EP2612380A4 - LIGHT EMITTING APPARATUS, ENERGY GENERATOR OR OTHER ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME - Google Patents

LIGHT EMITTING APPARATUS, ENERGY GENERATOR OR OTHER ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME

Info

Publication number: EP2612380A4
Authority: EP; European Patent Office
Prior art keywords: manufacturing; light emitting; same; energy generator; electronic apparatus
Prior art date: 2010-09-01
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Other versions

Inventor

Mark D Lowenthal

William Johnstone Ray

Neil O Shotton

Richard A Blanchard

Brad Oraw

Mark Allan Lewandowski

Jeffrey Baldridge

Eric Anthony Perozziello

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

NthDegree Technologies Worldwide Inc

Original Assignee

NthDegree Technologies Worldwide Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2010-09-01

Filing date

2011-09-01

Publication date

2015-01-14

2011-08-31Priority claimed from US13/223,302external-prioritypatent/US8846457B2/en

2011-08-31Priority claimed from US13/223,293external-prioritypatent/US8877101B2/en

2011-08-31Priority claimed from US13/223,297external-prioritypatent/US8415879B2/en

2011-08-31Priority claimed from US13/223,294external-prioritypatent/US8674593B2/en

2011-08-31Priority claimed from US13/223,286external-prioritypatent/US8852467B2/en

2011-08-31Priority claimed from US13/223,279external-prioritypatent/US8809126B2/en

2011-08-31Priority claimed from US13/223,289external-prioritypatent/US9018833B2/en

2011-09-01Application filed by NthDegree Technologies Worldwide IncfiledCriticalNthDegree Technologies Worldwide Inc

2013-07-10Publication of EP2612380A2publicationCriticalpatent/EP2612380A2/en

2015-01-14Publication of EP2612380A4publicationCriticalpatent/EP2612380A4/en

StatusWithdrawnlegal-statusCriticalCurrent

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/80—Constructional details
- H10H29/85—Packages
- H10H29/857—Interconnections
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/20—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00
- H10H29/24—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00 comprising multiple light-emitting semiconductor devices
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/80—Constructional details
- H10H29/85—Packages
- H10H29/855—Optical field-shaping means, e.g. lenses
- H10H29/8552—Light absorbing arrangements, e.g. black matrix
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/951—Supplying the plurality of semiconductor or solid-state bodies
- H01L2224/95101—Supplying the plurality of semiconductor or solid-state bodies in a liquid medium
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13034—Silicon Controlled Rectifier [SCR]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13062—Junction field-effect transistor [JFET]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Computer Hardware Design (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Chemical & Material Sciences (AREA)
Manufacturing & Machinery (AREA)
Organic Chemistry (AREA)
Life Sciences & Earth Sciences (AREA)
Wood Science & Technology (AREA)
Materials Engineering (AREA)
General Engineering & Computer Science (AREA)
Led Device Packages (AREA)
Optics & Photonics (AREA)
Electroluminescent Light Sources (AREA)

EP11822653.9A2010-09-012011-09-01 LIGHT EMITTING APPARATUS, ENERGY GENERATOR OR OTHER ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAMEWithdrawnEP2612380A4 (en)

Applications Claiming Priority (12)

Application Number	Priority Date	Filing Date	Title
US37928410P	2010-09-01	2010-09-01
US37922510P	2010-09-01	2010-09-01
US37983010P	2010-09-03	2010-09-03
US37982010P	2010-09-03	2010-09-03
US13/223,302US8846457B2 (en)	2007-05-31	2011-08-31	Printable composition of a liquid or gel suspension of diodes
US13/223,293US8877101B2 (en)	2007-05-31	2011-08-31	Method of manufacturing a light emitting, power generating or other electronic apparatus
US13/223,297US8415879B2 (en)	2007-05-31	2011-08-31	Diode for a printable composition
US13/223,294US8674593B2 (en)	2007-05-31	2011-08-31	Diode for a printable composition
US13/223,286US8852467B2 (en)	2007-05-31	2011-08-31	Method of manufacturing a printable composition of a liquid or gel suspension of diodes
US13/223,279US8809126B2 (en)	2007-05-31	2011-08-31	Printable composition of a liquid or gel suspension of diodes
US13/223,289US9018833B2 (en)	2007-05-31	2011-08-31	Apparatus with light emitting or absorbing diodes
PCT/US2011/050174WO2012031096A2 (en)	2010-09-01	2011-09-01	Light emitting, power generating or other electronic apparatus and method of manufacturing same

Publications (2)

Publication Number	Publication Date
EP2612380A2 EP2612380A2 (en)	2013-07-10
EP2612380A4true EP2612380A4 (en)	2015-01-14

Family

ID=48607508

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP11822653.9AWithdrawnEP2612380A4 (en)	2010-09-01	2011-09-01	LIGHT EMITTING APPARATUS, ENERGY GENERATOR OR OTHER ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME

