Since apple iPhone 4 prototype, an engineer, 3/25/2010 was stolen (as known by apple Inc.), the invention to be disclosed and claimed in this application was prematurely disclosed to the public and not authorized by apple Inc. The U.S. priority application on which this application is based is filed after a theft event known to apple inc.
The present invention relates generally to electronic device housings.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
CROSS-REFERENCE TO RELATED APPLICATIONS
This application claims priority to U.S. provisional patent application No. 61/300,780 filed on 2/2010, U.S. provisional patent application No. 61/325,625 filed on 4/19/2010, and U.S. provisional patent application No. 61/325,786 filed on 4/19/2010, all of which are incorporated herein by reference in their entirety.
Electronic devices may be provided with mechanical and electronic components for providing different functions to a user. In some cases, components of an electronic device may be configured to provide mechanical features that improve the performance, aesthetics, robustness, and size of the electronic device.
Electronic devices that may be provided with these components may include desktop computers, computer monitors including embedded computers, wireless computer cards, wireless adapters, televisions, set-top boxes, gaming consoles, routers, portable electronic devices (such as laptop computers and tablet computers), handheld devices (such as cellular telephones and media players), and small devices (such as wrist-watch devices, pendant devices, headset and earpiece devices, and other wearable micro-devices). Portable devices such as cellular telephones, media players, and other handheld electronic devices are sometimes described herein as examples.
Fig. 1 illustrates an exemplary electronic device that is provided with mechanical and electrical features to improve performance, aesthetics, robustness, and size. As shown in fig. 1, device 10 may include storage and processing circuitry 12, and storage and processing circuitry 12 may include one or more different types of memory, such as hard disk drive storage, non-volatile memory (e.g., flash memory or other electronically programmable read-only memory), volatile memory (e.g., static or dynamic random access memory), or a combination of these. Storage and processing circuitry 12 may be used to control the operation of device 10. The processing circuitry in circuit 12 may be based on a processor, such as a microprocessor, microcontroller, digital signal processor, dedicated processor circuitry, power management circuitry, audio and video chips, and other suitable integrated circuits.
With one suitable arrangement, the storage and processing circuitry 12 may be used to run software on the device 10, such as an internet browsing application, a Voice Over Internet Protocol (VOIP) telephone call application, an email application, a media playback application, operating system functions, antenna and wireless circuitry control functions, or a combination of these. The storage and processing circuitry 12 may be used to implement appropriate communication protocols. The communication protocols that may be implemented using storage and processing circuitry 12 may include internet protocols, wireless local area network protocols (e.g., IEEE802.11 protocols, sometimes referred to as IEEE802.11 protocols)Protocols for other short-range wireless communication links such asProtocols, protocols for handling cellular telephone communication services, or other similar communication protocols.
Input-output devices 14 may be used to allow data to be provided to device 10 and to allow data to be provided from device 10 to external devices. Examples of input-output devices 14 that may be used in device 10 include: a display such as a touch screen (e.g., a liquid crystal display or an organic light emitting diode display), buttons, a joystick, a click wheel, a scroll wheel, a touch pad, a keypad, a keyboard, a microphone, a speaker, and other devices for creating sound, a camera, sensors, or a combination of these. The user may control the operation of device 10 by providing commands through device 14 or by providing commands through an accessory that communicates with device 10 over a wireless or wired communication link. Device 14 or an accessory that communicates with device 10 via a wireless or wired connection may be used to communicate visual or acoustic information to a user of device 10. The device 10 may include a connector for forming a data port (e.g., for attaching an external device such as a computer, accessory, etc.).
Various components of the electronic device may be enclosed by the housing 16. The housing may protect the internal components and may help maintain the internal components in their assembled position within the device 10. The housing 16 may also help form a portion of the outer peripheral look and feel (e.g., a decorative look) of the device 10. The housing can be widely varied. For example, the housing may include various exterior components using various different materials. In one example, at least a portion of the housing may include a translucent/transparent portion through which the internal components may optically communicate with the outside world.
According to one embodiment of the invention, the apparatus 10 may include an optical system 18. The optical system 18 may include, for example, optical components that operate through a window or opening 22 in the housing 16. The optical component may correspond to one or more camera modules, for example. Even if located inside the housing 16, the camera module may be configured to capture image data external to the device 10 via the window 22 by a line of sight through the window 22. The optical components may be positioned along an axis 24 that is aligned with the window 22 to provide the best possible image capture. By way of example, the window 22 may be associated with a translucent or transparent portion of the housing. In one embodiment, apparatus 10 may include one or more alignment structures to ensure proper installation and operation of optical system 18 relative to housing 16.
The housing member of the electronic device may provide various attributes to the electronic device, such as structural attributes, functional attributes, decorative attributes, or a combination of these. In some cases, the housing member may constitute an external component of the electronic device, thereby providing a mechanical structure for the device. The housing member can be provided in any suitable form. In some embodiments, the housing member may include an outer peripheral member. Fig. 2A is a cross-sectional view of an exemplary electronic device structure having an outer periphery member along the width of the device, in accordance with one embodiment of the present invention. Fig. 2B is an exploded cross-sectional view of an exemplary electronic device having an external peripheral member along the length of the device, in accordance with one embodiment of the present invention. Fig. 2C is a top view of an exemplary electronic device having an external peripheral component, in accordance with one embodiment of the present invention. Fig. 2D is a bottom view of an exemplary electronic device having external peripheral components, in accordance with one embodiment of the present invention. Electronic device 200 may comprise any suitable type of electronic device including, for example, one or more of the types of electronic devices described above in connection with device 10 (FIG. 1).
The electronic device 200 may have any suitable shape, including, for example, a shape bounded by a front surface 210, a back surface 212, a left surface 214, a right surface 216, an upper surface 218, and a lower surface 219 (not shown in the cross-sectional views of fig. 2A and 2B). Each surface may be substantially planar, curved, or a combination thereof. The surface may include one or more bevels, detents, openings, dips (dip), extensions, or other features that modify the smoothness of the surface.
