CN2788350Y - Diffuser frame - Google Patents

Abstract

Translated fromChinese

一种扩散器框架，用于一沉积腔内的扩散器，该沉积腔在基材上进行沉积制程，该扩散器将制程气体扩散至该沉积腔内并在其周缘形成数个栓孔，其特征是具有：一呈矩形封闭外形的框架本体，具有至少1550公厘长及至少1350公厘宽的框架开口，该框架本体上在对应扩散器的栓孔处形成数个孔洞，且该框架表面经阳极电镀处理。

A diffuser frame, used for a diffuser in a deposition chamber, the deposition chamber performs a deposition process on a substrate, the diffuser diffuses a process gas into the deposition chamber and forms several pinholes on its periphery, its Characterized by: a frame body of rectangular closed shape, having a frame opening at least 1550 mm long and at least 1350 mm wide, a plurality of holes formed in the frame body corresponding to the keyholes of the diffuser, and the surface of the frame Anodized.

Description

Diffuser frame

Technical field

The utility model relates to a kind of diffuser frame, especially a kind of diffuser in the deposit cavity and the diffuser frame that can conveniently install and clean of being used for.

Background technology

In the processing procedure of flat-panel screens,, therefore in processing procedure, need to plate different materials, such as SiO owing to need on glass substrate, make transistor component₂, film such as SiNx, a-Si and n+a-Si.Present many using plasmas assistant chemical vapor phase deposition system (PECVD, Plasma Enhanced Chemical VaporDeposition) grows up.PECVD is in a vacuum system, after feeding process gas, activate its reaction, and quicken processing procedure speed because of the process gas ion after dissociating can utilize electric field etc. to make it have directivity with a plasma board activated plasma, the process gas that dissociates.

Be used for this kind deposition manufacture process deposit cavity 10 structure as shown in Figure 4, this deposit cavity 10 is hedged off from the outer world to form reaction compartment.This deposit cavity 10 comprises a loam cake 12 and a cavity 14.One O type ring 16 is to be arranged between this loam cake 12 and the cavity 14, so that present airtight state between the deposit cavity 10 and the external world.

This loam cake 12 is to be hedged off from the outer world by cavity lid 22.Be horizontally arranged with backer board (Backing Plate) 34 and one diffuser (Diffuser) 30 in this cavity lid 22.

Process gas is arranged on the outer process gas source of deposit cavity 10 via a gas line 71 with one, again via a gas access 70, and passes through the centre of backer board 34, and in the injected space of going under this backer board 34.After this injected process gas can be positioned at the dividing plate (not shown) diffusion of these backer board 34 belows via one earlier, and below dividing plate and backer board 34, via on diffuser 30, profile is a shower nozzle dull and stereotyped and the many apertures 32 of formation it on and sprayed to the upper surface of a substrate (S), and this substrate (S) is to be configured on the pedestal (susceptor) 60.

One radio frequency (radio frequency) power supply 80 is to be connected to this backer board 34 and diffuser 30, and the process gas that excites injected process gas and activate this diffuser 30 of flowing through is provided, thereby is deposited as film on substrate (S).That is this backer board 34 and diffuser 30 are as a upper electrode.

The side system of cavity 14 covers 22 with the cavity of loam cake 12 and combines, and as above-mentioned, O type ring 16 is to be arranged between this loam cake 12 and the cavity 14.Pedestal 60 is provided in a side of in this cavity 14.Pedestal 60 is apart from diffuser 30 1 segment distances, and towards diffuser 30, and substrate (S) is the upper surface that is placed on this pedestal 60.Be provided with a heater 62 in this pedestal 60, be used for the substrate (S) that is placed on this pedestal 60 is heated to a suitable temperature, in deposition manufacture process, to carry out thin film deposition.Simultaneously, pedestal 60 is grounded, thereby as a below electrode.In order to prevent that the processing procedure material is deposited over the periphery of substrate (S), one hides frame (Shadow Frame) 64 is configured on this pedestal 60, and hides the periphery of substrate (S).

These cavity 14 bottom sides, pedestal 60 belows form an outlet 52, with after finishing deposition manufacture process, process gas system are detached to the external world.

As shown in the figure, as top electrode, and be to mutually combine, and be electrically connected to each other via the bolt 42 that is arranged on the edge with diffuser 30 and the backer board 34 that process gas is injected into substrate (S) upper surface.A plurality of insulating parts 44,46,48 are to be arranged between the peripheral part and cavity lid 22 that diffuser 30 and backer board 34 mutually combine, and so that cavity lid 22 and diffuser 30 and backer board 34 are electrically insulated each other, and keep vacuum state in the deposit cavity 10.

