| KR100304881B1              (en)* | 1998-10-15 | 2001-10-12 | 구자홍 | GaN system compound semiconductor and method for growing crystal thereof | 
| US6596079B1              (en) | 2000-03-13 | 2003-07-22 | Advanced Technology Materials, Inc. | III-V nitride substrate boule and method of making and using the same | 
| US6447604B1              (en)* | 2000-03-13 | 2002-09-10 | Advanced Technology Materials, Inc. | Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminum, indium, gallium) nitride ((al,in,ga)n) substrates for opto-electronic and electronic devices | 
| JP3453558B2              (en) | 2000-12-25 | 2003-10-06 | 松下電器産業株式会社 | Nitride semiconductor device | 
| KR100387099B1              (en)* | 2001-05-02 | 2003-06-12 | 광주과학기술원 | GaN-Based Light Emitting Diode and Fabrication Method thereof | 
| DE10142653A1              (en)* | 2001-08-31 | 2003-04-30 | Osram Opto Semiconductors Gmbh | Radiation-emitting semiconductor component used as an illuminating diode or laser diode, has a semiconductor body with a radiation-producing active layer and a p-conducting contact layer containing indium gallium nitride | 
| TWI262606B              (en) | 2001-08-30 | 2006-09-21 | Osram Opto Semiconductors Gmbh | Radiation-emitting semiconductor-element and its production method | 
| JP4088111B2              (en)* | 2002-06-28 | 2008-05-21 | 日立電線株式会社 | Porous substrate and manufacturing method thereof, GaN-based semiconductor multilayer substrate and manufacturing method thereof | 
| US6835957B2              (en)* | 2002-07-30 | 2004-12-28 | Lumileds Lighting U.S., Llc | III-nitride light emitting device with p-type active layer | 
| KR20040050735A              (en)* | 2002-12-09 | 2004-06-17 | (주)옵트로닉스 | The Method For Improving Ohmic-Contact In P-Type Ⅲ-Nitride Compound Semiconductor | 
| KR100611491B1              (en) | 2004-08-26 | 2006-08-10 | 엘지이노텍 주식회사 | Nitride semiconductor light emitting device and manufacturing method | 
| RU2262156C1              (en)* | 2004-09-14 | 2005-10-10 | Закрытое акционерное общество "Нитридные источники света" | Semiconductor element emitting light in ultraviolet range | 
| KR100691283B1              (en) | 2005-09-23 | 2007-03-12 | 삼성전기주식회사 | Nitride semiconductor device | 
| KR100780212B1              (en) | 2006-03-30 | 2007-11-27 | 삼성전기주식회사 | Nitride semiconductor devices | 
| RU2402837C1              (en)* | 2009-10-21 | 2010-10-27 | Закрытое акционерное общество "ЭПИ-ЦЕНТР" | Semiconductor light-emitting device with porous buffer layer | 
| US8592242B2              (en)* | 2010-11-18 | 2013-11-26 | Tsmc Solid State Lighting Ltd. | Etching growth layers of light emitting devices to reduce leakage current | 
| JP2014112599A              (en)* | 2012-12-05 | 2014-06-19 | Stanley Electric Co Ltd | Semiconductor light-emitting element and method of manufacturing the same | 
| JP2015115377A              (en)* | 2013-12-10 | 2015-06-22 | 株式会社リコー | COMPOUND SEMICONDUCTOR DEVICE, LIGHT SOURCE DEVICE, LASER DEVICE, AND COMPOUND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 
| CN105633223B              (en)* | 2015-12-31 | 2018-10-09 | 华灿光电(苏州)有限公司 | Semiconductor devices in AlGaN templates, the preparation method of AlGaN templates and AlGaN templates | 
| CN110335927B              (en)* | 2019-07-11 | 2020-10-30 | 马鞍山杰生半导体有限公司 | Ultraviolet LED and preparation method thereof |