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GB1330100A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
GB1330100A
GB1330100AGB2305672AGB2305672AGB1330100AGB 1330100 AGB1330100 AGB 1330100AGB 2305672 AGB2305672 AGB 2305672AGB 2305672 AGB2305672 AGB 2305672AGB 1330100 AGB1330100 AGB 1330100A
Authority
GB
United Kingdom
Prior art keywords
epoxy resin
iii
resin composition
halogenated
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2305672A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines CorpfiledCriticalInternational Business Machines Corp
Publication of GB1330100ApublicationCriticalpatent/GB1330100A/en
Expiredlegal-statusCriticalCurrent

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Abstract

1330100 Epoxy resin composition INTERNATIONAL BUSINESS MACHINES CORP 17 May 1972 [28 June 1971] 23056/72 Heading C3B [Also in Division G2] An epoxy resin composition comprises: (I) an epoxy resin having an epoxide equivalent weight of 800-2000; (II) an amine curing agent, (III) a halogenated polycarboxylic anhydride; and (IV) a halogenated hydrocarbon solvent. I may be a diglycidyl ether of bisphenol A or resorcinol or an epoxy novolac resin. II may be methylenedianiline, phenylenediamine, diaminodiphenylsulphone, diethylenetriamine or triethylenetetramine. III may be chlorendic, dichloromaleic, tetrabromo- or tetrachlorophthalic, dichlorocitraconic or a halogenated derivative or tri- or pyro-mellitic anhydrides. I may comprise 5-30% by wt., II may comprise 2-12% by wt. and III 1-5% by wt, each of the total composition. Uses.-In preparing positive photoresist images.
GB2305672A1971-06-281972-05-17Epoxy resin compositionExpiredGB1330100A (en)

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
US15762571A1971-06-281971-06-28

Publications (1)

Publication NumberPublication Date
GB1330100Atrue GB1330100A (en)1973-09-12

Family

ID=22564554

Family Applications (1)

Application NumberTitlePriority DateFiling Date
GB2305672AExpiredGB1330100A (en)1971-06-281972-05-17Epoxy resin composition

Country Status (5)

CountryLink
JP (1)JPS5037531B1 (en)
DE (1)DE2231297A1 (en)
FR (1)FR2143706B1 (en)
GB (1)GB1330100A (en)
IT (1)IT951496B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4368253A (en)1981-01-281983-01-11Ciba-Geigy CorporationImage formation process
US4439517A (en)*1982-01-211984-03-27Ciba-Geigy CorporationProcess for the formation of images with epoxide resin
US4663269A (en)*1985-08-071987-05-05Polytechnic Institute Of New YorkMethod of forming highly sensitive photoresist film in the absence of water
US6378201B1 (en)1990-09-272002-04-30International Business Machines CorporationMethod for making a printed circuit board

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS5137216A (en)*1974-09-261976-03-29Asahi Chemical Ind
US5650261A (en)*1989-10-271997-07-22Rohm And Haas CompanyPositive acting photoresist comprising a photoacid, a photobase and a film forming acid-hardening resin system
US6168898B1 (en)*1998-02-172001-01-02Isola Laminate Systems Corp.Positive acting photodielectric composition

Cited By (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4368253A (en)1981-01-281983-01-11Ciba-Geigy CorporationImage formation process
US4439517A (en)*1982-01-211984-03-27Ciba-Geigy CorporationProcess for the formation of images with epoxide resin
EP0085024A3 (en)*1982-01-211984-09-26Ciba-Geigy AgMethod for producing images in photoresist layers
US4663269A (en)*1985-08-071987-05-05Polytechnic Institute Of New YorkMethod of forming highly sensitive photoresist film in the absence of water
US6378201B1 (en)1990-09-272002-04-30International Business Machines CorporationMethod for making a printed circuit board

Also Published As

Publication numberPublication date
FR2143706B1 (en)1976-06-11
JPS5037531B1 (en)1975-12-03
JPS4815059A (en)1973-02-26
FR2143706A1 (en)1973-02-09
DE2231297A1 (en)1973-01-11
IT951496B (en)1973-06-30

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Legal Events

DateCodeTitleDescription
PSPatent sealed
PLNPPatent lapsed through nonpayment of renewal fees

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