Country Status (4)

Country	Link
EP (1)	EP2612380A4 (en)
KR (4)	KR102404843B1 (en)
CN (1)	CN103582962B (en)
WO (1)	WO2012031096A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR2954361B1 (en)	2009-12-23	2012-06-15	Arjo Wiggins Fine Papers Ltd	ULTRA SMOOTH AND RECYCLABLE PRINTING SHEET AND METHOD OF MANUFACTURING THE SAME
PT2802711T (en)	2012-01-13	2018-01-30	Arjo Wiggins Fine Papers Ltd	Method for producing a sheet
DE102015215599A1 (en)	2015-08-14	2017-02-16	Audi Ag	Energy storage arrangement, in particular for a motor vehicle, motor vehicle and method for producing an energy storage device
CN111261653B (en)*	2018-11-30	2023-08-01	成都辰显光电有限公司	Micro light-emitting diode, display panel and transfer method thereof
KR102791991B1 (en)*	2019-03-18	2025-04-07	삼성디스플레이 주식회사	Light emitting diode solvent, light emitting ink comprising the same and method of fabrication display device
KR102731021B1 (en)*	2020-01-23	2024-11-15	삼성디스플레이 주식회사	Photodegradable thickening agent, light emitting element ink comprising the same and method of fabricating display device
KR102844621B1 (en)	2020-04-22	2025-08-11	삼성디스플레이 주식회사	Light emitting element ink and method of fabricating display device
CN111739789B (en)*	2020-06-30	2024-05-03	安徽安美半导体有限公司	Reworking cleaning process of diode
US12328931B2 (en)	2022-03-04	2025-06-10	Taiwan Semiconductor Manufacturing Co., Ltd.	Hybrid integrated circuit dies and methods of forming the same

Citations (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO1995017005A1 (en)*	1993-12-17	1995-06-22	The Regents Of The University Of California	Method for fabricating self-assembling microstructures
US5469020A (en)*	1994-03-14	1995-11-21	Massachusetts Institute Of Technology	Flexible large screen display having multiple light emitting elements sandwiched between crossed electrodes
EP0747948A2 (en)*	1995-06-07	1996-12-11	The Regents Of The University Of California	Method and apparatus for fabricating self-assembling microstructures
WO2000045443A1 (en)*	1999-01-28	2000-08-03	Nova Crystals, Inc.	High performance light emitting diodes
US20060278886A1 (en)*	2005-06-10	2006-12-14	Sony Corporation	Light emitting diode, method of manufacturing light emitting diode, light emitting diode backlight, light emitting diode illuminating device, light emitting diode display, and electronic apparatus
WO2007149362A2 (en)*	2006-06-16	2007-12-27	Articulated Technologies, Llc	Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements
US20080224153A1 (en)*	2006-12-04	2008-09-18	Sony Corporation	Electronic device, method of producing the same, light-emitting diode display unit, and method of producing the same
EP2048704A1 (en)*	2006-07-12	2009-04-15	Sony Corporation	Mounting method, mounting structure, method for manufacturing electronic equipment, electronic equipment, method for manufacturing light emitting diode display, and light emitting diode display
US20090230174A1 (en)*	2008-01-22	2009-09-17	Washington, University Of	Self-assembly of elements using microfluidic traps

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0955538A (en)*	1995-08-10	1997-02-25	Furukawa Electric Co Ltd:The	Multi-wavelength light emitting element
US6611002B2 (en)*	2001-02-23	2003-08-26	Nitronex Corporation	Gallium nitride material devices and methods including backside vias
US6918946B2 (en)*	2001-07-02	2005-07-19	Board Of Regents, The University Of Texas System	Applications of light-emitting nanoparticles
JP4397394B2 (en)*	2003-01-24	2010-01-13	ディジタル・オプティクス・インターナショナル・コーポレイション	High density lighting system
US6936193B2 (en)*	2003-04-14	2005-08-30	Research Frontiers Incorporated	Suspended particle device light valve film
US20050146870A1 (en)*	2004-01-06	2005-07-07	Jeng-Shyong Wu	Elongated flexible lighting equipment and fabricating method of same
KR20060127201A (en)*	2004-03-16	2006-12-11	다우 코닝 코포레이션	Hole transport material comprising polysiloxane
US7476557B2 (en)	2004-03-29	2009-01-13	Articulated Technologies, Llc	Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
GB2418532A (en)*	2004-09-28	2006-03-29	Arima Optoelectronic	Textured light emitting diode structure with enhanced fill factor
US7554257B2 (en)*	2005-03-02	2009-06-30	Osram Opto Semiconductors Gmbh	Method to generate high efficient devices which emit high quality light for illumination
FR2892594B1 (en)*	2005-10-21	2007-12-07	Saint Gobain	LIGHT STRUCTURE COMPRISING AT LEAST ONE ELECTROLUMINESCENT DIODE, ITS MANUFACTURE AND ITS APPLICATIONS
US20080121899A1 (en)*	2006-11-07	2008-05-29	World Properties, Inc.	Transparent electrode for LED array
US8110425B2 (en)*	2007-03-20	2012-02-07	Luminus Devices, Inc.	Laser liftoff structure and related methods
WO2008128554A1 (en)*	2007-04-20	2008-10-30	MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V.	Highly conductive, transparent carbon films as electrode materials
US8889216B2 (en)	2007-05-31	2014-11-18	Nthdegree Technologies Worldwide Inc	Method of manufacturing addressable and static electronic displays
US8133768B2 (en)	2007-05-31	2012-03-13	Nthdegree Technologies Worldwide Inc	Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
JP2013074070A (en)*	2011-09-27	2013-04-22	Fujitsu Ltd	Semiconductor device and manufacturing method of semiconductor device

