| US5540782A (en)* | 1992-10-15 | 1996-07-30 | Tokyo Electron Kabushiki Kaisha | Heat treating apparatus having heat transmission-preventing plates |
| USD427570S (en)* | 1997-01-31 | 2000-07-04 | Tokyo Electron Limited | Quartz fin heat retaining tube |
| USD405427S (en)* | 1997-01-31 | 1999-02-09 | Tokyo Electron Limited | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
| USD405428S (en)* | 1997-01-31 | 1999-02-09 | Tokyo Electron Ltd. | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
| USD404016S (en)* | 1997-01-31 | 1999-01-12 | Tokyo Electron Limited | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
| USD428858S (en)* | 1997-01-31 | 2000-08-01 | Tokyo Electron Limited | Quartz fin heat retaining tube |
| US6616767B2 (en)* | 1997-02-12 | 2003-09-09 | Applied Materials, Inc. | High temperature ceramic heater assembly with RF capability |
| US5911896A (en)* | 1997-06-25 | 1999-06-15 | Brooks Automation, Inc. | Substrate heating apparatus with glass-ceramic panels and thin film ribbon heater element |
| USD404375S (en)* | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Heat retaining tube base for use in a semiconductor wafer head processing apparatus |
| US6037574A (en)* | 1997-11-06 | 2000-03-14 | Watlow Electric Manufacturing | Quartz substrate heater |
| AU2001271904A1 (en)* | 2000-07-10 | 2002-02-05 | Temptronic Corporation | Wafer chuck having with interleaved heating and cooling elements |
| US6529686B2 (en)* | 2001-06-06 | 2003-03-04 | Fsi International, Inc. | Heating member for combination heating and chilling apparatus, and methods |
| US6506994B2 (en)* | 2001-06-15 | 2003-01-14 | Applied Materials, Inc. | Low profile thick film heaters in multi-slot bake chamber |
| WO2006060134A2 (en)* | 2004-11-15 | 2006-06-08 | Cree, Inc. | Restricted radiated heating assembly for high temperature processing |
| TWD116389S1 (en)* | 2005-10-27 | 2007-04-11 | 東京威力科創股份有限公司 | Heater for semiconductor making |
| TWD125599S1 (en)* | 2006-09-28 | 2008-10-21 | 東京威力科創股份有限公司 | Heater for semiconductor manufacturing |
| TWD125598S1 (en)* | 2006-09-28 | 2008-10-21 | 東京威力科創股份有限公司 | Heater for semiconductor manufacturing |
| JP5073751B2 (en)* | 2006-10-10 | 2012-11-14 | エーエスエム アメリカ インコーポレイテッド | Precursor delivery system |
| US8986456B2 (en)* | 2006-10-10 | 2015-03-24 | Asm America, Inc. | Precursor delivery system |
| USD600220S1 (en)* | 2008-03-28 | 2009-09-15 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| TWD130834S1 (en)* | 2008-03-28 | 2009-09-11 | 東京威力科創股份有限公司 | Heat dissipation fins for heat preservation cylinders used in semiconductor manufacturing |
| USD615937S1 (en)* | 2009-03-06 | 2010-05-18 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| USD616393S1 (en)* | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| USD616392S1 (en)* | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| US8933375B2 (en)* | 2012-06-27 | 2015-01-13 | Asm Ip Holding B.V. | Susceptor heater and method of heating a substrate |