DK0841167T3 - Process for making through-hole and using said method for making a silicon substrate having a through-hole, and a device using such a substrate, method for making ..... - Google Patents

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1996-11-11

Filing date

1997-11-10

Publication date

2005-01-24

1997-11-10Application filed by Canon KkfiledCriticalCanon Kk

2005-01-24Application grantedgrantedCritical

2005-01-24Publication of DK0841167T3publicationCriticalpatent/DK0841167T3/en

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/13—Heads having an integrated circuit

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Weting (AREA)
Pressure Sensors (AREA)
Particle Formation And Scattering Control In Inkjet Printers (AREA)
Micromachines (AREA)

DK97119648T1996-11-111997-11-10 Process for making through-hole and using said method for making a silicon substrate having a through-hole, and a device using such a substrate, method for making .....DK0841167T3 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP29864296		1996-11-11
JP29864396		1996-11-11

Publications (1)

Publication Number	Publication Date
DK0841167T3true DK0841167T3 (en)	2005-01-24

Family

ID=26561605

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DK97119648TDK0841167T3 (en)	1996-11-11	1997-11-10	Process for making through-hole and using said method for making a silicon substrate having a through-hole, and a device using such a substrate, method for making .....

Country Status (3)

Country	Link
EP (1)	EP0841167B1 (en)
DE (1)	DE69730667T2 (en)
DK (1)	DK0841167T3 (en)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6336714B1 (en)	1996-02-07	2002-01-08	Hewlett-Packard Company	Fully integrated thermal inkjet printhead having thin film layer shelf
US6273557B1 (en)	1998-03-02	2001-08-14	Hewlett-Packard Company	Micromachined ink feed channels for an inkjet printhead
US6379571B1 (en)*	1998-06-11	2002-04-30	Canon Kabushiki Kaisha	Etching method for processing substrate, dry etching method for polyetheramide resin layer, production method of ink-jet printing head, ink-jet head and ink-jet printing apparatus
RU2144472C1 (en)*	1998-11-03	2000-01-20	Самсунг Электроникс Ко., Лтд.	Method for creating thick-film layer in microinjection device
RU2144471C1 (en)*	1998-11-03	2000-01-20	Самсунг Электроникс Ко., Лтд.	Method and device for assembling of microinjector
RU2151066C1 (en)*	1998-11-03	2000-06-20	Самсунг Электроникс Ко., Лтд.	Microinjector nozzle plate assembly and method for its manufacture
RU2144470C1 (en)*	1998-11-03	2000-01-20	Самсунг Электроникс Ко., Лтд.	Microinjector and method for its manufacture
JP4690556B2 (en)*	2000-07-21	2011-06-01	大日本印刷株式会社	Fine pattern forming apparatus and fine nozzle manufacturing method
IT1320599B1 (en)*	2000-08-23	2003-12-10	Olivetti Lexikon Spa	MONOLITHIC PRINT HEAD WITH SELF-ALIGNED GROOVING AND RELATIVE MANUFACTURING PROCESS.
US6675476B2 (en)	2000-12-05	2004-01-13	Hewlett-Packard Development Company, L.P.	Slotted substrates and techniques for forming same
US6419346B1 (en)	2001-01-25	2002-07-16	Hewlett-Packard Company	Two-step trench etch for a fully integrated thermal inkjet printhead
US6481832B2 (en)	2001-01-29	2002-11-19	Hewlett-Packard Company	Fluid-jet ejection device
US6517735B2 (en)	2001-03-15	2003-02-11	Hewlett-Packard Company	Ink feed trench etch technique for a fully integrated thermal inkjet printhead
US6818138B2 (en)*	2001-06-22	2004-11-16	Hewlett-Packard Development Company, L.P.	Slotted substrate and slotting process
ES2290220T3 (en)	2001-08-10	2008-02-16	Canon Kabushiki Kaisha	METHOD FOR MANUFACTURING A LIQUID DISCHARGE HEAD, HEAD SUBSTRATE FOR LIQUID DISCHARGE AND METHOD FOR MANUFACTURING.
ITTO20011019A1 (en)	2001-10-25	2003-04-28	Olivetti I Jet	PERFECT PROCEDURE FOR THE CONSTRUCTION OF A SUPPLY DUCT FOR AN INK JET PRINT HEAD.