2011
- 2011-09-01KRKR1020217035378Apatent/KR102404843B1/enactiveActive
- 2011-09-01KRKR1020137008391Apatent/KR102030331B1/ennot_activeExpired - Fee Related
- 2011-09-01KRKR1020207025886Apatent/KR102321916B1/ennot_activeExpired - Fee Related
- 2011-09-01CNCN201180052548.5Apatent/CN103582962B/enactiveActive
- 2011-09-01WOPCT/US2011/050174patent/WO2012031096A2/enactiveApplication Filing
- 2011-09-01KRKR1020197028661Apatent/KR102156532B1/enactiveActive
- 2011-09-01EPEP11822653.9Apatent/EP2612380A4/ennot_activeWithdrawn

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO1995017005A1 (en)*	1993-12-17	1995-06-22	The Regents Of The University Of California	Method for fabricating self-assembling microstructures
US5469020A (en)*	1994-03-14	1995-11-21	Massachusetts Institute Of Technology	Flexible large screen display having multiple light emitting elements sandwiched between crossed electrodes
EP0747948A2 (en)*	1995-06-07	1996-12-11	The Regents Of The University Of California	Method and apparatus for fabricating self-assembling microstructures
WO2000045443A1 (en)*	1999-01-28	2000-08-03	Nova Crystals, Inc.	High performance light emitting diodes
US20060278886A1 (en)*	2005-06-10	2006-12-14	Sony Corporation	Light emitting diode, method of manufacturing light emitting diode, light emitting diode backlight, light emitting diode illuminating device, light emitting diode display, and electronic apparatus
WO2007149362A2 (en)*	2006-06-16	2007-12-27	Articulated Technologies, Llc	Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements
EP2048704A1 (en)*	2006-07-12	2009-04-15	Sony Corporation	Mounting method, mounting structure, method for manufacturing electronic equipment, electronic equipment, method for manufacturing light emitting diode display, and light emitting diode display
US20080224153A1 (en)*	2006-12-04	2008-09-18	Sony Corporation	Electronic device, method of producing the same, light-emitting diode display unit, and method of producing the same
US20090230174A1 (en)*	2008-01-22	2009-09-17	Washington, University Of	Self-assembly of elements using microfluidic traps

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
BARRY C R ET AL: "Approaching Programmable Self-Assembly fromNanoparticle-Based Devices to Integrated Circuits", PROCEEDINGS OF THE FOUNDATIONS OF NANOSCIENCE, XX, XX, 21 April 2004 (2004-04-21), XP002367627*
HWANG ET AL: "Optical and electrical properties of GaN micron-scale light-emitting diode", JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, PERGAMON PRESS, LONDON, GB, vol. 69, no. 2-3, 1 February 2008 (2008-02-01), pages 752 - 758, XP022456345, ISSN: 0022-3697, DOI: 10.1016/J.JPCS.2007.07.111*
See also references ofWO2012031096A2*

Also Published As

Publication number	Publication date
WO2012031096A3 (en)	2014-03-20
KR20200106995A (en)	2020-09-15
KR20190116535A (en)	2019-10-14
KR102404843B1 (en)	2022-06-07
CN103582962B (en)	2017-03-22
KR20210136146A (en)	2021-11-16
EP2612380A2 (en)	2013-07-10
WO2012031096A2 (en)	2012-03-08
KR102030331B1 (en)	2019-10-10
KR102156532B1 (en)	2020-09-16
CN103582962A (en)	2014-02-12
KR102321916B1 (en)	2021-11-05
KR20130108575A (en)	2013-10-04

