| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| GB8421499AGB8421499D0 (en) | 1984-08-24 | 1984-08-24 | Heat sink | 
| GB8519745AGB2163598A (en) | 1984-08-24 | 1985-08-06 | Heat sink | 
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| GB8421499AGB8421499D0 (en) | 1984-08-24 | 1984-08-24 | Heat sink | 
| Publication Number | Publication Date | 
|---|---|
| GB8421499D0true GB8421499D0 (en) | 1984-09-26 | 
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| GB8421499APendingGB8421499D0 (en) | 1984-08-24 | 1984-08-24 | Heat sink | 
| GB8519745AWithdrawnGB2163598A (en) | 1984-08-24 | 1985-08-06 | Heat sink | 
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| GB8519745AWithdrawnGB2163598A (en) | 1984-08-24 | 1985-08-06 | Heat sink | 
| Country | Link | 
|---|---|
| GB (2) | GB8421499D0 (en) | 
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| GB8531565D0 (en)* | 1985-12-21 | 1986-02-05 | Marston Palmer Ltd | Heat sink | 
| US4729426A (en)* | 1986-03-06 | 1988-03-08 | Thermalloy Incorporated | Bonded clip heat sink | 
| FR2679729B1 (en)* | 1991-07-23 | 1994-04-29 | Alcatel Telspace | HEATSINK. | 
| GB2278503B (en)* | 1992-02-28 | 1995-08-23 | Aavid Eng Inc | Self-locking heat sinks for surface mount devices | 
| US5283467A (en)* | 1992-06-05 | 1994-02-01 | Eaton Corporation | Heat sink mounting system for semiconductor devices | 
| DE9404266U1 (en)* | 1994-03-14 | 1994-05-19 | Siemens Nixdorf Informationssysteme AG, 33106 Paderborn | Cooling and shielding device for an integrated circuit | 
| US5883782A (en)* | 1997-03-05 | 1999-03-16 | Intel Corporation | Apparatus for attaching a heat sink to a PCB mounted semiconductor package | 
| US6229706B1 (en)* | 1998-04-27 | 2001-05-08 | Aavid Thermal Products, Inc. | Reverse cantilever spring clip | 
| US6169659B1 (en)* | 2000-02-04 | 2001-01-02 | Silicon Graphics, Inc. | Metered force single point heatsink attach mechanism | 
| DE10149886A1 (en)* | 2001-10-10 | 2003-04-30 | Eupec Gmbh & Co Kg | The power semiconductor module | 
| US6580611B1 (en)* | 2001-12-21 | 2003-06-17 | Intel Corporation | Dual-sided heat removal system | 
| DE10225993A1 (en) | 2002-06-12 | 2003-12-24 | Bosch Gmbh Robert | heatsink | 
| ES2476596T3 (en)* | 2008-04-29 | 2014-07-15 | Agie Charmilles Sa | Printed circuit board unit and manufacturing procedure | 
| DE102009022255A1 (en)* | 2009-05-20 | 2010-11-25 | Eutegra Ag | LED with heat sink | 
| US10192846B2 (en) | 2014-11-05 | 2019-01-29 | Infineon Technologies Austria Ag | Method of inserting an electronic component into a slot in a circuit board | 
| US10553557B2 (en)* | 2014-11-05 | 2020-02-04 | Infineon Technologies Austria Ag | Electronic component, system and method | 
| US10064287B2 (en) | 2014-11-05 | 2018-08-28 | Infineon Technologies Austria Ag | System and method of providing a semiconductor carrier and redistribution structure | 
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| DE2220288A1 (en)* | 1972-04-25 | 1973-11-15 | Siemens Ag | RECTIFIER ARRANGEMENT | 
| Publication number | Publication date | 
|---|---|
| GB8519745D0 (en) | 1985-09-11 | 
| GB2163598A (en) | 1986-02-26 | 
| Publication | Publication Date | Title | 
|---|---|---|
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