DieErfindung betrifft ein technisches Stabendoskop, speziell ein Stabendoskopzur Inspektion von Lötprozessenund Verlötungenelektronischer Bauelemente auf Leiterplatinen. Die rasant fortschreitendeKomplexitätsolcher elektronischer Bauelemente bedingt deren zunehmend steigendeHerstellungskosten. Bei der Bestückungeinzelner Platinen mit mehreren solcher Bauelemente lohnt es sich beiAusfall eines dieser Bauelemente, ein ausgefallenes Bauelement vonder Platine auszulötenund anschließendein neues Bauelement einzulöten.TheThe invention relates to a technical rod endoscope, especially a rod endoscopefor inspection of soldering processesand solderingselectronic components on printed circuit boards. The rapidly advancingcomplexitySuch electronic components causes their increasingly increasingProduction costs. In the assemblySingle boards with several such components are worthwhileFailure of one of these components, a failed component ofto solder the boardand subsequentlyto solder in a new component.
Problematischbei solchen Reparaturlötungensind die erforderlichen hohen Temperaturen. Dies trifft insbesonderebei Verwendung der neuen bleifreien Lote zu. Die erforderlichenhohen Löttemperaturensind jedoch sowohl fürdie Bauelemente als auch fürdie Platinen, die in aller Regel selbst mehrschichtig aufgebautsind, extrem belastend. Zu hohe Temperaturen, die auf solche Struktureneinwirken, führenzu Aufwölbungenund Verwerfungen sowohl in den Bauelementen als auch der Platine,und zwar aufgrund der unterschiedlichen Wärmeausdehnungskoeffizientender miteinander im Verbund verwendeten Werkstoffe. Die für das Umlöten aufzuwendendenTemperatur-Zeit-Profile müssendaher sehr genau auf den schmalen Arbeitsbereich zwischen der zumfehlerfreien Entlötenund Verlötenerforderlichen hohen Temperatur und der den Schichtstrukturen maximalzuträglichenTemperaturen eingestellt werden.Problematicin such repair brazingare the required high temperatures. This is especially truewhen using the new lead-free solders. The necessaryhigh soldering temperaturesHowever, both are forthe components as well forthe boards, which are usually self-layeredare, extremely stressful. Too high temperatures on such structuresact, leadto bulgesand distortions in both the components and the board,because of the different thermal expansion coefficientsthe materials used together in a composite. The expendable for the re-solderingTemperature-time profiles needtherefore very close to the narrow work area between theerror-free desolderingand solderingrequired high temperature and the layer structures maximumwholesomeTemperatures are set.
Diefür solcheReparaturlötungenerforderliche Wärmewird heute überwiegenddurch Heißgashaubenzugeführt,die überdie auszulötendenoder einzulötendenBauteile gestülptwerden. Dabei erfolgt die exakte Positionierung der Hauben in derRegel mittels eines zentralen und mit Unterdruck beaufschlagtenAnsaugverbinders, der die Heißgashaube inexakt definierter Position auf dem einzulötenden oder auszulötenden Bauteilfixiert. Diese Positionierung erfolgt in der Weise, dass der zurPlatinenoberflächeplanparallel ausgerichtete untere Umfassungsrand der Heißgashaubeeinen Abstand zur Platinenoberflächeeinhält,der im Größenordnungsbereichvon ungefähreinem Millimeter liegt. Zusätzlich wirddie Reparaturbaugruppe von unterhalb der Platine vollflächig miteinem IR-Wärmestrahlererhitzt.Thefor suchReparaturlötungenrequired heatbecomes prevalent todayby hot gas hoodssuppliedthe abovethe ones to be killedor to be killedSlipped componentsbecome. The exact positioning of the hoods takes place in theUsually by means of a central and acted upon by negative pressureAnsaugverbinders, the hot gas hood inexactly defined position on the component to be soldered or solderedfixed. This positioning is done in such a way that theplatinum surfaceplane-parallel aligned lower peripheral edge of the hot gas hooda distance to the board surfacecomply,the order of magnitudeof aboutone millimeter lies. In addition willthe repair assembly from below the board with all overan IR heat radiatorheated.
