, since the low melting point solder is contained in the conductive particles, the particles in the agglomerated portion of the conductive particles can be firmly connected by the low melting point solder. The reliability of electrical connection between the two wiring circuit layers via the agglomerated portion can be improved.
【００１７】[0017]
【発明の実施の形態】 本発明の絶縁シートは、少なく
とも熱硬化性樹脂と導電性粒子を含有するものであり、
熱硬化性樹脂としては例えば、ＰＰＥ（ポリフェニレン
エーテル）、ＢＴレジン（ビスマレイミドトリアジ
ン）、エポキシ樹脂、ポリイミド樹脂、フッ素樹脂、フ
ェノール樹脂などが挙げられ、さらにそれらの樹脂の硬
化剤を含有する。BEST MODE FOR CARRYING OUT THE INVENTION The insulating sheet of the present invention contains at least a thermosetting resin and conductive particles,
Examples of the thermosetting resin include PPE (polyphenylene ether), BT resin (bismaleimide triazine), epoxy resin, polyimide resin, fluororesin, phenol resin, and the like, and further contain a curing agent for those resins.
【００１８】また、絶縁シート中には、熱硬化性樹脂と
ともに絶縁成分として、無機質フィラーを含有すること
が絶縁シートの強度を高めるとともに熱的安定性を高め
る上で望ましい。用いられる無機質フィラーとしては、
ＳｉＯ2、Ａｌ2Ｏ3、ＡｌＮ、ＳｉＣの群から選ばれる
少なくとも１種が使用できる。この無機質フィラーは、
有機樹脂：無機質フィラーの体積比率で５０：５０〜９
５：５の比率で複合化されるのが適当である。また、無
機質フィラーの表面は有機樹脂との塗れを良くするため
に、カップリング処理されていても良い。Further, it is desirable that the insulating sheet contains an inorganic filler as an insulating component together with the thermosetting resin in order to enhance the strength of the insulating sheet and enhance the thermal stability. As the inorganic filler used,
At least one selected from the group consisting of SiO2 , Al2 O3 , AlN and SiC can be used. This inorganic filler is
50: 50-9 by volume ratio of organic resin: inorganic filler
Suitably it is compounded at a ratio of 5: 5. Further, the surface of the inorganic filler may be subjected to a coupling treatment in order to improve the wettability with the organic resin.
【００１９】また、絶縁シート中の導電性粒子は、全量
中に対して５〜３０体積％、特に１０〜２５体積％の割
合で含まれることが重要である。この導電性粒子の割合
を上記の範囲に限定したのは、導電性粒子の含有率が５
体積％よりも低いと、絶縁性シートの両面に配置された
配線回路層間の導電性粒子が十分に凝縮されず、導通す
るための導通路が確保できなくなるためである。一方、
導電性粒子の含有率が３０体積％を超えると、導通部以
外の配線間においても導電性粒子による導通路が形成さ
れやすい、もしくは信頼性に耐えうる絶縁性が確保でき
ずに配線回路間または貫通導体間で短絡してしまうから
である。It is important that the conductive particles in the insulating sheet are contained in a proportion of 5 to 30% by volume, particularly 10 to 25% by volume, based on the total amount. The ratio of the conductive particles is limited to the above range because the content ratio of the conductive particles is 5
This is because when the content is less than the volume%, the conductive particles between the wiring circuit layers arranged on both surfaces of the insulating sheet are not sufficiently condensed, and a conduction path for conduction cannot be secured. on the other hand,
When the content ratio of the conductive particles exceeds 30% by volume, conductive paths are easily formed by the conductive particles even between wirings other than the conductive portion, or insulating properties that can withstand reliability cannot be ensured, or between wiring circuits or This is because a short circuit will occur between the through conductors.