The electronic device 200 may be constructed using any suitable structure, including, for example, using the outer peripheral member 220. The outer peripheral member 220 may form a loop (loop) that surrounds or wraps some or all of the electronic device. The loop formed by the outer peripheral member 220 may define an interior volume 222 in which electronic device components can be placed. For example, the outer peripheral member 220 may wrap around the device such that the outer surface of the outer peripheral member 220 defines some or all of the left surface 214, the right surface 216, the upper surface 218, and the lower surface 219 of the device. To provide the user with the desired functionality, the electronic device may include several components that are placed within the device (e.g., within volume 222).
The outer peripheral member may have a particular height (e.g., a device height h) to define the volume 222 amount. More specifically, the volume 222 or the independently measurable (e.g., height, thickness, length, or width) of the outer periphery member 220 can be selected to provide at least a minimum volume amount required to house and secure the electronic device components. In some embodiments, other conditions may instead or additionally control the measurability of outer periphery member 220. For example, the thickness (e.g., thickness t of the outer peripheral member), length (e.g., device length l), height (e.g., device height h), and profile of the outer peripheral member may be selected based on structural requirements (e.g., rigidity and resistance to bending, compression, tension, torsion in particular directions). As another example, the measureable amount of the outer peripheral member 220 can be selected based on a desired device size or shape, e.g., driven by industrial design considerations.
In some embodiments, the outer peripheral member may serve as a structural member upon which other electronic device components may be mounted. More specifically, it may be desirable to secure individual electronic device components placed within the device to ensure that the components do not move or break, which may adversely affect the functionality of the device. Outer peripheral member 220 may include any suitable feature for securing a device component. For example, the outer peripheral member may include one or more recesses, channels, protrusions, or openings for receiving or engaging electronic device components. In some embodiments, the outer peripheral member may instead or additionally include features for retaining internal structural device components that can secure other components. For example, an internal structure such as an internal platform (described in more detail below) may be coupled to an inner surface of the outer peripheral member so that other electronic components may be mounted to the internal platform. In some embodiments, the outer peripheral member may include one or more openings to provide access to one or more internal components held within the volume 222.
The outer peripheral member 220 (or device 200) can have any suitable cross-section. For example, the outer peripheral member 220 may have a generally rectangular cross-section. In some embodiments, the outer peripheral member 220 may alternatively or additionally have a cross-section of a different shape, including, for example, a circular, elliptical, polygonal, or curved cross-section. In some embodiments, the shape or size of the profile may vary along the length or width of the device (e.g., an hourglass-shaped profile).
Outer periphery member 220 may be constructed in any suitable manner. In some embodiments, the outer periphery member 220 can be constructed by connecting several different elements together. For example, the outer periphery member 220 can be constructed by connecting 3 different elements together. The elements may be formed from any suitable material including, for example, metal. More specifically, the elements may be included within one or more circuits (e.g., as part of an antenna assembly or as a heart rate monitor). The individual elements may be formed in any suitable manner. In some embodiments, cold work (cold work) may be used to form the elements. In some embodiments, the element may be formed using a forging process, an annealing process, a machining process, or any other suitable process or combination of processes instead or in addition. In some embodiments, the various elements may be interconnected or connected to other electronic device components using a vapor (braising) process (e.g., ceramic material connected to a single component that is used as part of the antenna).
The various elements of the outer periphery member may be connected together using any suitable means. In some embodiments, fasteners or adhesives may be used to join the individual elements. In some embodiments, intermediate elements may instead or additionally be placed between adjacent individual elements to securely connect the individual elements together. For example, the intermediate element may be formed from a material that is capable of changing from a first state to a second state. In the first state, the material of the intermediate element may flow into the gaps between adjacent individual elements. In the second state, the material may be bonded to adjacent individual elements and provide a structural bond between the individual elements such that the individual elements and the intermediate element form a complete component. For example, the intermediate element may be constructed from a plastics material.
In some embodiments, the individual elements may be formed of a conductive material, while the intermediate elements may be comprised of an insulating or dielectric material. This may ensure that the different circuits comprising the individual elements do not interfere with each other. Furthermore, the dielectric material in the gap between the individual elements can help control capacitance, radio frequency energy, and other electrical transfer across the gap.
The use of intermediate elements to connect the individual elements together can create artifacts or other defects along the interface between the individual elements and the intermediate elements. For example, excess material of the intermediate element may flow or spill beyond the boundary of the interface, onto the outer surface of one of the individual elements. To ensure that the resulting part is aesthetically pleasing and meets industrial design requirements, the part may be machined to remove excess material from one or more of the individual elements and the intermediate elements. For example, a single process or tool may be used to polish different components. The single process may be applied in a single arrangement, for example, including an arrangement corresponding to the softest material of the individual elements and intermediate elements used to form the component. In some cases, the process may instead or additionally dynamically adjust the manner in which the process is applied based on the element or material being processed. For example, the force, speed, or type of tool used may vary based on the component being processed. The resulting component may comprise a continuous surface bridging the interfaces between the individual elements and the intermediate element. For example, the resulting part may include a smooth surface bridging the seam between the two elements.
Electronic device components may be placed within volume 222 using any suitable means. For example, the electronic device 200 may include components 230 and 232 that are inserted into the volume 222. Each of the components 230 and 232 may comprise separate elements or several components assembled together as a component layer or stack, or several layers of components to be inserted within the volume 222. In some embodiments, components 230 and 232 each represent several components stacked along the height direction of the device. The component layers can be electrically coupled to each other to enable data and power transfer, as required for proper operation of the electronic device 200. For example, component layers may be electrically coupled using PCBs, flex, solder, SMT, wires, connectors, or a combination of these. The component layers may be inserted into the outer periphery member 220 using any suitable means. For example, both components 230 and 232 may be inserted from front surface 210 or from back surface 212 (e.g., back to front, front to back, or middle to front and back). Alternatively, the components may be inserted from both the front surface 210 and the back surface 212.
