The application is a divisional application of Chinese patent application 201180042791.9, the application date of the original application is 2011, 09 and 05 days, and the invention name is as follows: a movable body apparatus, an object processing apparatus, an exposure apparatus, a method for manufacturing a flat panel display, and a method for manufacturing a device.
Detailed Description
Embodiment 1
Hereinafter, embodiment 1 will be described with reference to fig. 1 to 8 (B).
Fig. 1 schematically shows a configuration of a liquid crystal exposure apparatus 10 according to embodiment 1. The liquid crystal exposure apparatus 10 is used in a so-called scanner which is a projection exposure apparatus of a step-and-scan type in which a rectangular glass substrate P (hereinafter simply referred to as a substrate P) of a liquid crystal display device (flat panel display) is an exposure object.
As shown in fig. 1, liquid crystal exposure apparatus 10 includes illumination system IOP, mask stage MST holding mask M, projection optical system PL, apparatus main body 30 supporting mask stage MST, projection optical system PL, and the like, substrate stage device PST holding substrate P, and a control system and the like. In the following description, the direction in which the mask M and the substrate P are scanned relative to the projection optical system PL during exposure is referred to as the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is referred to as the Y-axis direction, the directions orthogonal to the X-axis and the Y-axis are referred to as the Z-axis direction, and the directions of rotation (inclination) about the X-axis, the Y-axis, and the Z-axis are referred to as the θ X, θ Y, and θ Z directions, respectively. The positions in the X-axis, Y-axis, and Z-axis directions will be described as X position, Y position, and Z position, respectively.
The illumination system IOP is configured in the same manner as the illumination system disclosed in, for example, U.S. patent No. 6,552,775 and the like. That is, the illumination system IOP irradiates light emitted from a light source (e.g., a mercury lamp), not shown, as exposure illumination light (illumination light) IL onto the mask M via a mirror, a dichroic mirror, a shutter, a wavelength selective filter, various lenses, and the like, not shown. The illumination light IL is light using, for example, i-line (wavelength 365nm), g-line (wavelength 436nm), h-line (wavelength 405nm), or the like (or a composite light of the i-line, g-line, and h-line). The wavelength of the illumination light IL can be appropriately switched by a wavelength selection filter according to, for example, a required resolution.
A mask M having a circuit pattern or the like formed on its pattern surface (the lower surface in fig. 1) is fixed to the mask stage MST by, for example, vacuum suction. Mask stage MST is mounted in a non-contact state on a pair of mask stage guides 35 fixed to barrel surface plate 31, which is a part of apparatus main body 30, and can be driven in the scanning direction (X-axis direction) by a predetermined stroke by a mask stage driving system (not shown) including, for example, a linear motor, and can be driven in the Y-axis direction and the θ z direction, respectively, as appropriate, to a small extent. The positional information (including the rotation information in the θ z direction) of mask stage MST in the XY plane is measured by a mask interferometer system including a laser interferometer (not shown).
Projection optical system PL is supported by barrel surface plate 31 below mask stage MST in fig. 1. The projection optical system PL of the present embodiment has the same configuration as that of the projection optical system disclosed in, for example, U.S. Pat. No. 6,552,775. That is, the projection optical system PL includes a plurality of projection optical systems (multi-lens projection optical systems) in which projection areas of the pattern image of the mask M are arranged in a staggered grid pattern, and functions as a projection optical system having a rectangular single image field with the Y-axis direction as the longitudinal direction. In the present embodiment, for example, an erecting erect image is formed by a bilateral telecentric equal magnification system in each of the plurality of projection optical systems. Hereinafter, a plurality of projection areas of the projection optical system PL arranged in a staggered grid pattern will be collectively referred to as exposure area IA (see fig. 2).
Therefore, after the illumination area on mask M is illuminated with illumination light IL from illumination system IOP, a projection image (partial erected image) of the circuit pattern of mask M in the illumination area is formed on the illumination area (exposure area IA) of illumination light IL through projection optical system PL by illumination light IL passing through mask M, and this area IA is conjugate to the illumination area on substrate P whose surface is coated with a resist (sensitive agent). Then, by synchronously driving mask stage MST and substrate stage device PST, mask M is moved in the scanning direction (X-axis direction) with respect to illumination area (illumination light IL), and substrate P is moved in the scanning direction (X-axis direction) with respect to exposure area IA (illumination light IL), whereby scanning exposure of one shot area (divided area) on substrate P is performed, and the pattern of mask M (mask pattern) is transferred to the shot area. That is, in the present embodiment, a pattern of the mask M is generated on the substrate P by the illumination system IOP and the projection optical system PL, and the pattern is formed on the substrate P by exposing the sensitive layer (resist layer) on the substrate P with the illumination light IL.
Device body 30 includes lens barrel surface plate 31 described above, a pair of lateral columns 32 that support the vicinity of the + Y side and-Y side ends of lens barrel surface plate 31 from below, and a substrate stage mount 33 that supports pair of lateral columns 32 from below. Substrate stage mounting 33 includes a main body 33a formed of a rectangular plate-like member (see fig. 2) in a plan view with the X-axis direction as the longitudinal direction, a pair of support portions 33b that support the pair of cross columns 32, respectively, and a pair of connecting portions 33c that connect the pair of support portions 33b and the main body 33 a. The main body portion 33a, the pair of support portions 33b, and the pair of connecting portions 33c are integrally formed. The pair of support portions 33b are supported from below by the vibration isolator 34 provided on the floor 11 of the clean room. Thus, mask stage MST and projection optical system PL supported by apparatus main body 30 are separated from ground 11 in terms of vibration.
As shown in fig. 2, a pair of Y stators 37 are fixed to the upper surface of the main body 33 a. The pair of Y stators 37 are members extending parallel to the Y axis, and are arranged parallel to each other at a predetermined interval in the X axis direction. Each of the pair of Y stators 37 has a magnet unit including a plurality of permanent magnets arranged in the Y axis direction. Y linear guide members 38 extending parallel to the Y axis are fixed to the + X side and the-X side of the Y stator 37 on the upper surface of the main body portion 33a and on the + X side, respectively. Y linear guide members 38 extending parallel to the Y axis are fixed to the + X side and the-X side of the Y stator 37 on the main body portion 33a and on the-X side, respectively. In fig. 2 (and fig. 5a to 8B), a pair of support portions 33B and a pair of connection portions 33c (each see fig. 1) of substrate stage mount 33 are not shown.
