CN216248434U - Optical emission submodule and optical module - Google Patents

Abstract

The application provides a transmitter optical subassembly and an optical module, wherein the transmitter optical subassembly comprises a tube shell, a tube cap, a transmitter optical chip and a connecting circuit, a first cavity is arranged in the tube shell, an opening and a socket are arranged on the side wall of the tube shell, and the socket enables an electric connector to enter the first cavity; the pipe cap cover is buckled with the opening to form a second cavity; the light emitting chip is arranged in the second cavity, the linking circuit is arranged in the first cavity, and the linking circuit is electrically connected with the light emitting chip and the electric connector through the opening. The tube has been add to this application, be equipped with first cavity in the tube, the tube cap cover detains the tube and forms the second cavity, be equipped with linking circuit in the first cavity, be equipped with light emission chip in the second cavity, the one end of linking circuit is passed through the opening of tube and is connected with light emission chip electricity, the other end is connected with the electric connector electricity, directly be light emission chip transmission data signal through the electric connector promptly for the optical module has good high frequency transmission characteristic, better electromagnetic shield effect.

Description

Optical emission submodule and optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to a light emission submodule and an optical module.

Background

With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology become increasingly important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.

The existing optical module generally refers to an integrated module for photoelectric conversion, and for optical signal transmission, a laser chip is generally used to convert an electrical signal from an upper computer into an optical signal. In order to provide a flat optical bearing surface for a Laser chip, the Laser chip is usually disposed on a ceramic substrate, a conductive metal layer is coated on the surface of the ceramic substrate, the Laser chip is disposed on the conductive metal layer, one side of an EA region of an EML (electro-absorption Modulated Laser) chip is connected to a termination resistor, and the other side of the EA region is connected to a radio frequency signal line of the ceramic substrate and then connected to a flexible board and a circuit board through a pin.

However, with the requirement and development of high speed, the requirement on the package structure of an optical device is higher and higher, and the traditional TO-CAN tube seat transmits high-frequency signals through pins, so that the design of high-speed products is greatly limited due TO the limitation of bandwidth.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a transmitter optical subassembly and an optical module, and aims TO solve the problem that the traditional TO-CAN packaged transmitter optical subassembly transmits high-frequency signals limited by bandwidth and limits the development of a high-speed optical module.

In a first aspect, the present application provides a tosa comprising:

the shell comprises a shell, a first cavity and a second cavity, wherein the first cavity is arranged in the shell, an opening and a socket are arranged on the side wall of the shell, and the socket enables an electric connector to enter the first cavity;

the pipe cap covers and buckles the opening to form a second cavity;

the light emitting chip is arranged in the second cavity;

and the linking circuit is arranged in the first cavity, is electrically connected with the light emitting chip through the opening and is electrically connected with the electric connector.

In a second aspect, the present application provides an optical module, including the tosa of the first aspect and an electrical connector, where the electrical connector is inserted into a package of the tosa.

The light emission secondary module comprises a tube shell, a tube cap, a light emission chip and a connecting circuit, wherein a first cavity is arranged in the tube shell, an opening and a socket are formed in the side wall of the tube shell, and the socket enables an electric connector to enter the first cavity; the pipe cap cover is buckled with the opening to form a second cavity; the light emitting chip is arranged in the second cavity, the linking circuit is arranged in the first cavity, the linking circuit is electrically connected with the light emitting chip through the opening, and the linking circuit is electrically connected with the electric connector. The packaging mode of the light emission submodule is changed, the tube shell is added, the first cavity is arranged in the tube shell, the tube cap covers the tube shell to form the second cavity, the connecting circuit is arranged in the first cavity, the light emission chip is arranged in the second cavity, the electric connector is inserted into the first cavity, one end of the connecting circuit is electrically connected with the light emission chip through the opening, the other end of the connecting circuit is electrically connected with the electric connector, namely, the electric connector is used for transmitting data signals for the light emission chip, the traditional method that the data signals are transmitted through the pins is replaced, and the light emission submodule has good high-frequency transmission characteristics; and optical devices such as a light emitting chip, a connecting circuit, an electric connector and the like are packaged through a pipe cap and a pipe shell, so that the optical module has a better electromagnetic shielding effect.

