GB2419138B - Methods and apparatus for sputtering - Google Patents

Methods and apparatus for sputtering

Info

Publication number: GB2419138B
Authority: GB; United Kingdom
Prior art keywords: sputtering; methods
Prior art date: 2004-10-16
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Inventor

Mark Ashley Ford

Rajkumar Jakkaraju

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Trikon Technologies Ltd

Original Assignee

Trikon Technologies Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2004-10-16

Filing date

2005-10-17

Publication date

2009-08-19

2005-10-17Application filed by Trikon Technologies LtdfiledCriticalTrikon Technologies Ltd

2005-11-23Publication of GB0521001D0publicationCriticalpatent/GB0521001D0/en

2006-04-19Publication of GB2419138ApublicationCriticalpatent/GB2419138A/en

2009-08-19Application grantedgrantedCritical

2009-08-19Publication of GB2419138BpublicationCriticalpatent/GB2419138B/en

2025-10-17Anticipated expirationlegal-statusCritical

StatusExpired - Lifetimelegal-statusCriticalCurrent

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Organic Chemistry (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Chemical Kinetics & Catalysis (AREA)
Physics & Mathematics (AREA)
Plasma & Fusion (AREA)
Analytical Chemistry (AREA)
Physical Vapour Deposition (AREA)
Electrodes Of Semiconductors (AREA)
Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

GB0521001A2004-10-162005-10-17Methods and apparatus for sputteringExpired - LifetimeGB2419138B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
GBGB0423032.2AGB0423032D0 (en)	2004-10-16	2004-10-16	Methods and apparatus for sputtering

Publications (3)

Publication Number	Publication Date
GB0521001D0 GB0521001D0 (en)	2005-11-23
GB2419138A GB2419138A (en)	2006-04-19
GB2419138Btrue GB2419138B (en)	2009-08-19

Family

ID=33462860

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
GBGB0423032.2ACeasedGB0423032D0 (en)	2004-10-16	2004-10-16	Methods and apparatus for sputtering
GB0521001AExpired - LifetimeGB2419138B (en)	2004-10-16	2005-10-17	Methods and apparatus for sputtering

Family Applications Before (1)

Application Number	Title	Priority Date	Filing Date
GBGB0423032.2ACeasedGB0423032D0 (en)	2004-10-16	2004-10-16	Methods and apparatus for sputtering

Country Status (3)

Country	Link
JP (1)	JP5290496B2 (en)
DE (1)	DE102005049233A1 (en)
GB (2)	GB0423032D0 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2010287300A (en)*	2009-06-15	2010-12-24	Wd Media Singapore Pte Ltd	Method for manufacturing magnetic recording medium

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4714536A (en)*	1985-08-26	1987-12-22	Varian Associates, Inc.	Planar magnetron sputtering device with combined circumferential and radial movement of magnetic fields
US20040050690A1 (en)*	2000-12-05	2004-03-18	Green Gordon Robert	Magnetron sputtering apparatus
GB2393321A (en)*	2002-04-06	2004-03-24	Gencoa Ltd	Plasma generation
GB2413702A (en)*	2004-04-27	2005-11-02	Trikon Technologies Ltd	Methods and apparatus for controlling rotating magnetic fields

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3238459B2 (en)*	1992-03-12	2001-12-17	株式会社半導体エネルギー研究所	Manufacturing method of aluminum nitride thin film
JPH0913165A (en)*	1995-06-28	1997-01-14	Asahi Glass Co Ltd	Radio wave transmission type heat ray blocking film and film forming method thereof
JPH09176852A (en)*	1995-12-21	1997-07-08	Sony Disc Technol:Kk	Magnetron sputtering device
JPH10195649A (en)*	1996-12-27	1998-07-28	Sony Corp	Magnetron sputtering apparatus and method of manufacturing semiconductor device
JP4213777B2 (en)*	1997-12-26	2009-01-21	パナソニック株式会社	Sputtering apparatus and method
JP2000192239A (en)*	1998-12-22	2000-07-11	Matsushita Electric Ind Co Ltd	Sputtering method and sputtering device
JP4040607B2 (en)*	2004-06-14	2008-01-30	芝浦メカトロニクス株式会社	Sputtering apparatus and method, and sputtering control program

2004
- 2004-10-16GBGBGB0423032.2Apatent/GB0423032D0/ennot_activeCeased
2005
- 2005-10-14DEDE102005049233Apatent/DE102005049233A1/ennot_activeCeased
- 2005-10-14JPJP2005299954Apatent/JP5290496B2/ennot_activeExpired - Lifetime
- 2005-10-17GBGB0521001Apatent/GB2419138B/ennot_activeExpired - Lifetime

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4714536A (en)*	1985-08-26	1987-12-22	Varian Associates, Inc.	Planar magnetron sputtering device with combined circumferential and radial movement of magnetic fields
US20040050690A1 (en)*	2000-12-05	2004-03-18	Green Gordon Robert	Magnetron sputtering apparatus
GB2393321A (en)*	2002-04-06	2004-03-24	Gencoa Ltd	Plasma generation
GB2413702A (en)*	2004-04-27	2005-11-02	Trikon Technologies Ltd	Methods and apparatus for controlling rotating magnetic fields

Also Published As

Publication number	Publication date
DE102005049233A1 (en)	2006-04-20
JP2006138010A (en)	2006-06-01
JP5290496B2 (en)	2013-09-18
GB0521001D0 (en)	2005-11-23
GB0423032D0 (en)	2004-11-17
GB2419138A (en)	2006-04-19

Publication	Publication Date	Title
GB0822148D0 (en)	2009-01-14	Methods and apparatus
GB0417328D0 (en)	2004-09-08	Apparatus and method
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GB2412393B (en)	2008-02-13	Apparatus and method
GB0507538D0 (en)	2005-05-18	Apparatus and method
GB0419915D0 (en)	2004-10-13	Apparatus and method
GB0409691D0 (en)	2004-06-02	Apparatus and method
GB0416471D0 (en)	2004-08-25	Apparatus and method
GB0501688D0 (en)	2005-03-02	Method and apparatus
GB0502965D0 (en)	2005-03-16	Apparatus and method
GB0504159D0 (en)	2005-04-06	Apparatus and method
AP2007003949A0 (en)	2007-04-30	Apparatus and method
GB0617518D0 (en)	2006-10-18	Apparatus and method
EP1804703A4 (en)	2009-09-02	Cryo-surgical apparatus and methods
GB2414492B (en)	2008-03-05	Apparatus and method
GB0502318D0 (en)	2005-03-16	Apparatus and method
GB0411721D0 (en)	2004-06-30	Method and apparatus
GB2419138B (en)	2009-08-19	Methods and apparatus for sputtering
GB0504469D0 (en)	2005-04-13	Method and apparatus
GB0419986D0 (en)	2004-10-13	Method and apparatus
GB0407659D0 (en)	2004-05-05	Method and apparatus
GB0412695D0 (en)	2004-07-07	Apparatus and method

Legal Events

Date	Code	Title	Description
2015-08-12	732E	Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)	Free format text:REGISTERED BETWEEN 20150716 AND 20150722

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