As shown in fig. 2, substrate stage device PST includes Y-step surface plate 50, substrate support member 60, a plurality of air levitation devices 70, fixed point stage 80, and the like.
The Y-step surface plate 50 is a plate-like member having a rectangular shape in plan view with the X-axis direction as the longitudinal direction and being parallel to the XY plane, and is disposed above the main body portion 33 a. The width (dimension (length) in the Y-axis direction) of the Y-step surface plate 50 is set to be substantially the same as (actually slightly longer than) the width (dimension (length) in the Y-axis direction) of the substrate P. The dimension (length) of the Y-step surface plate 50 in the longitudinal direction is set to a dimension (length) that covers the movement range of the substrate P in the X-axis direction, and in the present embodiment, is set to, for example, about 2.5 times the dimension of the substrate P in the X-axis direction. As is apparent from fig. 2 and 3, an elongated hole-shaped opening 50a that is long in the Y-axis direction is formed in the center of the Y-step surface plate 50.
As shown in fig. 3, a pair of Y movers 57 are fixed to the lower surface of the Y stepping surface plate 50 so as to face the pair of Y stators 37, respectively. Each Y mover 57 has a coil unit including a coil not shown. Y stepping surface plate 50 is driven by two (a pair of) Y linear motors, for example, including a pair of Y stators 37 and a pair of Y movers 57, at a predetermined stroke in the Y axis direction on substrate stage mount 33.
A plurality of Y sliders 58 are fixed to the lower surface of the Y stepping surface plate 50. The Y slider 58 is formed of a member having an inverted U-shaped XZ cross section and slidably engaged with the Y linear guide member 38 with low friction. The Y-slide 58 is provided with, for example, two Y-linear guide members 38 as shown in fig. 1. Therefore, in the present embodiment, a total of eight Y sliders 58 (four of the eight Y sliders 58 are hidden on the deep side of the other four in fig. 3) are fixed to the lower surface of the Y stepping surface plate 50 so as to correspond to the four Y linear guide members 38, for example.
Returning to fig. 2, X linear guides 54 extending parallel to the X axis are fixed to the Y stepping surface plate 50 near the + Y side end and near the-Y side end, respectively.
The substrate support member 60 is a U-shaped member in a plan view as shown in fig. 2, and supports the substrate P from below. The substrate support member 60 includes a pair of X support members 61 and one connecting member 62 connecting the pair of X support members 61.
The pair of X-supporting members 61 are each formed of a rod-like member having a YZ cross-sectional rectangle (see fig. 1) whose longitudinal direction is the X-axis direction, and are arranged in parallel to each other at a predetermined interval (slightly shorter than the dimension of the substrate P in the Y-axis direction) in the Y-axis direction. The length direction of each of the pair of X-support members 61 is set to be slightly longer than the X-axis direction of the substrate P. The vicinity of the ends of the substrate P on the + Y side and the-Y side is supported from below by a pair of X support members 61.
An unillustrated adsorption pad is provided on each of the pair of X support members 61. The pair of X-support members 61 holds the substrate P by suction from below in the vicinity of both ends in the Y-axis direction by, for example, vacuum suction. A Y moving mirror 68Y (rod mirror) having a reflection surface orthogonal to the Y axis is attached to the-Y side surface of the-Y side X support member 61.
As shown in fig. 1, the distance between the pair of X support members 61 in the Y axis direction corresponds to the distance between the pair of X linear guides 54. An X slider 64, which is constituted by a YZ cross-sectional inverted U-shaped member and slidably engaged with the corresponding X linear guide 54 with low friction, is fixed to the lower surface of each of the pair of X support members 61. Although not shown in fig. 1 because they are overlapped in the depth direction of the paper, the X slider 64 is provided with, for example, two X linear guides 54.
The connecting member 62 is formed of a rod-like member having a rectangular XZ cross section (see fig. 3) with the Y-axis direction as the longitudinal direction, and connects the-X-side end portions of the pair of X-support members 61 to each other. As is apparent from fig. 1 and 3, the connecting member 62 is mounted on the upper surface of each of the pair of X support members 61, and the Z position of the lower surface thereof is substantially the same as the Z position of the lower surface of the substrate P. As shown in fig. 2, an X moving mirror 68X (rod mirror) having a reflecting surface orthogonal to the X axis is attached to the-X side surface of the connecting member 62.
The substrate support member 60 is driven by a predetermined stroke in the X axis direction on the Y stepping dial 50 by two X linear motors, which are composed of a pair of stators (for example, magnet units including a plurality of permanent magnets arranged in the X axis direction) fixed to the upper surface of the Y stepping dial 50 and a pair of movers (for example, coil units including coils) fixed to the lower surfaces of the pair of X support members 61, though not shown. The substrate support member 60 is driven by a predetermined stroke in the Y-axis direction by the Y-stepping dial 50, is driven by a predetermined stroke in the Y-axis direction integrally with the Y-stepping dial 50, is driven by a predetermined stroke in the X-axis direction on the Y-stepping dial 50 in parallel with (or independently of) the Y-stepping dial 50, and is driven by a predetermined stroke in the X-axis direction and the Y-axis direction.
Positional information of the substrate support member 60 in the XY plane is obtained by a substrate interferometer system including a pair of X interferometers 66X and a pair of Y interferometers 66Y. The pair of X interferometers 66X and the pair of Y interferometers 66Y are fixed to the apparatus main body 30 by a support member not shown. The X interferometer 66X (or the Y interferometer 66Y) splits light from a light source (not shown) by a beam splitter (not shown), irradiates one of the split light as distance measurement light onto the X moving mirror 68X (or the Y moving mirror 68Y), irradiates the other as reference light onto a fixed mirror (not shown) attached to the projection optical system PL (or a member that can be regarded as integral with the projection optical system PL), superimposes reflected light of the distance measurement light from the X moving mirror 68X (or the Y moving mirror 68Y) and reflected light of the reference light from the fixed mirror onto a light receiving element (not shown), and obtains the position of the reflecting surface of the X moving mirror 68X (or the Y moving mirror 68Y) (that is, the displacement of the substrate support member 60) based on the position of the reflecting surface of the fixed mirror from the interference of the light.