In some embodiments, one or more components may be used as structural elements. Alternatively, the electronic device 200 may include different structural elements placed within the volume 222 and coupled to the outer peripheral member 220. For example, electronic device 200 may include one or more internal components or platforms 240 that may serve as mounting points or areas for helping secure, hold, or compress one or more component layers (e.g., component 230 to a rear surface of internal platform 240, component 232 to a front surface of internal platform 240). Internal platform 240 may be coupled to outer peripheral member 220 using any suitable means, including, for example, using snaps, fasteners, flexure (flexure), welding, gluing, or a combination of these. Alternatively, the interior platform 240 may even be part of the outer peripheral member (e.g., machined, molded, cast, or integrally formed as a single unit). The inner platform can have any suitable dimensions, including, for example, dimensions smaller than the interior volume of the outer peripheral member 220.
The interior platform 240 may be positioned at any suitable height within the outer peripheral member 220, including, for example, substantially at half the height of the outer peripheral member 220. The resulting structure (e.g., outer peripheral member 220 and inner platform 240) may constitute an H-shaped structure that provides sufficient rigidity and resistance to tension, compression, torsion, and bending.
The interior platform, the interior surface of the outer peripheral member, or both, may include one or more protrusions, recesses, shelves, recesses, channels, or other features for receiving and retaining electronic device components. In some cases, the inner platform, the outer peripheral member, or both, may include one or more openings for coupling components located at the front and rear regions of the inner platform 240. The size of each region may be selected based on any suitable criteria, including, for example, the operational needs of the system, the number and type of electronic components in the device, the manufacturing constraints of the internal platform, or a combination of these. The internal platform may be constructed of any suitable material as a distinct component (e.g., plastic, metal, or both) or, alternatively, defined from existing electronics components placed within the volume defined by the external peripheral member. The internal platform may be formed, for example, by a printed circuit board or chip used by the device.
In some embodiments, the inner platform 240 may include one or more conductive elements for providing electrical connections between the components. For example, the internal platform 240 may include one or more PCBs, flex, wires, solder plates, cables, connectors, or other conductive mechanisms for connecting components within the device.
The electronic device 200 may include a front cover plate assembly 250 and a rear cover plate assembly 260 that define a front surface and a rear surface, respectively, of the device 200. The front and rear cover plate assemblies may include one or more components, or may include at least front and rear members that form some or all of the exterior front and rear surfaces of the device. The front cover assembly 250 and the back cover assembly 260 may be flush, recessed, or raised with respect to the front and back surfaces of the outer peripheral member 220. In the example of fig. 2A and 2B, the front and back cover plate assemblies 250 and 260 may spill or protrude beyond the front and back edges of the outer peripheral member 220 (e.g., such that the inner surface of the cover plate assembly is flush with the front or back surface of the outer peripheral member).
Optionally, one or both of the cover plate assemblies may be flush or sub-flush with respect to the outer peripheral member, for example, to prevent edges from engaging other surfaces (e.g., at least a portion of the cover plate assembly may be contained within the volume 222). In some embodiments, one or both of the front cover plate assembly 150 and the rear cover plate assembly 160 may include one or more windows. Any suitable information or content may pass through the window. For example, the cover assembly may include a window through which the camera may capture images. As another example, the cover assembly may include a window through which display-provided content is available or through which light (e.g., from a flashlight) is provided.
In some embodiments, the different components of the electronic device may be made substantially of glass. For example, some portions of the electronic device housing may have at least 75% of the exterior glass. In one implementation, one or both of the cover plate assemblies may include a glass element that provides a substantial portion of the cover plate assembly. More specifically, the front and rear surfaces of the device may include a large amount of glass, while the left and right upper and lower surfaces of the device may include a large amount of metal (e.g., steel).
In some embodiments, the housing of the portable electronic device may impact or rub against various surfaces. When plastic or softer metal housing surfaces are used, the surfaces may be susceptible to scratching. On the other hand, the glass housing surface (e.g., glass cover plate assembly) can be more scratch resistant. Also, glass housing surfaces may provide radio transparency, while metal housing surfaces may interfere with or impede wireless communication. In one embodiment, an electronic device case may employ glass case members (e.g., glass cover plate assemblies) for the front and back surfaces of the electronic device case. For example, the front surface formed by the glass housing member may be transparent to provide visual access to a display device located behind the glass housing member of the front surface, while the rear surface formed by the glass housing member may be transparent or opaque. The opacity may hide any internal components within the electronic device housing, if desired. In one embodiment, a surface coating or film may be applied to the glass housing member to provide opacity or at least partial translucency. Such a surface coating or film may be provided on the inner or outer surface of the glass housing member.
Fig. 3A is a schematic perspective view of an exemplary electronic device, in accordance with one embodiment of the present invention. FIG. 3B is an exploded view of the electronic device of FIG. 3A, according to one embodiment of the invention. Fig. 3C is a cross-sectional view of the electronic device of fig. 3A, in accordance with one embodiment of the present invention. The electronic device of fig. 3A-3C may include some or all of the features of the electronic device of fig. 2A-2D. More specifically, components having similar components may share some or all of the features. The external peripheral member 320 may surround the periphery of the electronic device 300 to form part or all of the outermost surface, upper surface, and lower surface of the electronic device (e.g., front surface 310, rear surface 312, left surface 314, right surface 316, upper surface 318, and lower surface 319). The outer periphery member 320 can have any suitable shape, including, for example, one or more elements that can be combined to form a ring. The annular shape of the outer peripheral member 320 may enclose a volume 322 in which electronic device components may be assembled and retained. The shape of the external peripheral device 320 may define the boundaries of the volume 322 and thus can be determined based on the size and type of components placed within the volume 322. The boundaries of the volume 322 (e.g., defined by the shape of the outer peripheral member 320) may have any suitable shape, including, for example, a substantially rectangular shape (e.g., having straight or rounded edges or corners), a circle, an ellipse, a polygon, or any other closed shape capable of defining a volume.
