CN216871970U - Panel of flat panel detector - Google Patents

Abstract

The utility model provides a panel of a flat panel detector, which comprises a light-emitting substrate and a chip, wherein the light-emitting substrate comprises a bearing substrate and a light-emitting layer, the light-emitting layer is fixed on the outer surface of the bearing substrate and comprises a plurality of light-emitting units, the light-emitting layer is formed by weaving first conductive fibers and second conductive fibers in a warp-weft mode, at least one of the first conductive fibers and the second conductive fibers comprises a light-emitting material, and the chip is electrically connected with the light-emitting layer. The first conductive fibers and the second conductive fibers are woven into the mesh-shaped light emitting layer, the light emitting layer is fixed on the outer surface of the bearing substrate, free image conversion of the light emitting substrate can be realized through program control based on the chip so as to meet different customer requirements, and the panel of the flat panel detector is low in cost and environment-friendly.

Description

Panel of flat panel detector

Technical Field

The utility model belongs to the field of X-ray detector imaging, and relates to a flat panel detector panel.

Background

At present, the X-ray flat panel detector adopts a common carbon fiber carbon plate on the appearance surface, and is locked and attached by screws and fixed on a structural member. Then sticking a film made of PET (polyethylene terephthalate) material on the carbon plate to adapt to different pattern requirements of different customers. Although the method adopting the film can solve the problem of complex patterns, the film is not environment-friendly and inconvenient to rework, the waste back adhesive of the film is easy to adhere to the surface of the carbon plate, and once the carbon plate needs to be replaced, the carbon plate is relatively troublesome, and the waste film can pollute the environment; the problem of the pigment of the film is also solved when the film is pasted on the carbon plate, once the operable Area (AA Area for short) of the film has patterns, the image of the detector is influenced by different ink densities, and artifacts are formed when the detector images. And a small number of detectors are directly silk-screened on the carbon plate, but silk-screen patterns are difficult, can only be suitable for simple patterns and cannot meet the requirements of various customized customers, and the patterns are exposed outside and have the risk of being worn and erased after a long time.

Therefore, it is urgently needed to find a flat panel detector panel which is environment-friendly, suitable for various customer requirements, and does not affect the imaging of the detector and is convenient for reworking.

SUMMERY OF THE UTILITY MODEL

In view of the above disadvantages of the prior art, an object of the present invention is to provide a flat panel detector panel, which is used to solve the problems of the prior art that reworking of a film of a common detector panel is inconvenient, not environment-friendly, affects the imaging of a detector, and is not suitable for various customer requirements.

To achieve the above and other related objects, the present invention provides a flat panel detector panel, comprising:

the luminous substrate comprises a bearing substrate and a luminous layer, the luminous layer is fixed on the outer surface of the bearing substrate and comprises a plurality of luminous units, the luminous layer is formed by weaving first conductive fibers and second conductive fibers in a warp-weft mode, and at least one of the first conductive fibers and the second conductive fibers comprises a luminous material;

and the chip is electrically connected with the luminous layer.

Optionally, the light-emitting layer includes at least one first conductive fiber and at least one second conductive fiber therein.

Optionally, the crossing points of the first conductive fibers and the second conductive fibers constitute the light emitting unit.

Optionally, the chip is disposed at the bottom of the carrier substrate or embedded inside the carrier substrate.

Optionally, the chip includes a processor and a memory, the memory storing a program, the program being executed by the processor to implement the light emitting pattern conversion and/or the light emitting color conversion of the light emitting layer.

Optionally, a protective layer is disposed on a surface of the light emitting substrate having the light emitting layer.

Optionally, the protective layer includes one of a single-layer film structure or a multi-layer film structure, and the protective layer includes at least one of a waterproof layer and an antibacterial layer.

Optionally, a circuit port electrically connected to the chip and used for connecting an external circuit is further disposed in the light emitting substrate.

Optionally, a main switch for controlling the light emitting layer to emit light is disposed in the light emitting substrate.

Optionally, the flat panel detector panel further includes a detector housing, and the light-emitting substrate is mounted on the detector housing.

