Disclosure of utility model
The application discloses a power module and a server, which are used for realizing liquid cooling and detecting leakage at the same time.
In order to achieve the above purpose, the present application provides the following technical solutions:
In a first aspect, an embodiment of the present application provides a power module, including a housing, a main board assembly, a liquid cooling assembly, a heat conducting element, and a leakage detecting assembly;
The shell is internally provided with an accommodating space;
the main board assembly is fixedly arranged in the accommodating space and comprises a main board and a plurality of heating devices fixedly arranged on the first surface of the main board;
The liquid cooling assembly comprises a liquid cooling plate and a joint connector, wherein the liquid cooling plate is positioned in the accommodating space and positioned at one side of the plurality of heating devices, which is away from the main board, and the liquid cooling plate and the main board assembly are coupled into an integral structure through the heat conducting element;
The leakage detection assembly is arranged at the integral structure and/or the joint connector.
The power module adopts liquid cooling heat dissipation, so that heat dissipation efficiency is improved. Specifically, the power module carries out liquid cooling to the mainboard subassembly through the liquid cooling subassembly, and the liquid cooling board of liquid cooling subassembly is inside to have the liquid cooling passageway, and joint connector one end is connected with the liquid cooling passageway, and the other end protrusion is outside the casing for provide coolant liquid such as water for the liquid cooling board. The joint connector can be directly connected with a liquid cooling pipeline of an external device such as a server, and can also be connected with an additional liquid cooling pipeline. The liquid cooling plate and the main board component are coupled into an integral structure through the heat conducting element, so that the increase of thermal resistance caused by the generation of gaps is avoided. Heat generated by the main board assembly is transferred to the cooling liquid in the liquid cooling plate through heat conduction of the heat conduction element and convection heat exchange of the cooling liquid, and heat is taken away through circulation flow of the cooling liquid, so that interval liquid cooling heat dissipation is realized. The leakage of the cooling liquid in the liquid cooling plate can cause catastrophic damage to the electric devices of the power supply module, so the power supply module provided by the embodiment of the application is provided with the leakage detection assembly for monitoring the leakage condition in real time. The leakage detection assembly may be disposed inside the housing of the power module, such as at a portion where the connector is located inside the housing, or may be disposed outside the housing of the power module, such as at a portion where the connector protrudes outside the housing. The leakage detection assembly can be directly and electrically connected with the main board, and can also be electrically connected with external equipment of the power module, such as a server.
Therefore, the power module provided by the embodiment of the application realizes the liquid cooling efficient heat dissipation, and also monitors the leakage in real time, and timely takes correct measures for the leakage.
In some embodiments, the leak detection assembly is disposed in the unitary structure comprising:
The liquid leakage detection assembly is arranged on the outer side surface of the integral structure, surrounds the main board and is electrically connected with the main board, and the arrangement mode can be used for timely detecting liquid leakage outside the integral structure so as to avoid damage of the liquid leakage to electric devices on the main board;
And/or, the leakage detection assembly is arranged on the main board and is electrically connected with the main board, and the arrangement mode can timely detect the leakage inside the whole structure. The leakage detection assembly is electrically connected with the main board, so that the main board can take correct measures, such as alarm or power failure, for the leakage in time.
In some embodiments, the leak detection assembly is disposed at the header connector, the leak detection assembly having an electrical connection port for electrical connection with an external device. The liquid cooling plate and connector joint and connector and external liquid cooling pipeline joint leak liquid, so that the leak liquid is prevented from entering the power module to damage the power device on the main board, and meanwhile, the leak liquid can be prevented from damaging external equipment connected with the power module such as the internal electric device of a server. The leakage detection assembly is provided with an electric connection port electrically connected with external equipment such as a server, so that the external equipment such as the server can take correct measures in time, such as alarming, switching to another power supply or power-off protection and the like.
In some embodiments, the leak detection assembly includes a leak detection line and/or a leak sensor. The leakage detection assembly can be a leakage detection line, occupies a small space, is convenient to lay, and can be wound on an irregular structure. The liquid leakage detection line can be a resistance type liquid leakage line or a capacitance type liquid leakage line. The liquid leakage detection lines at all positions can be connected in series and parallel, and timely detection can be performed. Of course, the leakage detection component can also be a leakage sensor, and the leakage sensor can sensitively detect the existence of liquid and timely give out a warning so as to timely handle potential leakage problems.