Umin dieser Umgebung die fürdie Lötprozesseerforderlichen Zeit-Temperatur-Profile optimieren und einhaltenzu können,aber auch um die einzelnen Lötstadienauch unmittelbar verfolgen zu können,werden, soweit möglich,technische Endoskope zur unmittelbaren optischen Inspektion derLötprozesseeingesetzt. Ein solcher Einsatz von herkömmlichen Endoskopen ist jedochaufgrund der hohen Temperaturen des unter der Löthaube austretenden Heißgases nurdort möglich,wo die Platinen nicht all zu dicht bestückt sind und einen relativgroßenAbstand zwischen der Löthaubeund dem Endoskop einzuhalten ermöglichen.Die bekannten, üblicherweisesenkrecht zur Platinenoberflächeangesetzten Endoskope, die sich bei diesen Einsätzen auf bis zu 100°C und darüber erwärmen, sindhier, wie die Praxis zeigt, schnell an die Grenzen ihrer Leistungsfähigkeitgelangt.Aroundin this environment the forthe soldering processesOptimize and maintain required time-temperature profilesto be able tobut also around the individual soldering stagesto be able to follow directlybe, as far as possible,technical endoscopes for direct optical inspection of thesoldering processesused. However, such use of conventional endoscopes isdue to the high temperatures of the hot gas escaping from the topping cap onlypossible there,where the boards are not too densely populated and a relativehugeDistance between the soldering domeand allow the endoscope to comply.The well-known, usuallyperpendicular to the board surfaceattached endoscopes, which heat up to 100 ° C and above in these applicationsHere, as the practice shows, quickly reaching the limits of their performancearrives.
Ausgehendvon diesem Stand der Technik liegt der Erfindung die Aufgabe zugrunde,ein Stabendoskop fürtechnische Zwecke zu schaffen, das einen Einsatz auch in unmittelbarerNähe heißer Objekte,speziell zur unmittelbaren Beobachtung von Heißgas-Lötungen und Heißgas-Entlötungen,ermöglicht.outgoingFrom this prior art, the invention is based on the objecta staff endoscope forTo create technical purposes, the use also in the immediateNear hot objects,especially for direct observation of hot gas soldering and hot gas desoldering,allows.
DieErfindung löstdiese Aufgabe durch ein Stabendoskop für technische Zwecke, das dieim Anspruch 1 genannten Merkmale aufweist.TheInvention solvesthis task by a rod endoscope for technical purposes, which theHaving mentioned in claim 1 features.
EinAusführungsbeispielder Erfindung ist in der
Dasgezeigte Endoskop besteht aus drei ineinanderliegend und zueinanderkoaxial ausgerichteten Rohren, nämlicheinem Innenrohr
ImInnenrohr
Imeinblickseitigen Randbereich des Außenrohres
DieBeleuchtungs-Faserlichtleiterbündel
Diebeiden stirnseitigen Radialverschlüsse
DasKühlmittelfluidist übereinen Einlassanschluss
Dasin den Ringraum des Zwischenrohres
DasKühlmittelfluidkann dann übereinen im Kopfbereich des Außenrohres
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| DE200520017518DE202005017518U1 (en) | 2005-11-04 | 2005-11-04 | Tubular endoscope for technical purposes e.g. for inspection of soldering processes and soldering of electronic elements on printed boards, has coaxially aligned pipes in which optical system is party accommodated | 
| DE102006052241ADE102006052241A1 (en) | 2005-11-04 | 2006-11-03 | Tubular endoscope for technical purposes e.g. for inspection of soldering processes and soldering of electronic elements on printed boards, has coaxially aligned pipes in which optical system is party accommodated | 
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| DE200520017518DE202005017518U1 (en) | 2005-11-04 | 2005-11-04 | Tubular endoscope for technical purposes e.g. for inspection of soldering processes and soldering of electronic elements on printed boards, has coaxially aligned pipes in which optical system is party accommodated | 
| Publication Number | Publication Date | 
|---|---|