As described above, the flat panel detector panel of the present invention uses the mesh woven by the first conductive fibers and the second conductive fibers as the light emitting layer having the plurality of light emitting units, and the light emitting layer is fixed on the outer surface of the carrier substrate to form the light emitting substrate, so that the light emitting substrate is convenient to detach and simple to rework, the chip is used to control the light emission of each light emitting unit in the light emitting layer to further realize the panel to display images, the free change and switching of display patterns are realized through the control program in the memory in the chip, the requirements of various customers are met, and the flat panel detector panel has low power consumption and uniform density, and the occurrence of artifacts is prevented to influence the detector imaging. The utility model is also beneficial to the rework of the detector, does not generate redundant film sticking waste, reduces the cost and is environment-friendly. In addition, the protective layer is arranged on the outer surfaces of the light-emitting layer and the bearing substrate, so that the safety of a circuit is protected, and the high industrial utilization value is achieved.

Drawings

Fig. 1 is a flowchart illustrating a method for manufacturing a flat panel detector panel according to a second embodiment.

Fig. 2 is a schematic structural view showing the mesh light-emitting layer formed by the method for manufacturing a flat panel detector panel according to the second embodiment.

Fig. 3 is a schematic cross-sectional structure diagram of the flat panel detector panel according to the second embodiment of the present invention after the light-emitting layer is fixed to the outer surface of the carrier substrate.

Fig. 4 is a schematic cross-sectional structure diagram showing the method for manufacturing a flat panel detector panel according to the second embodiment after forming a protection layer.

Fig. 5 is a top view of the flat panel detector panel according to the second embodiment of the present invention, after the chip is embedded in the carrier substrate.

Fig. 6 is a schematic structural view showing the chip embedded in the carrier substrate in the method for manufacturing a flat panel detector panel according to the second embodiment.

FIG. 7 is a schematic cross-sectional view of a flat panel detector panel according to the present invention.

FIG. 8 is a front view of the flat panel detector panel showing silk screen and trademark images according to the present invention.

FIG. 9 is a schematic diagram of a flat panel detector panel displaying screen printing and trademark images according to the present invention.

Description of the element reference numerals

1a first conductive fiber

1b second conductive fiber

11 light emitting unit

12 light-emitting layer

2 bearing substrate

3 protective layer

4 chip

5 light-emitting substrate

51 Silk-screen printing

Trademark 52

6 casing of detector

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The utility model is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.

Please refer to fig. 1 to 9. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.

Example one

The present embodiment provides a flat panel detector panel, as shown in fig. 7, which is a schematic cross-sectional structure diagram of the flat panel detector panel, and includes a light-emitting substrate 5 and achip 4, wherein the light-emitting substrate 5 includes acarrier substrate 2 and a light-emitting layer 12, the light-emitting layer 12 is fixed on an outer surface of thecarrier substrate 2 and includes a plurality of light-emitting units 11, the light-emittinglayer 12 is woven by warp and weft first conductive fibers 1a and secondconductive fibers 1b, and at least one of the first conductive fibers 1a and the secondconductive fibers 1b includes a light-emitting material; thechip 4 is electrically connected to the light-emittinglayer 12.

As an example, the light emitting layer includes at least one first conductive fiber 1a and at least one secondconductive fiber 1 b.

As an example, the crossing points of the first conductive fibers 1a and the secondconductive fibers 1b constitute thelight emitting unit 11.

Specifically, the first conductive fiber 1a and the secondconductive fiber 1b are electrified, and since the electric field at the intersection between the first conductive fiber 1a and the secondconductive fiber 1b changes, the luminescent material is influenced by the electric field to generate electroluminescence, that is, theluminescent unit 11 is formed, which is similar to the luminescent principle of a flexible light emitting diode and has low power consumption.

As an example, thechip 4 is disposed at the bottom of thecarrier substrate 2 or embedded inside thecarrier substrate 2.

As an example, thechip 4 comprises a processor and a memory, in which a program is stored, which program is executed by the processor to achieve a conversion of the light emission pattern and/or a conversion of the light emission color of thelight emitting layer 12.

Specifically, thelight emitting layer 12 may display asilk screen 51, atrademark 52, or other images and fonts composed of available dots.

As an example, the light-emittingsubstrate 5 is provided with a protective layer 3 on the side having the light-emittinglayer 12.

As an example, the protective layer 3 includes one of a single-layer film structure or a multi-layer film structure, and the protective layer 3 includes at least one of a waterproof layer and an antibacterial layer.

