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GB1312714A - Methods of making multilayer printed circuit assemblies - Google Patents

Methods of making multilayer printed circuit assemblies

Info

Publication number
GB1312714A
GB1312714AGB1694170AGB1312714DAGB1312714AGB 1312714 AGB1312714 AGB 1312714AGB 1694170 AGB1694170 AGB 1694170AGB 1312714D AGB1312714D AGB 1312714DAGB 1312714 AGB1312714 AGB 1312714A
Authority
GB
United Kingdom
Prior art keywords
layers
printed circuit
boards
stack
multilayer printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1694170A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Company PLC
Original Assignee
General Electric Company PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Company PLCfiledCriticalGeneral Electric Company PLC
Publication of GB1312714ApublicationCriticalpatent/GB1312714A/en
Expiredlegal-statusCriticalCurrent

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Abstract

1312714 Laminated printed circuit assemblies GENERAL ELECTRIC CO Ltd 19 April 1971 [9 April 1970] 16941/70 Heading B5N [Also in Division H1] A method of making a multilayer printed circuit assembly comprises coating at least some of the boards to be assembled with a bonding epoxy resin, positioning the boards to form an open stack, evacuating the stack in an evacuating enclosure and then compressing the stack while evacuated to form the assembly. In the embodiment disclosed printed circuit boards 1 of epoxy-resin impregnated woven glass fibre and intermediate woven glass fibre layers 2 are interspersed with collapsible layers 3 of crimped preformed paper or acrylic sheet or polyurethane foam. Pins 6 act to locate the layers. Layers 1, 2 are all impregnated or coated with the bonding resin. In a further embodiment the collapsible layers 3 are dispensed with. The boards 1 and layers 2 are supported in the vertical plane by pins (as 6).
GB1694170A1970-04-091970-04-09Methods of making multilayer printed circuit assembliesExpiredGB1312714A (en)

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
GB16941701970-04-09

Publications (1)

Publication NumberPublication Date
GB1312714Atrue GB1312714A (en)1973-04-04

Family

ID=10086424

Family Applications (1)

Application NumberTitlePriority DateFiling Date
GB1694170AExpiredGB1312714A (en)1970-04-091970-04-09Methods of making multilayer printed circuit assemblies

Country Status (1)

CountryLink
GB (1)GB1312714A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
DE3539989A1 (en)*1985-11-121987-05-14Lauffer MaschfPress for laminating multilayer circuits
GB2265496A (en)*1992-03-251993-09-29Dyconex AgImprovements in or relating to printed circuit board reinforcement
EP0724946A3 (en)*1986-09-151997-04-23Compositech LtdReinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products
WO2016133465A1 (en)*2015-02-172016-08-25Agency For Science, Technology And ResearchA composite laminate and its usage
DE112009003811B4 (en)*2008-12-252017-04-06Mitsubishi Electric Corporation Method for producing a printed circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
DE3539989A1 (en)*1985-11-121987-05-14Lauffer MaschfPress for laminating multilayer circuits
EP0724946A3 (en)*1986-09-151997-04-23Compositech LtdReinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products
GB2265496A (en)*1992-03-251993-09-29Dyconex AgImprovements in or relating to printed circuit board reinforcement
GB2265496B (en)*1992-03-251995-05-31Dyconex AgImprovements in or relating to printed circuit board reinforcement
DE112009003811B4 (en)*2008-12-252017-04-06Mitsubishi Electric Corporation Method for producing a printed circuit board
WO2016133465A1 (en)*2015-02-172016-08-25Agency For Science, Technology And ResearchA composite laminate and its usage

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Legal Events

DateCodeTitleDescription
PSPatent sealed [section 19, patents act 1949]
PLNPPatent lapsed through nonpayment of renewal fees
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