Outer periphery member 320 can have any suitable dimensions, and the pair can be determined based on any suitable criteria (e.g., aesthetic or industrial design, structural considerations, component requirements for the desired function, or product design). For example, the outer peripheral member 320 may have a length (e.g., along the axis 101) in the range of 70mm-150mm, such as 80mm-140mm, 90mm-130mm, 100mm-120mm, or 105mm-115mm, or any other subrange in the range of 70mm-150 mm. As another example, the outer peripheral member 320 may have a width (e.g., along the axis 102) in a range of 40mm-85mm, such as 50mm-75mm, 55mm-65mm, or any other subrange in a range of 40mm-85 mm. As another example, the outer peripheral member 320 may have a height (e.g., along the axis 103) in a range of 4mm-15mm, such as 5mm-14mm, 6mm-13mm, 7mm-12mm, 8mm-11mm, 9mm-10mm, or any other subrange in a range of 4mm-15 mm.
The outer peripheral member may have any suitable cross-section including, for example, a variable cross-section or a constant cross-section. In some embodiments, the profile of the ring can be selected based on desired structural properties for the outer peripheral member. For example, the outer peripheral member 320 may be substantially rectangular in cross-section such that the height of the outer peripheral member is substantially greater than the width of the outer peripheral member. This may provide structural robustness in compression and tension as well as bending. In some embodiments, the outer peripheral member cross-section may be sized relative to the size of the inner platform cross-section. For example, the outer peripheral member height may be in the range of 5-15 times the inner platform height, such as 8-12 times, 9-11 times, or about 10 times the inner platform height. In one implementation, the height of the outer peripheral member may be about 9mm and the height of the inner platform may be about 0.9 mm.
As another example, the width of the outer peripheral member may be in the range of 8-25 times the width of the inner platform, such as 12-20 times, 15-18 times, or about 16 times the width of the inner platform. For example, the outer peripheral member may be 50mm wide and the inner member may be 3mm wide. In some embodiments, the height of the inner platform may be related to the width of the outer peripheral member. For example, the width of the outer peripheral member may be 1-8 times the height of the inner platform, such as 2-6 times or about 4 times the height of the inner platform. In one implementation, the height of the inner platform may be about 0.7mm and the width of the outer peripheral member may be about 2.5 mm. In some embodiments, the height of the outer peripheral member may be related to the width of the inner platform. For example, the width of the inner platform may be 3-10 times the height of the outer peripheral member, such as 4-8 times, 5-7 times, or about 6 times the height of the outer peripheral member. For example, the width of the inner platform may be about 5.5mm and the height of the outer peripheral member may be about 0.9 mm.
In some embodiments, outer peripheral member 320 may include one or more openings, knobs, extensions, flanges (flanges), ramps, or other features for receiving a component or element of the device. The features of the outer periphery member can extend from any surface of the outer periphery member, including, for example, from an interior surface (e.g., to hold an interior component or component layer), or from an exterior surface. More specifically, the outer peripheral member 320 may include a slot or opening 324 for receiving a card or tray within the device. The opening 324 may be aligned with one or more internal components that receive and connect an inserted component (e.g., an inserted SIM card). As another example, the outer peripheral member 320 may include a connector opening 325 (e.g., a connector for 30 pins) through which the connector may engage one or more conductive pins of the electronic device 300. Outer peripheral member 320 may include openings 326 and 327 for providing audio to a user (e.g., an opening adjacent a speaker) or receiving audio from a user (e.g., an opening adjacent a microphone). The outer peripheral member 320 can instead or additionally include an opening (e.g., opening 328) for an audio connector or power source, or a feature 329 for holding and activating a button such as a volume control or mute switch.
The various features of outer periphery member 320 may be configured in any suitable manner at any suitable time. In some embodiments, the features may be configured as part of a process of creating the outer periphery member 320 from a single piece of material that is manufactured into the final shape of the outer periphery member 320 (e.g., using a machining process). In some embodiments, pieces of material can alternatively or additionally be separately shaped or combined into outer peripheral member 320. For example, several angled elements (e.g., two elements with segments having substantially 90 degrees angles, and one element with two segments each having a 90 degree angle) may be connected together to form a closed component (e.g., a loop). The various features may then be created as part of each individual piece, or once the entire outer periphery member has been assembled. Outer periphery member 320 may be constructed of any suitable material, including, for example, metal (e.g., steel or aluminum), plastic (e.g., polyurethane, polyethylene, or polycarbonate), composite materials, or any combination thereof. In some embodiments, outer periphery member 320 may be constructed from a combination of materials.
In some embodiments, outer periphery member 320 may have a functional purpose or purpose in addition to serving as a decorative component or as a structural component. For example, the outer periphery member 320 may be used as part of an antenna for capturing electromagnetic waves emitted by or in a communication network. In some cases, the outer periphery member 320 may be used as part of more than one antenna.
In some embodiments, one or more portions of outer peripheral member 320 may be treated to provide an aesthetically pleasing component. More specifically, left surface 314, right surface 316, upper surface 318, and lower surface 319 may be treated using a decorative surface treatment, such as, for example, polishing, coating (e.g., using a dye or colored material, or a material that provides an optical effect), glazing, thin film deposition, grinding, superfinishing, or any other suitable process. In some embodiments, the front and rear surfaces of the outer periphery member 320 may instead or additionally be provided with a decorative treatment (e.g., for areas of the outer periphery member that may not be covered by the front and rear cover plate assemblies 350 and 360).