In the above-mentioned insulating part 44,46,48, insulating part 46 is frameworks that a ceramic material is made, and is fixed to cavity by the mode that fixes and covers 22 peripheries.Because cavity lid 22 generally is to be made by aluminum metal, thus may be subjected to the heat energy that is produced by pedestal 60 and be positioned at the substrate (S) on the pedestal 60 heat energy influence and expand.Especially for making the deposit cavity of large substrate, thereby the increasing change in volume when being subjected to temperature effect, insulating part 46 may be increased from cavity lid 22 possibilities of unclamping.

Summary of the invention

In order to unclamp from the cavity lid because of cavity lid is subjected to temperature effect insulating part in season preventing, the utility model provides a kind of diffuser frame, especially a kind of diffuser that is applicable in the deposit cavity of making large substrate, and the diffuser frame that can conveniently install and clean can further fix insulating part between cavity lid and diffuser.

The technical scheme that its technical problem that solves the utility model adopts is, a kind of diffuser frame, be used for the diffuser in the deposit cavity, this deposit cavity carries out deposition manufacture process on base material, this diffuser diffuses to process gas in this deposit cavity and at its periphery and forms several keyholes, it is characterized in that having: the frame body of a rectangular sealing profile, have at least 1550 millimeters long, at least 1350 millimeters wide frame openings, keyhole place at corresponding diffuser on this frame body forms several holes, and the aluminum metal that this framework system handles (anodized) by the surface through anodization is made.

According to the utility model, this frame body has at least 20 millimeters frame wall thickness along the direction of length and width.

According to the utility model, this diffuser frame system is fixed to the periphery of this diffuser by bolt.

The beneficial effects of the utility model are that owing to be the periphery that a diffuser frame is fixed to diffuser, the periphery of self-diffusion device extends to the cavity lid, so can further insulating part be fixed between cavity lid and diffuser.

Description of drawings

Below in conjunction with drawings and Examples the utility model is further specified.

Fig. 1 is the generalized section of utilization deposit cavity of the present utility model.

Fig. 2 is the exploded perspective view of the loam cake among Fig. 1.

Fig. 3 is the zoomed-in view of the part A among Fig. 1.

Fig. 4 is the generalized section of a known deposit cavity.

Embodiment

Fig. 1 is the generalized section of utilization deposit cavity 100 of the present utility model.As shown in Figure 1, this deposit cavity 100 is hedged off from the outer world to form reaction compartment.This deposit cavity 100 comprises a loam cake 112 and a cavity 114.One O type ring 116 is to be arranged between this loam cake 112 and the cavity 114, so that present airtight state between the deposit cavity 100 and the external world.

This loam cake 112 is to be hedged off from the outer world by cavity lid 122.Be horizontally arranged with a backer board 134 and a diffuser 130 in this cavity lid 122.

Process gas is arranged on the outer process gas source of deposit cavity 100 via a gas line 171 with one, again via a gas access 170, and passes through the centre of backer board 134, and in the injected space of going under this backer board 134.After this injected process gas can be positioned at the dividing plate (not shown) diffusion of these backer board 134 belows via one earlier, and below dividing plate and backer board 134, via on diffuser 130, profile is a shower nozzle dull and stereotyped and the many apertures 132 of formation it on and sprayed to the upper surface of a substrate (S), and this substrate (S) is to be configured on the pedestal 160.

One radio frequency (radio frequency) power supply 180 is to be connected to this backer board 134 and diffuser 130, and the process gas that excites injected process gas and activate this diffuser 130 of flowing through is provided, thereby is deposited as film on substrate (S).That is this backer board 134 and diffuser 130 are as a upper electrode.

As shown in Figure 1, the side of cavity 114 system covers 122 with the cavity of loam cake 112 and combines, and as above-mentioned, O type ring 116 (Fig. 3) is to be arranged between this loam cake 112 and the cavity 114.Pedestal 160 is provided in a side of in this cavity 114.Pedestal 160 is apart from diffuser 130 1 segment distances, and towards diffuser 130, and substrate (S) is the upper surface that is placed on this pedestal 160.Be provided with a heater 162 in this pedestal 160, be used for the substrate (S) that is placed on this pedestal 160 is heated to a suitable temperature, in deposition manufacture process, to carry out thin film deposition.Simultaneously, pedestal 160 is grounded, thereby as a below electrode.In order to prevent that the processing procedure material is deposited over the periphery of substrate (S), one hides frame (ShadowFrame) 164 is configured on this pedestal 160, and hides the periphery of substrate (S).

Form a top on this cavity lid 122 and detach outlet 152,, process gas system is detached to the external world with after finishing deposition manufacture process.

