Movatterモバイル変換

[0]ホーム
URL:

DE60040685D1 - IC HOUSING - Google Patents

IC HOUSING

Info

Publication number
DE60040685D1
DE60040685D1DE60040685TDE60040685TDE60040685D1DE 60040685 D1DE60040685 D1DE 60040685D1DE 60040685 TDE60040685 TDE 60040685TDE 60040685 TDE60040685 TDE 60040685TDE 60040685 D1DE60040685 D1DE 60040685D1
Authority
DE
Germany
Prior art keywords
substrate
integrated circuit
conductive layers
circuit package
vias
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60040685T
Other languages
German (de)
Inventor
Bob Sankman
Hamid Azimi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel CorpfiledCriticalIntel Corp
Application grantedgrantedCritical
Publication of DE60040685D1publicationCriticalpatent/DE60040685D1/en
Anticipated expirationlegal-statusCritical
Expired - Lifetimelegal-statusCriticalCurrent

Links

Classifications

Landscapes

Abstract

An integrated circuit package is provided that includes a multi-layer organic substrate. The substrate has conductive vias provided between isolated conductive layers. The vias are formed using a laser to cut through a dielectric layer separating the conductive layers. External interconnects in the form of T-shaped pins are soldered to the substrate of the integrated circuit package. An integrated circuit can be attached to the substrate using a flip-chip technique.
DE60040685T1999-12-022000-12-04 IC HOUSINGExpired - LifetimeDE60040685D1 (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
US09/453,007US6430058B1 (en)1999-12-021999-12-02Integrated circuit package
PCT/US2000/032904WO2001041212A2 (en)1999-12-022000-12-04Integrated circuit package

Publications (1)

Publication NumberPublication Date
DE60040685D1true DE60040685D1 (en)2008-12-11

Family

ID=23798861

Family Applications (1)

Application NumberTitlePriority DateFiling Date
DE60040685TExpired - LifetimeDE60040685D1 (en)1999-12-022000-12-04 IC HOUSING

Country Status (11)

CountryLink
US (1)US6430058B1 (en)
EP (1)EP1240667B1 (en)
JP (2)JP2003515955A (en)
KR (2)KR20060100479A (en)
CN (1)CN100385655C (en)
AT (1)ATE412974T1 (en)
AU (1)AU2059501A (en)
DE (1)DE60040685D1 (en)
HK (1)HK1046470B (en)
MY (1)MY119884A (en)
WO (1)WO2001041212A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US6690580B1 (en)*2002-03-072004-02-10Amd, Inc.Integrated circuit structure with dielectric islands in metallized regions
US20040107569A1 (en)*2002-12-052004-06-10John GuzekMetal core substrate packaging
US7132743B2 (en)*2003-12-232006-11-07Intel CorporationIntegrated circuit package substrate having a thin film capacitor structure
US7492570B2 (en)*2005-04-132009-02-17Kabushiki Kaisha ToshibaSystems and methods for reducing simultaneous switching noise in an integrated circuit
WO2006127436A1 (en)*2005-05-202006-11-30Electro Scientific Industries, Inc.Method of forming passive electronic components on a substrate by direct write technique using shaped uniform laser beam
KR100771359B1 (en)2006-10-312007-10-29삼성전기주식회사 Substrate with Core Stiffener
US8637987B2 (en)2011-08-092014-01-28Micron Technology, Inc.Semiconductor assemblies with multi-level substrates and associated methods of manufacturing
US9368437B2 (en)2011-12-312016-06-14Intel CorporationHigh density package interconnects
WO2013101241A1 (en)2011-12-312013-07-04Intel CorporationOrganic thin film passivation of metal interconnections
US10485111B2 (en)2017-07-122019-11-19Globalfoundries Inc.Via and skip via structures
US10199261B1 (en)2017-07-192019-02-05Globalfoundries Inc.Via and skip via structures
US10586012B2 (en)*2018-04-252020-03-10International Business Machines CorporationSemiconductor process modeling to enable skip via in place and route flow
US10978388B2 (en)2018-10-082021-04-13International Business Machines CorporationSkip via for metal interconnects
CN114285387B (en)*2021-12-092023-05-09电子科技大学 A kind of small LC filter and its preparation method