The X linear motor for driving the substrate support member 60 is controlled based on the outputs of the pair of X interferometers 66X, and the Y linear motor for driving the Y stepping surface plate 50 is controlled based on the outputs of the pair of Y interferometers 66Y (or a Y linear encoder (not shown)). The distance (and the number of the pair of Y interferometers 66Y) is set so that the distance measuring light from at least one of the Y interferometers 66Y is irradiated to the Y moving mirror 68Y regardless of the position of the substrate support member 60 in the X axis direction. In contrast, the distance between the pair of X interferometers 66X is set so that the X moving mirror 68X is irradiated with the ranging light from the pair of X interferometers 66X as needed regardless of the position of the substrate support member 60 in the Y axis direction.
In the present embodiment, a plurality of, for example, 10 air levitation devices 70 are fixed to the upper surface of the Y-stage surface plate 50. For example, among 10 air levitation devices 70, for example, 5 air levitation devices are disposed at a predetermined interval in the Y-axis direction on the + X side of the opening 50a and in the region between the pair of X linear guides 54, and the other 5 air levitation devices are disposed at a predetermined interval in the Y-axis direction on the-X side of the opening 50a and in the region between the pair of X linear guides 54. For example, 10 aero-levitation devices 70 are substantially identical except for the different configurations.
Each air levitation device 70 is formed of a rectangular parallelepiped member extending in the X-axis direction (the dimension in the X-axis direction is longer than the dimensions in the Y-axis and Z-axis directions), and the longitudinal dimension thereof is set to be substantially the same as (actually, slightly shorter than) the dimension in the X-axis direction of the substrate. The air levitation apparatus 70 has a porous member on its upper surface (surface facing the lower surface of the substrate P), and ejects a pressurized gas (for example, air) from a plurality of fine holes of the porous member to the lower surface of the substrate P, thereby levitating the substrate P. The pressurized gas may be supplied to the air levitation device 70 from the outside, or a blower device or the like may be incorporated in the air levitation device 70. The hole for ejecting the pressurized gas may be formed by machining. The amount of levitation of substrate P by plurality of air levitation devices 70 (the distance between the upper surface of air levitation device 70 and the lower surface of substrate P) is set to, for example, several tens of micrometers to several thousands of micrometers.
Fixed point stage 80 shown in fig. 4 includes weight canceling device 81 mounted on main body 33a of substrate stage mount 33, air chuck device 88 supported by weight canceling device 81 from below, and a plurality of Z voice coil motors 95 for driving air chuck device 88 in three degrees of freedom in θ x, θ y, and Z axis.
As shown in fig. 3, the weight cancellation device 81 is inserted into an opening 50a formed in the Y-step surface plate 50. Here, the dimension defining the opening end of the opening 50a (and/or the outer dimension of the weight canceling device 81) is set so that the opening end of the opening 50a does not contact the weight canceling device 81 when the Y-step surface plate 50 moves in the Y-axis direction by a predetermined stroke. The shape of the opening 50a is not particularly limited as long as it can avoid contact between the weight cancellation device 81 and the Y-stepping surface plate 50 when the Y-stepping surface plate 50 moves in the Y-axis direction by a predetermined stroke, and may be circular, for example.
Returning to fig. 4, weight cancellation device 81 includes a housing 82 fixed to main body 33a of substrate stage mount 33 (see fig. 1), a compression coil spring 83 accommodated in housing 82 and extendable and retractable in the Z-axis direction, a Z slider 84 mounted on compression coil spring 83, and the like. The housing 82 is formed of a bottomed cylindrical member having a + Z-side opening. The Z slider 84 is formed of a cylindrical member extending in the Z axis, and is connected to the inner wall surface of the housing 82 by a parallel plate spring device 85 (including a pair of plate springs arranged apart in the Z axis direction and parallel to the XY plane). The parallel plate spring devices 85 are disposed on the + X side, -X side, + Y side, and-Y side (+ Y side and-Y side parallel plate spring devices 85 are not shown) of the Z slider 84. The Z slider 84 is restricted from moving relative to the housing 82 in a direction parallel to the XY plane by the rigidity (tensile rigidity) of the plate spring provided in the parallel plate spring device 85, and is relatively movable in the Z-axis direction with a minute stroke relative to the housing 82 by the flexibility of the plate spring. The upper end (+ Z-side end) of the Z-slider 84 protrudes upward from the + Z-side end of the casing 82, and supports the air chuck device 88 from below. A hemispherical recess 84a is formed in the upper end surface of the Z slider 84.
The weight cancellation device 81 cancels the weight (downward (-Z direction) force due to gravitational acceleration) of the slider 84 and the air chuck device 88 of the board P, Z by compressing the elastic force (upward force in the gravitational direction (+ Z direction)) of the coil spring 83, thereby reducing the load on the plurality of Z voice coil motors 95. In addition, instead of the compression coil spring 83, a weight-balancing device such as that disclosed in U.S. patent application publication No. 2010/0018950 may be used to balance the weight of the air chuck device 88 and the like using an air spring or the like capable of controlling the load.
The air chuck device 88 is disposed above the weight cancellation device 81 (+ Z side). The air chuck device 88 includes a base member 89, a vacuum preload air bearing 90 fixed to the base member 89, and a pair of air levitation devices 91 respectively disposed on the + X side and the-X side of the vacuum preload air bearing 90.
The base member 89 is formed of a plate-like member arranged in parallel with the XY plane, and the Z position of the lower surface thereof is arranged slightly higher than the Z position of the upper surface of the Y-step surface plate 50 as shown in fig. 3. Returning to fig. 4, a spherical air bearing 92 having a hemispherical bearing surface is fixed to the center of the lower surface of the base member 89. The spherical air bearing 92 is inserted into a recess 84a formed in the Z slider 84. Thus, the air chuck device 88 is supported by the Z slider 84 so as to be swingable (rotatable in the θ x and θ y directions) with respect to the XY plane. As a device for supporting the air chuck device 88 to be swingable with respect to the XY plane, for example, a pseudo-spherical bearing device using a plurality of air bearings disclosed in U.S. patent application publication No. 2010/0018950 may be used, and an elastic hinge device may be used.
As shown in fig. 2, vacuum preload air bearing 90 is formed of a rectangular plate-like member having a longitudinal direction in the Y-axis direction in a plan view, and its area is set to be slightly larger than the area of exposure region IA. The vacuum preload air bearing 90 has a gas ejection hole and a gas suction hole in its upper surface, and ejects a pressurized gas (for example, air) from the gas ejection hole toward the lower surface of the substrate P and sucks the gas between the substrate P and the gas suction hole. Vacuum preload air bearing 90 forms a highly rigid gas film between its upper surface and the lower surface of substrate P by the balance between the pressure of the gas ejected toward the lower surface of substrate P and the negative pressure with substrate P, and holds substrate P by suction in a non-contact manner through a substantially constant gap (gap/slit). The flow rate or pressure of the gas to be discharged and the flow rate or pressure of the gas to be sucked are set so that the distance between the upper surface (substrate holding surface) of the vacuum preload air bearing 90 and the lower surface of the substrate P is, for example, on the order of several micrometers to several tens micrometers.