Specifically, as shown in fig. 8, thesilk screen 51 and the trademark 52(LOGO for short) shown on the light-emitting substrate 5 are schematic diagrams, and thechip 4 controls the light-emitting unit 11 to emit light to control the light-emittingsubstrate 5 to display images.

Specifically, as shown in fig. 9, the front views of thesilk screen 51 and thetrademark 52 displayed on the light-emittingsubstrate 5 are shown, and when the light-emitting substrate 5 displays an image, only thesilk screen 51 is displayed, and no artifact occurs, so that the influence of the artifact on the imaging quality of the detector is avoided.

Specifically, the size, shape, color, and position information of thetrademark 52 displayed on the light-emittingsubstrate 5 may be controlled by the program.

Specifically, the information of the width, position, and operable area of thescreen print 51 displayed on the light-emittingsubstrate 5 may be set according to the condition of the machine, and remain unchanged after the setting is completed.

Specifically, a circuit port connected to an external circuit is provided on the light-emittingsubstrate 5, the pins of thechip 4 are electrically connected to an external power supply circuit through the circuit port, and thechip 4 executes the program to control part of the light-emittingunits 11 in the light-emittinglayer 12 to emit light, so as to form a visible light-emitting pattern in the light-emittinglayer 12, thereby realizing free switching of images displayed by the light-emittinglayer 12 in the light-emittingsubstrate 5.

Specifically, the light-emittingsubstrate 5 is further provided with a main switch for controlling the light-emittinglayer 12 to emit light, and when the light source is not needed, the main switch is controlled to turn off the power supply to the light-emittinglayer 12, so that the light-emittinglayer 12 does not operate.

By way of example, the flat panel detector panel further comprises adetector housing 6, and the light-emittingsubstrate 5 is mounted on thedetector housing 6.

The flat panel detector panel of this embodiment is through will by first conductive fiber 1a with secondconductive fiber 1b is wovenluminous layer 12 is fixed in order constituting on the carryingsubstrate 2luminous substrate 5 makespanel 5 dismantles conveniently, and the reworking is simple, and does not have unnecessary pad pasting discarded object to produce, and the cost is reduced and the environmental protection,luminous layer 12 utilizes electroluminescent's principle to launch the light, and the low power dissipation, density are even, only show luminous silk screen printing, have avoided producing the artifact, and the image detector is imaged. In addition, thechip 4 is used for controlling the operation of the light-emittingunit 11 in the light-emittinglayer 12, a circuit formed by thechip 4 and the light-emittinglayer 12 is programmed and stored in a memory in thechip 4, and the simple and free change of display patterns in the light-emittingsubstrate 5 is realized through the program, so that different requirements of customers are met.

Example two

The present embodiment provides a method for manufacturing a flat panel detector panel, as shown in fig. 1, in order to form a flowchart of the method for manufacturing the flat panel detector panel, the method includes the following steps:

s1: providing first conductive fibers and second conductive fibers, and weaving the first conductive fibers and the second conductive fibers into a mesh to form a light-emitting layer with a plurality of light-emitting units, wherein at least one of the first conductive fibers and the second conductive fibers comprises a light-emitting material;

s2: providing a bearing substrate, and fixing the light-emitting layer on the outer surface of the bearing substrate to obtain a light-emitting substrate;

s3: and providing a chip, and electrically connecting the chip with the luminous layer.

Referring to fig. 2, the step S1 is executed: providing a first conductive fiber 1a and a secondconductive fiber 1b, weaving the first conductive fiber 1a and the secondconductive fiber 1b into a mesh to form alight emitting layer 12 having a plurality of light emittingunits 11, wherein at least one of the first conductive fiber 1a and the secondconductive fiber 1b comprises a light emitting material.

As an example, as shown in fig. 2, the structure of thelight emitting layer 12 is a schematic diagram, and the crossing points of the first conductive fibers 1a and the secondconductive fibers 1b constitute thelight emitting unit 11.

Specifically, the light emitting color of thelight emitting unit 11 is related to the material of the light emitting material, and the light emitting color of thelight emitting unit 11 may be selected according to actual needs to be suitable for the first conductive fiber 1a and/or the secondconductive fiber 1 b.

Specifically, the thicknesses of the first conductive fibers 1a and the secondconductive fibers 1b may be selected as needed. In this embodiment, the diameter of the cross section of the first conductive fiber 1a and the secondconductive fiber 1b is greater than 1 μm.