【００２０】また、この導電性粒子は、銅、アルミニウ
ム、金、銀のうちから選ばれる少なくとも１種の金属
と、２４０℃以下の融点を持つ低融点半田からなること
が重要である。２４０℃以下の低融点半田を含有させる
のは、絶縁性シートの両面に配置された配線回路層間を
導電性粒子による凝集部を介して電気的に接続させた際
に、有機樹脂と金属との熱膨張係数の差により、温度サ
イクルや半田耐熱の際に導通路が破壊されてしまう恐れ
があるからである。しかし、低融点半田を含有せしめる
ことによって低融点半田が溶融し導電性粒子間あるいは
導電性粒子と配線回路層間で強固な金属結合が形成でき
る。低融点半田の融点を２４０℃以下に限定したのは、
融点が２４０℃を超えると、この絶縁シートを硬化した
際、低融点半田が十分に溶融せず、金属結合が硬化時に
形成されないためである。特に、この低融点半田の融点
は、絶縁シート中の熱硬化性樹脂の熱硬化温度以下であ
ることが望ましい。It is important that the conductive particles are made of at least one metal selected from copper, aluminum, gold and silver, and a low melting point solder having a melting point of 240 ° C. or lower. The low-melting-point solder having a temperature of 240 ° C. or less is contained in the organic resin and the metal when the wiring circuit layers arranged on both surfaces of the insulating sheet are electrically connected to each other through the aggregating portion of the conductive particles. This is because the difference in the coefficient of thermal expansion may destroy the conductive path during temperature cycling or heat resistance of the solder. However, when the low melting point solder is contained, the low melting point solder is melted and a strong metal bond can be formed between the conductive particles or between the conductive particles and the wiring circuit layer. The reason why the melting point of the low melting point solder is limited to 240 ° C. or lower is
This is because when the melting point exceeds 240 ° C., when the insulating sheet is cured, the low melting point solder is not sufficiently melted, and the metal bond is not formed during curing. In particular, the melting point of the low melting point solder is preferably equal to or lower than the thermosetting temperature of the thermosetting resin in the insulating sheet.
【００２１】また、この導電性粒子中の低融点半田の割
合は、上記低融点半田による作用を充分に発揮させる上
では、導電性粒子中に５体積％以上の割合で含有させる
ことが重要であり、５体積％よりも少ないと、絶縁性シ
ートの両面に配置された配線回路層間あるいは導電性粒
子間に充分な金属結合を形成できない。逆に半田は、抵
抗が比較的高いために、５０体積％を超えて含有する
と、抵抗が高くなる恐れがある。また、合金の形成に伴
う体積収縮が大きくなり、ボイド等が発生しやすり、く
なる。従って、低融点半田の含有量は導電性粒子に対し
て、５〜５０体積％、特に１０〜４０体積％であること
がよい。The proportion of the low melting point solder in the conductive particles is important to be contained in the conductive particles in a proportion of 5% by volume or more in order to sufficiently exert the action of the low melting point solder. If it is less than 5% by volume, a sufficient metal bond cannot be formed between wiring circuit layers or conductive particles arranged on both surfaces of the insulating sheet. On the contrary, since the solder has a relatively high resistance, if the content of the solder exceeds 50% by volume, the resistance may increase. In addition, the volume shrinkage accompanying the formation of the alloy becomes large, and voids are likely to occur. Therefore, the content of the low melting point solder is preferably 5 to 50% by volume, particularly 10 to 40% by volume with respect to the conductive particles.
【００２２】また、導電性粒子は、その平均粒径が１〜
１０μｍであることが望ましく、この平均粒径が１μｍ
よりも小さいとこの導電性粒子の凝集部において粒子間
の接触が低下し貫通導体の抵抗がおおきくなるおそれが
あり、１０μｍよりも大きいと、均一な分散が難しくな
るためである。The conductive particles have an average particle size of 1 to
10 μm is desirable, and the average particle size is 1 μm
If it is smaller than 10 μm, the contact between particles may be reduced in the agglomerated portion of the conductive particles and the resistance of the through conductor may be large, and if it is larger than 10 μm, uniform dispersion may be difficult.
【００２３】なお、導電性粒子において、前記低融点半
田は、銅、アルミニウム、金、銀のうちから選ばれる少
なくとも１種の金属粒子の表面に被覆形成されているこ
とが、粒子間の接触を均一化できるとともに、金属結合
を安定して形成することができるために望ましい。この
半田の被覆は、置換メッキ法等によって容易に被覆する
ことができる。In the conductive particles, the low melting point solder is formed by coating the surface of at least one kind of metal particles selected from copper, aluminum, gold and silver so as to prevent contact between particles. It is desirable because it can be made uniform and a metal bond can be stably formed. This solder coating can be easily coated by a displacement plating method or the like.
