FR2156006A1 - - Google Patents

Info

Publication number: FR2156006A1
Authority: FR; France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Other versions

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

International Business Machines Corp

Original Assignee

International Business Machines Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1971-10-04

Filing date

1972-09-27

Publication date

1973-05-25

1972-09-27Application filed by International Business Machines CorpfiledCriticalInternational Business Machines Corp

1973-05-25Publication of FR2156006A1publicationCriticalpatent/FR2156006A1/fr

1976-05-21Application grantedgrantedCritical

1976-05-21Publication of FR2156006B1publicationCriticalpatent/FR2156006B1/fr

StatusExpiredlegal-statusCriticalCurrent

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Physics & Mathematics (AREA)
Mounting Of Printed Circuit Boards And The Like (AREA)
Connecting Device With Holders (AREA)
Cosmetics (AREA)
Fats And Perfumes (AREA)
Coupling Device And Connection With Printed Circuit (AREA)
Lead Frames For Integrated Circuits (AREA)

FR7235073A1971-10-041972-09-27ExpiredFR2156006B1 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US18598071A	1971-10-04	1971-10-04

Publications (2)

Publication Number	Publication Date
FR2156006A1true FR2156006A1 (en)	1973-05-25
FR2156006B1 FR2156006B1 (en)	1976-05-21

Family

ID=22683166

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FR7235073AExpiredFR2156006B1 (en)	1971-10-04	1972-09-27

Country Status (5)

Country	Link
US (1)	US3757271A (en)
JP (1)	JPS5225222B2 (en)
DE (1)	DE2242337C2 (en)
FR (1)	FR2156006B1 (en)
GB (1)	GB1375430A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0002166A3 (en)*	1977-11-18	1979-08-08	International Business Machines Corporation	Carrier for mounting an integrated-circuit chip and method for its manufacture
FR2479237A1 (en)*	1980-03-27	1981-10-02	Hitco	BIS-MALEIMIDE RESIN AND COMPOSITE PRODUCTS CONTAINING THE SAME
EP0262284A1 (en)*	1986-09-29	1988-04-06	Tektronix, Inc.	Connection apparatus for integrated circuit

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB1430114A (en)*	1972-07-03	1976-03-31	Ibm	Electrical connector
US3877064A (en)*	1974-02-22	1975-04-08	Amp Inc	Device for connecting leadless integrated circuit packages to a printed-circuit board
JPS5740678B2 (en)*	1974-02-26	1982-08-28
US3960423A (en)*	1974-10-02	1976-06-01	Amp Incorporated	Multi-contact connector for substrate-to-board connections
JPS5828400Y2 (en)*	1975-02-10	1983-06-21	日本電気株式会社	In-housing structure of microwave integrated circuit
JPS5734776Y2 (en)*	1976-10-29	1982-07-31
US4166665A (en)*	1976-12-27	1979-09-04	Cutchaw John M	Liquid cooled connector for large scale integrated circuit packages
US4063791A (en)*	1976-12-27	1977-12-20	Cutchaw John M	Connector for leadless integrated circuit packages
JPS55128274A (en)*	1979-03-28	1980-10-03	Nippon Electric Co	Electronic circuit package connecting structure
US4331373A (en)*	1980-03-24	1982-05-25	Burroughs Corporation	Modular system with system carrier, test carrier and system connector
US4402561A (en)*	1981-03-27	1983-09-06	Amp Incorporated	Socket for integrated circuit package with extended leads
DE3245030A1 (en)*	1982-12-06	1984-06-07	Siemens AG, 1000 Berlin und 8000 München	SMALL HEATER
JPS60100455A (en)*	1983-11-05	1985-06-04	Mitsubishi Electric Corp	semiconductor equipment
US4571015A (en)*	1984-03-16	1986-02-18	Amp Incorporated	Electrical connector having rotating clamps for securing electronic packages therein
US4595794A (en)*	1984-03-19	1986-06-17	At&T Bell Laboratories	Component mounting apparatus
JPS6144786U (en)*	1984-08-27	1986-03-25	第一精工株式会社	IC package socket
JPS61278159A (en)*	1985-06-03	1986-12-09	Yamaichi Electric Mfg Co Ltd	Carrier for ic package
US4747017A (en)*	1986-05-27	1988-05-24	General Motors Corporation	Surface mountable integrated circuit package equipped with sockets
US5053853A (en)*	1990-05-08	1991-10-01	International Business Machines Corporation	Modular electronic packaging system
EP0654822A1 (en)*	1993-11-19	1995-05-24	BULL HN INFORMATION SYSTEMS ITALIA S.p.A.	Heat sink assembly for integrated circuit
US6016852A (en)*	1994-12-01	2000-01-25	Intel Corporation	Leaded grid array IC package having coplanar bent leads for surface mount technology
US5933327A (en)*	1998-04-03	1999-08-03	Ericsson, Inc.	Wire bond attachment of a integrated circuit package to a heat sink
US10104812B2 (en)*	2011-09-01	2018-10-16	Infineon Technologies Ag	Elastic mounting of power modules
CN103124488A (en)*	2011-11-21	2013-05-29	鸿富锦精密工业（深圳）有限公司	Radiating component
US11910566B1 (en)*	2021-03-18	2024-02-20	Amazon Technologies, Inc.	Processor heat exchanger with separate mounting structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3297974A (en)*	1965-04-15	1967-01-10	Ind Electronic Hardware Corp	Receptacle for integrated circuit module
US3335327A (en)*	1965-01-06	1967-08-08	Augat Inc	Holder for attaching flat pack to printed circuit board
BE699239A (en)*	1966-06-20	1967-11-03