Here, as shown in fig. 2, vacuum preload air bearing 90 is disposed immediately below (on the side of the negative Z) projection optical system PL, and holds by suction a portion (exposed portion) of substrate P located immediately below projection optical system PL, which corresponds to exposure region IA. Since the vacuum preload air bearing 90 applies a so-called preload to the substrate P, the rigidity of the gas film formed between the substrate P and the vacuum preload air bearing 90 can be increased, and even if the substrate P is distorted or warped, the shape of the exposed position of the substrate P located immediately below the projection optical system PL can be reliably corrected along the upper surface of the vacuum preload air bearing 90. Further, since the vacuum preload air bearing 90 does not restrict the position of the substrate P in the XY plane, the substrate P can be moved along the XY plane with respect to the illumination light IL (see fig. 3) even in a state where the substrate P is sucked and held by the vacuum preload air bearing 90 at the exposure target portion. Such non-contact air chuck devices (vacuum preloaded air bearings) are disclosed, for example, in U.S. patent No. 7,607,647, et al. The pressurized gas discharged from the vacuum preload air bearing 90 may be supplied from the outside, or a blower or the like may be incorporated in the vacuum preload air bearing 90. Further, a suction device (vacuum device) for sucking the gas between the upper surface of the vacuum preload air bearing 90 and the lower surface of the substrate P may be provided outside the vacuum preload air bearing 90 or may be incorporated in the vacuum preload air bearing 90. The gas ejection holes and the gas suction holes may be formed by machining, or a porous material may be used. As a method of vacuum preloading, a negative pressure may be generated by using only a positive pressure gas (e.g., bernoulli chuck device) without performing gas suction.
The pair of air levitation devices 91 levitate the substrate P by ejecting pressurized gas (e.g., air) from the upper surface thereof toward the lower surface of the substrate P, as in the air levitation device 70 described above. The Z position of the upper surface of the pair of air levitation devices 91 is set to be substantially the same as the Z position of the upper surface of the vacuum preload air bearing 90. As shown in fig. 3, the Z position of the upper surfaces of the vacuum preload air bearing 90 and the pair of air levitation devices 91 is set to be slightly higher than the Z position of the upper surfaces of the plurality of air levitation devices 70. Therefore, the plurality of air levitation devices 70 are of a high levitation type capable of levitating the substrate P higher than the pair of air levitation devices 91. The pair of air levitation devices 91 may not only eject the pressurized gas to the substrate P but also suck the air between the upper surface thereof and the substrate P as in the vacuum preload air bearing 90. In this case, it is preferable to set the suction pressure to a load weaker than the preload of the vacuum preload air bearing 90.
As shown in fig. 4, each of the plurality of Z voice coil motors 95 includes a Z stator 95a fixed to a base frame 98 provided on the ground 11 and a Z mover 95b fixed to the base member 89. The Z voice coil motors 95 are disposed on the + X side, -X side, + Y side, and-Y side (+ Y side and-Y side Z voice coil motors 95, not shown) of the weight cancellation device 81, for example, and can drive the air chuck device 88 in the three-degree-of-freedom directions of the θ X, θ Y, and Z axes with a minute stroke. The plurality of Z voice coil motors 95 may be disposed at three positions not located on the same straight line.
The base frame 98 includes a plurality of leg portions 98a (for example, four leg portions corresponding to the Z voice coil motor 95) inserted through the plurality of through holes 33d formed in the main body portion 33a, and a main body portion 98b supported from below by the plurality of leg portions 98 a. The main body 98b is formed of a plate-like member having an annular shape in plan view, and the weight cancellation device 81 is inserted into an opening 98c formed in a central portion thereof. The legs 98a are in a non-contact state with the main body 33a and are separated from each other in terms of vibration. Therefore, the reaction force when the air chuck device 88 is driven using the plurality of Z voice coil motors 95 is not transmitted to the weight cancellation device 81.
The positional information of the air chuck device 88 driven by the Z voice coil motors 95 in the three-degree-of-freedom direction is obtained using a plurality of Z sensors 96 fixed to the main body 33a, for example, four Z sensors in the present embodiment. The Z sensor 96 is provided with one Z sensor (not shown) on the + X side, the-X side, the + Y side, and the-Y side of the weight cancellation device 81, respectively. The Z sensor 96 uses a target portion 97 fixed to the lower surface of the base member 89 of the air chuck device 88 to determine a change in the Z-axis direction distance between the main body portion 98b (main body portion 33a) of the base frame 98 and the base member 89. The main control device, not shown, determines positional information of the air chuck device 88 in the Z-axis, θ x, and θ y directions as needed from outputs of the four Z sensors 96, and controls the position of the air chuck device 88 by appropriately controlling the four Z voice coil motors 95 based on the measured values. Since the plurality of Z sensors 96 and the target portion 97 are disposed near the plurality of Z voice coil motors 95, high-speed and highly responsive control can be performed. In addition, the arrangement of the Z sensor 96 and the target portion 97 may be reversed.
Here, the final position of the air chuck device 88 is controlled so that the upper surface of the substrate P above the vacuum preload air bearing 90 is always within the depth of focus of the projection optical system PL. The main controller (not shown) controls the air chuck device 88 to drive (auto focus control) so that the upper surface of the substrate P is always within the focal depth of the projection optical system PL (the projection optical system PL is always focused on the upper surface of the substrate P) while monitoring the position (surface position) of the upper surface of the substrate P by a surface position measuring system (auto focus sensor) (not shown). The Z sensor 96 may be provided at three positions, for example, not on the same straight line, since it is sufficient to obtain positional information of the air chuck device 88 in the Z axis, the θ x, and the θ y directions.
The liquid crystal exposure apparatus 10 (see fig. configured as described above) is configured such that the mask M is loaded on the mask stage MST by a mask loader (not shown) and the substrate P is loaded on the substrate support member 60 by a substrate loader (not shown) under the control of a main controller (not shown). Thereafter, the main controller executes alignment measurement using an alignment detection system, not shown, and performs an exposure operation of the step-and-scan method after the alignment measurement is completed.