To reduce the overall weight, size, or both of the electronic device 300, the thickness of the outer periphery member 320 may be selected such that the outer periphery member 320 only minimally resists one or more of bending, twisting, pulling, compressing, or other deformation of the strap. For example, outer peripheral member 320 may be more resistant to tension and compression, but less resistant to bending or twisting. To provide sufficient resistance to all types of deformation, the electronic device 300 may include structural components placed within the volume 322. In some embodiments, one or more internal components of the electronic device may be connected to the external peripheral member and used as structural components. For example, a circuit board (with or without separate rigid elements) may be connected to opposing portions of the outer peripheral member 320. Alternatively, different or specialized structural components may be coupled to the outer peripheral member 320. In the example of fig. 3A-3C, electronic device 300 may include an internal platform 340 that constitutes a distinct structural component of the electronic device. The inner platform 340 may comprise any suitable shape, including, for example, a substantially planar shape. In some embodiments, the inner platform 340 can include several different regions, such as a main region and a step (step) region extending from the main region, to engage one or more features of the outer periphery member 320. An interior platform, such as interior platform 340, is described in more detail in conjunction with fig. 4A-4B.
Fig. 4A is a schematic view of an exemplary internal platform coupled to an external peripheral member in accordance with one embodiment of the present invention. Fig. 4B is a top view of an exemplary internal platform coupled to an external peripheral member according to one embodiment of the present invention. Fig. 4C is a cross-sectional view of an exemplary internal platform coupled to an external peripheral member, according to one embodiment of the present invention. The device housing 400 may include an outer peripheral member 420 coupled with an inner platform 440. The outer peripheral member and the inner platform may include some or all of the features described above with respect to the apparatus of fig. 2A-2D and 3A-3C. More specifically, the inner platform 440 may include some or all of the features described above in connection with the inner platform 340.
The inner platform 440 may be constructed in any suitable manner. In some embodiments, the inner platform 440 may be constructed from a single element or a combination of several elements. The internal platform 440 may be placed within an electronic device to support or hold electronic components. The inner platform 440 may comprise several different conductive plates (e.g., metal plates), including a base plate 441, an upper step 442, and a lower step 444. The plates and steps can be of any suitable size, including, for example, large plates to cover a majority of the area (e.g., 40%, 50%, 60%, 70%, 80%, 90%) surrounded by the outer periphery member. Alternatively, the entire inner platform 440 may cover only a portion of the area (e.g., 60%, 70%, 80%, 90% or more) surrounded by the outer peripheral member. The step may be substantially smaller than the plate, for example including a portion that acts as a tab to ground the inner platform 440.
Each plate and step may be constructed of the same or different materials, including, for example, the same electrically conductive material (e.g., metal). In some embodiments, one or more steps may be incorporated into the same piece of material used to make up the panel. For example, step 446 may include a raised region of plate 441. Alternatively, the steps may be constructed from a different sheet material than the plates. For example, steps 442 may be constructed from a sheet material that is not used for plate 441. Plate 441 and steps 442 and 444 may be placed in the same or different planes. In one implementation, substrate 441 may be placed at a first level, and steps 442 and 444 may be offset relative to substrate 441 (e.g., raised toward a front surface of the device). Steps 442 and 444 may be raised any suitable amount, including substantially the same amount, for example (e.g., steps 442 and 444 are substantially in the same plane). For example, steps 442 and 444 can be placed such that the front surface of the steps is flush or slightly sub-flush with respect to the front surface of outer periphery member 420 to which they are connected. Discontinuities in the inner platform 440 for distinguishing the plate 441 and the steps 442 and 444 may be provided at any suitable location. For example, the discontinuity may be located as part of the raised surface, as a step, or on a plate. In some embodiments, the distinction between the plate and the steps may be arbitrary, as the steps and the plate are constructed from a single sheet of material.
Plate 441 and steps 442 and 444 can be at least partially electrically isolated to ensure that elements of the outer periphery remain electrically isolated (e.g., to ensure antenna performance). For example, steps 442 may be attached to plate 441 or to an elevated portion of plate 441 using attachment elements 450. Connecting element 450 may be constructed of any suitable material, including, for example, a suitable insulating material (e.g., plastic injection molded between step 442 and plate 441). As another example, the rungs 444 can be incorporated as part of the sheet used to make up the plate 441, and can thus be electrically connected to the plate. Step 444 can include an attachment element 452, such as a mirror image attachment element 450, placed on a front surface of the step. More specifically, the connecting elements 450 and 452 may be placed in a position extending forward from the front surface of the outer periphery member 420. The connecting elements 450 and 452 can be provided using any suitable means, including, for example, by a molded material (e.g., plastic) between the plates and the steps, or on the surface of one or more of the plates and the steps. Connecting elements 450 and 452 may have any suitable shape, including planar shapes or three-dimensional shapes (e.g., including steps to connect plate 441 to one or more steps 442 and 444 located in different planes), for example. Elements 450 and 452 can form different elements, or can alternatively be different portions of a continuous element. In some embodiments, connecting elements 450 and 452 may be connected to an outer peripheral member (e.g., as shown in fig. 4B) in a manner that is electrically isolated from different portions of plate 441. Optionally, the connecting elements 450 and 452 are provided in a manner that electrically insulates different sections of the outer periphery member 420 (e.g., insulating elements 424 and 426, but only in the vicinity of the step 444, as required for antenna performance).
The inner platform 440 may be coupled to the outer peripheral member 420 using any suitable means. In some embodiments, portions of plate 441 and steps 442 and 444 may extend beyond the edges of connecting elements 450 and 452 so that the inner platform may be coupled to the outer periphery member via the plate and steps (e.g., the metal elements of the inner platform may be coupled to the metal outer periphery member for ground or antenna performance). For example, the exposed metal surfaces of plate 441 and steps 442 and 444 can be coupled to outer peripheral member 420 using welding, soldering, or any other joining process that maintains electrical conductivity. Alternatively, one or more hot melts, adhesives, tapes, fasteners, or other non-conductive attachment processes may be used. When using a conductive process such as welds 460 (e.g., laser welds), the welds may be distributed such that the outer periphery member elements used to maintain electrical isolation remain isolated. More specifically, the welds 460 along the plate 441 may be positioned such that the small L-shaped elements 426 are electrically insulated from the large L-shaped elements 424 and the U-shaped elements 428. Alternatively, if it is important for small-form elements 426 and large-form elements 424 to be electrically isolated only near the interface between the elements, then solder joints 460 may be distributed such that a conductive path exists between elements 424 and 426 through plate 441 rather than through step 444.