In some embodiments, the liquid cooling plate comprises a heat conducting plate and a liquid cooling pipe, the liquid cooling pipe is embedded on the surface of the side, facing the main plate, of the heat conducting plate, and the side, facing the main plate, of the liquid cooling pipe is parallel to the heat conducting plate;
The liquid cooling pipe comprises a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are both connected with the joint connector.
The liquid cooling board is realized through the structure of liquid cooling pipe embedding heat-conducting plate, and the liquid cooling pipe is located heat-conducting plate and is close to mainboard one side, and with heat-conducting plate surface parallel and level, contact heat transfer between liquid cooling pipe and the mainboard subassembly of being convenient for. The liquid inlet and the liquid outlet of the liquid cooling pipe are both positioned on the same side of the heat conducting plate, so that liquid cooling pipelines in external equipment connected with the power supply module are conveniently distributed, and meanwhile, the connector is convenient to maintain. It can be understood that the liquid inlet and the liquid outlet of the liquid cooling pipe can be positioned on different sides of the heat conducting plate, and at the moment, a liquid cooling pipeline is required to be additionally arranged to be connected with the power supply module through the joint connector.
In some embodiments, the connector is a quick connector to support electrohydraulic hot plug and facilitate later maintenance.
In some embodiments, the plurality of heat generating devices includes a first heat generating device having a power consumption greater than a power consumption of a remaining heat generating device of the plurality of heat generating devices;
In the embodiment of the application, the power module carries out reconstruction design on the heating device on the main board, so that the liquid cooling pipeline on the liquid cooling board is closest to the position with the largest heating value of the heating device on the main board, and the place with the largest heating value is cooled again. Specifically, the internal high-power-consumption devices are arranged according to the positions of the liquid cooling pipes in the liquid cooling plate, so that the heat transfer path can be shortened, and the liquid cooling plate can be ensured to perform faster heat dissipation on the devices with high heat. It can be appreciated that the first heat generating device in this embodiment may be one electrical device or one type of electrical device, and mainly aims to distinguish power consumption from other electrical devices.
Or the plurality of heating devices comprise a second heating device, and the size of the second heating device is larger than the sizes of the rest heating devices in the plurality of heating devices along the normal direction of the main board;
Orthographic projection of the second heating device on the liquid cooling plate is second projection, the second projection is located outside the liquid cooling pipe layout area, and an imitation groove matched with the second heating device is formed in one side of the liquid cooling plate, facing the main plate.
In the embodiment of the application, the power supply module carries out reconstruction design on the heating device on the main board, so that the liquid cooling pipeline on the liquid cooling board is closest to the position with the largest heating value of the heating device on the main board, and the place with the largest heating value is cooled again. But to some large-scale and little electric devices of consumption, can directly dispel the heat with the liquid cooling board contact, because the restriction of accommodation space size, the liquid cooling board adopts the profile modeling design, and the liquid cooling board forms the profile modeling groove that corresponds to the second device that generates heat, realizes the perfect laminating of second device that generates heat and liquid cooling board. It can be understood that the second heat generating device in this embodiment may be one electrical device or one type of electrical device, and is mainly aimed at distinguishing the size from the other electrical devices, for example, the second heat generating device is a capacitor with a larger shape and a flyback transformer with a higher shape.
In some embodiments, an annular insulating barrier surrounding the motherboard assembly is disposed between the unitary structure and the housing. The shell of the power module is usually made of metal materials, the annular insulating baffle is arranged inside the shell, and the annular insulating baffle is fixed on the integral structure through plastic screws, so that the short circuit caused by metal can be avoided, and the inside of the shell has certain structural strength.
In some embodiments, the housing includes an upper housing and a lower housing, the upper housing and the lower housing are covered to form the accommodating space, and a guide groove is provided on a top plate of the upper housing. In order to be convenient for assemble with external equipment such as server, along power module's assembly direction, power module's last casing top sets up the guide way, can realize accurate assembly.
In a second aspect, embodiments of the present application further provide a server, including a power module according to any one of the embodiments of the first aspect.