【００２４】この絶縁シートを作製するには、熱硬化性
樹脂、または熱硬化性樹脂と無機質フィラーとの混合物
に、導電性粒子を適量加え、溶媒としてトルエン等を用
いてスラリー化した後、このスラリーを用いてドクター
ブレード法、カレンダーロール法などによってシート状
に形成することにより作製することができる。To prepare this insulating sheet, an appropriate amount of conductive particles is added to a thermosetting resin or a mixture of a thermosetting resin and an inorganic filler, which is slurried using toluene or the like as a solvent. It can be produced by forming a sheet using a slurry by a doctor blade method, a calendar roll method or the like.
【００２５】次に、上記絶縁シートを用いた多層配線基
板の製造方法について図１をもとに説明する。まず、転
写シート１表面に金属箔を接着した後、エッチングなど
の処理により配線回路層２を形成したものを作製する
（ａ）。その後、再びレジスト法などにより配線回路層
２の異なる配線回路層と電気的接続を必要とする部分、
言い換えれば、貫通導体を形成する部分をメッキ法によ
り銅メッキからなる所定の高さの導電性突起３を形成す
る（ｂ）。Next, a method of manufacturing a multilayer wiring board using the above insulating sheet will be described with reference to FIG. First, after a metal foil is adhered to the surface of the transfer sheet 1, a wiring circuit layer 2 is formed by a treatment such as etching (a). After that, a portion that needs to be electrically connected to a different wiring circuit layer of the wiring circuit layer 2 by the resist method or the like,
In other words, the conductive projection 3 having a predetermined height and formed of copper plating is formed on the portion where the through conductor is to be formed by plating (b).
【００２６】ここで、転写シート１は、配線回路層２形
成時のエッチングなどの工程に耐える機械特性や寸法安
定性を有するものが用いられ、ポリエチレン系のものが
好適に使用される。また、金属箔を接着する為の接着剤
としては、酸、アルカリに強いアクリル酸エステルなど
が好適に用いられる。Here, the transfer sheet 1 is one having mechanical properties and dimensional stability that can withstand a process such as etching when forming the wiring circuit layer 2, and a polyethylene-based one is preferably used. Further, as the adhesive for adhering the metal foil, acrylic acid ester which is resistant to acid and alkali is preferably used.
【００２７】また、上記導電性突起３を形成する方法と
しては、配線回路層の厚みよりも厚い金属箔を形成し、
これを通常の方法で所定のパターンに形成した後、導電
性突起を形成する部分にドライフィルムレジストなどで
再度マスキングした後、その他の領域をエッチング処理
して所定の配線回路層の厚みに調整することも可能であ
る。As a method of forming the conductive protrusions 3, a metal foil thicker than the thickness of the wiring circuit layer is formed,
After this is formed into a predetermined pattern by a normal method, the portion where the conductive protrusion is to be formed is masked again with a dry film resist or the like, and then the other region is etched to adjust the thickness of the predetermined wiring circuit layer. It is also possible.
【００２８】その後、前述したように、少なくとも熱硬
化性樹脂４中に導電性粒子５を分散含有する絶縁シート
６を作製、準備する（ｃ）。After that, as described above, the insulating sheet 6 containing the conductive particles 5 dispersed in at least the thermosetting resin 4 is prepared and prepared (c).
【００２９】そして、絶縁シート６に導電性突起３を有
する配線回路層２が形成された転写シート１を位置合わ
せして積層し、Ｂステージ状態の絶縁シート６を７０〜
２００℃に過熱しながら導電性突起３及び配線回路層２
が絶縁シート６表面に埋設できる程度の圧力を印加し
（ｄ）、その後、転写シート１を引き剥がすことによ
り、導電性突起３とともに配線回路層２を絶縁シート６
の表面に転写して１層の配線シートａを作製する
（ｅ）。Then, the transfer sheet 1 on which the wiring circuit layer 2 having the conductive protrusions 3 is formed is aligned and laminated on the insulating sheet 6, and the insulating sheet 6 in the B stage state
Conductive protrusion 3 and wiring circuit layer 2 while overheating to 200 ° C
Is applied to the surface of the insulating sheet 6 (d), and then the transfer sheet 1 is peeled off, so that the conductive projection 3 and the wiring circuit layer 2 are separated from the insulating sheet 6.
Then, a one-layer wiring sheet a is produced by transferring the same onto the surface of (e).