Here, an example of the operation of substrate stage device PST during the exposure operation will be described with reference to fig. 5(a) to 8 (B). In addition, although the case where four irradiation regions are set on one substrate (the case of taking four sides) will be described below, the number and arrangement of the irradiation regions set on one substrate P may be changed as appropriate.
For example, as shown in FIG. 5A, the exposure process is performed in the order of the 1 st irradiation region S1 set on the-Y side and the-X side of the substrate P, the 2 nd irradiation region S2 set on the + Y side and the-X side of the substrate P, the 3 rd irradiation region S3 set on the + Y side and the + X side of the substrate P, and the 4 th irradiation region S4 set on the-Y side and the + X side of the substrate P. In substrate stage device PST, as shown in fig. 5(a), the position of substrate support member 60 in the XY plane is controlled such that 1 st irradiation region S1 is located on the + X side of exposure region IA based on the outputs of the pair of X interferometer 66X and + Y side Y interferometer 66Y.
Thereafter, as shown in fig. 5B, the substrate support member 60 is driven in the-X direction at a predetermined constant speed (see the arrow in fig. 5B) with respect to the illumination light IL (see fig. 1) in accordance with the output of the pair of X interferometers 66X, whereby the mask pattern is transferred to the 1 st shot area S1 on the substrate P. After the exposure process for irradiation field 1S 1 is completed, substrate stage device PST controls the position of substrate support member 60 such that the + X-side end of irradiation field 2S 2 is located slightly on the-X side of exposure field IA (not shown in fig. 6 a, see fig. 2) based on the output of pair of Y interferometers 66Y, as shown in fig. 6 a.
Next, as shown in fig. 6B, the substrate support member 60 is driven in the + X direction at a predetermined constant speed (see the arrow in fig. 6B) with respect to the illumination light IL (see fig. 1) in accordance with the output of the pair of X interferometers 66X, whereby the mask pattern is transferred to the 2 nd shot area S2 on the substrate P. Thereafter, as shown in fig. 7 a, the position of the substrate support member 60 in the XY plane is controlled so that the-X side end of the 3 rd shot region S3 is positioned on the slightly + X side of the exposure region IA (not shown in fig. 7 a, see fig. 2) based on the output of the pair of X interferometers 66X (see the arrow in fig. 7 a), and as shown in fig. 7B, the substrate support member 60 is driven in the-X direction at a predetermined constant speed (see the arrow in fig. 7B) based on the output of the pair of X interferometers 66X with respect to the illumination light IL (see fig. 1), whereby the mask pattern is transferred onto the 3 rd shot region S3 on the substrate P.
Next, as shown in fig. 8a, the position of the substrate support member 60 in the XY plane is controlled so that the + X side end of the 4 th shot region S4 is located on the slightly-X side (see arrow in fig. 8 a; see fig. 2) with respect to the exposure region IA (not shown in fig. 8 a) based on the output of the Y interferometer 66Y on the-X side, and as shown in fig. 8B, the mask pattern is transferred to the 4 th shot region S4 on the substrate P by driving the substrate support member 60 at a predetermined constant speed in the + X direction (see arrow in fig. 8B) based on the output of the pair of X interferometers 66X with respect to the illumination light IL (see fig. 1).
The main controller measures surface position information of the exposed portion of the front surface of the substrate P in the step-and-scan type exposure operation shown in fig. 5(a) to 8 (B). Then, the main control device controls the positions (surface positions) of the vacuum preload air bearings 90 of the air chuck device 88 in the Z-axis direction, the θ x direction, and the θ y direction based on the measured values so as to position the surface position of the portion to be exposed located immediately below the projection optical system PL in the surface of the substrate P within the depth of focus of the projection optical system PL. Thus, even if, for example, the surface of the substrate P is undulated or the thickness of the substrate P is varied, the surface position of the exposed portion of the substrate P can be reliably positioned within the depth of focus of the projection optical system PL, and the exposure accuracy can be improved. Most of the area of substrate P other than the portion corresponding to exposure area IA is supported by floating by a plurality of air levitation devices 70. Thus, the substrate P is prevented from being bent by its own weight.
As described above, since the substrate stage device PST included in the liquid crystal exposure apparatus 10 according to embodiment 1 centrally controls the surface position of the substrate surface at the position corresponding to the exposure region, the weight of the substrate stage device PST can be significantly reduced as compared with a case where the substrate holder (that is, the entire substrate P) having the same area as the substrate P is driven in the Z-axis direction and the tilt direction, respectively, as in the stage device disclosed in, for example, U.S. patent application publication No. 2010/0018950.
Further, since the substrate support member 60 has a structure of holding only the end portion of the substrate P, if the substrate P is increased in size, the X linear motor for driving the substrate support member 60 only needs to have a small output, and the running cost can be reduced. In addition, the basic equipment such as power supply equipment can be easily prepared. Further, since the output of the X linear motor is small, the initial cost can be reduced. Further, since the output (thrust) of the X linear motor is small, the influence of the driving reaction force on the entire apparatus (influence on the exposure accuracy due to vibration) is also small. Further, assembly, adjustment, maintenance, and the like are easy as compared with the conventional substrate stage device. Further, since the number of members is small and each member is lightweight, transportation is also easy. Further, although Y-stage surface plate 50 including a plurality of air levitation devices 70 is larger than substrate support member 60, positioning of substrate P in the Z-axis direction is performed by fixed point stage 80, and air levitation devices 70 themselves levitate only substrate P, so that rigidity is not required, and a relatively lightweight device can be used.
Further, since the levitation amount of substrate P in plurality of air levitation devices 70 is set to, for example, several tens to several thousands of micrometers (that is, the levitation amount is larger than fixed point stage 80), contact between substrate P and air levitation device 70 is prevented even if substrate P is deflected or the installation position of air levitation device 70 is shifted. Since the rigidity of the pressurized gas ejected from the air levitation devices 70 is low, the load on the Z voice coil motor 95 is small when the surface position of the substrate P is controlled using the fixed point stage 80.
Further, since the substrate support member 60 for supporting the substrate P has a simple configuration, the weight can be reduced. Therefore, although the reaction force generated when the substrate support member 60 is driven is transmitted to the apparatus main body 30 through the Y-stage surface plate 50, the driving reaction force itself is small, and therefore, even if the apparatus vibration (such as a resonance phenomenon caused by the oscillation or vibration of the apparatus main body 30) due to the driving reaction force is generated, there is little possibility that the influence is exerted on the exposure accuracy.