The power module assembled by the server provided by the embodiment of the application adopts liquid cooling heat dissipation, the connector of the liquid cooling plate in the power module can be directly connected with the liquid cooling pipeline inside the server, so that the full liquid cooling heat dissipation of the server is realized, the server is ensured to effectively dissipate heat under a high-load or high-temperature environment, the performance degradation of the power module and the whole server is avoided, and further, the fault caused by high temperature is avoided. Meanwhile, the leakage detection assembly of the power module can be directly compatible with a leakage detection system in the server, so that the server can take correct measures for leakage.
Detailed Description
Firstly, introducing the application scenario of the application, in the related technology, the general redundant power supply mainly uses a small fan to radiate heat of the whole power supply module, and in order to ensure the circulation of air, the power supply module is provided with an open pore structure at the front and the back, and the following problems mainly exist:
1. The power module occupies a small space in the server, and under the precondition of the traditional air cooling heat dissipation mode, the specification of the fan is basically constant, and the heat dissipation capacity which can be taken away is limited. And because the power module is located the tail end of server, the air of power module air intake can be through the preheating of server other parts, and the temperature can rise very much for power module is in a higher temperature environment, can radiating temperature allowance very little. As the power consumption of the main components of the server increases, the required power supply power also increases, generating more heat. The temperature of each component of the power supply module is continuously increased with the increase of power consumption. Under high load or high temperature environment, if heat dissipation cannot be effectively carried out, the performance of a power supply and the whole system can be reduced, and even faults are caused;
2. The open pore structure is arranged in front of and behind the power module, so that the fan can conveniently drive air to circulate, but the air can be more easily influenced by dust and other sundries. In the redundant power supply system, an increase in the number of fans causes external dust accumulation to be more serious. This not only affects the heat dissipation effect, but also may cause damage to the electronic devices inside the power supply;
3. The great amount of heat that produces in the current forced air cooling power module needs to be taken out through the fan, and the more the heat, the faster the fan rotational speed, the noise is bigger, in redundant electrical power generating system, because more fans are required to ensure the radiating effect, consequently noise problem can be more outstanding. This is a significant disadvantage for application scenarios requiring low noise environments;
4. under the current general trend of full liquid cooling of the data center, the full liquid cooling of the data center cannot be realized by adopting air cooling for the power supply module.
Therefore, the development of the liquid cooling power supply module is an important ring in the whole liquid cooling process of the data center.
Based on the application scenario, the embodiment of the application provides a power module and a server, which are used for realizing liquid cooling and liquid leakage detection.
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application. In the description of the embodiment of the present application, unless otherwise indicated, "/" means or, for example, a/B may represent a or B, and "and/or" in the text is merely an association relationship describing an association object, which means that three relationships may exist, for example, a and/or B, and that three cases of a alone, a and B together, and B alone exist, and further, in the description of the embodiment of the present application, "a plurality" means two or more.
The terms "first," "second," and the like, are used below for descriptive purposes only and are not to be construed as implying or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature, and in the description of embodiments of the application, unless otherwise indicated, the meaning of "a plurality" is two or more.
Fig. 1 is a three-dimensional perspective view of a power module according to an embodiment of the present application, and fig. 2 is an exploded view of the power module, as shown in fig. 1 to 2, the power module includes a housing 100, a main board assembly 200, a liquid cooling assembly 300, and a heat conducting element. The housing 100 has a receiving space therein.
The motherboard assembly 200 is fixedly disposed in the accommodating space, and includes a motherboard 210 and a plurality of heat generating devices fixedly disposed on a first surface of the motherboard 210, wherein one end of the motherboard 210 extends out of the housing 100 to form a first interface 211 for signal connection with an external device such as a server, and the first interface 211 may be an interface for a golden finger. When the power module is installed on the server, the golden finger plug-in interface is plugged with the server to realize electric connection.
The liquid cooling assembly 300 includes a liquid cooling plate 310 and a connector 320, wherein the liquid cooling plate 310 is located in the accommodating space and is located at a side of the plurality of heat generating devices facing away from the main board 210, that is, the heat generating devices are located between the liquid cooling plate 310 and the main board 210. All the heat generating devices are fixedly arranged on the first surface of the main board 210, and the liquid cooling plate 310 is in direct contact or indirect contact with the other surface of the heat generating devices to form a heat conducting path, wherein the indirect contact can be realized through a heat conducting element such as a heat conducting gasket or heat conducting gel. The liquid cooling plate 310 and the main board assembly 200 are coupled into an integral structure through heat conducting elements, and can be specifically realized by adopting a heat conducting gel vacuum pouring method, one end of the joint connector 320 is connected with the liquid cooling plate 310, and the other end penetrates through the shell 100 and extends out of the shell 100 to be connected with an external liquid cooling pipeline. The external liquid cooling pipeline can be an external device connected with the power supply module, such as a liquid cooling pipeline inside the server, or can be a liquid cooling pipeline independently arranged for the power supply module.
