FR2842387B1 - HEATING SHIELD FOR PLASMA ENGRAVING REACTOR, ETCHING METHOD FOR ITS IMPLEMENTATION - Google Patents

HEATING SHIELD FOR PLASMA ENGRAVING REACTOR, ETCHING METHOD FOR ITS IMPLEMENTATION

Info

Publication number: FR2842387B1
Authority: FR; France
Prior art keywords: implementation; etching method; heating shield; plasma engraving; reactor
Prior art date: 2002-07-11
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Other versions

Inventor

Michel Puech

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Alcatel Lucent SAS

Nokia Inc

Original Assignee

Alcatel SA

Nokia Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-07-11

Filing date

2002-07-11

Publication date

2005-07-08

2002-07-11Application filed by Alcatel SA, Nokia IncfiledCriticalAlcatel SA

2002-07-11Priority to FR0208728ApriorityCriticalpatent/FR2842387B1/en

2003-07-10Priority to PCT/FR2003/002156prioritypatent/WO2004008477A2/en

2003-07-10Priority to US10/516,457prioritypatent/US20050224178A1/en

2003-07-10Priority to JP2004520754Aprioritypatent/JP2005532693A/en

2003-07-10Priority to EP03763950Aprioritypatent/EP1523754A2/en

2004-01-16Publication of FR2842387A1publicationCriticalpatent/FR2842387A1/en

2005-07-08Application grantedgrantedCritical

2005-07-08Publication of FR2842387B1publicationCriticalpatent/FR2842387B1/en

2022-07-11Anticipated expirationlegal-statusCritical

StatusExpired - Fee Relatedlegal-statusCriticalCurrent

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature

Landscapes

Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
Plasma & Fusion (AREA)
Chemical & Material Sciences (AREA)
Analytical Chemistry (AREA)
Drying Of Semiconductors (AREA)
ing And Chemical Polishing (AREA)

FR0208728A2002-07-112002-07-11 HEATING SHIELD FOR PLASMA ENGRAVING REACTOR, ETCHING METHOD FOR ITS IMPLEMENTATIONExpired - Fee RelatedFR2842387B1 (en)

Priority Applications (5)

Application Number	Priority Date	Filing Date	Title
FR0208728AFR2842387B1 (en)	2002-07-11	2002-07-11	HEATING SHIELD FOR PLASMA ENGRAVING REACTOR, ETCHING METHOD FOR ITS IMPLEMENTATION
PCT/FR2003/002156WO2004008477A2 (en)	2002-07-11	2003-07-10	Heating jacket for plasma etching reactor, and etching method using same
US10/516,457US20050224178A1 (en)	2002-07-11	2003-07-10	Heating jacket for plasma etching reactor, and etching method using same
JP2004520754AJP2005532693A (en)	2002-07-11	2003-07-10	Heating jacket for plasma etching reactor and etching method using heating jacket
EP03763950AEP1523754A2 (en)	2002-07-11	2003-07-10	Heating jacket for plasma etching reactor, and etching method using same

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
FR0208728AFR2842387B1 (en)	2002-07-11	2002-07-11	HEATING SHIELD FOR PLASMA ENGRAVING REACTOR, ETCHING METHOD FOR ITS IMPLEMENTATION

Publications (2)

Publication Number	Publication Date
FR2842387A1 FR2842387A1 (en)	2004-01-16
FR2842387B1true FR2842387B1 (en)	2005-07-08

Family

ID=29763738

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FR0208728AExpired - Fee RelatedFR2842387B1 (en)	2002-07-11	2002-07-11	HEATING SHIELD FOR PLASMA ENGRAVING REACTOR, ETCHING METHOD FOR ITS IMPLEMENTATION

Country Status (5)

Country	Link
US (1)	US20050224178A1 (en)
EP (1)	EP1523754A2 (en)
JP (1)	JP2005532693A (en)
FR (1)	FR2842387B1 (en)
WO (1)	WO2004008477A2 (en)

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JP7422531B2 (en)*	2019-12-17	2024-01-26	東京エレクトロン株式会社	Plasma processing equipment and plasma processing method

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2002
- 2002-07-11FRFR0208728Apatent/FR2842387B1/ennot_activeExpired - Fee Related
2003
- 2003-07-10USUS10/516,457patent/US20050224178A1/ennot_activeAbandoned
- 2003-07-10JPJP2004520754Apatent/JP2005532693A/enactivePending
- 2003-07-10EPEP03763950Apatent/EP1523754A2/ennot_activeWithdrawn
- 2003-07-10WOPCT/FR2003/002156patent/WO2004008477A2/enactiveApplication Filing

Also Published As

Publication number	Publication date
WO2004008477A2 (en)	2004-01-22
US20050224178A1 (en)	2005-10-13
EP1523754A2 (en)	2005-04-20
JP2005532693A (en)	2005-10-27
WO2004008477A3 (en)	2004-04-08
FR2842387A1 (en)	2004-01-16

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Legal Events

Date	Code	Title	Description
2007-08-03	CD	Change of name or company name
2011-05-06	TP	Transmission of property
2012-04-20	ST	Notification of lapse	Effective date:20120330

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