【００３０】導電性突起３および配線回路層２を埋設す
る為の圧力としては、５ｋｇ／ｃｍ2以上、特に１０〜
７０ｋｇ／ｃｍ2の範囲が望ましい。かかる圧力を印可
しつつ、導電性突起３を絶縁シート６中に押しこむと、
導電性突起３の先端部に絶縁シート６中の導電性粒子５
が緻密に凝縮した凝集部８が形成される。Embedding the conductive protrusion 3 and the wiring circuit layer 2
5kg / cm as the pressure for2Above, especially 10
70 kg / cm2The range of is desirable. Apply such pressure
While pushing the conductive protrusions 3 into the insulating sheet 6,
The conductive particles 5 in the insulating sheet 6 are attached to the tips of the conductive protrusions 3.
A densely condensed portion 8 is formed.
【００３１】その後、図２に示すように、上記と同様な
工程によって、片面のみ、あるいは両面に配線回路層２
を形成し、また導電性突起３を転写した配線シートｂ、
ｃを作製し（ｆ）、これらを位置合せして積層した後、
各配線シートａ，ｂ，ｃにおける熱硬化性樹脂が完全硬
化する温度に加熱することにより、図３の多層配線基板
Ａを作製することができる。Thereafter, as shown in FIG. 2, the wiring circuit layer 2 is formed on only one side or both sides by the same steps as described above.
And a wiring sheet b on which the conductive protrusions 3 are transferred,
c is produced (f), these are aligned and laminated,
By heating to a temperature at which the thermosetting resin in each wiring sheet a, b, c is completely cured, the multilayer wiring board A of FIG. 3 can be manufactured.
【００３２】また、本発明によれば、多層配線基板の全
ての配線層を上記のような導電性粒子を含有する絶縁シ
ートによって形成する必要はなく、例えば、多層配線基
板のうちの１層の絶縁層を前記導電性粒子を分散含有す
る絶縁シートを用いて形成しても良い。Further, according to the present invention, it is not necessary to form all the wiring layers of the multilayer wiring board by the insulating sheet containing the conductive particles as described above. The insulating layer may be formed using an insulating sheet containing the conductive particles dispersed therein.
【００３３】その他、一般に、プリプレグと呼ばれるガ
ラスなどの繊維体と熱硬化性樹脂の複合材料からなる絶
縁板の表面及び裏面に、上記の導電性粒子を含有する絶
縁シートを用いて配線層を形成することも可能である。In addition, in general, a wiring layer is formed on the front and back surfaces of an insulating plate made of a composite material of a fibrous material such as glass called prepreg and a thermosetting resin by using the insulating sheet containing the above conductive particles. It is also possible to do so.
【００３４】このようにして作製される多層配線基板に
依れば、図３に示されるとおり、絶縁層１１の両側に形
成された配線回路層１２が、一方の配線回路層１２に設
けられた導電性突起１３と、前記導電性粒子１４による
凝集部１５を通じて互いに電気的に接続された構造から
なる。According to the multilayer wiring board manufactured in this manner, as shown in FIG. 3, the wiring circuit layers 12 formed on both sides of the insulating layer 11 are provided on one wiring circuit layer 12. The conductive protrusions 13 and the conductive particles 14 have a structure in which they are electrically connected to each other through the agglomerates 15 formed by the conductive particles 14.
【００３５】上記製造方法および多層配線基板におい
て、上記の導電性突起３、１３の高さは、導電性粒子１
４による凝集部の密度を決定する要因であって、この導
電性突起３、１３の高さは、貫通導体が形成される絶縁
層１１の厚み、あるいは前記製造工程において絶縁シー
ト６の厚みに対して５０〜９５％、特に５０〜８０％で
あることが望ましい。これは突起高さが５０％よりも低
いと、導電性粒子による凝縮が不十分となり、配線回路
層間を接続するための導電路が形成されにくくなり、９
５％を超えると絶縁層の変形が大きく、絶縁層にクラッ
クなどの空隙が発生したり、絶縁層の平坦性が失われる
か、または、絶縁層の熱硬化時の加圧力がその他の領域
に付加されずに、熱硬化性樹脂の十分な硬化特性が得ら
れないなどの不具合が発生する恐れがある。In the above-mentioned manufacturing method and multilayer wiring board, the height of the above-mentioned conductive protrusions 3 and 13 is the same as that of the conductive particles 1.
4 is a factor that determines the density of the agglomerated portion, and the height of the conductive protrusions 3 and 13 is relative to the thickness of the insulating layer 11 in which the through conductor is formed or the thickness of the insulating sheet 6 in the manufacturing process. 50 to 95%, especially 50 to 80%. When the protrusion height is lower than 50%, the condensation due to the conductive particles becomes insufficient, and it becomes difficult to form the conductive path for connecting the wiring circuit layers.
