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GB1335095A - Polycondensation copolymers - Google Patents

Polycondensation copolymers

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Publication number
GB1335095A
GB1335095AGB1335095DAGB1335095AGB 1335095 AGB1335095 AGB 1335095AGB 1335095D AGB1335095D AGB 1335095DAGB 1335095 AGB1335095 AGB 1335095A
Authority
GB
United Kingdom
Prior art keywords
acid
diamine
copolymers
jan
photo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kodak Ltd
Original Assignee
Kodak Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kodak LtdfiledCriticalKodak Ltd
Publication of GB1335095ApublicationCriticalpatent/GB1335095A/en
Expiredlegal-statusCriticalCurrent

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Abstract

1335095 Co-poly carbonamide-sulphonamides KODAK Ltd 12 Jan 1972 [14 Jan 1971] 1834/71 Heading C3R [Also in Division G2] Photo-sensitizable copolymers comprise residues of a diamine, an olefinically unsaturated dicarboxylic acid and an aromatic disulphonic acid in the polymer chain. The diamine may be a C 2-6 alkylene diamine or an alicyclic diamine with 6 or 7 ring carbons, e.g. tri- or hexamethylene diamine or 1,4-diaminomethyl cyclohexane. The carboxylic acid may be 1,2- dicarboxy-cis-4-cyclohexene or (2 : 2: 1)-bicyclohexene-2,3-dicarboxylic acid and the sulphonic acid may be m-benzene-disulphonic acid. The copolymers may be prepared by interfacial techniques using the acid chlorides. Solutions of the copolymer and a sensitizer may be used for photo-resists (see Division G2).
GB1335095D1971-01-141971-01-14Polycondensation copolymersExpiredGB1335095A (en)

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
GB1834711971-01-14

Publications (1)

Publication NumberPublication Date
GB1335095Atrue GB1335095A (en)1973-10-24

Family

ID=9728821

Family Applications (1)

Application NumberTitlePriority DateFiling Date
GB1335095DExpiredGB1335095A (en)1971-01-141971-01-14Polycondensation copolymers

Country Status (2)

CountryLink
FR (1)FR2122169A5 (en)
GB (1)GB1335095A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4107155A (en)1977-06-291978-08-15Eastman Kodak CompanyPolysulfonamides
US4865950A (en)*1988-01-211989-09-12Eastman Kodak Co.Laminate for the formation of beam leads for IC chip bonding featuring improved positive-working resist
US6045967A (en)*1997-01-102000-04-04Hyundai Electronics Industries Co., Ltd.Method and device using ArF photoresist
US6291131B1 (en)1998-08-262001-09-18Hyundai Electronics Industries Co., Ltd.Monomers for photoresist, polymers thereof, and photoresist compositions using the same
US6369181B1 (en)1997-12-292002-04-09Hyundai Electronics Industries Co., Ltd.Copolymer resin, preparation thereof, and photoresist using the same
US6410670B1 (en)1998-08-262002-06-25Hyundai Electronics Industries Co., Ltd.Photoresist monomer having hydroxy group and carboxy group, copolymer thereof and photoresist composition using the same
US6569971B2 (en)1998-08-272003-05-27Hyundai Electronics Industries Co., Ltd.Polymers for photoresist and photoresist compositions using the same
EP2428842A1 (en)*2010-09-142012-03-14Rohm and Haas Electronic Materials LLCPhotoresists comprising multi-amide component
JP2019518981A (en)*2016-05-122019-07-04ノーロッキー, ダニエル, ジェイ.NAWROCKI, Daniel, J. Polysulfonamide redistribution composition and method of using the same

Cited By (13)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4107155A (en)1977-06-291978-08-15Eastman Kodak CompanyPolysulfonamides
US4865950A (en)*1988-01-211989-09-12Eastman Kodak Co.Laminate for the formation of beam leads for IC chip bonding featuring improved positive-working resist
US6045967A (en)*1997-01-102000-04-04Hyundai Electronics Industries Co., Ltd.Method and device using ArF photoresist
US6608158B2 (en)1997-12-292003-08-19Hyundai Electronics Industries Co., Ltd.Copolymer resin, preparation thereof, and photoresist using the same
US6369181B1 (en)1997-12-292002-04-09Hyundai Electronics Industries Co., Ltd.Copolymer resin, preparation thereof, and photoresist using the same
US6291131B1 (en)1998-08-262001-09-18Hyundai Electronics Industries Co., Ltd.Monomers for photoresist, polymers thereof, and photoresist compositions using the same
US6410670B1 (en)1998-08-262002-06-25Hyundai Electronics Industries Co., Ltd.Photoresist monomer having hydroxy group and carboxy group, copolymer thereof and photoresist composition using the same
US6569971B2 (en)1998-08-272003-05-27Hyundai Electronics Industries Co., Ltd.Polymers for photoresist and photoresist compositions using the same
US6987155B2 (en)1998-08-272006-01-17Hyundai Electronics Industries Co., Ltd.Polymers for photoresist and photoresist compositions using the same
EP2428842A1 (en)*2010-09-142012-03-14Rohm and Haas Electronic Materials LLCPhotoresists comprising multi-amide component
CN102591145A (en)*2010-09-142012-07-18罗门哈斯电子材料有限公司Photoresists comprising multi-amide component
CN102591145B (en)*2010-09-142013-12-04罗门哈斯电子材料有限公司Photoresists comprising multi-amide component
JP2019518981A (en)*2016-05-122019-07-04ノーロッキー, ダニエル, ジェイ.NAWROCKI, Daniel, J. Polysulfonamide redistribution composition and method of using the same

Also Published As

Publication numberPublication date
FR2122169A5 (en)1972-08-25

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Legal Events

DateCodeTitleDescription
PSPatent sealed
PLNPPatent lapsed through nonpayment of renewal fees

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