| DE202005017518U1true DE202005017518U1 (en) | 2007-03-08 | 
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| DE200520017518Expired - LifetimeDE202005017518U1 (en) | 2005-11-04 | 2005-11-04 | Tubular endoscope for technical purposes e.g. for inspection of soldering processes and soldering of electronic elements on printed boards, has coaxially aligned pipes in which optical system is party accommodated | 
| Country | Link | 
|---|---|
| DE (1) | DE202005017518U1 (en) | 
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
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| DE3421106C2 (en)* | 1983-06-08 | 1985-11-28 | AVL Gesellschaft für Verbrennungskraftmaschinen und Messtechnik mbH, Prof. Dr.Dr.h.c. Hans List, Graz | Device for determining the processes in the combustion chamber of an internal combustion engine that is in operation | 
| DE4211526A1 (en)* | 1992-04-06 | 1993-10-07 | Berlin Laser Medizin Zentrum | Optical working shaft for rigid endoscope for photo therapy - radiates optical radiation of high power e.g of laser isotropically through working shaft at distal end in predetermined spaced segments | 
| DE4237286A1 (en)* | 1992-04-06 | 1994-05-05 | Laser Medizin Zentrum Ggmbh Be | Method and device for increasing the efficiency of an optical work shaft for photo-thermotherapy | 
| DE10008557A1 (en)* | 2000-02-24 | 2001-10-25 | Huettinger Medtech Gmbh | Device for thermal obliteration of biological tissue using intense laser radiation, where the device is split into a handpiece and a puncture shaft, the latter being easily removable to facilitate cleaning | 
| DE10307903A1 (en)* | 2003-02-18 | 2004-09-02 | Karl Storz Gmbh & Co. Kg | Method for mounting an endoscope | 
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| DE3316167A1 (en)* | 1982-09-14 | 1984-03-15 | Brennstoffinstitut Freiberg, Ddr 9200 Freiberg | PERISCOPE FOR HIGH TEMPERATURE REACTORS | 
| DE3421106C2 (en)* | 1983-06-08 | 1985-11-28 | AVL Gesellschaft für Verbrennungskraftmaschinen und Messtechnik mbH, Prof. Dr.Dr.h.c. Hans List, Graz | Device for determining the processes in the combustion chamber of an internal combustion engine that is in operation | 
| DE4211526A1 (en)* | 1992-04-06 | 1993-10-07 | Berlin Laser Medizin Zentrum | Optical working shaft for rigid endoscope for photo therapy - radiates optical radiation of high power e.g of laser isotropically through working shaft at distal end in predetermined spaced segments | 
| DE4237286A1 (en)* | 1992-04-06 | 1994-05-05 | Laser Medizin Zentrum Ggmbh Be | Method and device for increasing the efficiency of an optical work shaft for photo-thermotherapy | 
| DE10008557A1 (en)* | 2000-02-24 | 2001-10-25 | Huettinger Medtech Gmbh | Device for thermal obliteration of biological tissue using intense laser radiation, where the device is split into a handpiece and a puncture shaft, the latter being easily removable to facilitate cleaning | 
| DE10307903A1 (en)* | 2003-02-18 | 2004-09-02 | Karl Storz Gmbh & Co. Kg | Method for mounting an endoscope | 
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| DE202005017518U1 (en) | Tubular endoscope for technical purposes e.g. for inspection of soldering processes and soldering of electronic elements on printed boards, has coaxially aligned pipes in which optical system is party accommodated | |
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| Date | Code | Title | Description | 
|---|---|---|---|
| R163 | Identified publications notified | ||
| R207 | Utility model specification | Effective date:20070412 | |
| R150 | Term of protection extended to 6 years | Effective date:20090109 | |
| R151 | Term of protection extended to 8 years | ||
| R151 | Term of protection extended to 8 years | Effective date:20111206 | |
| R152 | Term of protection extended to 10 years | ||
| R152 | Term of protection extended to 10 years | Effective date:20131206 | |
| R071 | Expiry of right |