If it exceeds 5%, the deformation of the insulating layer is large, and voids such as cracks are generated in the insulating layer, the flatness of the insulating layer is lost, or the pressure applied during heat curing of the insulating layer is in other areas. If the thermosetting resin is not added, a problem such as insufficient curing characteristics of the thermosetting resin may occur.
【００３６】このように、本発明に依れば、異なる層間
を接続する貫通導体の形成にあたり、導電性粒子を分散
含有する絶縁シートを用いて、導電性突起と導電性粒子
による凝集部を介して２つの配線回路層間を接続するこ
とによって、レーザ、パンチングやドリルなどによるビ
アホールの加工が不要となり、また、配線回路層と貫通
導体との位置決めを転写シート上の配線回路層に形成す
る導電性突起によって任意に設けることができるため
に、配線回路層と貫通導体との位置ずれの発生を防止す
ることができる。また、配線回路層を転写法によって形
成する際に、導電性突起がアンカーとして機能すること
によって配線回路層の転写不良などの発生を抑制するこ
とができる。As described above, according to the present invention, in forming the through conductor connecting the different layers, the insulating sheet containing the conductive particles dispersed therein is used to interpose the conductive projections and the agglomerated portions of the conductive particles. By connecting the two wiring circuit layers with each other, it is not necessary to process a via hole by laser, punching, drilling, or the like, and the positioning of the wiring circuit layer and the through conductor is formed in the wiring circuit layer on the transfer sheet. Since the protrusions can be provided arbitrarily, it is possible to prevent the positional displacement between the wiring circuit layer and the through conductor from occurring. Further, when the wiring circuit layer is formed by the transfer method, the conductive protrusion functions as an anchor, so that it is possible to suppress the occurrence of defective transfer of the wiring circuit layer.
【００３７】[0037]
【実施例】絶縁シートとして、有機樹脂としてイミド樹
脂を用い、さらに無機フィラーとして種々の平均粒径の
球状シリカを用い、これらを有機樹脂：無機フィラーが
体積比で８０：２０となる組成物を用い、これに平均粒
径５μｍの銅粉の表面に置換メッキ法によって表１、２
の各種半田を被覆した導電性粉末を表１、２に示す比率
で添加して混練機で混練した後、ドクターブレード法に
より厚さ５０μｍの半硬化状態の絶縁シートを作製し
た。EXAMPLE As an insulating sheet, an imide resin was used as an organic resin, spherical silica having various average particle diameters was used as an inorganic filler, and a composition in which the volume ratio of organic resin: inorganic filler was 80:20 was prepared. The surface of the copper powder having an average particle size of 5 μm was used by the displacement plating method as shown in Tables 1 and 2.
The conductive powder coated with the various solders was added at the ratios shown in Tables 1 and 2 and kneaded with a kneader, and then a 50 μm thick semi-cured insulating sheet was prepared by the doctor blade method.
【００３８】その後、厚さ１２μｍの銅箔を接着した２
枚の転写シートの銅箔に対してフォトレジスト法によっ
て表面用配線回路層および裏面用配線回路層を形成し
た。そして、表層用配線回路層に対してのみ所望の貫通
導体を形成する箇所以外の領域をレジストにて被覆した
後、メッキ法にて２５〜４５μｍの高さで、直径が５０
μｍの導電性突起を形成した。なお、この導電性突起
は、直径が７５μｍの導体パッドの中央部に形成した。Thereafter, a copper foil having a thickness of 12 μm was adhered to the copper foil 2
A wiring circuit layer for the front surface and a wiring circuit layer for the back surface were formed on the copper foils of the transfer sheets by a photoresist method. Then, after covering a region other than the place where a desired through conductor is formed only on the surface wiring circuit layer with a resist, the height is 25 to 45 μm and the diameter is 50 by a plating method.
A μm conductive protrusion was formed. The conductive protrusion was formed at the center of the conductor pad having a diameter of 75 μm.