Further, since the Y-stage table 50 is heavier than the substrate support member 60, the driving reaction force is also larger than when the substrate support member 60 is driven, but when the Y-stage table 50 is driven to move the substrate PY in the Y-axis direction by a long stroke (i.e., when the exposure is not performed), there is less possibility that the apparatus vibration due to the driving reaction force affects the exposure accuracy.
EXAMPLE 2 embodiment
Next, a substrate stage device according to embodiment 2 will be described with reference to fig. 9 and 10. Substrate stage device PSTa according to embodiment 2 differs in that substrate supporting member 160 supporting substrate P can be driven in the X-axis, Y-axis, and θ z directions to Y-step surface plate 50 in a minute manner.
Note that, in substrate stage device PSTa according to embodiment 2, members having the same configurations and functions as those of substrate stage device PST according to embodiment 1 (see fig. 2) are given the same reference numerals as those of embodiment 1, and description thereof will be omitted.
Substrate stage device PSTa includes a pair of X brackets 20. The pair of X-carriages 20 are disposed above the Y-stage surface plate 150 and on the + X side and the-Y side of the substrate support member 160, respectively. Each X carriage 20 is formed of a plate-like member that is rectangular in plan view with the X-axis direction as the longitudinal direction and is arranged parallel to the XY plane, and as shown in fig. 10, X sliders 24 having YZ cross-sections in an inverted U shape are fixed near four corners of the lower surface thereof (two of the four sliders 24 are hidden on the deep side of the other two in the drawing sheet).
On the other hand, a pair of X linear guides 54 disposed apart in the Y axis direction are fixed to the upper surface of the Y stepping surface plate 150 near the + Y side and the-Y side ends, respectively. The X carriage 20 on the + X side is slidably mounted on the pair of X linear guides 54 on the + Y side by the X slider 24, and the X carriage 20 on the-Y side is slidably mounted on the pair of X linear guides 54 on the-Y side by the X slider 24. The X carriage 20 is driven by an X linear motor (including an X mover (not shown) fixed to the X carriage 20 and an X stator fixed to the Y stepping surface plate 150 corresponding to the X mover) in a predetermined stroke in the X axis direction on the Y stepping surface plate 150. The positional information of the X carriage 20 is obtained by a Y linear encoder system (including a not-shown linear encoder head (detector) fixed to the X carriage 20 and a not-shown Y linear scale fixed to the Y stepping surface plate 150). The pair of X carriages 20 are driven synchronously according to the measurements of the Y linear encoder system described above.
Further, X guides 55 are fixed to the upper surface of the Y stepping surface plate 150 near the + Y-side end and near the-Y-side end, respectively, inside the pair of X linear guides 54. The X guide 55 is formed of a YZ cross-sectional rectangular member extending in the X axis direction (see fig. 10), and the flatness of the upper surface thereof is set to be extremely high. The interval between the two X guides 55 substantially matches the interval between the pair of X support members 61 included in the substrate support member 160.
As shown in fig. 10, an air bearing 65 having a bearing surface facing the upper surface of the X guide 55 is attached to the lower surface of each of the pair of X support members 61 of the substrate support member 160. The substrate support member 160 is supported in a floating manner on the pair of X guides 55 by the action of the air bearing 65. In embodiment 1, the X slider 64 (see fig. 1) is fixed to the lower surface of the X support member 61, but the X slider 64 is not provided in the substrate support member 160 of embodiment 2.
Returning to fig. 9, the substrate support member 160 is driven in the X-axis, Y-axis, and θ z directions slightly with respect to the pair of X carriages 20 by two X voice coil motors 29X and two Y voice coil motors 29Y. One of the two X voice coil motors 29X and one of the two Y voice coil motors 29Y are disposed on the-Y side of the substrate support member 160, and the other of the two X voice coil motors 29X and the other of the two Y voice coil motors 29Y are disposed on the + Y side of the substrate support member 160. The one and the other X voice coil motors 29X are disposed at positions that are point-symmetrical with respect to the center of gravity CG of the system in which the substrate support member 160 and the substrate P are combined, and the one and the other Y voice coil motors 29Y are disposed at positions that are point-symmetrical with respect to the center of gravity CG.
As shown in fig. 10, one (Y-side) Y voice coil motor 29Y includes a stator 27Y (for example, having a coil unit including a coil) fixed to the upper surface of the X bracket 20 on the-Y side via a support member 28, and a mover 67Y (for example, having a magnet unit including a magnet) fixed to the side surface of the X support member 61 on the-Y side. In fig. 10, the X voice coil motor 29X is hidden on the deep side of the drawing, but the other (+ Y side) Y voice coil motor 29Y (see fig. 9) has the same configuration as the one Y voice coil motor 29Y. The other (+ Y side) X voice coil motor 29X includes a stator 27X fixed to the upper surface of the + Y side X bracket 20 via the support member 28, and a mover 67X fixed to the side surface of the + Y side X support member 61. In fig. 10, the Y voice coil motor 29Y is hidden on the deep side of the paper surface, but one (the Y side) X voice coil motor 29X has the same configuration as the other X voice coil motor 29X.
Returning to fig. 9, when the pair of X carriages 20 are driven in the X-axis direction by a predetermined stroke on the Y-stepping surface plate 150, the substrate support member 160 is driven synchronously with respect to the pair of X carriages 20 by the two X voice coil motors 29X (driven in the same direction and at the same speed as the pair of X carriages 20). Thereby, the pair of X-brackets 20 and the substrate support member 160 move integrally in the X-axis direction. When the Y stepping platen 150 and the pair of X carriages 20 are driven in the Y axis direction by a predetermined stroke, the substrate support member 160 is driven synchronously with respect to the pair of X carriages 20 by the two Y voice coil motors 29Y (driven in the same direction and at the same speed as the pair of X carriages 20). Thereby, the Y-step surface plate 150 and the substrate support member 160 move integrally in the Y-axis direction. The substrate support member 160 is driven to a proper slight extent in a direction (θ Z direction) around an axis parallel to the Z axis passing through the center of gravity CG by a difference in the thrust of the two X voice coil motors 29X (or the two Y voice coil motors 29Y). The positional information of the substrate support member 160, i.e., the substrate P, in the XY plane (including the θ z direction) is obtained by the pair of X interferometers 66X.