US7105097B2 (en)	2002-01-31	2006-09-12	Hewlett-Packard Development Company, L.P.	Substrate and method of forming substrate for fluid ejection device
US6648454B1 (en)	2002-10-30	2003-11-18	Hewlett-Packard Development Company, L.P.	Slotted substrate and method of making
US6880926B2 (en)	2002-10-31	2005-04-19	Hewlett-Packard Development Company, L.P.	Circulation through compound slots
CN100355573C (en)	2002-12-27	2007-12-19	佳能株式会社	Ink-jet recording head and mfg. method, and substrate for mfg. ink-jet recording head
US6821450B2 (en)	2003-01-21	2004-11-23	Hewlett-Packard Development Company, L.P.	Substrate and method of forming substrate for fluid ejection device
US6883903B2 (en)	2003-01-21	2005-04-26	Martha A. Truninger	Flextensional transducer and method of forming flextensional transducer
KR100480791B1 (en)	2003-06-05	2005-04-06	삼성전자주식회사	Monolithic ink jet printhead and method of manufacturing thereof
JP2005035281A (en)*	2003-06-23	2005-02-10	Canon Inc	Method for manufacturing liquid discharge head
US7429335B2 (en)	2004-04-29	2008-09-30	Shen Buswell	Substrate passage formation
DE102005046156B3 (en)*	2005-09-27	2007-05-31	Siemens Ag	Device with functional element and method for manufacturing the device
JP4144640B2 (en)*	2006-10-13	2008-09-03	オムロン株式会社	Method for manufacturing vibration sensor
DE102007031549B4 (en)	2007-07-06	2021-07-08	Robert Bosch Gmbh	Single crystal silicon device and method of making a single crystal silicon device
CN101873935A (en)*	2007-11-24	2010-10-27	惠普开发有限公司	Inkjet-printing device printhead die with edge protection layer for heating resistor
US9136160B2 (en)	2012-06-29	2015-09-15	Institute of Microelectronics, Chinese Academy of Sciences	Solid hole array and method for forming the same
CN103510088B (en)*	2012-06-29	2015-11-11	中国科学院微电子研究所	Solid-state hole array and manufacturing method thereof
CN103281661B (en)*	2013-05-09	2019-02-05	上海集成电路研发中心有限公司	A kind of MEMS microphone structure and its manufacturing method
JP2023108679A (en)*	2022-01-26	2023-08-07	キヤノン株式会社	Recording element substrate and manufacturing method for the same
CN120315166B (en)*	2025-06-17	2025-08-22	中科院南京天文仪器有限公司	MEMS deformable mirror based on double-layer electrode collaborative etching and preparation method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4784721A (en)*	1988-02-22	1988-11-15	Honeywell Inc.	Integrated thin-film diaphragm; backside etch
US5387314A (en)*	1993-01-25	1995-02-07	Hewlett-Packard Company	Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining
US5308442A (en)*	1993-01-25	1994-05-03	Hewlett-Packard Company	Anisotropically etched ink fill slots in silicon
JP3343875B2 (en)*	1995-06-30	2002-11-11	キヤノン株式会社	Method of manufacturing inkjet head

1997
- 1997-11-10DKDK97119648Tpatent/DK0841167T3/enactive
- 1997-11-10DEDE69730667Tpatent/DE69730667T2/ennot_activeExpired - Lifetime
- 1997-11-10EPEP19970119648patent/EP0841167B1/ennot_activeExpired - Lifetime

Also Published As

Publication number	Publication date
DE69730667T2 (en)	2005-09-22
DE69730667D1 (en)	2004-10-21
EP0841167B1 (en)	2004-09-15
EP0841167A2 (en)	1998-05-13
EP0841167A3 (en)	2000-03-08

Publication	Publication Date	Title
DK0841167T3 (en)	2005-01-24	Process for making through-hole and using said method for making a silicon substrate having a through-hole, and a device using such a substrate, method for making .....
DK93895A (en)	1996-02-25	Coated substrate and process for making the same
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DE69722296D1 (en)	2003-07-03	Substrate on which bumps are formed and manufacturing process
NO901603D0 (en)	1990-04-09	IMPRESSED SUBSTRATE FOR POLISHING AND CLEANING.
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NO992124D0 (en)	1999-04-30	Apparatus comprising electronic and / or optoelectronic circuits and method for realizing the circuits
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