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4634041A (en)1984-06-291987-01-06International Business Machines CorporationProcess for bonding current carrying elements to a substrate in an electronic system, and structures thereof
JPH0634452B2 (en)*1985-08-051994-05-02株式会社日立製作所 Ceramic circuit board
JPS62287658A (en)*1986-06-061987-12-14Hitachi Ltd ceramic multilayer circuit board
US4970570A (en)1986-10-281990-11-13International Business Machines CorporationUse of tapered head pin design to improve the stress distribution in the braze joint
JPH02260599A (en)1989-03-311990-10-23Mitsumi Electric Co LtdManufacture of multilayer board
US5175609A (en)1991-04-101992-12-29International Business Machines CorporationStructure and method for corrosion and stress-resistant interconnecting metallurgy
US6077725A (en)1992-09-032000-06-20Lucent Technologies IncMethod for assembling multichip modules
JP2716336B2 (en)1993-03-101998-02-18日本電気株式会社 Integrated circuit device
US5397598A (en)1993-11-121995-03-14International Business Machines CorporationMethod for selectively coating a member having a shank by masking a portion of the shank with a washer
JPH08181450A (en)1994-12-221996-07-12Hitachi Ltd Electronic circuit board and manufacturing method thereof
WO1998011605A1 (en)1995-06-191998-03-19Ibiden Co., Ltd.Circuit board for mounting electronic parts
US5718367A (en)1995-11-211998-02-17International Business Machines CorporationMold transfer apparatus and method
TW331698B (en)*1996-06-181998-05-11Hitachi Chemical Co LtdMulti-layered printed circuit board
JP3235490B2 (en)1996-11-132001-12-04日立エーアイシー株式会社 Manufacturing method of multilayer printed wiring board
JP2994295B2 (en)1997-01-141999-12-27日本アビオニクス株式会社 Build-up printed wiring board and method of manufacturing the same
US5786238A (en)*1997-02-131998-07-28Generyal Dynamics Information Systems, Inc.Laminated multilayer substrates
JP3340350B2 (en)1997-04-182002-11-05富士通株式会社 Thin film multilayer substrate and electronic device
US6136623A (en)*1998-05-062000-10-24Xerox CorporationMultiple wavelength laser arrays by flip-chip bonding

Also Published As

Publication numberPublication date
KR20060100479A (en)2006-09-20
WO2001041212A2 (en)2001-06-07
HK1046470B (en)2009-04-09
US6430058B1 (en)2002-08-06
JP2004349714A (en)2004-12-09
EP1240667B1 (en)2008-10-29
KR20020056956A (en)2002-07-10
AU2059501A (en)2001-06-12
MY119884A (en)2005-07-29
ATE412974T1 (en)2008-11-15
CN1433574A (en)2003-07-30
KR100635408B1 (en)2006-10-19
JP2003515955A (en)2003-05-07
EP1240667A2 (en)2002-09-18
WO2001041212A3 (en)2001-12-13
HK1046470A1 (en)2003-01-10
CN100385655C (en)2008-04-30

Similar Documents

PublicationPublication DateTitle
TWI267180B (en)Multi-chip electronic package having laminate carrier and method of making same
ATE412974T1 (en) IC HOUSING
TW200511612A (en)Mount for semiconductor light emitting device
TW200511534A (en)Tape circuit substrate and semiconductor chip package using the same
TW200507131A (en)Multi-layer circuit board for electronic device
WO2003069695A3 (en)Multilayer package for a semiconductor device
TW200507218A (en)Layout circuit substrate, manufacturing method of layout circuit substrate, and circuit module
JP2005501415A5 (en)
FR2840711B1 (en) INTEGRATED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
FI20030493A0 (en) Procedure for manufacturing an electronics module and an electronics module
KR102194718B1 (en)Embedded board and method of manufacturing the same
CN108780791A (en)Semiconductor device, electronic module, electronic equipment and the method for producing semiconductor device
TW200727499A (en)Multi-chip build-up package of an optoelectronic chip and method for fabricating the same
KR930001361A (en) Flip Chip Mounting and Wiring Packages and Methods
MY140754A (en)Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof
JP2005026263A (en)Hybrid integrated circuit
TW200420203A (en)Multilayer board and its manufacturing method
TW200620585A (en)Semiconductor package structure and method for fabricating the same
FR2557755B1 (en) MULTI-LAYER WIRING SUBSTRATE
MY123561A (en)Integrated circuit structure.
TW200706085A (en)Circuit board structure and method for fabricating the same
CN104716057B (en)Integrated circuit package system and its manufacturing method with built in items
MY139629A (en)Method for fabricating semiconductor component
JPS56161696A (en)Board
JP2007305692A (en)Electronic component, method for manufacturing the same, substrate including built-in electronic component, and method for manufacturing the same

Legal Events

DateCodeTitleDescription
8364No opposition during term of opposition
[8]ページ先頭
©2009-2025 Movatter.jp