Note that the operation and the like at the time of step scanning of substrate stage device PSTa in embodiment 2 are the same as those in embodiment 1 described above, and therefore, the description thereof is omitted.
According to substrate stage device PSTa of embodiment 2, in addition to the effects obtainable by embodiment 1 described above, substrate support member 160 holding substrate P is separated from Y-stage surface plate 150 in terms of vibration in a direction parallel to the XY plane without contacting it, and therefore transmission of reaction force and vibration of the X linear motor (or Y linear motor) when substrate support member 160 is driven can be suppressed. Further, when the substrate P is driven in the scanning direction, the substrate P can be driven in the cross scanning direction and the θ z direction in a minute manner, and thus exposure can be performed with higher accuracy. Further, since the substrate support member 160 has a structure that only holds the end portion of the substrate P, the voice coil motor for driving the substrate support member 160 may have a small output if the substrate P is large, and the operation cost can be reduced.
Embodiment 3
Next, embodiment 3 will be described with reference to fig. 11 to 13 (a). Embodiment 3 differs from embodiment 1 (see fig. 1 and the like) in the configuration of apparatus main body 30 and substrate stage device PST. Note that, of apparatus main body 130 and substrate stage device PSTb of embodiment 3, members having the same configurations and functions as those of embodiment 1 are given the same reference numerals as those of embodiment 1, and description thereof will be omitted.
As shown in fig. 12(B), substrate stage device PSTb according to embodiment 3 is such that Y-step surface plate 50 is mounted on mount 40 provided on ground 11. As shown in fig. 11, a pair of mounts 40 are provided so as to be separated from each other in the X-axis direction, and a Y-step surface plate 50 is mounted on the two mounts 40. As is apparent from fig. 11 and 12(a), a plurality of Y linear guide members 38 for linearly guiding the Y stepping surface plate 50 in the Y axis direction and a Y stator 37 constituting a Y linear guide for driving the Y stepping surface plate 50 in the Y axis direction are fixed to the upper surfaces of the pair of mounts 40.
As shown in fig. 11, in apparatus main body 130, main body 133a and connecting portion 133c of substrate stage mount 133 are set to be shorter in the X-axis direction than main body 33a and connecting portion 33c (see fig. 1, respectively) of embodiment 1. The main body 133a is disposed between the longitudinal center portions of the pair of support portions 33 b. As shown in fig. 12(a), weight canceling device 81 of fixed point stage 80 is mounted on main body 133 a. The main body 133a is formed with a through hole through which the leg 98a of the chassis frame 98 is inserted.
Here, as shown in fig. 11, the pair of mounts 40 are separated from main body 133a and substrate stage mount 133 (i.e., device body 130) in terms of vibration, with one being disposed on the + X side of main body 133a and the other being disposed on the-X side of main body 133 a. Therefore, the transmission of the reaction force, vibration, and the like to the apparatus main body 130 when the Y-stepping surface plate 50 is driven in the Y-axis direction can be suppressed.
In substrate stage device PSTb according to embodiment 3, since fixed point stage 80 is mounted on main body 133a which is a part of device main body 130 and Y-step surface plate 50 is mounted on a pair of stages 40, there is a possibility that the Z position of substrate support member 60b (the Z position of the movement plane when substrate support member 60b moves in parallel along the XY plane) and the Z position of fixed point stage 80 may change due to, for example, the action of vibration isolator 34. Therefore, in embodiment 3, the substrate supporting member 60B adsorbs and holds the substrate P (so as to restrain the substrate P in the Z-axis direction) by using the holding member 161B that is slightly movable in the Z-axis direction with respect to the X-supporting member 61B as shown in fig. 13 a (the holding member 161B is not shown in fig. 11 to 12B). The holding member 161b is formed of a rod-like member extending in the X-axis direction, and has an adsorption pad (not shown) on its upper surface (not shown, such as a pipe for vacuum suction). Pins 162b protruding downward (-Z side) are attached to the lower surface of the holding member 161b near both longitudinal ends thereof. The pin 162b is inserted into a recess formed in the upper surface of the X support member 61b, and is supported from below by a compression coil spring accommodated in the recess. Thereby, the holding member 161b (i.e., the substrate P) can move in the Z-axis direction (vertical direction) with respect to the X-support member 61 b. Therefore, as described above, if the Z position of substrate support member 60b and the Z position of fixed point stage 80 are offset, substrate P is also moved (moved up and down) in the Z-axis direction relative to X support member 61b in accordance with the Z position of air levitation device 70, and therefore, the load on substrate P in the Z-axis direction can be suppressed. As shown in the substrate support member 60c of fig. 13(B), a holding member 161c having an unillustrated suction pad may be slightly moved in the Z-axis direction with respect to the X-support member 61B by using a plurality of parallel plate spring devices 162 c. In embodiment 3, the substrate support member 60b (or 60c) may be configured to be slightly driven in the Y-axis direction and the θ z direction with respect to the Y-step surface plate 50, as in embodiment 2.
The configuration of the liquid crystal exposure apparatus according to embodiments 1 to 3 may be changed as appropriate. For example, the substrate support members 60 and 160 according to embodiments 1 and 2 are configured to hold the substrate P by suction from below, but are not limited to this configuration, and may hold the substrate P by a pressing device that presses an end portion of the substrate P in the Y-axis direction (from one X support member 61 side to the other X support member 61 side). In this case, the exposure process can be performed on the substantially entire surface of the substrate P.
Further, the shaft guide device for guiding the Y-stage surface plates 50 and 150 or the substrate support members 60, 160, 60b and 60c may be a non-contact shaft guide device including a guide member made of, for example, stone, ceramic, or the like, and a plurality of aerostatic bearings (air bearings).
The driving device for driving the Y-stage surface plates 50 and 150 or the substrate support members 60, 160, 60b, and 60c may be a feeding device in which a ball screw and a rotary motor are combined, a belt driving device in which a belt (or a rope) and a rotary motor are combined, or the like.
The positional information of the substrate support members 60, 160, 60b, and 60c may be obtained by using a linear encoder system. Further, the position information of each of the pair of X support members 61 (61 b in the above-described embodiment 3) included in the substrate support members 60, 160, 60b, and 60c may be independently obtained using the linear encoder system, and in this case, the pair of X support members 61 may not be mechanically connected to each other (the connecting member 62 is not required).