【００３９】その後、上記絶縁シートに上記表面用及び
裏面用の配線回路層を両側から重ね合わせ、少なくとも
導電性突起形成箇所に１５ｋｇ／ｃｍ2の圧力を印加し
て、両面に配線回路層が形成されたコア用配線シートを
形成した。なお、かかるコア用配線シートにおいては、
配線回路層間の貫通導体は、導電性突起と、その先端に
導電性粒子による凝集部によって形成されたものであっ
た。この時の貫通導体の端部に設けられる配線回路層の
最小径は０．１ｍｍとした。Thereafter, the front and back wiring circuit layers are superposed on both sides of the insulating sheet, and a pressure of 15 kg / cm2 is applied to at least the conductive protrusion forming portions to form wiring circuit layers on both sides. The formed core wiring sheet was formed. In addition, in such a core wiring sheet,
The penetrating conductor between the wiring circuit layers was formed by the conductive protrusion and the agglomeration of the conductive particles at the tip thereof. At this time, the minimum diameter of the wiring circuit layer provided at the end of the through conductor was 0.1 mm.
【００４０】同様にして、導電性突起を形成した配線回
路層を絶縁シートの片面のみに転写した配線シートを４
枚作製し、前記コア用配線シートの上下面にそれぞれ２
枚の配線シートを位置合わせして積層した後、温度２０
０℃、圧力２０ｋｇ／ｃｍ2で硬化して、配線回路層６
層の多層配線基板を作製した。Similarly, a wiring sheet obtained by transferring a wiring circuit layer having conductive protrusions formed on only one side of an insulating sheet is used.
2 sheets are prepared on the upper and lower surfaces of the core wiring sheet.
After aligning and stacking the wiring sheets, temperature 20
The wiring circuit layer 6 is cured by hardening at 0 ° C. and a pressure of 20 kg / cm2.
A multilayer wiring board of layers was produced.
【００４１】得られた配線基板に対して、貫通導体４０
０個の初期の導通抵抗を測定し、その平均を算出した。
あわせて絶縁層自体の絶縁抵抗を測定した。For the obtained wiring substrate, the through conductor 40
Zero initial conduction resistances were measured and the average was calculated.
In addition, the insulation resistance of the insulation layer itself was measured.
【００４２】また、作製した多層配線基板を２６０℃の
半田に浸漬するディップテストを５回行い、試験後の配
線回路層のふくれや回路の抵抗変化率を測定し、その測
定結果を表１、２に示した。あわせてFurther, a dip test of immersing the manufactured multilayer wiring board in solder at 260 ° C. was carried out 5 times, and the swelling of the wiring circuit layer and the resistance change rate of the circuit after the test were measured, and the measurement results are shown in Table 1. Shown in 2. Together
【００４３】[0043]
【表１】[Table 1]
【００４４】[0044]
【表２】[Table 2]
【００４５】表１、２の結果から明らかなように、絶縁
シート中の導電性粒子の割合が５体積％よりも少ない試
料Ｎｏ．１１では、貫通導体の抵抗が１７５ｍΩ以上と
なり、十分な導通が得られなかった。また、導電性粒子
の割合が３０体積％を超える試料Ｎｏ．１８では、抵抗
値が１．２ｍΩと極端に小さく、絶縁抵抗が１０6Ωと
なり、ビア部以外で導通パスが生じており、短絡してい
ることがわかった。As is clear from the results of Tables 1 and 2, the sample No. 1 in which the ratio of the conductive particles in the insulating sheet is less than 5% by volume. In No. 11, the resistance of the through conductor was 175 mΩ or more, and sufficient conduction was not obtained. Moreover, the sample No. in which the ratio of the conductive particles exceeds 30% by volume. In No. 18, it was found that the resistance value was extremely small at 1.2 mΩ, the insulation resistance was 106 Ω, and a conduction path was generated in a portion other than the via portion, resulting in a short circuit.
【００４６】また、導電性粒子中の低融点半田の割合が
５体積％よりも少ない試料Ｎｏ．３では、２６０℃の半
田耐熱５回後の抵抗変化率が１０％を超え、信頼性の低
いものであった。また、導電性粒子中の低融点半田の割
合が５０体積％よりも多い試料Ｎｏ．１０も、２６０℃
の半田耐熱５回後の抵抗変化率が１０％を超え、信頼性
の低いものであった。さらに、半田の融点が２４０℃よ
りも高い試料Ｎｏ．１では、半田耐熱５回後の抵抗変化
率が１０％を超えるものであった。Further, in the sample No. 5 in which the proportion of the low melting point solder in the conductive particles was less than 5% by volume. In No. 3, the resistance change rate after 5 times of soldering heat treatment at 260 ° C. exceeded 10% and the reliability was low. In addition, in the sample No. 5 in which the proportion of the low melting point solder in the conductive particles is more than 50% by volume. 10 also 260 ℃
The resistance change rate after 5 times of solder heat resistance exceeded 10%, and the reliability was low. Furthermore, the sample No. 3 whose melting point of solder is higher than 240 ° C. In No. 1, the resistance change rate after soldering heat resistance 5 times exceeded 10%.
