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GB2491733A - Heat sink with multiple vapor chambers - Google Patents

Heat sink with multiple vapor chambersDownload PDF

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Publication number
GB2491733A
GB2491733AGB1212820.3AGB201212820AGB2491733AGB 2491733 AGB2491733 AGB 2491733AGB 201212820 AGB201212820 AGB 201212820AGB 2491733 AGB2491733 AGB 2491733A
Authority
GB
United Kingdom
Prior art keywords
heat sink
vapor chambers
multiple vapor
activation point
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB1212820.3A
Other versions
GB201212820D0 (en
GB2491733B (en
Inventor
John P Franz
Sarah Nicole Anthony
Joseph R Allen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LPfiledCriticalHewlett Packard Development Co LP
Publication of GB201212820D0publicationCriticalpatent/GB201212820D0/en
Publication of GB2491733ApublicationCriticalpatent/GB2491733A/en
Application grantedgrantedCritical
Publication of GB2491733BpublicationCriticalpatent/GB2491733B/en
Expired - Fee Relatedlegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

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Abstract

A heat sink is disclosed. The heat sink comprises a base (102, 402) with at least one vapor chamber (208, 408) containing a fluid with a first activation point. The base has at least one vapor chamber (212, 412) containing a fluid with a second activation point. The first activation point is different than the second activation point.
GB1212820.3A2010-01-262010-01-26Heat sink with multiple vapor chambersExpired - Fee RelatedGB2491733B (en)

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
PCT/US2010/022087WO2011093852A1 (en)2010-01-262010-01-26Heat sink with multiple vapor chambers

Publications (3)

Publication NumberPublication Date
GB201212820D0 GB201212820D0 (en)2012-09-05
GB2491733Atrue GB2491733A (en)2012-12-12
GB2491733B GB2491733B (en)2013-12-04

Family

ID=44319607

Family Applications (1)

Application NumberTitlePriority DateFiling Date
GB1212820.3AExpired - Fee RelatedGB2491733B (en)2010-01-262010-01-26Heat sink with multiple vapor chambers

Country Status (5)

CountryLink
US (1)US20120012281A1 (en)
CN (1)CN102713787A (en)
DE (1)DE112010004802T5 (en)
GB (1)GB2491733B (en)
WO (1)WO2011093852A1 (en)

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CN102683520A (en)*2012-05-312012-09-19华南理工大学LED aluminium vapor chamber integrated radiating structure and preparation method thereof
US9610955B2 (en)2013-11-112017-04-04Smartdrive Systems, Inc.Vehicle fuel consumption monitor and feedback systems
CN103824823B (en)*2014-03-102017-07-18吴鸿平Endogenous fluids heat-exchange system
CN107613724B (en)2014-06-042020-04-28华为技术有限公司 an electronic device
CN105636405A (en)*2014-11-052016-06-01福特全球技术公司Highly integrated power electronic module assembly
TWM512883U (en)*2015-05-052015-11-21Cooler Master Co Ltd Cooling module, water-cooled cooling module and cooling system
CN105261596A (en)*2015-09-232016-01-20吴鸿平Lighting LED integrated thermal movement device
US9880595B2 (en)2016-06-082018-01-30International Business Machines CorporationCooling device with nested chambers for computer hardware
US20180177073A1 (en)*2016-12-212018-06-21Delphi Technologies, Inc.Compression fit heat sink for electronic components
US20180213679A1 (en)*2017-01-262018-07-26Asia Vital Components Co., Ltd.Heat dissipation unit
US11110833B2 (en)*2017-08-312021-09-07Faurecia Automotive Seating, LlcThermal-transfer component for a vehicle seat
DE102018109920A1 (en)*2018-04-252019-10-31Dr. Ing. H.C. F. Porsche Aktiengesellschaft Cooling of power electronic circuits
US11387506B2 (en)*2018-10-312022-07-12Toyota Motor Engineering & Manufacturing North America, Inc.Thermal management systems including vapor chambers and phase change materials and vehicles including the same
JP6725180B2 (en)*2018-12-072020-07-15ホアウェイ・テクノロジーズ・カンパニー・リミテッド Electronic device
CN112566444B (en)*2019-09-252023-01-20深圳富泰宏精密工业有限公司Composite material radiator and electronic device thereof
CN115151119A (en)*2021-03-292022-10-04北京小米移动软件有限公司Electronic device
JP7628382B2 (en)2022-03-092025-02-10株式会社Tmeic Heat Pipe Device
US12089370B2 (en)*2022-03-222024-09-10Baidu Usa LlcThermal management device for high density processing unit
US20230345669A1 (en)*2022-04-202023-10-26Quanta Computer Inc.Heat-Absorbing Chassis For Fan-Less Electronic Component

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US20050128710A1 (en)*2003-12-152005-06-16Beiteimal Abdlmonem H.Cooling system for electronic components
US20060096740A1 (en)*2004-11-102006-05-11Wen-Chun ZhengNearly isothermal heat pipe heat sink and process for making the same

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US7694727B2 (en)*2007-01-232010-04-13Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation device with multiple heat pipes
US20090059524A1 (en)*2007-08-272009-03-05Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation device
CN101500372B (en)*2009-01-212011-07-06深圳市深南电路有限公司 Electronic equipment and its heat dissipation substrate
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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20030121643A1 (en)*2002-01-032003-07-03Connors Matthew JosephBi-level heat sink
US20050128710A1 (en)*2003-12-152005-06-16Beiteimal Abdlmonem H.Cooling system for electronic components
US20060096740A1 (en)*2004-11-102006-05-11Wen-Chun ZhengNearly isothermal heat pipe heat sink and process for making the same

Also Published As

Publication numberPublication date
GB201212820D0 (en)2012-09-05
GB2491733B (en)2013-12-04
US20120012281A1 (en)2012-01-19
CN102713787A (en)2012-10-03
DE112010004802T5 (en)2012-11-15
WO2011093852A1 (en)2011-08-04

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Legal Events

DateCodeTitleDescription
732EAmendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text:REGISTERED BETWEEN 20160825 AND 20160831

PCNPPatent ceased through non-payment of renewal fee

Effective date:20170126
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