Fig. 3 is a schematic diagram of a leakage detection of a power module according to an embodiment of the present application, referring to fig. 3, the power module further includes a leakage detection assembly 400, where the leakage detection assembly 400 is disposed at the integral structure and/or the connector 320, and is used for detecting a leakage condition at the liquid cooling plate 310 and the connector 320, so as to avoid the leakage from damaging the main board 210, electrical devices on the main board 210, and electrical devices in external devices connected to the power module.
The power module adopts liquid cooling heat dissipation, so that heat dissipation efficiency is improved. Specifically, the power module performs liquid cooling on the motherboard assembly 200 through the liquid cooling assembly 300, the liquid cooling plate 310 of the liquid cooling assembly 300 has a liquid cooling channel therein, and one end of the connector 320 is connected to the liquid cooling channel, and the other end protrudes outside the housing 100, so as to provide cooling liquid such as water for the liquid cooling plate 310. The joint connector 320 may be directly connected to the liquid cooling pipe 312 of an external device such as a server, or may be connected to an additional liquid cooling pipe 312. The liquid cooling plate 310 and the main board assembly 200 are coupled into a unitary structure by a heat conducting element, avoiding the occurrence of gaps resulting in increased thermal resistance. Heat generated by the main board assembly 200 is transferred to the cooling liquid in the liquid cooling plate 310 through heat conduction of the heat conduction element and convection heat exchange of the cooling liquid, and heat is taken away through circulation flow of the cooling liquid, so that interval liquid cooling heat dissipation is realized. The leakage of the cooling liquid in the liquid cooling plate 310 may cause catastrophic damage to the electrical devices of the power module, so the power module provided by the embodiment of the application is provided with the leakage detection assembly 400 to monitor the leakage condition in real time. The leakage detecting assembly 400 may be disposed inside the housing 100 of the power module, such as at an integral structure, and a portion of the connector 320 located inside the housing 100, or may be disposed outside the housing 100 of the power module, such as a portion of the connector 320 protruding outside the housing 100. The leakage detection assembly 400 may be directly electrically connected to the main board 210, or may be electrically connected to an external device of the power module, such as a server.
Therefore, the power module provided by the embodiment of the application realizes the liquid cooling efficient heat dissipation, and also monitors the leakage in real time, and timely takes correct measures for the leakage.
In some embodiments, the leak detection assembly 400 is disposed in a unitary structure comprising:
The leakage detection assembly 400 is arranged on the outer side surface of the integral structure, surrounds the main board 210 and is electrically connected with the main board 210, and the arrangement mode can detect leakage outside the integral structure in time so as to avoid damage of the leakage to electric devices on the main board 210;
and/or, the leakage detection assembly 400 is disposed on the motherboard 210 and electrically connected to the motherboard 210, and the arrangement manner can detect the leakage inside the whole structure in time. When the leakage liquid falls to the main board 210, the leakage liquid is detected in time, so that the damage of the leakage liquid to the electric devices on the main board 210 is avoided, and the main board 210 can take correct measures, such as alarm or power failure, in time for the leakage liquid through the electric connection of the leakage liquid detection assembly 400 and the main board 210.
In some embodiments, the leak detection assembly 400 is disposed at the header connector 320, the leak detection assembly 400 having an electrical connection port for electrical connection with an external device. The arrangement mode can leak liquid at the joint of the liquid cooling plate 310 and the joint connector 320 and at the joint of the joint connector 320 and an external liquid cooling pipeline, so that the damage of the leaked liquid to the electric devices on the main board 210 in the power module is avoided, and the damage of the leaked liquid to the external equipment connected with the power module such as the electric devices in the server is avoided. The leak detection assembly 400 has an electrical connection port for electrical connection with an external device, such as a server, to facilitate the external device, such as the server, to take corrective action in time, such as alerting, switching to another power source, or power-down protection, etc.