【００４７】以上の貫通導体の抵抗値および半田耐熱試
験の結果から、導電性粒子の含有量が５〜３０体積％の
もの、低融点半田の溶融温度が２４０℃以下のもの、導
電性粒子中の低融点半田の割合が５〜５０体積％のもの
は、いずれも貫通導体の初期特性が２５ｍΩ以下、２６
０℃の半田耐熱試験５回後の抵抗変化率が１０％以下と
十分な接続信頼性が得られた。また、何れのサンプルの
表面は平坦で、膨れやクラックなどの異常は確認できな
かった。From the above resistance value of the through conductor and the result of the solder heat resistance test, the content of the conductive particles is 5 to 30% by volume, the melting point of the low melting point solder is 240 ° C. or less, and the conductive particles are Of the low melting point solder of 5 to 50% by volume, the initial characteristics of the through conductor are 25 mΩ or less, 26
Sufficient connection reliability was obtained with a resistance change rate of 10% or less after 5 times of the soldering heat resistance test at 0 ° C. The surface of each sample was flat, and no abnormalities such as swelling and cracks could be confirmed.
【００４８】また、貫通導体とパッドとの接続状態を観
察した結果、本発明の配線基板においては、パッドと貫
通導体との位置ずれは全く観察されなかった。Further, as a result of observing the connection state between the through conductor and the pad, in the wiring board of the present invention, no displacement between the pad and the through conductor was observed.
【００４９】比較例従来法によって、導電性粒子を含有しない絶縁シートに
対してレーザによって直径が５０μｍのビアホールを形
成し、そのホール内に銅紛を含有する導電性ペーストを
スクリーン印刷法によって充填しビアホール導体を形成
した。Comparative Example According to a conventional method, a via hole having a diameter of 50 μm is formed by a laser on an insulating sheet containing no conductive particles, and a conductive paste containing copper powder is filled in the hole by a screen printing method. A via hole conductor was formed.
【００５０】転写シートの表面に直径が７５μｍのパッ
ドを含む配線回路層を形成し、これをビアホール導体が
形成された絶縁シートに位置合せして積層して転写形成
した。同様に、複数の配線回路層を形成した絶縁シート
を作製し、それらを積層後、温度２００℃、圧力２０ｋ
ｇ／ｃｍ2で硬化して、配線回路層６層の多層配線基板
を作製した。そして、配線回路層と貫通導体との位置ず
れを調査した結果、５０／２００個についてパッドから
貫通導体の一部はみ出しが認められた。また、初期抵抗
は、５５ｍΩ、半田耐熱後の抵抗変化率が５０％であっ
た。A wiring circuit layer including a pad having a diameter of 75 μm was formed on the surface of the transfer sheet, and the wiring circuit layer was aligned and laminated on the insulating sheet on which the via-hole conductor was formed to perform transfer forming. Similarly, an insulating sheet having a plurality of wiring circuit layers formed is produced, and after laminating them, the temperature is 200 ° C. and the pressure is 20 k
It was cured at g / cm2 to prepare a multilayer wiring board having 6 wiring circuit layers. Then, as a result of investigating the positional deviation between the wiring circuit layer and the through conductor, a part of the through conductor was found protruding from the pad for 50/200 pieces. The initial resistance was 55 mΩ, and the resistance change rate after solder heat resistance was 50%.
【００５１】[0051]
【発明の効果】以上詳述した通り、本発明によれば、異
なる層間を接続する貫通導体の形成にあたり、レーザ、
パンチング、ドリルの加工が不要であり、また、配線回
路層と貫通導体との位置きめを転写シート上の配線回路
層に形成する導電性突起によって形成し、しかも配線回
路層上で任意の部分に設けることができる為に、配線回
路層と貫通導体との位置ずれの発生を防止することがで
き、さらには配線回路層の転写不良などをも防止するこ
とができ、歩留まりの高い多層配線基板を作製すること
ができる。As described in detail above, according to the present invention, a laser is used to form a through conductor for connecting different layers.
