| US4978567A (en)* | 1988-03-31 | 1990-12-18 | Materials Technology Corporation, Subsidiary Of The Carbon/Graphite Group, Inc. | Wafer holding fixture for chemical reaction processes in rapid thermal processing equipment and method for making same |
| US5304248A (en)* | 1990-12-05 | 1994-04-19 | Applied Materials, Inc. | Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions |
| US5584936A (en)* | 1995-12-14 | 1996-12-17 | Cvd, Incorporated | Susceptor for semiconductor wafer processing |
| US6214122B1 (en)* | 1997-03-17 | 2001-04-10 | Motorola, Inc. | Rapid thermal processing susceptor |
| US5840124A (en)* | 1997-06-30 | 1998-11-24 | Emcore Corporation | Wafer carrier with flexible wafer flat holder |
| USD404370S (en)* | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus |
| US6436228B1 (en)* | 1998-05-15 | 2002-08-20 | Applied Materials, Inc. | Substrate retainer |
| JP3551867B2 (en)* | 1999-11-09 | 2004-08-11 | 信越化学工業株式会社 | Silicon focus ring and manufacturing method thereof |
| US6717121B2 (en)* | 2001-09-28 | 2004-04-06 | Graphic Packaging International, Inc. | Patterned microwave susceptor element and microwave container incorporating same |
| US7381276B2 (en)* | 2002-07-16 | 2008-06-03 | International Business Machines Corporation | Susceptor pocket with beveled projection sidewall |
| CN100565786C (en)* | 2002-12-09 | 2009-12-02 | Nxp股份有限公司 | The system and method that in the cold wall CVD system, suppresses the chip temperature skew |
| JP4744855B2 (en)* | 2003-12-26 | 2011-08-10 | 日本碍子株式会社 | Electrostatic chuck |
| US20050217585A1 (en)* | 2004-04-01 | 2005-10-06 | Blomiley Eric R | Substrate susceptor for receiving a substrate to be deposited upon |
| US7585371B2 (en)* | 2004-04-08 | 2009-09-08 | Micron Technology, Inc. | Substrate susceptors for receiving semiconductor substrates to be deposited upon |
| US20060005767A1 (en)* | 2004-06-28 | 2006-01-12 | Applied Materials, Inc. | Chamber component having knurled surface |
| USD559993S1 (en)* | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
| TWD121115S1 (en)* | 2005-03-30 | 2008-01-21 | 東京威力科創股份有限公司 | Cover ring |
| USD557226S1 (en)* | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD548705S1 (en)* | 2005-09-29 | 2007-08-14 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| US7651571B2 (en)* | 2005-12-22 | 2010-01-26 | Kyocera Corporation | Susceptor |
| US20090050272A1 (en)* | 2007-08-24 | 2009-02-26 | Applied Materials, Inc. | Deposition ring and cover ring to extend process components life and performance for process chambers |
| JP2009283904A (en)* | 2008-04-25 | 2009-12-03 | Nuflare Technology Inc | Coating apparatus and coating method |
| WO2010021890A2 (en)* | 2008-08-19 | 2010-02-25 | Lam Research Corporation | Edge rings for electrostatic chucks |
| US20100098519A1 (en)* | 2008-10-17 | 2010-04-22 | Memc Electronic Materials, Inc. | Support for a semiconductor wafer in a high temperature environment |
| TW201630105A (en)* | 2015-02-12 | 2016-08-16 | 漢民科技股份有限公司 | Wafer holder |
| USD646764S1 (en)* | 2010-11-04 | 2011-10-11 | Faster S.P.A. | Sealing gasket |
| WO2012142408A2 (en)* | 2011-04-14 | 2012-10-18 | Veeco Instruments Inc. | Substrate holders and methods of substrate mounting |
| USD709536S1 (en)* | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD709537S1 (en)* | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD709539S1 (en)* | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD709538S1 (en)* | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| US20150041314A1 (en)* | 2012-03-29 | 2015-02-12 | Kyocera Corporation | Annular member and film-forming device in which same is used |
| US9376752B2 (en)* | 2012-04-06 | 2016-06-28 | Applied Materials, Inc. | Edge ring for a deposition chamber |
| CN104704626B (en)* | 2012-10-24 | 2017-12-05 | 应用材料公司 | Minimal contact edge ring for rapid heat treatment |
| KR101317942B1 (en)* | 2013-03-13 | 2013-10-16 | (주)테키스트 | Edge ring cooling module for semi-conductor manufacture chuck |
| USD724553S1 (en)* | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
| TWI734668B (en)* | 2014-06-23 | 2021-08-01 | 美商應用材料股份有限公司 | Substrate thermal control in an epi chamber |
| US10000847B2 (en)* | 2014-09-24 | 2018-06-19 | Applied Materials, Inc. | Graphite susceptor |
| US10269614B2 (en)* | 2014-11-12 | 2019-04-23 | Applied Materials, Inc. | Susceptor design to reduce edge thermal peak |
| USD783922S1 (en)* | 2014-12-08 | 2017-04-11 | Entegris, Inc. | Wafer support ring |
| JP1530148S (en)* | 2015-02-26 | 2015-08-03 | | |
| USD767234S1 (en)* | 2015-03-02 | 2016-09-20 | Entegris, Inc. | Wafer support ring |