In some embodiments, the leak detection assembly 400 includes a leak detection line and/or a leak sensor. The leakage detection assembly 400 can be a leakage detection line, occupies a small space, is convenient to lay, and can be wound on an irregular structure. The liquid leakage detection line can be a resistance type liquid leakage line or a capacitance type liquid leakage line. The liquid leakage detection lines at all positions can be connected in series and parallel, and timely detection can be performed. Of course, the leak detection assembly 400 may also be a leak sensor that can sensitively detect the presence of liquid and issue a warning in time to address potential leak problems in time.
The resistive leak detection technology is a simpler leak detection method, and the working principle of the resistive leak detection technology is based on the conductivity of liquid. When liquid contacts two parallel conductive tracks (resistive wires) laid down in the potential leakage area, a conductive path is formed, resulting in a change in the electrical resistance of the circuit. The detection system determines whether leakage has occurred by monitoring the change in the resistance value. This method is applicable to liquids capable of conducting electricity, such as water or other electrolyte solutions.
The capacitive liquid leakage detection technology is a high-efficiency detection method based on the principle of capacitance change. Such detection systems typically include a capacitive sensor and corresponding signal processing components. The working principle is as follows:
1. Capacitance principle-capacitance sensor consists of two conductive plates, and when a medium (such as air) is arranged between them, the formed capacitance is small. Once there is liquid intrusion between the plates, the capacitance increases significantly due to the dielectric constant of the liquid being much greater than air.
2. And a detection mechanism that the system continuously monitors the change of the capacitance value. When liquid leakage occurs in the detection area, the sudden increase of the capacitance can be detected by the detection circuit and trigger an alarm signal. The capacitive detection has high sensitivity and high reaction speed, can adapt to various liquid types, and is not easily influenced by external interference such as dust.
In one possible implementation manner, a leakage disaster recovery detection mechanism is provided in the power module, and the leakage of the liquid in the liquid cooling tube 312 in the liquid cooling plate 310 can cause catastrophic damage to the power device, so that a detection device for a leakage alarm is adopted in the power module, and a resistive type leakage detection line is used, but not limited to a resistive type leakage detection line, a capacitive type leakage detection line and the like can also be used. The leakage detection terminal is installed on the main board 210 inside the power module, or a leakage detection line is arranged between the main board 210 and the liquid cooling board 310 and is electrically connected with the main board 210, or a leakage detection line and a leakage sensor are arranged outside the whole structure after vacuum filling and around the circuit board, so as to detect in time, and an anti-interference structure such as an anti-interference circuit or a physical anti-interference structure is designed. The physical anti-interference structure can be a specific anti-interference shielding piece.
In one possible implementation, a leakage disaster recovery detection mechanism is provided outside the power module, and a leakage line is arranged near the joint connector 320 and connected in series-parallel with a leakage detection line on the liquid cooling plate 310 in an external device such as a server. The following describes the hierarchical processing logic for a drain using a server as an example:
The leakage alarm is divided into three levels in total, wherein the first level alarm is that any one leakage sensor or leakage detection line detects leakage, a leakage signal is transmitted to a baseboard management controller (baseboard management controller, BMC) of a server to alarm at first time, the second level alarm is that when any one leakage sensor or leakage detection line detects leakage, the leakage duration lasts for more than 60 seconds, the server switches power supply to another power module, and the third level alarm is that when two leakage sensors or leakage detection lines detect leakage, or the leakage duration lasts for more than 120 seconds, the power module is powered down and enters protection.
Fig. 4 is a schematic structural diagram of a liquid cooling assembly 300 according to an embodiment of the present application, as shown in fig. 4, a liquid cooling plate 310 includes a heat conducting plate 311 and a liquid cooling tube 312, the liquid cooling tube 312 is embedded in a surface of the heat conducting plate 311 facing the main board 210, and one side of the liquid cooling tube 312 facing the main board 210 is flush with the heat conducting plate 311, the liquid cooling tube 312 includes a liquid inlet and a liquid outlet, and both the liquid inlet and the liquid outlet are connected with a joint connector 320.