There is no need for punching or drilling, and the positioning of the wiring circuit layer and the through conductors is formed by the conductive protrusions formed on the wiring circuit layer on the transfer sheet, and at any part on the wiring circuit layer. Since it can be provided, it is possible to prevent the positional displacement between the wiring circuit layer and the through conductor from occurring, and also to prevent the transfer failure of the wiring circuit layer and the like, and to provide a multilayer wiring board with a high yield. Can be made.
【図１】本発明の多層配線基板の製造方法を説明するた
めの工程図である。FIG. 1 is a process chart for explaining a method for manufacturing a multilayer wiring board according to the present invention.
【図２】本発明の多層配線基板の製造方法を説明するた
めの図１に続く工程図である。FIG. 2 is a process drawing following FIG. 1 for explaining the method for manufacturing a multilayer wiring board according to the present invention.
【図３】図１〜図２の工程を経て作製される多層配線基
板を説明するための概略断面図である。FIG. 3 is a schematic cross-sectional view for explaining a multilayer wiring board manufactured through the steps of FIGS.
１ 転写シート２ 配線回路層３ 導電性突起４ 熱硬化性樹脂５ 導電性粒子６ 絶縁シート1 transfer sheet2 wiring circuit layers3 Conductive protrusion4 Thermosetting resin5 Conductive particles6 Insulation sheet
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０５Ｋ 3/20 Ｈ０５Ｋ 3/20 Ｂ Ｃ 3/40 3/40 Ｋ Ｆターム(参考） 5E317 AA24 BB12 CC33 CD25 CD27 CD32 GG16 5E343 AA02 AA16 AA22 BB24 BB67 BB71 DD32 DD56 DD62 DD63 DD76 GG06 GG11 5E346 AA05 AA06 AA12 AA15 AA22 AA32 AA43 AA51 BB11 BB16 CC02 CC08 CC16 CC31 CC32 CC34 CC38 CC39 DD02 DD12 DD22 DD32 EE06 EE07 EE09 EE13 EE18 FF01 FF04 FF07 FF09 GG15 GG17 GG22 GG25 GG28 HH11 HH31Continuation of front page (51) Int.Cl.7 Identification code FI theme code (reference) H05K 3/20 H05K 3/20 BC 3/40 3/40 K F term (reference) 5E317 AA24 BB12 CC33 CD25 CD27 CD32 GG16 5E343 AA02 AA16 AA22 BB24 BB67 BB71 DD32 DD56 DD62 DD63 DD76 GG06 GG11 5E346 AA05 AA06 AA12 AA15 AA22 AA32. GG28 HH11 HH31
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001228027AJP2003046258A (en) | 2001-07-27 | 2001-07-27 | Insulating sheet for wiring board, multilayer wiring board using the same, and method of manufacturing the same |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001228027AJP2003046258A (en) | 2001-07-27 | 2001-07-27 | Insulating sheet for wiring board, multilayer wiring board using the same, and method of manufacturing the same |
| Publication Number | Publication Date |
|---|---|
| JP2003046258Atrue JP2003046258A (en) | 2003-02-14 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001228027APendingJP2003046258A (en) | 2001-07-27 | 2001-07-27 | Insulating sheet for wiring board, multilayer wiring board using the same, and method of manufacturing the same |
| Country | Link |
|---|---|
| JP (1) | JP2003046258A (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005322769A (en)* | 2004-05-10 | 2005-11-17 | Shinko Electric Ind Co Ltd | Method of manufacturing electronic component mounting structure |
| JP2006128520A (en)* | 2004-10-29 | 2006-05-18 | Tdk Corp | Multilayer substrate manufacturing method |
| KR100820635B1 (en)* | 2007-01-03 | 2008-04-11 | 삼성전기주식회사 | Circuit Board Manufacturing Method |
| KR100841987B1 (en)* | 2007-07-10 | 2008-06-27 | 삼성전기주식회사 | Multi-layer printed circuit board manufacturing method |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005322769A (en)* | 2004-05-10 | 2005-11-17 | Shinko Electric Ind Co Ltd | Method of manufacturing electronic component mounting structure |
| JP2006128520A (en)* | 2004-10-29 | 2006-05-18 | Tdk Corp | Multilayer substrate manufacturing method |
| KR100820635B1 (en)* | 2007-01-03 | 2008-04-11 | 삼성전기주식회사 | Circuit Board Manufacturing Method |
| KR100841987B1 (en)* | 2007-07-10 | 2008-06-27 | 삼성전기주식회사 | Multi-layer printed circuit board manufacturing method |
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