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EP2044629A4 - CAMERA SYSTEM AND RELATED METHODS - Google Patents

CAMERA SYSTEM AND RELATED METHODS

Info

Publication number
EP2044629A4
EP2044629A4EP07796897AEP07796897AEP2044629A4EP 2044629 A4EP2044629 A4EP 2044629A4EP 07796897 AEP07796897 AEP 07796897AEP 07796897 AEP07796897 AEP 07796897AEP 2044629 A4EP2044629 A4EP 2044629A4
Authority
EP
European Patent Office
Prior art keywords
camera system
related methods
methods
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07796897A
Other languages
German (de)
French (fr)
Other versions
EP2044629A2 (en
Inventor
Michael R Feldman
James E Morris
Robert D Tekolste
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Flir Systems Trading Belgium BVBA
Original Assignee
DigitalOptics Corp East
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/487,580external-prioritypatent/US8049806B2/en
Application filed by DigitalOptics Corp EastfiledCriticalDigitalOptics Corp East
Publication of EP2044629A2publicationCriticalpatent/EP2044629A2/en
Publication of EP2044629A4publicationCriticalpatent/EP2044629A4/en
Withdrawnlegal-statusCriticalCurrent

Links

Classifications

Landscapes

EP07796897A2006-07-172007-07-17 CAMERA SYSTEM AND RELATED METHODSWithdrawnEP2044629A4 (en)

Applications Claiming Priority (3)

Application NumberPriority DateFiling DateTitle
US11/487,580US8049806B2 (en)2004-09-272006-07-17Thin camera and associated methods
US85536506P2006-10-312006-10-31
PCT/US2007/016156WO2008011003A2 (en)2006-07-172007-07-17Camera system and associated methods

Publications (2)

Publication NumberPublication Date
EP2044629A2 EP2044629A2 (en)2009-04-08
EP2044629A4true EP2044629A4 (en)2012-08-01

Family

ID=38957311

Family Applications (1)

Application NumberTitlePriority DateFiling Date
EP07796897AWithdrawnEP2044629A4 (en)2006-07-172007-07-17 CAMERA SYSTEM AND RELATED METHODS

Country Status (5)

CountryLink
EP (1)EP2044629A4 (en)
JP (2)JP5292291B2 (en)
KR (1)KR101185881B1 (en)
CN (1)CN101512768B (en)
WO (1)WO2008011003A2 (en)

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WO2009104669A1 (en)2008-02-202009-08-27コニカミノルタオプト株式会社Imaging lens, imaging apparatus, portable terminal, and method for producing imaging lens
US9118825B2 (en)2008-02-222015-08-25Nan Chang O-Film Optoelectronics Technology Ltd.Attachment of wafer level optics
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US9419032B2 (en)2009-08-142016-08-16Nanchang O-Film Optoelectronics Technology LtdWafer level camera module with molded housing and method of manufacturing
TW201109165A (en)2009-09-112011-03-16E Pin Optical Industry Co LtdStacked disk-shaped optical lens array, stacked disk-shaped lens module array and the method of manufacturing thereof
US8305699B2 (en)2009-09-232012-11-06Samsung Electronics Co., Ltd.Wafer-level lens module with extended depth of field and imaging device including the wafer-level lens module
JP2011085625A (en)*2009-10-132011-04-28Toppan Printing Co LtdCamera module and method for manufacturing the same
JP5556140B2 (en)*2009-11-202014-07-23凸版印刷株式会社 Camera module and manufacturing method thereof
CN103201838A (en)*2010-06-142013-07-10赫普塔冈微光学有限公司Method of manufacturing a plurality of optical devices
NL2005164C2 (en)2010-07-282012-01-31Anteryon Internat B V OPTICAL UNIT.
FR2966936B1 (en)*2010-11-022012-12-07Commissariat Energie Atomique OPTICAL IMAGING SYSTEM FOR A CONCAVE SPHERICAL SURFACE
CN102478695B (en)*2010-11-252016-05-11鸿富锦精密工业(深圳)有限公司Lens module array, manufacture method and camera lens
US9910239B2 (en)*2010-11-302018-03-06Flir Systems Trading Belgium BvbaWafer level optical elements and applications thereof
KR101262470B1 (en)*2011-01-312013-05-08엘지이노텍 주식회사Lens assembly and camera module
NL2006373C2 (en)2011-03-112012-09-17Anteryon Internat B V OPTICAL UNIT.
US8345360B2 (en)*2011-06-032013-01-01Visera Technologies Company LimitedCamera unit and macro lens thereof
WO2012173252A1 (en)*2011-06-172012-12-20コニカミノルタアドバンストレイヤー株式会社Method for manufacturing wafer lens, wafer lens, method for manufacturing lens unit, and lens unit
JP2013007969A (en)*2011-06-272013-01-10Sharp CorpImaging lens, lens array, imaging lens producing method, and imaging module
US20130122247A1 (en)*2011-11-102013-05-16Omnivision Technologies, Inc.Spacer Wafer For Wafer-Level Camera And Method For Manufacturing Same
JP5469235B2 (en)*2012-12-202014-04-16オリンパス株式会社 Lens module manufacturing method
SG11201606706WA (en)*2014-02-182016-09-29Heptagon Micro Optics Pte LtdOptical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
CN106164731B (en)*2014-04-042019-08-20夏普株式会社 Lens Elements and Cameras
US20160307881A1 (en)*2015-04-202016-10-20Advanced Semiconductor Engineering, Inc.Optical sensor module and method for manufacturing the same
US9829698B2 (en)2015-08-312017-11-28Panasonic CorporationEndoscope
JP6744119B2 (en)*2016-04-052020-08-19パナソニックi−PROセンシングソリューションズ株式会社 Endoscope
US9778443B2 (en)*2015-10-052017-10-03Omnivision Technologies, Inc.Three-surface wide field-of-view lens system
KR101701060B1 (en)*2015-11-032017-01-31삼성전기주식회사Camera module
US10677964B2 (en)2017-10-232020-06-09Omnivision Technologies, Inc.Lens wafer assembly and associated method for manufacturing a stepped spacer wafer
US11311187B2 (en)2018-04-062022-04-26Amo Development, LlcMethods and systems for corneal topography with in-focus scleral imaging
KR102555577B1 (en)*2019-01-282023-07-18삼성전자주식회사Electronic module including camera module

