Disclosure of utility model
Aiming at the problems in the prior art, the utility model aims to provide a control wafer assembly and physical vapor deposition equipment, and solves the technical problems of low control wafer utilization rate and high cost in the related art.
The embodiment of the disclosure provides a control wafer assembly, which comprises:
A control wafer body;
The shielding disc is positioned above the control wafer body, at least one working window is arranged on the shielding disc, and the working window exposes the control wafer body below;
A connecting rod coupled with the control wafer body and the shielding disc;
the control chip body is rotatably connected with the shielding disc through the connecting rod.
In some embodiments, a plurality of the working windows are arranged in the circumferential direction in the shielding plate.
In some embodiments, the plurality of the working windows includes the working window having an offset distance from a center point of the shutter disk.
In some embodiments, the offset distance is 10mm to 50mm.
In some embodiments, a through hole is formed in the shutter disk, the through hole forming the working window.
In some embodiments, the distance between the shielding disc and the control wafer body is 5 mm-50 mm.
In some embodiments, the connecting rod is bonded with the control wafer body or connected through a buckle structure.
In some embodiments, the connecting rod comprises:
The first section of rod and the second section of rod which are connected in a rotating way are respectively connected with the shielding disc and the control wafer body.
In some embodiments, the first section of rod is provided with a hollow structure and the second section of rod is provided with a rotating shaft mated with the hollow structure, the rotating shaft rotatably extending into the hollow structure.
In some embodiments, the shielding plate is provided with an edge shielding part, and the edge shielding part is abutted with the control wafer body along the radial direction of the control wafer body.
In some embodiments, the shielding plate is provided with a plurality of the edge shielding portions arranged in a circumferential direction, or the edge shielding portions are edge turnups.
The disclosed embodiments also provide a physical vapor deposition apparatus, including:
the rotary positioner is used for bearing the control wafer assembly in any embodiment;
And the pressing device is installed with the rotary positioner and is used for stretching to press the shielding disc.
In some embodiments, the rotational positioner is a stepper rotation mechanism.
In some embodiments, the pressing device includes:
and the fixed linear driver and the pressing structure is arranged on the rotary positioner.
The control wafer assembly and the physical vapor deposition equipment of the embodiment of the disclosure have the following advantages:
The embodiment of the disclosure sets up the shielding disc above the control wafer body and rotatably connects through the connecting rod. Then, when PVD test is performed, coating is performed on the control wafer body through the working window. After the test is finished, the control wafer body and the shielding disc are rotatably connected, so that the working window is aligned to an uncoated area on the control wafer body by rotating the control wafer body or the shielding disc before the next test, and the PVD test of the next round is continued. When the control wafer assembly of the embodiment is used, each time of coating is performed, coating and monitoring are performed on the local area of the control wafer body only through the discrete working window, coating is not required to be performed on the whole control wafer body, and the single-wafer utilization rate of the control wafer body can be improved and the equipment cost is reduced through the rotation fit between the control wafer body and the shielding plate.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in many different forms and should not be construed as limited to the examples set forth herein, but rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
As used in the specification and in the claims, the terms "a," "an," "the," and/or "the" are not specific to a singular, but may include a plurality, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus.
In the description of the present application, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, and are merely for convenience of describing the present application and simplifying the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of the present application, and the azimuth terms "inside and outside" refer to inside and outside with respect to the outline of each component itself.
Spatially relative terms, such as "above," "upper" and "upper surface," "above" and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the process is carried out, the exemplary term "above" may be included. Upper and lower. Two orientations below. The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present application. Furthermore, although terms used in the present application are selected from publicly known and commonly used terms, some terms mentioned in the present specification may be selected by the applicant at his or her discretion, the detailed meanings of which are described in relevant parts of the description herein. Furthermore, it is required that the present application is understood, not simply by the actual terms used but by the meaning of each term lying within.
It will be understood that when an element is referred to as being "on," "connected to," "coupled to," or "contacting" another element, it can be directly on, connected or coupled to, or contacting the other element or intervening elements may be present. In contrast, when an element is referred to as being "directly on," "directly connected to," "directly coupled to," or "directly contacting" another element, there are no intervening elements present.
Furthermore, the drawings are merely schematic illustrations of the present utility model and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus a repetitive description thereof will be omitted.
