Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique SA
Original Assignee
Radiotechnique SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique SAfiledCriticalRadiotechnique SA
Priority to FR977614ApriorityCriticalpatent/FR1406595A/en
Application grantedgrantedCritical
Publication of FR1406595ApublicationCriticalpatent/FR1406595A/en
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
H05K13/04—Mounting of components, e.g. of leadless components
H05K13/0473—Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/01—Tools for processing; Objects used during processing
H05K2203/0147—Carriers and holders
H05K2203/0173—Template for holding a PCB having mounted components thereon
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
H05K2203/1305—Moulding and encapsulation
H05K2203/1316—Moulded encapsulation of mounted components
Landscapes
Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
FR977614A1964-06-091964-06-09 Method of making devices allowing the temporary holding of electronic elements associated with a printed circuit boardExpiredFR1406595A (en)