The inner platform 440 may be coupled to any suitable portion of the outer peripheral member 420. For example, the inner platform 440 may fit within the height of the outer peripheral member 420 (e.g., based on the location of the outer peripheral member's contact points or areas). The distribution of the connection points may be selected based on structural considerations, including, for example, based on desired resistance to torsion, bending, or other mechanical forces. More specifically, the electronic device can include at least 4 contact points or areas distributed within the outer peripheral member 420 (e.g., proximal corners of the outer peripheral member). As another example, the inner platform 440 may include contact areas along a linear portion of the outer peripheral member 420 (e.g., along an edge of the plate 441). As another example, the step regions (e.g., steps 442 and 444) of the inner platform 440 can be coupled to or proximate to the front or rear surface of the outer peripheral member 420 (e.g., on opposing portions of the front or rear surface) such that portions of the steps 442 and 444 (e.g., connecting elements 450 and 452) extend beyond the front surface of the outer peripheral member 420, while the plate 441 does not. In some embodiments, the outer peripheral member 420 may include one or more tabs or extensions that support the inner platform 440 (e.g., tabs on which the platform is soldered or welded). For example, the outer peripheral member 420 may include tabs 422 that support the inner platform 440 when the inner platform 440 is inserted into the outer peripheral member.
In some embodiments, the inner platform 440 may be placed within the height of the outer peripheral member 420 such that components may be placed on both the front and back surfaces of the inner platform 440. For example, some components may be inserted from the rear surface and some components may be inserted from the front surface. For safety, the components may be coupled to the internal platform and may instead or additionally be electrically connected to each other through an opening in or around the periphery of the internal platform. In some embodiments, some components may first be coupled to a back cover plate assembly and a front cover plate assembly that are placed over the front and back surfaces of the outer periphery member before being inserted into the interior volume enclosed by the outer periphery member 420 and coupled to the outer periphery member. In practice, the internal platform 440 may define, by its location, a front compartment or area or a rear compartment or area within the volume in which the electronic device components may be placed. The size of each chamber or region may be determined based on any suitable conditions, including, for example, the number and size of components placed within each region, the desired position of the inner platform 440 relative to the outer peripheral members (e.g., if available position is limited due to structural requirements), or combinations thereof. For example, the front compartment may be used for display circuitry and touch interface, while the back compartment may be used for processing circuitry, batteries, connector interface, and input interface.
For safety, the components may be coupled to the inner platform 440 and can instead or additionally be electrically connected to each other through an opening of the inner platform 440. The internal platform 440 may include any suitable features for securing and connecting electronic device components, such as one or more snaps, prongs, ramps, extensions, openings, access points, doors, or combinations thereof. In some cases, the internal platform 440 may include one or more specialized features for receiving or securing specific electronic components, such as microphones, speakers, audio jacks, cameras, light sources, chips, or combinations thereof. Moreover, the internal platform 440 may include one or more electronic components, including, for example, connectors and conductive paths for electrically connecting to, or passing data or power between, electronic device components, or both.
Returning to fig. 3A-3C, to retain components within volume 332, electronic device 300 may include a back cover plate assembly 360 and a front cover plate assembly 350 that provide a back surface and a front surface, respectively, of the electronic device. Each cover plate assembly may be coupled to the outer peripheral member 320 using any suitable means, including, for example, using adhesives, tapes, mechanical fasteners, hooks, tabs, extensions, or combinations thereof. In some embodiments, one or both of the cover plate assemblies 350 and 360 may be removable, for example, to use or replace an electronic device component (e.g., a battery). In some embodiments, the front and rear cover plate assemblies 350, 360 may include several different portions, including, for example, a fixed portion and a movable portion. The interior surfaces of the front and rear cover plate assemblies 350, 360 may include any suitable features, including, for example, one or more ridges, hooks, tabs, extensions, or combinations thereof for retaining the cover plate or ensuring proper alignment of the cover plate on the outer peripheral member 320. Features of the front and back cover plate assemblies 350, 360 may interact with corresponding features of the outer peripheral member 320 or other components of the electronic device to ensure proper placement of the cover plates.
The back and front cover plate assemblies 360, 350 may be positioned relative to the outer periphery member 330 in any suitable manner. FIG. 5 is a cross-sectional view of an exemplary electronic device component according to one embodiment of the invention. The electronic device 500 may include an outer peripheral member 520 having some or all of the features of the outer peripheral member 220 (fig. 2A-2D). More specifically, outer peripheral member 520 may include one or more features (e.g., member 530) for retaining internal components of the device. The front and back surfaces of the electronic device 500 may be provided in part by the front and back cover plate assemblies 550, 560 and in part by the exposed front and back surfaces of the outer peripheral member 520. More specifically, the front and rear cover plate assemblies 550, 560 may be recessed within the outer peripheral member 520, for example, in order to protect the components of the cover plate assembly from damage due to impacts along the front or rear surfaces. The front and back cover plate assemblies 550, 560 may include some or all of the features of the back and front cover plate assemblies 260, 250 (fig. 2A-2D).