Publication	Publication Date	Title
EP2612380A4 (en)	2015-01-14	LIGHT EMITTING APPARATUS, ENERGY GENERATOR OR OTHER ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME
EP2660884A4 (en)	2015-04-15	LIGHT EMITTING APPARATUS AND METHOD FOR MANUFACTURING THE SAME
EP2560219A4 (en)	2014-11-26	LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP2523228A4 (en)	2014-07-02	LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME
EP2475013A4 (en)	2013-10-16	SOLAR ENERGY GENERATING APPARATUS AND METHOD FOR MANUFACTURING THE SAME
EP2656402A4 (en)	2014-07-09	ELECTROLUMINESCENT DIODE CHIP AND METHOD FOR MANUFACTURING THE SAME
EP2757600A4 (en)	2015-02-25	LIGHT EMITTING APPARATUS AND METHOD FOR MANUFACTURING THE SAME
EP2645432A4 (en)	2014-07-30	LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP2892103A4 (en)	2016-07-20	ELECTRIC POWER STORAGE DEVICE AND METHOD FOR PRODUCING THE SAME
EP2490269A4 (en)	2014-07-30	LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP2573931A4 (en)	2014-03-26	ENERGY PRODUCTION ELEMENT AND ENERGY GENERATING APPARATUS EQUIPPED WITH THE POWER GENERATING ELEMENT
EP2858134A4 (en)	2016-04-20	METHOD FOR MANUFACTURING THERMOELECTRIC CONVERTER, METHOD FOR MANUFACTURING ELECTRONIC DEVICE EQUIPPED WITH THERMOELECTRIC CONVERTER, AND THERMOELECTRIC CONVERTER
EP2280426A4 (en)	2014-03-19	LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP2641391A4 (en)	2015-06-17	SHOOTING APPARATUS MODULE AND METHOD FOR MANUFACTURING SAME
EP2549528A4 (en)	2014-04-02	COMPOSITE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP2439788A4 (en)	2014-01-08	PHOTOVOLTAIC GENERATOR AND METHOD FOR MANUFACTURING THE SAME
EP2816622A4 (en)	2015-04-29	LIGHT EMITTING APPARATUS AND METHOD FOR MANUFACTURING THE SAME
BR112012025660A2 (en)	2016-06-28	light emitting device and method of manufacturing the light emitting device
EP2682669A4 (en)	2014-09-17	LINEAR LIGHT IRRADIATION DEVICE, AND METHOD FOR MANUFACTURING THE SAME
EP2535954A4 (en)	2015-04-15	LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE
EP2579338A4 (en)	2014-08-13	LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP2548588A4 (en)	2015-01-14	THREE-DIMENSIONAL ARTIFICIAL TUTOR AND METHOD FOR MANUFACTURING THE SAME
EP2525086A4 (en)	2014-07-23	APPARATUS FOR GENERATING WIND POWER AND ITS ACTUATION METHOD
EP2210287A4 (en)	2015-09-02	LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP2693841A4 (en)	2014-10-22	ORGANIC ELECTROLUMINESCENCE DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ORGANIC ELECTROLUMINESCENCE LIGHTING DEVICE

Legal Events

Date	Code	Title	Description
2013-06-07	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text:ORIGINAL CODE: 0009012
2013-07-10	AK	Designated contracting states	Kind code of ref document:A2 Designated state(s):AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2013-07-10	AX	Request for extension of the european patent	Extension state:BA ME
2013-08-07	RIN1	Information on inventor provided before grant (corrected)	Inventor name:RAY, WILLIAM, JOHNSTONE Inventor name:ORAW, BRAD Inventor name:LEWANDOWSKI, MARK, ALLAN Inventor name:LOWENTHAL, MARK, D. Inventor name:BLANCHARD, RICHARD, A. Inventor name:SHOTTON, NEIL, O. Inventor name:PEROZZIELLO, ERIC, ANTHONY Inventor name:BALDRIDGE, JEFFREY
2013-12-11	DAX	Request for extension of the european patent (deleted)
2014-04-23	R17D	Deferred search report published (corrected)	Effective date:20140320
2014-10-29	17P	Request for examination filed	Effective date:20140918
2014-10-29	RBV	Designated contracting states (corrected)	Designated state(s):AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2015-01-14	A4	Supplementary search report drawn up and despatched	Effective date:20141211
2015-01-14	RIC1	Information provided on ipc code assigned before grant	Ipc:H01L 25/075 20060101ALI20141205BHEP Ipc:H01L 33/38 20100101ALI20141205BHEP Ipc:H01L 25/00 20060101ALI20141205BHEP Ipc:C09D 11/00 20140101AFI20141205BHEP Ipc:H01L 33/20 20100101ALI20141205BHEP
2017-07-26	17Q	First examination report despatched	Effective date:20170627
2018-03-09	STAA	Information on the status of an ep patent application or granted ep patent	Free format text:STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
2018-04-11	18D	Application deemed to be withdrawn	Effective date:20171108

Movatterモバイル変換