GB2522954B - High temperature multilayer flexible printed wiring board - Google Patents

High temperature multilayer flexible printed wiring board

Info

Publication number: GB2522954B
Authority: GB; United Kingdom
Prior art keywords: high temperature; wiring board; printed wiring; flexible printed; multilayer flexible
Prior art date: 2013-11-04
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Inventor

A Nelson Robert

L Dubois Raymond

A Collier Michael

E Keating James

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Ftg Circuits Inc

Original Assignee

Ftg Circuits Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2013-11-04

Filing date

2014-11-03

Publication date

2018-08-08

2014-10-29Priority claimed from US14/527,124external-prioritypatent/US20150122532A1/en

2014-11-03Application filed by Ftg Circuits IncfiledCriticalFtg Circuits Inc

2014-12-17Publication of GB201419574D0publicationCriticalpatent/GB201419574D0/en

2015-08-12Publication of GB2522954ApublicationCriticalpatent/GB2522954A/en

2018-08-08Application grantedgrantedCritical

2018-08-08Publication of GB2522954BpublicationCriticalpatent/GB2522954B/en

StatusActivelegal-statusCriticalCurrent

2034-11-03Anticipated expirationlegal-statusCritical

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Laminated Bodies (AREA)

GB1419574.7A2013-11-042014-11-03High temperature multilayer flexible printed wiring boardActiveGB2522954B (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US201361899628P	2013-11-04	2013-11-04
US14/527,124US20150122532A1 (en)	2013-11-04	2014-10-29	High temperature multilayer flexible printed wiring board

Publications (3)

Publication Number	Publication Date
GB201419574D0 GB201419574D0 (en)	2014-12-17
GB2522954A GB2522954A (en)	2015-08-12
GB2522954Btrue GB2522954B (en)	2018-08-08

Family

ID=52118636

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB1419574.7AActiveGB2522954B (en)	2013-11-04	2014-11-03	High temperature multilayer flexible printed wiring board

Country Status (1)

Country	Link
GB (1)	GB2522954B (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3215574A (en)*	1963-03-25	1965-11-02	Hughes Aircraft Co	Method of making thin flexible plasticsealed printed circuits
US4800461A (en)*	1987-11-02	1989-01-24	Teledyne Industries, Inc.	Multilayer combined rigid and flex printed circuits
JPH01244851A (en)*	1988-03-28	1989-09-29	Matsushita Electric Works Ltd	Manufacture of electric laminate
US5629497A (en)*	1994-10-04	1997-05-13	Cmk Corporation	Printed wiring board and method of manufacturing in which a basefilm including conductive circuits is covered by a cured polyimide resin lay
US5633480A (en)*	1994-10-04	1997-05-27	Cmk Corporation	Printed wiring board having a cover lay laminated on a polyimide resin base film containing conductive circuits
US5877940A (en)*	1993-12-02	1999-03-02	Teledyne Industries Inc.	Fabrication multilayer combined rigid/flex printed circuit board
US5997983A (en)*	1997-05-30	1999-12-07	Teledyneindustries, Inc.	Rigid/flex printed circuit board using angled prepreg
WO2008003545A1 (en)*	2006-07-04	2008-01-10	Continental Automotive Gmbh	Flexible conductor and use of a glass fiber material and a resin for the flexible conductor
US20130192882A1 (en)*	2012-01-27	2013-08-01	Kyocera Slc Technologies Corporation	Wiring board and mounting structure using the same

2014
- 2014-11-03GBGB1419574.7Apatent/GB2522954B/enactiveActive

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3215574A (en)*	1963-03-25	1965-11-02	Hughes Aircraft Co	Method of making thin flexible plasticsealed printed circuits
US4800461A (en)*	1987-11-02	1989-01-24	Teledyne Industries, Inc.	Multilayer combined rigid and flex printed circuits
JPH01244851A (en)*	1988-03-28	1989-09-29	Matsushita Electric Works Ltd	Manufacture of electric laminate
US5877940A (en)*	1993-12-02	1999-03-02	Teledyne Industries Inc.	Fabrication multilayer combined rigid/flex printed circuit board
US5629497A (en)*	1994-10-04	1997-05-13	Cmk Corporation	Printed wiring board and method of manufacturing in which a basefilm including conductive circuits is covered by a cured polyimide resin lay
US5633480A (en)*	1994-10-04	1997-05-27	Cmk Corporation	Printed wiring board having a cover lay laminated on a polyimide resin base film containing conductive circuits
US5997983A (en)*	1997-05-30	1999-12-07	Teledyneindustries, Inc.	Rigid/flex printed circuit board using angled prepreg
WO2008003545A1 (en)*	2006-07-04	2008-01-10	Continental Automotive Gmbh	Flexible conductor and use of a glass fiber material and a resin for the flexible conductor
US20130192882A1 (en)*	2012-01-27	2013-08-01	Kyocera Slc Technologies Corporation	Wiring board and mounting structure using the same

Also Published As

Publication number	Publication date
GB201419574D0 (en)	2014-12-17
GB2522954A (en)	2015-08-12

Publication	Publication Date	Title
EP3200572A4 (en)	2018-05-23	Printed wiring board
SG11201601118WA (en)	2016-03-30	Printed-circuit board motor
HUE038755T2 (en)	2018-11-28	Connecting device for electrically connecting two circuit boards
EP3174374A4 (en)	2018-04-04	Printed wiring board
EP2952073A4 (en)	2016-11-30	Printed circuit board having orthogonal signal routing
GB201320180D0 (en)	2014-01-01	Flexible electronic substrate
EP2747529A4 (en)	2015-05-06	Wiring board
SG11201604511UA (en)	2016-07-28	Insulating layer for printed circuit board and printed circuit board
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EP2916629A4 (en)	2016-07-13	Printed circuit board
EP2915415A4 (en)	2016-10-05	PRINTED CIRCUIT BOARD
TWI562698B (en)	2016-12-11	Printed circuit board and method for manufacturing same
IL245215A (en)	2017-06-29	Thermal management of printed circuit board components
EP3010061A4 (en)	2017-03-15	Flexible printed circuit boards structure
GB201308444D0 (en)	2013-06-19	Apparatus for coupling circuit boards
GB2519191B (en)	2018-07-18	Method for manufacturing a printed circuit board
GB2502148B (en)	2015-04-29	Printed circuit board heatsink mounting
EP3071002A4 (en)	2016-12-07	Flexible printed circuit
EP2931010A4 (en)	2016-08-03	PRINTED CIRCUIT BOARD

Legal Events

Date	Code	Title	Description
2017-02-22	732E	Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)	Free format text:REGISTERED BETWEEN 20170126 AND 20170201

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