| JP1546800S (en)* | 2015-06-12 | 2016-03-28 | | |
| USD810705S1 (en)* | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
| DE102015220924B4 (en)* | 2015-10-27 | 2018-09-27 | Siltronic Ag | Susceptor for holding a semiconductor wafer with orientation notch, method for depositing a layer on a semiconductor wafer and semiconductor wafer |
| USD830434S1 (en)* | 2015-12-28 | 2018-10-09 | Ntn Corporation | Inner ring for tapered roller bearing |
| US10777442B2 (en)* | 2016-11-18 | 2020-09-15 | Applied Materials, Inc. | Hybrid substrate carrier |
| US10704147B2 (en)* | 2016-12-03 | 2020-07-07 | Applied Materials, Inc. | Process kit design for in-chamber heater and wafer rotating mechanism |
| JP1584906S (en)* | 2017-01-31 | 2017-08-28 | | |
| USD876504S1 (en)* | 2017-04-03 | 2020-02-25 | Asm Ip Holding B.V. | Exhaust flow control ring for semiconductor deposition apparatus |
| USD830981S1 (en)* | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
| CN110770877B (en)* | 2017-06-13 | 2024-06-18 | 日本碍子株式会社 | Component for semiconductor manufacturing device |
| JP1598997S (en)* | 2017-08-31 | 2018-03-05 | | |
| JP1598998S (en)* | 2017-08-31 | 2018-03-05 | | |
| JP6878212B2 (en)* | 2017-09-07 | 2021-05-26 | 昭和電工株式会社 | Manufacturing method for susceptors, CVD equipment and epitaxial wafers |
| CN112204725B (en)* | 2018-04-20 | 2025-07-11 | 朗姆研究公司 | Edge Exclusion Control |
| EP3863043A4 (en)* | 2018-10-04 | 2021-11-03 | Toyo Tanso Co., Ltd. | Susceptor |
| USD909323S1 (en)* | 2018-10-12 | 2021-02-02 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| USD948463S1 (en)* | 2018-10-24 | 2022-04-12 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate supporting apparatus |
| JP1646504S (en)* | 2018-12-06 | 2019-11-25 | | |
| JP1646505S (en)* | 2018-12-07 | 2019-11-25 | | |
| US11961723B2 (en)* | 2018-12-17 | 2024-04-16 | Applied Materials, Inc. | Process kit having tall deposition ring for PVD chamber |
| USD888903S1 (en)* | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
| USD933725S1 (en)* | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| KR102305539B1 (en)* | 2019-04-16 | 2021-09-27 | 주식회사 티씨케이 | SiC EDGE RING |
| JP7400461B2 (en)* | 2019-12-26 | 2023-12-19 | 株式会社レゾナック | susceptor |
| TWI861334B (en)* | 2020-01-21 | 2024-11-11 | 荷蘭商Asm Ip私人控股有限公司 | Susceptor with sidewall humps for uniform deposition and method of processing crystalline substrate |
| EP4089065A4 (en)* | 2020-02-12 | 2024-03-27 | SK enpulse Co., Ltd. | CERAMIC COMPONENT AND PLASMA ETCHING APPARATUS USING SAME |
| US11404250B2 (en)* | 2020-07-08 | 2022-08-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Plasma etcher edge ring with a chamfer geometry and impedance design |
| USD1034491S1 (en)* | 2020-07-27 | 2024-07-09 | Applied Materials, Inc. | Edge ring |
| USD1038049S1 (en)* | 2020-11-18 | 2024-08-06 | Applied Materials, Inc. | Cover ring for use in semiconductor processing chamber |
| JP1692954S (en)* | 2020-12-10 | 2021-08-16 | | |
| TWD235071S (en)* | 2020-12-10 | 2024-12-01 | 日商紐富來科技股份有限公司 (日本) | Top plate |
| US20220361300A1 (en)* | 2021-05-10 | 2022-11-10 | The Boeing Company | Induction-heating system including a susceptor for generating induction heating below a selected curie temperature |
| JP7488796B2 (en)* | 2021-06-10 | 2024-05-22 | 日本碍子株式会社 | Focus ring mounting stand |
| JP1711119S (en)* | 2021-10-22 | 2022-03-29 | | Susceptoring |
| JP1711120S (en)* | 2021-10-22 | 2022-03-29 | | Suceptor cover |
| USD1049067S1 (en)* | 2022-04-04 | 2024-10-29 | Applied Materials, Inc. | Ring for an anti-rotation process kit for a substrate processing chamber |
| USD1053230S1 (en)* | 2022-05-19 | 2024-12-03 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD1069054S1 (en)* | 2022-08-08 | 2025-04-01 | As America, Inc. | Gasket |
| JP1741176S (en)* | 2022-10-20 | 2023-04-06 | | Cover base for susceptor |
| JP1741172S (en)* | 2022-10-20 | 2023-04-06 | | Susceptor cover |
| JP1741174S (en)* | 2022-10-20 | 2023-04-06 | | Susceptor |
| US12243761B2 (en)* | 2022-10-27 | 2025-03-04 | Applied Materials, Inc. | Detection and analysis of substrate support and pre-heat ring in a process chamber via imaging |
| USD1034493S1 (en)* | 2022-11-25 | 2024-07-09 | Ap Systems Inc. | Chamber wall liner for a semiconductor manufacturing apparatus |
| TW202434759A (en)* | 2023-02-01 | 2024-09-01 | 荷蘭商Asm Ip私人控股有限公司 | Susceptor assembly, reactor system, and depositing method |
| JP2024118119A (en)* | 2023-02-20 | 2024-08-30 | キオクシア株式会社 | Jig, semiconductor manufacturing apparatus, and method for operating semiconductor manufacturing apparatus |