Specifically, the light emission of thelight emitting unit 11 is controlled by controlling the electric field between the intersections of the first conductive fibers 1a and the secondconductive fibers 1 b.

Specifically, the shape and size of thelight emitting layer 12 formed by weaving the first conductive fibers 1a and the secondconductive fibers 1b into a mesh are determined according to actual needs, and are not limited herein, and the shape of the mesh in thelight emitting layer 12 includes a triangle, a quadrangle, or another suitable shape. In this embodiment, the grid in thelight emitting layer 12 is quadrilateral in shape.

Referring to fig. 3 to 4 again, the step S2 is executed: providing acarrier substrate 2, and fixing the light-emittinglayer 12 on the outer surface of thecarrier substrate 2 to obtain a light-emittingsubstrate 5.

By way of example, thecarrier substrate 2 comprises a carbon plate or other suitable material. In this embodiment, a carbon plate is used as thecarrier substrate 2.

Specifically, the shape, size and thickness of thecarrier substrate 2 can be selected according to actual needs, and are not limited herein.

As an example, as shown in fig. 3, in order to illustrate the cross-sectional structure of the light-emittinglayer 12 fixed on thecarrier substrate 2, a method for fixing the light-emittinglayer 12 on thecarrier substrate 2 includes a pressing method or other suitable methods. In this embodiment, a pressing technique is adopted to press thelight emitting layer 12 onto the outer surface of thecarrier substrate 2, and after the pressing technique, thelight emitting layer 12 and the commonflat panel detector 2 are pressed together, so that thelight emitting layer 12 and thecarrier substrate 2 form a whole to obtain thelight emitting substrate 5.

Specifically, in order to reinforce the structural strength of the first conductive fibers 1a and the secondconductive fibers 1b and prevent the electrical path in the light-emittinglayer 12 from being damaged during lamination, the light-emittinglayer 12 is further doped with carbon fibers to increase the strength of the light-emittinglayer 12, so that the light-emittinglayer 12 can be better laminated on the outer surface of thecarrier substrate 2 and is pressed together with thecarrier substrate 2.

As an example, the method further includes a step of forming a protective layer 3 on the surface of the light-emittingsubstrate 5 having the light-emittinglayer 12, and the protective layer 3 may include at least one of a waterproof layer and an antibacterial layer, and may be made of other suitable materials. In this embodiment, a polymer waterproof coating having waterproof property, crack resistance and good temperature adaptability is used as the protective layer 3, so as to protect the light-emittinglayer 12 and achieve a waterproof function, thereby preventing a short circuit between the light-emittinglayer 12 and thechip 4 and an external power source caused by a humid environment.

Specifically, as shown in fig. 4, in order to schematically illustrate the cross-sectional structure after the protective layer 3 is formed, a method for forming the protective layer 3 includes spin coating or other suitable methods.

Specifically, the protective layer 3 includes one of a single-layer film or a multilayer film, and the protective layer 3 includes at least one of a waterproof layer and an antibacterial layer.

Specifically, the protective layer 3 is made of a transparent material.

In particular, when the protective layer 3 comprises an antimicrobial coating, it is possible to meet the requirements of biocompatibility, i.e. to meet the requirement that the material causes the correct reaction at a specific part of the body.

Referring to fig. 5 to 7 again, the step S3 is executed: providing achip 4, and electrically connecting thechip 4 with the light-emittinglayer 12.

As an example, thechip 4 comprises a processor and a memory.

In particular, thechip 4 includes electronic circuitry and associated devices for controlling the light-emittinglayer 12.

Specifically, thechip 4 may control the operation state of any one or more of the light-emittingunits 11 in the light-emittinglayer 12, that is, simultaneously control the light-emitting and the light-off of one light-emittingunit 11 or a plurality of light-emittingunits 11.

As an example, as shown in fig. 5 and fig. 6, a top view of thechip 4 embedded in the back surface of thecarrier substrate 2 and a schematic view of thechip 4 embedded in the back surface of thecarrier substrate 2 are respectively shown, and thechip 4 may be placed at the bottom of thecarrier substrate 2 or embedded in thecarrier substrate 2, or may be at other suitable positions. In this embodiment, thechip 4 is placed on the back surface of thecarrier substrate 2 and embedded into the back surface to fix thechip 4.

