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JP1551512S - - Google Patents

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Publication number
JP1551512S
JP1551512SJPD2015-13036FJP2015013036FJP1551512SJP 1551512 SJP1551512 SJP 1551512SJP 2015013036 FJP2015013036 FJP 2015013036FJP 1551512 SJP1551512 SJP 1551512S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2015-13036F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filedfiledCritical
Priority to JPD2015-13036FpriorityCriticalpatent/JP1551512S/ja
Priority to TW104305549Fprioritypatent/TWD175853S/en
Priority to US29/544,069prioritypatent/USD802790S1/en
Application grantedgrantedCritical
Publication of JP1551512SpublicationCriticalpatent/JP1551512S/ja
Activelegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

Links

JPD2015-13036F2015-06-122015-06-12ActiveJP1551512S (en)

Priority Applications (3)

Application NumberPriority DateFiling DateTitle
JPD2015-13036FJP1551512S (en)2015-06-122015-06-12
TW104305549FTWD175853S (en)2015-06-122015-10-06 Cover rings for plasma processing equipment
US29/544,069USD802790S1 (en)2015-06-122015-10-30Cover ring for a plasma processing apparatus

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JPD2015-13036FJP1551512S (en)2015-06-122015-06-12

Publications (1)

Publication NumberPublication Date
JP1551512Strue JP1551512S (en)2016-06-13

Family

ID=56105200

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JPD2015-13036FActiveJP1551512S (en)2015-06-122015-06-12

Country Status (3)

CountryLink
US (1)USD802790S1 (en)
JP (1)JP1551512S (en)
TW (1)TWD175853S (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD836573S1 (en)2017-01-312018-12-25Hitachi High-Technologies CorporationRing for a plasma processing apparatus
USD840365S1 (en)2017-01-312019-02-12Hitachi High-Technologies CorporationCover ring for a plasma processing apparatus
USD907593S1 (en)2017-01-202021-01-12Hitachi High-Tech CorporationDischarge chamber for a plasma processing apparatus

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USD872859S1 (en)*2017-03-092020-01-14Pieter Van Weenen & Co. GmbhPart of an apparatus for medical and laboratory diagnosis
USD875054S1 (en)*2017-04-282020-02-11Applied Materials, Inc.Plasma connector liner
USD875055S1 (en)*2017-04-282020-02-11Applied Materials, Inc.Plasma connector liner
USD875053S1 (en)*2017-04-282020-02-11Applied Materials, Inc.Plasma connector liner
USD882536S1 (en)*2017-04-282020-04-28Applied Materials, Inc.Plasma source liner
USD858468S1 (en)2018-03-162019-09-03Applied Materials, Inc.Collimator for a physical vapor deposition chamber
USD859333S1 (en)2018-03-162019-09-10Applied Materials, Inc.Collimator for a physical vapor deposition chamber
JP1640255S (en)*2018-10-252019-09-02
USD881767S1 (en)*2018-11-302020-04-21Warn Automotive, LlcLatch ring
JP1638504S (en)*2018-12-062019-08-05
USD918273S1 (en)*2019-05-142021-05-04Dana GonzalezShoe and float collar device
USD913979S1 (en)*2019-08-282021-03-23Applied Materials, Inc.Inner shield for a substrate processing chamber
USD931241S1 (en)*2019-08-282021-09-21Applied Materials, Inc.Lower shield for a substrate processing chamber
US12100577B2 (en)2019-08-282024-09-24Applied Materials, Inc.High conductance inner shield for process chamber
USD937329S1 (en)2020-03-232021-11-30Applied Materials, Inc.Sputter target for a physical vapor deposition chamber
USD998575S1 (en)2020-04-072023-09-12Applied Materials, Inc.Collimator for use in a physical vapor deposition (PVD) chamber
US12080522B2 (en)2020-04-222024-09-03Applied Materials, Inc.Preclean chamber upper shield with showerhead
USD973609S1 (en)*2020-04-222022-12-27Applied Materials, Inc.Upper shield with showerhead for a process chamber
USD1009816S1 (en)2021-08-292024-01-02Applied Materials, Inc.Collimator for a physical vapor deposition chamber
USD997111S1 (en)2021-12-152023-08-29Applied Materials, Inc.Collimator for use in a physical vapor deposition (PVD) chamber
USD1038901S1 (en)2022-01-122024-08-13Applied Materials, Inc.Collimator for a physical vapor deposition chamber
JP1724328S (en)*2022-02-102022-09-08 Upper chamber for plasma processing equipment
USD1008967S1 (en)*2022-05-162023-12-26Japan Aviation Electronics Industry, LimitedCollar for connector