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1242726B (en)*	1965-11-26	1967-06-22	Telefunken Patent	Chassis for an electrical engineering device from a printed circuit board and a frame-shaped carrier

1971
- 1971-10-04USUS00185980Apatent/US3757271A/ennot_activeExpired - Lifetime
1972
- 1972-08-29DEDE2242337Apatent/DE2242337C2/ennot_activeExpired
- 1972-09-22JPJP47094672Apatent/JPS5225222B2/janot_activeExpired
- 1972-09-22GBGB4390372Apatent/GB1375430A/ennot_activeExpired
- 1972-09-27FRFR7235073Apatent/FR2156006B1/frnot_activeExpired

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3335327A (en)*	1965-01-06	1967-08-08	Augat Inc	Holder for attaching flat pack to printed circuit board
US3297974A (en)*	1965-04-15	1967-01-10	Ind Electronic Hardware Corp	Receptacle for integrated circuit module
BE699239A (en)*	1966-06-20	1967-11-03

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0002166A3 (en)*	1977-11-18	1979-08-08	International Business Machines Corporation	Carrier for mounting an integrated-circuit chip and method for its manufacture
FR2479237A1 (en)*	1980-03-27	1981-10-02	Hitco	BIS-MALEIMIDE RESIN AND COMPOSITE PRODUCTS CONTAINING THE SAME
EP0262284A1 (en)*	1986-09-29	1988-04-06	Tektronix, Inc.	Connection apparatus for integrated circuit

Also Published As

Publication number	Publication date
JPS5225222B2 (en)	1977-07-06
DE2242337A1 (en)	1973-04-12
GB1375430A (en)	1974-11-27
DE2242337C2 (en)	1983-04-14
JPS4845175A (en)	1973-06-28
US3757271A (en)	1973-09-04
FR2156006B1 (en)	1976-05-21

Publication	Publication Date	Title
FR2156006B1 (en)	1976-05-21
AU2658571A (en)	1972-09-21
AU2691671A (en)	1972-09-28
AU2485671A (en)	1972-08-03
AU2894671A (en)	1972-11-23
AU3005371A (en)	1972-12-21
AU2726271A (en)	1972-10-05
AU2941471A (en)	1972-11-30
AU2684071A (en)	1972-09-28
AU2952271A (en)	1972-12-07
AU2564071A (en)	1972-08-24
AU2669471A (en)	1972-09-21
AU2940971A (en)	1972-11-30
AU2473671A (en)	1972-08-03
AU2907471A (en)	1972-11-23
AU2486471A (en)	1972-08-03
AU2706571A (en)	1971-07-15
AU2740271A (en)	1972-10-12
AU2724971A (en)	1972-10-05
AU2927871A (en)	1972-11-30
AU2930871A (en)	1972-11-30
AU2938071A (en)	1972-11-30
AU2577671A (en)	1972-08-24
AU2503871A (en)	1972-08-10
AU2684171A (en)	1971-07-15

Legal Events

Date	Code	Title	Description
1983-07-22	ST	Notification of lapse

Movatterモバイル変換

FR2156006A1 - - Google Patents

Info

Links

Classifications

Landscapes

Applications Claiming Priority (1)

Publications (2)

Family

ID=22683166

Family Applications (1)

Country Status (5)

Cited By (3)

Families Citing this family (25)

Citations (3)

Family Cites Families (1)

Patent Citations (3)

Cited By (3)

Also Published As

Similar Documents

Legal Events