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WO2001091193A2 (en)*2000-05-232001-11-29Atmel CorporationIntegrated ic chip package for electronic image sensor die
EP1239519A2 (en)*2001-03-052002-09-11Canon Kabushiki KaishaImage pickup model and image pickup device
US20040047274A1 (en)*2002-06-272004-03-11Olumpus Optical Co., Ltd.Image pickup lens unit and image pickup device
WO2004027880A2 (en)*2002-09-172004-04-01Koninklijke Philips Electronics N.V.Camera device, method of manufacturing a camera device, wafer scale package
US20050285016A1 (en)*2004-06-292005-12-29Yung-Cheol KongImage sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure
US20060043262A1 (en)*2004-08-302006-03-02Micron Technology, Inc.Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers

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US7262799B2 (en)2000-10-252007-08-28Canon Kabushiki KaishaImage sensing apparatus and its control method, control program, and storage medium
US6635941B2 (en)2001-03-212003-10-21Canon Kabushiki KaishaStructure of semiconductor device with improved reliability
JP4506083B2 (en)*2002-03-252010-07-21コニカミノルタホールディングス株式会社 Imaging lens, imaging device including the same, imaging unit, and portable terminal including imaging unit
JP4030048B2 (en)*2002-03-282008-01-09シチズン電子株式会社 Small imaging module
JP2005198103A (en)*2004-01-082005-07-21Inter Action Corp Camera module assembling apparatus and assembling method
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JP2006080597A (en)*2004-09-072006-03-23Canon Inc Imaging module and imaging module manufacturing method
JP2006081043A (en)*2004-09-132006-03-23Seiko Precision IncSolid state imaging apparatus and electronic apparatus comprising the same
JP2008035047A (en)*2006-07-272008-02-14Matsushita Electric Ind Co Ltd Camera parts, camera, and method of manufacturing camera parts

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
WO2001091193A2 (en)*2000-05-232001-11-29Atmel CorporationIntegrated ic chip package for electronic image sensor die
EP1239519A2 (en)*2001-03-052002-09-11Canon Kabushiki KaishaImage pickup model and image pickup device
US20040047274A1 (en)*2002-06-272004-03-11Olumpus Optical Co., Ltd.Image pickup lens unit and image pickup device
WO2004027880A2 (en)*2002-09-172004-04-01Koninklijke Philips Electronics N.V.Camera device, method of manufacturing a camera device, wafer scale package
US20050285016A1 (en)*2004-06-292005-12-29Yung-Cheol KongImage sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure
US20060043262A1 (en)*2004-08-302006-03-02Micron Technology, Inc.Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references ofWO2008011003A2*

Also Published As

Publication numberPublication date
KR20090034981A (en)2009-04-08
JP2013153537A (en)2013-08-08
KR101185881B1 (en)2012-09-25
JP5292291B2 (en)2013-09-18
WO2008011003A3 (en)2008-06-26
JP2009544226A (en)2009-12-10
EP2044629A2 (en)2009-04-08
CN101512768A (en)2009-08-19
JP5372280B2 (en)2013-12-18
WO2008011003A2 (en)2008-01-24
CN101512768B (en)2012-11-21

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Legal Events

DateCodeTitleDescription
PUAIPublic reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text:ORIGINAL CODE: 0009012

17PRequest for examination filed

Effective date:20090217

AKDesignated contracting states

Kind code of ref document:A2

Designated state(s):AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

AXRequest for extension of the european patent

Extension state:AL BA HR MK RS

DAXRequest for extension of the european patent (deleted)
RAP1Party data changed (applicant data changed or rights of an application transferred)

Owner name:DIGITALOPTICS CORPORATION EAST

A4Supplementary search report drawn up and despatched

Effective date:20120704

RIC1Information provided on ipc code assigned before grant

Ipc:H01L 27/146 20060101ALI20120628BHEP

Ipc:H04N 5/225 20060101ALI20120628BHEP

Ipc:H01L 27/148 20060101AFI20120628BHEP

17QFirst examination report despatched

Effective date:20130403

RAP1Party data changed (applicant data changed or rights of an application transferred)

Owner name:FLIR SYSTEMS TRADING BELGIUM BVBA

STAAInformation on the status of an ep patent application or granted ep patent

Free format text:STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18DApplication deemed to be withdrawn

Effective date:20170110


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