The front and back cover plate assemblies 550, 560 may be coupled to any suitable portion of the outer peripheral member 520. In some embodiments, the front and back cover plate assemblies 550, 560 may be connected in the same or different manners relative to the outer peripheral member 520. In the example of the electronic device 500, both the front cover plate assembly 550 and the rear cover plate assembly 560 may be recessed within the front and rear surfaces of the outer peripheral member 520, respectively. More specifically, the front cover plate assembly 550 may cover no front surface 522 of the outer peripheral member 520 or only a portion of the front surface 522, such that both the outer peripheral member 520 and the front cover plate assembly 550 define the front surface 510 of the electronic device 500. Similarly, the back cover plate assembly 560 may not cover the back surface 524 of the outer peripheral member 520 or cover only a portion of the back surface 524, such that the back cover plate assembly 560 defines part or all of the back surface 512 of the electronic device 500. The resulting height of the electronic device 500 may then be limited to the height of the outer peripheral member 520 (e.g., in contrast to the embodiments described in connection with fig. 2A-2D, where the height of the device 200 may be the sum of the heights of the back cover plate assembly 260, the outer peripheral member 220, and the front cover plate assembly 250).
In some embodiments (not shown), one or both of the front and rear cover plate assemblies 550, 560 may partially cover the front and rear surfaces 522, 524, respectively, such that the entirety of the cover plate assembly is not recessed relative to the outer peripheral member 520. In some cases, the cover plate assembly may include an inner lip such that the lip may extend into the volume enclosed by the outer peripheral member 520, while an elevated portion of the assembly offset from the lip may extend above a front or rear surface of the outer peripheral member.
In some embodiments, one or both of the cover plate assemblies may instead be partially or fully recessed into the outer peripheral member. FIG. 6 is a cross-sectional view of an exemplary electronic device component, according to one embodiment of the invention. The electronic device 600 may include an outer peripheral member 620 having some or all of the features of the outer peripheral member 220 (fig. 2A-2D). More specifically, outer peripheral member 620 may include one or more features (e.g., component 630) for retaining the electronic component within the device. The front and back surfaces of the electronic device 600 may be provided in part by the front and back cover plate assemblies 650, 660, which in turn may include some or all of the features of the front and back cover plate assemblies 250, 260 (fig. 2A-2D).
In contrast to the electronic device 500 (fig. 5), one or both of the front cover plate assembly 650 and the back cover plate assembly 660 may be placed within the periphery of the outer peripheral member 630 (e.g., recessed within the outer peripheral member). In the particular example of fig. 6, the rear cover plate assembly 660 may be recessed into the outer peripheral member 620, while the front cover plate assembly 650 may be placed over (e.g., be spilled over) the front surface of the front cover plate assembly 620. The back cover plate assembly 660 may be sized such that some or all of the back cover plate assembly may fit within the volume 621 defined by the outer peripheral assembly 620. More specifically, the back cover plate assembly 660 may be positioned such that the back surface 622 of the outer peripheral assembly 620 remains exposed to the user. The back cover plate assembly 660 may be recessed within the outer peripheral member 620 any suitable amount. For example, the entirety of the back cover plate assembly 660 may be recessed within the outer periphery member 620, such that the back surface of the back cover assembly 660 may be flush with or behind the back surface 622 of the outer periphery member 620. The resulting height of the electronic device 600 may then be the sum of the heights of the outer peripheral member 620 and the front cover assembly 650 (the height of the outer peripheral member only if both cover assemblies are recessed, as shown in fig. 5). Optionally, a portion of the back cover plate assembly 660 may extend behind the back surface 622 while still remaining within the periphery defined by the outer peripheral member 620. In such a case, the amount by which the rear cover plate assembly 660 extends behind the rear surface 622 may be included within the overall height of the device 600.
Returning to the electronic device 300 (fig. 3A-3C), the front and back cover plate assemblies 350, 360 may be constructed of any suitable material or combination of materials. In some embodiments, each of the cover plate assemblies 350 and 360 may be constructed by combining several different elements. For example, one or both of the cover plate assemblies may comprise a transparent or translucent plate (e.g., a rectangular plate of glass). As another example, one or both of the cover assemblies may include a base or support structure constructed of one or more metals or plastics (e.g., aluminum) onto which the transparent element may be mounted. The transparent element may be mounted in any suitable manner, including, for example, such that one or more electronic device components are visible through the transparent element (e.g., display circuitry or a flash for image capture). As another example, the transparent element may be provided to receive signals through the transparent element (e.g., using a sensor or camera) or to detect a user environment. Optionally, one or more portions of the transparent element may appear opaque (e.g., using ink, or by placing a support structure behind the transparent element) so that the transparent element may primarily serve as a decorative component. The various components of each cover plate assembly may be assembled using any suitable means, including, for example, using one or more adhesives, fasteners, tapes, interlocking, overmolding (over mold), or machining processes, or any combination thereof.
In the example of fig. 3A-3C, the front cover plate assembly 350 may include a support structure 352 to which a glass plate 354 is mounted. Support structure 352 may include one or more openings, including one through which display 355 may be provided. In some embodiments, one or both of support structure 352 and glass plate 354 may include openings for device components, such as button openings 356 and receiver openings 357, as well as other openings for cameras, flash or other device sensors or input interfaces. The size and shape of the opening may be selected using any suitable means, including, for example, based on the size and shape of the device component placed in or under the opening (e.g., opening 356 may be determined by the size of the button, and opening 357 may be determined by the size of the receiver and acoustic considerations for providing sufficient audio to the user).
In some embodiments, glass plate 354 may include a decorative coating (finish) for hiding from view the internal components of the electronic device. For example, the opaque layer may be an applied region 359 surrounding display 355 to hide from view the non-display portions of the display circuitry. Because one or more sensors may receive signals through the glass plate 354, the opaque layer may be selectively removed or selected to allow signals to pass through the glass plate to sensors behind the plate. For example, the glass plate 354 may include regions 359a and 359b through which sensors (e.g., cameras, infrared sensors, proximity sensors, or background light sensors) may receive signals.