Fig. 1 is a perspective view of a control wafer assembly according to an embodiment of the present disclosure, and fig. 2 is a side view of the control wafer assembly shown in fig. 1, and as shown in fig. 1 and 2, the control wafer assembly includes:
a control wafer body 1;
A shutter disk 2 located above the control wafer body 1 and provided with at least one working window 2a (not shown in fig. 2);
A connecting rod 3 coupled with the control wafer body 1 and the shielding plate 2;
the control chip body 1 and the shielding disc 2 are rotatably connected through the connecting rod 3.
With the control wafer assembly of the embodiment of the present disclosure, when PVD test is performed, a coating is performed on the control wafer body 1 through the working window 2 a. After the test is finished, the control wafer body 1 and the shielding disc 2 are rotatably connected, so that before the next test, the control wafer body 1 or the shielding disc 2 can be rotated, the working window 2a is aligned to an uncoated area on the control wafer body 1, and the next PVD test can be continued.
When the control wafer assembly of the embodiment is used, each time of coating is performed, coating and monitoring are performed on the local area of the control wafer body 1 only through the discrete working window 2a, coating is not required to be performed on the whole control wafer body 1, and the single wafer utilization rate of the control wafer body 1 can be improved and the equipment cost is reduced through the running fit between the control wafer body 1 and the shielding disc 2.
In one implementation, a through hole is formed in the shutter disk 2, said through hole forming said working window 2a. Thus, in the PVD process, a film is sputtered onto the wafer body through the through hole. The shape of the through hole is not limited in this embodiment, and may be a round hole, a square hole, or a window of another shape.
As shown in fig. 3, a plurality of working windows 2a are provided in the shutter disk 2, so that plating monitoring can be performed for a plurality of discrete positions in a single test. In one embodiment, the working windows 2a include a plurality of working windows arranged in a circumferential direction, for example, a uniform or non-uniform arrangement.
In an alternative embodiment, as shown in fig. 3, a plurality of the working windows 2a include the working window 2a1 having a deviation distance l from the center point O of the shielding plate 2. In this design, the working window 2a1 is located offset from the center point O of the shutter disk 2, so that when the wafer body 1 (as shown in fig. 2) is rotated relative to the shutter disk 2, the working window 2a1 can be rotated to an adjacent uncoated area for the next round of testing. In this way, in a circular area centered on the center point O of the shutter disk 2 and having the offset distance l as a radius, more testable areas can be obtained to realize multiple rounds of testing.
By arranging the working window along the circumferential direction of the shielding disc 2 and deviating from the central point O of the shielding disc 2, coating monitoring can be carried out on different areas, such as an edge area and a central area, on the control wafer body 1, and the comprehensiveness and the accuracy of a final test result are improved.
In one embodiment, the offset distance l is 10mm to 50mm. Within this distance range, the coating area is neither too far nor too close to the center point O of the shutter disk 2, so that a multi-round test can be performed near the center area of the center of the wafer body 1.
In this embodiment of the disclosure, as shown in fig. 2, the distance H between the shielding disc 2 and the control wafer body 1 is 5mm to 50mm. The spacing between the shielding disc 2 and the control wafer body 1 is not too large or too small, so that the size of the working window 2a (shown in fig. 1) can be prevented from being a factor influencing the coating test result in the range, and the accuracy of the coating test result is ensured.
In the embodiment of the present disclosure, as shown in fig. 2, the connecting rod 3 is bonded to the control wafer body 1 or connected by a fastening structure, which can reduce damage to the control wafer body 1. Taking bonding as an example, the bottom end of the connecting rod 3 and the surface of the control wafer body 1 are bonded by using sol. Thus, after the current control wafer body 1 is tested and used, the next control wafer body can be conveniently detached and replaced.
The connection mode of the buckle structure is that a first buckle connector is adhered to the surface of the control wafer body 1, a second buckle connector matched with the first buckle connector is arranged at the bottom end of the connecting rod 3, and the first buckle connector is connected with the second buckle connector in a clamping manner, so that the control wafer body 1 and the connecting rod 3 are installed.
As an implementation manner, as shown in fig. 4, the connecting rod 3 includes a first section rod 31 and a second section rod 32 that are rotatably connected, where the first section rod 31 and the second section rod 32 are respectively connected with the shutter disk 2 and the control wafer body 1, and illustratively, the first section rod 31 is connected with the control wafer body 1 and the second section rod 32 is connected with the shutter disk 2, or the first section rod 31 is connected with the shutter disk 2 and the second section rod is connected with the control wafer body 1.