As shown in fig. 4, the liquid cooling plate 310 is realized by a structure that the liquid cooling tube 312 is embedded in the heat conducting plate 311, and the liquid cooling tube 312 is positioned on one side of the heat conducting plate 311 close to the main board 210 and is flush with the surface of the heat conducting plate 311, so that heat transfer between the liquid cooling tube 312 and the main board assembly 200 is facilitated. The liquid cooling tube 312 may be a U-shaped tube or an S-shaped tube to extend the path of the cooling liquid in the heat conductive plate 311, thereby extending the residence time of the cooling liquid in the liquid cooling tube 312 and improving the heat dissipation efficiency. Only one type of U-shaped liquid cooled tube is shown in fig. 4. The liquid inlet and the liquid outlet of the liquid cooling pipe 312 are both positioned on the same side of the heat conducting plate 311, so that the liquid cooling pipeline in the external equipment connected with the power module is convenient to be laid, and meanwhile, the joint connector 320 is convenient to maintain. It is understood that the liquid inlet and the liquid outlet of the liquid cooling pipe 312 may be located at different sides of the heat conducting plate 311, and an additional liquid cooling pipe is required to be connected to the power module through the connector 320.
In a possible implementation manner, the preparation process of the liquid cooling plate 310 adopts a shallow pipe burying process, and the liquid cooling pipe 312 is flattened and then is milled with the heat conducting plate 311. The heat conductive plate 311 may be an aluminum plate or an aluminum alloy plate, and weight reduction and cost control are performed by using the weight reduction of aluminum. The liquid-cooled tube 312 is a copper tube, make full use of the height of copper pipe the heat is taken away by the heat conducting property, and the heat dissipation is convenient. The joint connector 320 is communicated with the liquid cooling pipe 312 through the joint connecting seat 330, the joint connecting seat 330 can be a copper block, specifically, the copper pipe is welded with the copper block into a whole, a threaded hole communicated with the copper pipe is formed in the copper block, the joint connector 320 is in threaded connection with the threaded hole in the copper block, and replacement and maintenance of the joint connector 320 are facilitated. The copper block and the aluminum alloy plate are welded into a whole, and the aluminum alloy plate is subjected to nickel plating treatment, so that the welding is easy. Copper pipe, copper billet collocation aluminium alloy plate heat conduction realizes the liquid cooling heat dissipation.
In some embodiments, the joint connector 320 is a quick connector to support electrohydraulic hot plug, facilitating later maintenance. The quick connector is a manual connector, but not limited to a manual connector, and may be a connector that is locked by an external locking mechanism such as a blind plug quick connector. The position of the quick connector may be selected on the same side as the first interface 211, such as a golden finger, on the motherboard 210, so that the liquid cooling pipeline inside the power module and other liquid cooling pipelines inside the external device can be coupled to share the same path of cooling liquid. The quick connector may also be located on the opposite side of the golden finger of the motherboard 210, and a liquid cooling pipeline of a power module is separately connected to the quick connector.
In some embodiments, the plurality of heat generating devices includes a first heat generating device 220, the power consumption of the first heat generating device 220 being greater than the power consumption of the remaining heat generating devices of the plurality of heat generating devices;
In the embodiment of the application, the power module carries out reconstruction design on the heating devices on the main board 210, so that the liquid cooling tube 312 on the liquid cooling board 310 is closest to the position with the largest heating value of the heating devices on the main board 210, thereby realizing the purpose of focusing on cooling the place with the largest heating value. Specifically, the internal high-power-consumption devices are arranged according to the positions of the liquid cooling pipes 312 in the liquid cooling plate 310, so that the heat transfer path can be shortened, and the liquid cooling plate 310 can be ensured to perform faster heat dissipation on the devices with high heat. It can be appreciated that the first heat generating device 220 in this embodiment may be one electrical device or one type of electrical device, and mainly aims to distinguish power consumption from other electrical devices.
Or the plurality of heat generating devices includes a second heat generating device 230, and the size of the second heat generating device 230 is larger than the sizes of the remaining heat generating devices of the plurality of heat generating devices along the normal direction of the main board 210;
the orthographic projection of the second heating device 230 on the liquid cooling plate 310 is a second projection, the second projection is located outside the layout area of the liquid cooling tube 312, and a simulated groove adapted to the second heating device 230 is arranged on one side of the liquid cooling plate 310 facing the main board 210.