In some embodiments, the front cover plate assembly 350 may support or enable one or more interfaces through which a user may use the electronic device. For example, the glass plate 354 may support a touch interface (e.g., a touchpad or a touch screen) for controlling electronic device processes and operations. As another example, the front cover assembly 350 may include one or more buttons or sensors (described above) for interacting with the device. In some cases, buttons, switches, or other interface elements may be incorporated instead of or in addition to the outer peripheral member 320 or the rear cover member 360. The electronic device 300 may include any other suitable interface for interacting with a user, including, for example, display circuitry, a projector, audio output circuitry (e.g., a speaker or audio port), a tactile interface (e.g., a motor to create vibrations, or a power source to provide electrical stimulation), or a combination thereof.
To enhance the decorative or aesthetic appeal of the electronic device 300, one or all of the outer peripheral member 320, the front cover plate assembly 350, and the rear cover plate assembly 360 may be finished using a suitable process. For example, one or more of polishing, coating (e.g., using dyes or colored materials, or materials that provide optical effects), glazing, thin film deposition, grinding, superfinishing, or any other suitable process may be applied to the electronic device components. In some embodiments, one or more glass surfaces (e.g., of the front cover plate assembly 350 or of the back cover plate assembly 360) may be polished to provide an aesthetically pleasing appearance, for example, using one or more masks (masks), coatings (e.g., color photographic or dichroic coatings), ink layers, or combinations thereof. The particular finish applied to the glass surfaces of the front and back cover plate assemblies 350, 360 may be selected so that the front and back surfaces 310, 312 have the same or different appearances. In some embodiments, the glass surface may be treated to resist abrasion or impact (e.g., scratch), oil from contact, or any other external force used with the device.
FIG. 7 is a flow diagram of an exemplary process of assembling an electronic device, according to one embodiment of the invention. Process 700 may begin at step 702. At step 704, an outer periphery member is provided. For example, a housing component configured in a loop shape may be provided. The outer periphery member may be constructed in any suitable manner, including, for example, by connecting several different elements together using intermediate elements. The outer periphery member may be constructed of any suitable material or combination of materials, including, for example, conductive and insulating materials, wherein the conductive material is provided for elements that make up part of the electronic circuit. At step 706, an internal platform may be provided. For example, a component having at least one flat region may be provided, wherein the component is sized to fit at least partially within the volume enclosed by the outer peripheral member. The internal platform may be constructed from one or more elements, including, for example, by combining several elements. In some embodiments, the different construction elements may be combined in a manner that electrically insulates the conductive elements of the inner platform.
At step 708, the internal platform may be connected to an external peripheral member. For example, the internal platform may be inserted into a volume defined by the external peripheral member and retained by the external peripheral member. Any suitable means may be used to secure the internal platform including, for example, press fitting, mechanical fasteners, adhesives, molding processes (e.g., using intermediate materials), welding, brazing, or combinations thereof. In some embodiments, the process used may be selected based on the conductive properties of the process. In some embodiments, the internal platform may be attached to the strap in a manner that increases the structural integrity of the external peripheral member (e.g., improves resistance to certain types of external forces). The internal platform may divide the volume enclosed by the outer peripheral member into two regions or chambers, wherein each chamber is accessible from opposite sides or surfaces of the outer peripheral member (e.g., from the front or back of the outer peripheral member). At step 710, an electronic device component may be inserted into a volume enclosed by an outer peripheral member. For example, the assembly may be inserted into one or both chambers defined by the internal platform from one or both surfaces of the outer peripheral member. The components may be inserted separately and then interconnected within the outer periphery member, or may instead be at least partially connected to the outside of the chamber and inserted into the outer periphery member as a component assembly. Individual components or component assemblies may be connected to the internal platform or may be connected to components placed within other chambers through the internal platform.
At step 712, a cover plate assembly may be placed over the open surface of the outer periphery member. For example, a front cover plate assembly may be placed over the front surface of the outer periphery member and a rear cover plate assembly may be placed over the rear surface of the outer periphery member. The cover plate assembly may be connected or coupled to the outer peripheral member using any suitable means, including, for example, using one or more hooks, recesses, protrusions, interlocks, mechanical fasteners, springs, or other retaining components. The cover plate assembly may be used as an exterior surface of the device such that components inserted into the volume of the outer peripheral member (e.g., at step 710) may be retained and constrained within the device. In some embodiments, one or both of the front and back cover plate assemblies may be aligned relative to the internal components of the device to ensure that the internal components may operate properly. For example, the window of the cover assembly may be aligned with a sensor, light source, or display of the device. The process 700 then ends at step 714.
According to an embodiment, a method of constructing an electronic device is provided wherein two opposing surfaces of the internal platform and two opposing surfaces of the external peripheral member are coplanar.
According to an embodiment, there is provided an electronic device housing, wherein the front surface defines a single plane; at least one step is connected to the front surface.
According to an embodiment, an electronic device enclosure is provided, wherein at least two regions have the same volume.
According to an embodiment, an electronic device enclosure is provided wherein the ring defines a rectangle.
According to an embodiment, there is provided an electronic device housing part comprising: a first element having a first angled segment and comprising an inner surface and an outer surface; a second element having a second angled segment and comprising an inner surface and an outer surface; a third element having a third angular segment and a fourth angular segment and comprising an inner surface and an outer surface, wherein: the first, second and third elements are joined together to form an enclosed component; the inner surfaces of the first, second and third elements form a continuous inner surface for the component when the first, second and third elements are connected together; the outer surfaces of the first, second and third components form a continuous outer surface for the part when the first, second and third components are connected together; and the components define an interior volume in which the electronic device components may be housed.
According to an embodiment, there is provided an electronic device housing part, wherein the first, second, third and fourth angles are 90 degree angles.
According to an embodiment, an electronic device housing component is provided wherein the continuous interior surface of the component includes at least one feature for securing an electronic device component.
According to an embodiment, an electronic device housing component is provided, wherein the at least one feature is to receive an internal platform coupled to the component within an internal volume.
The above-described embodiments have been presented for purposes of illustration and not limitation. It is to be understood that one or more features of an embodiment may be combined with one or more features of another embodiment to provide a system and/or method without departing from the spirit and scope of the present invention.