Specifically, the light-emittingsubstrate 5 is further provided with a circuit port (not shown) electrically connected to the chip and used for connecting an external circuit.

As an example, the method further comprises the steps of providing adetector housing 6, and mounting the light-emittingsubstrate 5 on thedetector housing 6.

Specifically, as shown in fig. 7, in order to schematically illustrate the cross-sectional structure of the light-emittingsubstrate 5 mounted on thedetector housing 6, the method for mounting thepanel 5 on thedetector housing 6 includes screw locking, rivet riveting, bonding, or other suitable methods. In this embodiment, thepanel 5 is fixed to thedetector housing 6 by a screw locking method.

Specifically, after the light-emittingsubstrate 5 is mounted on thedetector housing 6, a circuit formed by the light-emittinglayer 12 and thechip 4 needs to be programmed as needed, and the programmed program is stored in the memory in thechip 4.

As an example, the program in the memory is executed by the processor to implement a light emission pattern conversion and/or a light emission color conversion of thelight emitting layer 12.

In the method for manufacturing the flat panel detector panel according to the embodiment, the first conductive fibers 1a and the secondconductive fibers 1b are woven into the mesh-shapedlight emitting layer 12, thelight emitting layer 12 is fixed on the outer surface of thecarrier substrate 2 to obtain thelight emitting substrate 5, and the protective layer 3 covering thelight emitting layer 12 and the outer surface of thecarrier substrate 2 is formed, so that thelight emitting layer 12 is protected, thelight emitting layer 12 is electrically connected with thechip 4, the processor in thechip 4 executes the program to control thelight emitting unit 11 in thelight emitting layer 12 to emit light, and the image display of thelight emitting substrate 5 is realized.

In summary, the flat panel detector panel of the present invention utilizes the first conductive fibers and the second conductive fibers to weave the mesh light emitting layer, and the light emitting layer is fixed on the carrier substrate to form the light emitting substrate, so that the panel is convenient to disassemble and simple to rework, and utilizes the protective layer to protect the circuit between the light emitting layer and the chip in the light emitting substrate, thereby preventing the short circuit or short circuit of the circuit, and then utilizes the chip to control each light emitting unit in the light emitting layer, so that the light emitting substrate can display images, and realize the free change of the display patterns of the light emitting substrate to meet various requirements of customers. Therefore, the present invention effectively overcomes various disadvantages of the prior art and has high industrial utilization value.

The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the utility model. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (10)

1. A flat panel detector panel, comprising:

the luminous substrate comprises a bearing substrate and a luminous layer, the luminous layer is fixed on the outer surface of the bearing substrate and comprises a plurality of luminous units, the luminous layer is formed by weaving first conductive fibers and second conductive fibers in a warp-weft mode, and at least one of the first conductive fibers and the second conductive fibers comprises a luminous material;

and the chip is electrically connected with the luminous layer.

2. The flat panel detector panel of claim 1, wherein: the luminescent layer comprises at least one first conductive fiber and at least one second conductive fiber.

3. The flat panel detector panel of claim 1, wherein: the crossing points of the first conductive fibers and the second conductive fibers form the light emitting unit.

4. The flat panel detector panel of claim 1, wherein: the chip is arranged at the bottom of the bearing substrate or embedded in the bearing substrate.

5. The flat panel detector panel of claim 1, wherein: the chip includes a processor and a memory, the memory having stored therein a program that is executed by the processor to implement a light emission pattern conversion and/or a light emission color conversion of the light emission layer.

6. The flat panel detector panel of claim 1, wherein: and a protective layer is arranged on one surface of the light-emitting substrate, which is provided with the light-emitting layer.

7. The flat panel detector panel of claim 6, wherein: the protective layer comprises one of a single-layer film structure or a multi-layer film structure, and the protective layer comprises at least one of a waterproof layer and an antibacterial layer.

8. The flat panel detector panel of claim 1, wherein: and a circuit port which is electrically connected with the chip and is used for connecting an external circuit is arranged in the light-emitting substrate.

9. The flat panel detector panel of claim 1, wherein: and a main switch for controlling the luminescence of the luminescent layer is arranged in the luminescent substrate.

10. The flat panel detector panel of claim 1, wherein: the flat panel detector panel further comprises a detector shell, and the light-emitting substrate is arranged on the detector shell.

Images