In the embodiment of the application, the power module performs reconstruction design on the heating device on the main board 210, so that the liquid cooling tube 312 on the liquid cooling plate 310 is closest to the position with the largest heating value of the heating device on the main board 210, and thereby the place with the largest heating value is cooled again. But for some large-size electric devices with low power consumption, the electric devices can directly contact with the liquid cooling plate 310 to dissipate heat, and due to the limitation of the size of the accommodating space, the liquid cooling plate 310 adopts a profiling design, and the liquid cooling plate 310 forms a corresponding profiling groove for the second heating device 230, so that the second heating device 230 and the liquid cooling plate 310 are perfectly attached. It should be understood that the second heat generating device 230 may be one electrical device or one type of electrical device in this embodiment, and is mainly distinguished from the other electrical devices in terms of size, for example, the second heat generating device 230 is a capacitor 232 with a larger shape and a flyback transformer 231 with a higher shape. As shown in fig. 4, for the higher flyback transformer 231, the heat conductive plate 311 is provided with a profiling groove 3111, and for the larger capacitor 232, the heat conductive plate is provided with a profiling groove 3112.
It should be noted that, the liquid cooling plate 310 is filled with a high heat conduction interface material with each electric device on the main board 210, and the electric devices are tightly contacted by a certain extrusion deformation amount, so that the increase of thermal resistance caused by the generation of gaps is avoided, other irregular devices and devices with smaller volume on the main board 210 can not be directly bonded due to lower height and more dispersion, the liquid cooling pipeline can not be directly bonded, a heat conduction gel vacuum filling method is adopted for the devices, the heat conduction gel is filled between the devices, the heat transfer of the devices is realized, the heat is transferred from the high-temperature devices to the low-temperature liquid cooling plate 310, the heat conduction problem of the small-space devices is solved by the method, and after the heat is transferred to the liquid cooling plate 310, the heat is taken away by the cooling liquid.
In some embodiments, an annular insulating barrier 500 is disposed between the unitary structure and the housing 100 about the motherboard assembly 200. The housing 100 of the power module is usually made of metal, the annular insulating baffle 500 is arranged inside the housing 100, and the annular insulating baffle 500 is fixed on the integral structure through plastic screws, so that not only can the short circuit caused by metal be avoided, but also the inside of the housing 100 can have certain structural strength.
Fig. 5 is a schematic structural view of an upper housing 110 in a power module, fig. 6 is a schematic structural view of a lower housing 120 and a part of the structure in the power module, and as shown in fig. 5 and 6, the housing 100 includes an upper housing 110 and a lower housing 120, the upper housing 110 and the lower housing 120 are covered to form a containing space, and a guiding slot 101 is provided on a top plate 111 of the upper housing 110. In order to facilitate assembly with external devices such as a server, a guide groove 101 is provided at the top of the upper housing 110 of the power module along the assembly direction of the power module, so that accurate assembly can be achieved.
As shown in fig. 5, the upper case 110 includes a top plate 111, a first side plate 112, and a second side plate 113. The top plate 111 of the upper housing 110 is provided with a guide groove 101, which can be matched with a guide protrusion on an external device, so that the assembly and disassembly of the power module are facilitated. The first side plate 112 and the second side plate 113 are connected to form an L-shaped structure and are connected with the top plate 111, the first side plate 112 and the second side plate 113 are all closed plate bodies, hollow ventilation areas do not exist, the connector 320 of the liquid cooling tube 312 penetrates through the first side plate 112 and is connected with the first side plate 112 in a sealing mode, dust and other sundries are prevented from entering the accommodating space from the first side plate 112 or the second side plate 113, and therefore electronic devices inside the power supply module are affected.