Fig. 2 is the exploded perspective view of the loam cake 112 among Fig. 1.Fig. 3 is the zoomed-in view of the part A among Fig. 1.As shown in Figure 3, as top electrode, and diffuser 130 and the backer board 134 that process gas is injected into substrate (S) upper surface mutually combined, and be electrically connected to each other.A plurality of insulating parts 144,146,148 are to be arranged between the peripheral part and cavity lid 122 that diffuser 130 and backer board 134 mutually combine, so that cavity lid 122 and diffuser 130 and backer board 134 are electrically insulated each other, and keep vacuum state in the deposit cavity 100.

In the above-mentioned insulating part 144,146,148, insulating part 144,148 all is by the made framework of fluoropolymer, and insulating part 146 is frameworks of being made by ceramic material, is fixed to cavity by the mode that fixes and covers 122 peripheries.

With reference to figure 2 and Fig. 3, in order to unclamp from cavity lid 122 because of cavity lid 122 is subjected to temperature effect insulating part 146 in season preventing, the utility model provides a kind of diffuser frame 200, is fixed to this diffuser 130, and these diffuser 130 peripheries form several keyholes 131.

According to the utility model, this diffuser frame 200 has the frame body 202 of a rectangular sealing profile, it is the frame openings of at least 1550 millimeters long (L) and at least 1350 millimeters wide (W), and these frame body 202 preferable directions along length and width respectively have at least 20 millimeters frame wall thickness (T) (ginseng Fig. 3).Keyhole 131 places at corresponding diffuser 130 on this frame body 202 form several holes 210, by this, can be the hole 131 that is fixed to the periphery of this diffuser 130 by several bolts 205 with this diffuser frame 200, frame body 202 is extended to cavity lid 122 to the periphery of diffuser 130, thereby a plurality of insulating parts 144,146,148 are arranged between the peripheral part and cavity lid 122 that diffuser 130 and backer board 134 mutually combine securely, as person illustrated in Fig. 2.

In order to strengthen anti-corrosion, insulation, antistatic and characteristic easy to clean, the diffuser frame 200 in the utility model is to be made through the aluminum metal of anodization processing (anodized) by the surface.That is, frame body 202 is inserted in the electrolyte through cleaning and after etching (etching), with electric current this electrolyte of flowing through, to form an oxide layer on the frame body surface, this is to have the knack of the known person of skill personage that anodization is handled.

Only owing to coming off easily after using in the frequent phase through the aluminum metal surface of anodization processing (anodized) or destroying, thereby need regularly replace diffuser frame 200, in the utility model, can be by the bolt 205 convenient diffuser frames 200 of removing and more renewing.

By above-mentioned utility model embodiment as can be known, the beneficial effects of the utility model are, owing to be the periphery that a diffuser frame is fixed to diffuser, the periphery of self-diffusion device extends to the cavity lid, even so handle in the deposit cavity of large substrate, this diffuser frame can further fix insulating part between cavity lid and diffuser also convenient periodic replacement.

Though the utility model discloses as above with preferred embodiment; right its is not in order to limit utility model; anyly have the knack of this skill person; in the spirit and scope that do not break away from utility model; when can being used for a variety of modifications and variations, so the protection range of utility model is when being as the criterion according to claims person of defining.

Claims (3)

Translated fromChinese

1.一种扩散器框架，用于一沉积腔内的扩散器，该沉积腔在基材上进行沉积制程，该扩散器将制程气体扩散至该沉积腔内并在其周缘形成数个栓孔，其特征是具有：1. A diffuser frame for a diffuser in a deposition chamber that performs a deposition process on a substrate, the diffuser diffuses a process gas into the deposition chamber and forms several pinholes at its periphery , which is characterized by having:一呈矩形封闭外形的框架本体，具有至少1550公厘长及至少1350公厘宽的框架开口，该框架本体上在对应扩散器的栓孔处形成数个孔洞，且该框架本体系由表面经阳极电镀处理的铝金属制成。A frame body of rectangular closed shape, having a frame opening at least 1550 mm long and at least 1350 mm wide, the frame body is formed with holes corresponding to the keyholes of the diffuser, and the frame body is formed from the surface through Made of anodized aluminum metal.2.根据权利要求1所述的扩散器框架，其特征是：该框架本体沿长度及宽度的方向具有至少20公厘的框壁厚度。2. The diffuser frame according to claim 1, wherein the frame body has a frame wall thickness of at least 20 mm along the length and width directions.3.根据权利要求1所述的扩散器框架，其特征是：该框架本体系通过螺栓被固定至该扩散器的周缘。3. The diffuser frame according to claim 1, wherein the frame body is fixed to the periphery of the diffuser by bolts.