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USD404370S (en)*1997-08-201999-01-19Tokyo Electron LimitedCap for use in a semiconductor wafer heat processing apparatus
USD404369S (en)*1997-08-201999-01-19Tokyo Electron LimitedManifold cover for use in a semiconductor wafer heat processing apparatus
USD404372S (en)*1997-08-201999-01-19Tokyo Electron LimitedRing for use in a semiconductor wafer heat processing apparatus
US6423175B1 (en)*1999-10-062002-07-23Taiwan Semiconductor Manufacturing Co., LtdApparatus and method for reducing particle contamination in an etcher
JP2003100713A (en)*2001-09-262003-04-04Kawasaki Microelectronics KkCover for plasma electrode
US7252738B2 (en)*2002-09-202007-08-07Lam Research CorporationApparatus for reducing polymer deposition on a substrate and substrate support
USD491963S1 (en)*2002-11-202004-06-22Tokyo Electron LimitedInner wall shield for a process chamber for manufacturing semiconductors
US20050150452A1 (en)*2004-01-142005-07-14Soovo SenProcess kit design for deposition chamber
JP2005340251A (en)*2004-05-242005-12-08Shin Etsu Chem Co Ltd Shower plate for plasma processing apparatus and plasma processing apparatus
TWD121115S1 (en)*2005-03-302008-01-21東京威力科創股份有限公司Cover ring
USD559993S1 (en)*2005-03-302008-01-15Tokyo Electron LimitedCover ring
US7186171B2 (en)*2005-04-222007-03-06Applied Materials, Inc.Composite retaining ring
USD556704S1 (en)*2005-08-252007-12-04Hitachi High-Technologies CorporationGrounded electrode for a plasma processing apparatus
USD557425S1 (en)*2005-08-252007-12-11Hitachi High-Technologies CorporationCover ring for a plasma processing apparatus
USD557226S1 (en)*2005-08-252007-12-11Hitachi High-Technologies CorporationElectrode cover for a plasma processing apparatus
US20080121620A1 (en)*2006-11-242008-05-29Guo G XProcessing chamber
US8298046B2 (en)*2009-10-212012-10-30SPM Technology, Inc.Retaining rings
USD638550S1 (en)*2009-11-132011-05-243M Innovative Properties CompanySample processing disk cover
USD638951S1 (en)*2009-11-132011-05-313M Innovative Properties CompanySample processing disk cover
USD667561S1 (en)*2009-11-132012-09-183M Innovative Properties CompanySample processing disk cover
USD703160S1 (en)*2011-01-272014-04-22Hitachi High-Technologies CorporationGrounded electrode for a plasma processing apparatus
USD658691S1 (en)*2011-03-302012-05-01Tokyo Electron LimitedLiner for plasma processing apparatus
USD658693S1 (en)*2011-03-302012-05-01Tokyo Electron LimitedLiner for plasma processing apparatus
USD699200S1 (en)*2011-09-302014-02-11Tokyo Electron LimitedElectrode member for a plasma processing apparatus
USD766849S1 (en)*2013-05-152016-09-20Ebara CorporationSubstrate retaining ring
USD716239S1 (en)*2013-11-062014-10-28Applied Materials, Inc.Upper chamber liner
USD717746S1 (en)*2013-11-062014-11-18Applied Materials, Inc.Lower chamber liner
USD716240S1 (en)*2013-11-072014-10-28Applied Materials, Inc.Lower chamber liner
JP1546800S (en)*2015-06-122016-03-28

Cited By (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD907593S1 (en)2017-01-202021-01-12Hitachi High-Tech CorporationDischarge chamber for a plasma processing apparatus
USD836573S1 (en)2017-01-312018-12-25Hitachi High-Technologies CorporationRing for a plasma processing apparatus
USD840365S1 (en)2017-01-312019-02-12Hitachi High-Technologies CorporationCover ring for a plasma processing apparatus

Also Published As

Publication numberPublication date
TWD175853S (en)2016-05-21
USD802790S1 (en)2017-11-14

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