As shown in fig. 6, the lower housing 120 includes a bottom plate 121, a third side plate 122 and a fourth side plate 123, the third side plate 122 and the fourth side plate 123 are connected to form an L-shaped structure, and are all connected to the bottom plate 121, the third side plate 122 and the fourth side plate 123 are all closed plates, there is no hollowed-out area, and dust and other impurities are prevented from entering the accommodating space from the third side plate 122 or the fourth side plate 123, thereby affecting the electronic devices inside the power module. The third side plate 122 is connected with a handle 130, and the push-pull and lifting of the whole power module can be realized through the handle 130, so that the power module is convenient to disassemble, assemble and transport. A second interface is also provided on the third side plate 122, which is electrically connected to the main plate 210, for connection to a municipal circuit. The fourth side plate 123 is provided with a buckle 140 near one end of the third side plate 122, the buckle 140 comprises a clamping part 141 and a driving part 142, and the clamping part 141 can extend or retract to the outer surface of the fourth side plate 123 by moving the driving part 142 so as to realize clamping locking or unlocking with external equipment, and the installation and the disassembly are convenient. It should be noted that, the main board 210 after vacuum infusion is fixed on the bottom board 121 by plastic screws, so as to avoid the short circuit of the main board 210 caused by metal contact. The second surface of the main board 210 faces the bottom board 121.
The power module provided by the embodiment of the application adopts liquid cooling heat dissipation, devices with high heat dissipation and high power consumption and liquid cooling pipes of the liquid cooling plate are placed on the same side through reconstructing the layout of the internal power devices, a heat transfer path is shortened, the liquid cooling plate is provided with a profiling structure to adapt to different power internal structures according to the requirements of devices with different sizes and the whole height of the power supply, irregularly-shaped devices are integrated in a mode of conducting gel vacuum infusion, a more uniform heat dissipation effect can be realized, the temperature gradient is reduced, the temperature control of the power module is ensured to be more stable during high-load operation, and in order to ensure the reliability of liquid cooling heat dissipation, the power module is also provided with a leakage disaster tolerance detection mechanism which alarms in the first time of leakage occurrence and enters a power module power-down protection mode according to sudden leakage, so that the use reliability of the power module is improved.
Compared with a power module adopting air cooling heat dissipation, the power module in the embodiment of the application does not need to use a fan, and can remarkably reduce system noise. This is particularly important in locations where a low noise environment is desired. And the front and back hole sealing of the power module directly avoids the contact between the hot air in the server and electronic devices in the power module, solves the problem of preheating the power module by hot air generated by other parts in the server, and simultaneously prevents dust from entering the server from the power module part, thereby protecting the environment in the server and the electronic devices.
All interfaces and communication in the power module with liquid cooling and heat dissipation are compatible with the air cooling power system, the technical bottleneck of a cold plate power supply is broken through, and the last short plate of the full cold solution scheme of the rack server is filled. The quick connector is coupled with the liquid cooling pipeline in the chassis, independent liquid supply is not needed, the cost is reduced, and the full liquid cooling and the full stack liquid cooling of the server can be adapted. Under the condition that the server is completely liquid-cooled and has no fan, the adoption of a liquid-cooled power supply is necessarily selected, and has important significance for realizing the complete liquid cooling and the complete stack liquid cooling of the server. In addition, the power module provided by the embodiment of the application has high adaptability to the existing server, the guide groove of the air-cooled power module is reserved, the free switching of the air-liquid power module can be realized, and the case structure is prevented from being modified, so that the operability is improved.
Liquid cooling heat dissipation generally has higher energy efficiency and can reduce energy consumption. Meanwhile, the liquid cooling is also beneficial to reducing the overall carbon emission of the system by reducing the number and the running time of the heat radiating equipment, and accords with the trend of green calculation and sustainable development.
Therefore, the power module provided by the embodiment of the application can better control the temperature of the power supply, further can improve the overall power, is suitable for a server with higher power, and breaks through the power limit. While providing higher supply power, the temperature is controlled to a lower range, reducing malfunctions and performance degradation due to overheating. The lower the temperature of the power supply module, the smaller the loss and the higher the conversion efficiency at the same output power.
In a second aspect, embodiments of the present application further provide a server, including a power module as in any one of the embodiments of the first aspect.
The power module assembled by the server provided by the embodiment of the application adopts liquid cooling heat dissipation, the connector of the liquid cooling plate in the power module can be directly connected with the liquid cooling pipeline inside the server, so that the full liquid cooling heat dissipation of the server is realized, the server is ensured to effectively dissipate heat under a high-load or high-temperature environment, the performance degradation of the power module and the whole server is avoided, and further, the fault caused by high temperature is avoided. Meanwhile, the leakage detection assembly of the power module can be directly compatible with a leakage detection system in the server, so that the server can take correct measures for leakage.
It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the present application without departing from the spirit and scope of the application. Thus, it is intended that the present application also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.