In fixed point stage 80 (see fig. 4), stator 95a that drives Z voice coil motor 95 of air chuck device 88 may be fixed to substrate stage mount 33 (main body 133a in embodiment 3) when the driving reaction force is so small that the influence on apparatus main body 30 can be ignored.
In fixed point stage 80, air chuck device 88 may be configured to be movable in the X axis direction, vacuum preload air bearing 90 may be positioned on the upstream side in the movement direction of substrate P before the start of the scanning exposure operation (for example, on the + X side of exposure area IA before exposure in irradiation area S1 No. 1 shown in fig. 5 a), the surface position of the upper surface of substrate P may be adjusted in advance at this position, and air chuck device 88 may be moved in synchronization with substrate P (substrate support member 60) as substrate P moves in the scanning direction (stopped immediately below exposure area IA during exposure).
In addition, in embodiment 1 described above, although the substrate P is not finely positioned in the Y-axis direction and the θ z direction during the scanning exposure, in this case, the mask stage MST may be configured to be driven finely in the Y-axis direction and the θ z direction, and the mask M may be made to follow the substrate P to perform the alignment.
Further, a mass block may be provided to reduce a driving reaction force when a movable member such as the Y-stage 50 and the substrate support member 60 is driven by a linear motor.
The illumination light is not limited to ArF excimer laser light (wavelength of 193nm), but may be any lightUsing ultraviolet light such as KrF excimer laser light (wavelength 248nm), F2Vacuum ultraviolet light such as laser light (wavelength 157 nm). Further, as the illumination light, for example, a harmonic wave, which is a fiber amplifier doped with erbium (or both erbium and ytterbium), is used, and a single wavelength laser light in the infrared region or the visible region oscillated from a DFB semiconductor laser or a fiber laser is amplified and converted into ultraviolet light in wavelength by a nonlinear optical crystal. In addition, solid state lasers (wavelength: 355nm, 266nm) and the like can also be used.
In the above embodiments, the projection optical system PL has been described as a multi-lens type projection optical system including a plurality of projection optical systems, but the number of projection optical systems is not limited to this, and may be one or more. The present invention is not limited to the projection optical system of the multi-lens system, and may be a projection optical system using a large mirror of the Offner type.
In the above-described embodiment, the projection optical system PL is described as using a system having an equal magnification of projection magnification, but the projection optical system PL is not limited to this, and may be any of an enlargement system and a reduction system.
In the above embodiment, although the light transmissive mask (reticle) is used for forming a predetermined light shielding pattern (or phase pattern, or dimming pattern) on a substrate having light transmission properties, an electronic mask disclosed in, for example, U.S. patent No. 6,778,257 may be used instead of the reticle, and the electronic mask (variable-shape mask) is a variable-shape mask using, for example, a DMD (Digital Micro-mirror Device) which is a type of non-light-emitting image display Device (also referred to as a spatial light modulator) and forms a transmission pattern, a reflection pattern, or a light-emitting pattern based on electronic data of a pattern to be exposed.
The exposure apparatus is particularly effective when applied to an exposure apparatus for exposing a substrate having a size (including at least one of an outer diameter, a diagonal line, and one side) of 500mm or more, for example, a large-sized substrate for a Flat Panel Display (FPD) such as a liquid crystal display device.
The exposure apparatus can be applied to exposure processing by a step and repeat method and exposure apparatus by a step and join method.
The application of the exposure apparatus is not limited to the exposure apparatus for liquid crystal which transfers a liquid crystal display element pattern onto an angular glass plate, and can be widely applied to the exposure apparatus for manufacturing, for example, an exposure apparatus for semiconductor manufacturing, a thin film magnetic head, a micromachine, a DNA chip, or the like. In addition to the production of microdevices such as semiconductor devices, the above embodiments can be applied to an exposure apparatus for transferring a circuit pattern to a glass substrate, a silicon wafer, or the like in order to produce a mask or a reticle used in a light exposure apparatus, an EUV exposure apparatus, an X-ray exposure apparatus, an electron beam exposure apparatus, or the like. The object to be exposed is not limited to a glass plate, and may be, for example, a wafer, a ceramic substrate, a film member, or another object such as a photomask. When the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and examples thereof include a film (a flexible sheet member).
Further, the movable body device (stage device) that moves the object along the predetermined two-dimensional plane is not limited to the exposure device, and an object processing device or the like that performs predetermined processing on the object, such as an object inspection device used for inspecting the object, may be used.
Further, the disclosures of all U.S. patent application publications and U.S. patent applications relating to exposure apparatuses and the like cited in the description so far are incorporated as a part of the present specification.
Method for manufacturing device
Next, a method for manufacturing a microdevice using the exposure apparatus according to each of the above embodiments in a lithography step will be described. The exposure apparatus 10 of each of the above embodiments can form a liquid crystal display device as a microdevice by forming a predetermined pattern (circuit pattern, electrode pattern, or the like) on a plate (glass substrate).
< Pattern Forming step >
First, a so-called photolithography step is performed in which a pattern image is formed on a photosensitive substrate (e.g., a glass substrate coated with a resist) using the exposure apparatus according to each of the above embodiments. Through the photolithography step, a predetermined pattern including a plurality of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate is subjected to a developing step, an etching step, a photoresist stripping step, and the like to form a predetermined pattern on the substrate.
< color Filter Forming step >
Next, a plurality of three dots corresponding to r (red), g (green), and b (blue) are formed in a matrix, or a plurality of R, G, B filter groups of three stripes are arranged in the horizontal scanning line direction.
< cell Assembly step >
Next, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern forming step, the color filter obtained in the color filter forming step, and the like. For example, a liquid crystal panel (liquid crystal cell) is manufactured by injecting liquid crystal between a substrate having a predetermined pattern obtained in the pattern forming step and a color filter obtained in the color filter forming step.
< Module Assembly step >
Then, the liquid crystal display element is completed by mounting various components such as a circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell).
In this case, in the pattern forming step, the exposure of the plate can be performed with high throughput and high accuracy by using the exposure apparatus according to each of the above embodiments, and as a result, the productivity of the liquid crystal display device can be improved.
The industrial application is as follows:
as described above, the object moving device of the present invention is suitable for driving an object along a predetermined two-dimensional plane. The object processing apparatus according to the present invention is suitable for performing a predetermined process on an object. The exposure apparatus of the present invention is suitable for forming a predetermined pattern on an object. The method for manufacturing a flat panel display of the present invention is suitable for manufacturing a flat panel display. The element manufacturing method of the present invention is suitable for producing a microdevice.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.