One of the first and second rods 31, 32 is an active rod. Through the rotation connection, when the driving rod rotates, the other section of rod keeps still, and the movement of the working window is realized.
In one embodiment, the first length of rod 31 is provided with a hollow structure and the second length of rod 32 is provided with a rotating shaft 321 cooperating with said hollow structure, the rotating shaft 321 rotatably extending into the hollow structure.
In this way, the rotating shaft 321 can rotate in the hollow structure, so as to realize the rotation connection between the shielding disc 2 and the control wafer body 1.
In the embodiment of the present disclosure, in the first section bar 31 and the second section bar 32, the corresponding section bar connected to the shielding plate 2 and the shielding plate 2 may be fixedly connected, such as an integral structure, a bolt connection, or a clamping connection, which is not limited herein.
In the embodiment of the disclosure, the shielding disc 2 and the connecting rod 3 are made of high-temperature resistant materials, so that pollution to the control wafer body 1 is avoided.
In another embodiment of the present disclosure, as shown in fig. 5, the shielding plate 4 is provided with an edge shielding portion 41, and the edge shielding portion 41 abuts against the wafer body 10 along the radial direction of the wafer body 10.
The edge shielding part 41 is used for blocking the relative displacement between the shielding disc 4 and the control wafer body 10, and ensures that the edge shielding part is stable in the PVD process.
In one embodiment, the shielding plate 4 is provided with a plurality of the edge shielding portions 41 arranged in the circumferential direction, and the edge shielding portions 41 are arranged in a dispersed manner in the circumferential direction. At this time, the edge shielding portion 41 may be a separate piece with respect to the shielding plate 4, and may be additionally installed at the edge of the shielding plate 4.
In the alternative, the edge shielding portion 41 is an edge flanging, and the edge shielding portion 41 may be an annular structure or a local flanging of the shielding plate 4.
Embodiments of the present disclosure also provide a physical vapor deposition apparatus, as shown in fig. 6, which may include:
A rotary positioner 51 for carrying the control wafer assembly 50 of any of the above embodiments;
A pressing means 52 is mounted with the rotational positioner 51 for elongating to press the shutter disk 501.
In this embodiment, the rotation positioner 51 is a rotation mechanism of the PVD apparatus, which can directly provide a rotation driving source for the wafer body 502, and the wafer body 502 is used as a driving member. When the control wafer body 502 is placed on a slide holder in the PVD equipment and clamped by the clamp 53, the pressing device 52 is controlled to press the shielding disc 501 downwards, the shielding disc 501 cannot rotate, and at the moment, the slide holder is driven to rotate by the control rotation positioner 51, so that the control wafer body 502 can be driven to rotate, and repeated use of the control wafer can be realized.
In a corresponding embodiment, the rotational positioner 51 is located at the front inlet position of the PVD equipment. Wherein the rotational positioner 51 selects a step rotation mechanism, such as a stepper motor, to achieve step rotation.
In the embodiment of the present disclosure, the pressing device 52 includes:
A fixedly mounted linear actuator 521 and a pressing structure 522 mounted with the linear actuator 521 and located above the rotational positioner 51, the linear actuator 521 being configured to drive the pressing structure 522 to move up and down.
As shown in fig. 6, the linear driver 521 provides a driving force to drive the pressing structure 522 to lift and lower. In use, when the control wafer body 502 needs to be rotated, the linear driver 521 is controlled to drive the pressing structure 522 to descend to abut against the shielding disc 501 to the pressing position. When the adjustment is completed, the linear actuator 521 is controlled to drive the pressing structure 522 in a reverse direction to release the pressing, and then transfer the wafer assembly into the PVD process chamber.
In one embodiment, the linear drive 521 is a lifting rod, which may be embodied as a belt drive, a rack and pinion, a ball screw, and a linear motor. The pressing means 52 is integrated in a rotating positioner in the physical vapor deposition apparatus and controlled to lengthen to press the shutter disk 501 and also controlled to reverse reset.
Fig. 6 shows only a rotary positioner in a physical vapor deposition apparatus, and reference is made to related art known to those skilled in the art for other structures of the physical vapor deposition apparatus, and not described in detail herein.
The foregoing is a further detailed description of the utility model in connection with the preferred embodiments, and it is not intended that the utility model be limited to the specific embodiments described. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the utility model, and these should be considered to be within the scope of the utility model.