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IL257205B - Self-directed metrology and example classification - Google Patents

Self-directed metrology and example classification

Info

Publication number
IL257205B
IL257205BIL257205AIL25720518AIL257205BIL 257205 BIL257205 BIL 257205BIL 257205 AIL257205 AIL 257205AIL 25720518 AIL25720518 AIL 25720518AIL 257205 BIL257205 BIL 257205B
Authority
IL
Israel
Prior art keywords
metrology
self
directed
example classification
classification
Prior art date
Application number
IL257205A
Other languages
Hebrew (he)
Other versions
IL257205A (en
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/247,774external-prioritypatent/US10483081B2/en
Application filed by Kla Tencor CorpfiledCriticalKla Tencor Corp
Publication of IL257205ApublicationCriticalpatent/IL257205A/en
Publication of IL257205BpublicationCriticalpatent/IL257205B/en

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IL257205A2015-08-282018-01-29 Self-directed metrology and example classificationIL257205B (en)

Applications Claiming Priority (3)

Application NumberPriority DateFiling DateTitle
US201562211375P2015-08-282015-08-28
US15/247,774US10483081B2 (en)2014-10-222016-08-25Self directed metrology and pattern classification
PCT/US2016/049157WO2017040351A1 (en)2015-08-282016-08-27Self directed metrology and pattern classification

Publications (2)

Publication NumberPublication Date
IL257205A IL257205A (en)2018-03-29
IL257205Btrue IL257205B (en)2021-01-31

Family

ID=58188172

Family Applications (1)

Application NumberTitlePriority DateFiling Date
IL257205AIL257205B (en)2015-08-282018-01-29 Self-directed metrology and example classification

Country Status (6)

CountryLink
JP (1)JP6914249B2 (en)
KR (1)KR102340756B1 (en)
CN (1)CN107924850B (en)
IL (1)IL257205B (en)
TW (1)TWI684225B (en)
WO (1)WO2017040351A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US10997710B2 (en)*2017-10-182021-05-04Kla-Tencor CorporationAdaptive care areas for die-die inspection
US11094053B2 (en)2018-10-082021-08-17Kla CorporationDeep learning based adaptive regions of interest for critical dimension measurements of semiconductor substrates
CN116503397B (en)*2023-06-262023-09-01山东天通汽车科技股份有限公司In-vehicle transmission belt defect detection method based on image data

Citations (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20070288219A1 (en)*2005-11-182007-12-13Khurram ZafarMethods and systems for utilizing design data in combination with inspection data
US20120141011A1 (en)*2009-06-022012-06-07Hitachi High-Technologies CorporationDefect image processing apparatus, defect image processing method, semiconductor defect classifying apparatus, and semiconductor defect classifying method
US20140023265A1 (en)*2011-01-262014-01-23Masahiro KitazawaPattern matching apparatus and computer program

Family Cites Families (20)

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Publication numberPriority datePublication dateAssigneeTitle
WO2001096843A1 (en)*2000-06-152001-12-20Kla-Tencor, Inc.Apparatus and method for applying feedback control to a magnetic lens
JP4154282B2 (en)*2003-05-142008-09-24株式会社日立ハイテクノロジーズ Circuit pattern inspection device
TWI308372B (en)*2005-09-012009-04-01Camtek LtdA method and a system for establishing an inspection-recipe
KR101665168B1 (en)*2005-11-182016-10-11케이엘에이-텐코 코포레이션Methods and systems for utilizing design data in combination with inspection data
US8045786B2 (en)*2006-10-242011-10-25Kla-Tencor Technologies Corp.Waferless recipe optimization
JP2008235575A (en)*2007-03-202008-10-02Toshiba Corp Pattern measuring method, pattern measuring device and program
JP5118872B2 (en)*2007-03-302013-01-16株式会社日立ハイテクノロジーズ Defect observation method and apparatus for semiconductor device
JP5408852B2 (en)*2007-08-092014-02-05株式会社日立ハイテクノロジーズ Pattern measuring device
JP5412169B2 (en)*2008-04-232014-02-12株式会社日立ハイテクノロジーズ Defect observation method and defect observation apparatus
JP6185693B2 (en)*2008-06-112017-08-23ケーエルエー−テンカー・コーポレーションKla−Tencor Corporation Systems and methods for detection of design and process defects on wafers, inspection of defects on wafers, selection to use one or more features in the design as process monitoring features, or some combination thereof
JP2012068051A (en)*2010-09-212012-04-05Toshiba CorpPattern defect inspection device and pattern defect inspection method
US8656323B2 (en)*2011-02-222014-02-18Kla-Tencor CorporationBased device risk assessment
JP5948138B2 (en)*2012-05-112016-07-06株式会社日立ハイテクノロジーズ Defect analysis support device, program executed by defect analysis support device, and defect analysis system
US9189844B2 (en)*2012-10-152015-11-17Kla-Tencor Corp.Detecting defects on a wafer using defect-specific information
CN102937599B (en)*2012-10-252015-01-07中国科学院自动化研究所Non-destructive testing systems and method used for detecting a metal-containing object through X-ray detection
KR102019534B1 (en)*2013-02-012019-09-09케이엘에이 코포레이션Detecting defects on a wafer using defect-specific and multi-channel information
US9619876B2 (en)*2013-03-122017-04-11Kla-Tencor Corp.Detecting defects on wafers based on 2D scatter plots of values determined for output generated using different optics modes
US9183624B2 (en)*2013-06-192015-11-10Kla-Tencor Corp.Detecting defects on a wafer with run time use of design data
US10079183B2 (en)*2013-06-262018-09-18Kla-Tenor CorporationCalculated electrical performance metrics for process monitoring and yield management
KR102393311B1 (en)*2016-03-312022-05-02호야 가부시키가이샤 Method for manufacturing a reflective mask blank, a reflective mask blank, a method for manufacturing a reflective mask, a reflective mask, and a method for manufacturing a semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20070288219A1 (en)*2005-11-182007-12-13Khurram ZafarMethods and systems for utilizing design data in combination with inspection data
US20120141011A1 (en)*2009-06-022012-06-07Hitachi High-Technologies CorporationDefect image processing apparatus, defect image processing method, semiconductor defect classifying apparatus, and semiconductor defect classifying method
US20140023265A1 (en)*2011-01-262014-01-23Masahiro KitazawaPattern matching apparatus and computer program

Also Published As

Publication numberPublication date
CN107924850A (en)2018-04-17
JP2018530911A (en)2018-10-18
KR102340756B1 (en)2021-12-16
IL257205A (en)2018-03-29
CN107924850B (en)2022-06-28
JP6914249B2 (en)2021-08-04
TWI684225B (en)2020-02-01
TW201727789A (en)2017-08-01
WO2017040351A1 (en)2017-03-09
KR20180037055A (en)2018-04-10

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