Drawings

In order to more clearly illustrate the technical solutions in the present disclosure, the drawings needed to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art according to the drawings. Furthermore, the drawings in the following description may be regarded as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, the actual timing of signals, and the like, involved in the embodiments of the present disclosure.

FIG. 1 is a connection diagram of an optical communication system according to some embodiments;

FIG. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of a light module according to some embodiments;

FIG. 4 is an exploded view of a light module according to some embodiments;

fig. 5 is an assembly schematic diagram of a circuit board, a tosa, and a rosa in an optical module provided in the embodiment of the present application;

fig. 6 is a schematic structural diagram of an tosa according to an embodiment of the present disclosure;

fig. 7 is an exploded view of an tosa according to an embodiment of the present disclosure;

FIG. 8 is a cross-sectional view of a tosa provided by an embodiment of the present application;

fig. 9 is a schematic partial structure diagram of an tosa according to an embodiment of the present disclosure;

FIG. 10 is a partial front view of a tosa provided by an embodiment of the present application;

FIG. 11 is a schematic diagram of electrical connections of a tosa according to an embodiment of the present invention;

fig. 12 is a schematic structural diagram of a package in a tosa according to an embodiment of the present disclosure;

fig. 13 is a cross-sectional view of a package in a tosa according to an embodiment of the present invention;

FIG. 14 is a partially assembled cross-sectional view of a tosa and a circuit board according to an embodiment of the present invention;

fig. 15 is a schematic diagram illustrating an electrical connection between the tosa and the circuit board according to an embodiment of the present invention.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present disclosure belong to the protection scope of the present disclosure.

Unless the context requires otherwise, throughout the description and the claims, the term "comprise" and its other forms, such as the third person's singular form "comprising" and the present participle form "comprising" are to be interpreted in an open, inclusive sense, i.e. as "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless otherwise specified.

In describing some embodiments, expressions of "coupled" and "connected," along with their derivatives, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, some embodiments may be described using the term "coupled" to indicate that two or more elements are in direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents herein.

"at least one of A, B and C" has the same meaning as "A, B or at least one of C," each including the following combination of A, B and C: a alone, B alone, C alone, a and B in combination, a and C in combination, B and C in combination, and A, B and C in combination.

"A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

The use of "adapted to" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted to or configured to perform additional tasks or steps.

As used herein, "about," "approximately," or "approximately" includes the stated values as well as average values that are within an acceptable range of deviation for the particular value, as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system).

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so as to complete information transmission. Because the optical signal has the passive transmission characteristic when being transmitted through the optical fiber or the optical waveguide, the information transmission with low cost and low loss can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform interconversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electrical signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electrical port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides and the like through the optical port, realizes electrical connection with an optical network terminal (such as an optical modem) through the electrical port, and the electrical connection is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to the computer and other information processing equipment through a network cable or a wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes aremote server 1000, a localinformation processing device 2000, anoptical network terminal 100, anoptical module 200, anoptical fiber 101, and anetwork cable 103;

one end of theoptical fiber 101 is connected to theremote server 1000, and the other end is connected to theoptical network terminal 100 through theoptical module 200. The optical fiber itself can support long-distance signal transmission, for example, signal transmission of several kilometers (6 kilometers to 8 kilometers), on the basis of which if a repeater is used, ultra-long-distance transmission can be theoretically achieved. Therefore, in a typical optical communication system, the distance between theremote server 1000 and theoptical network terminal 100 may be several kilometers, tens of kilometers, or hundreds of kilometers.

One end of thenetwork cable 103 is connected to the localinformation processing device 2000, and the other end is connected to theoptical network terminal 100. The localinformation processing apparatus 2000 may be any one or several of the following apparatuses: router, switch, computer, cell-phone, panel computer, TV set etc..

The physical distance between theremote server 1000 and theoptical network terminal 100 is greater than the physical distance between the localinformation processing apparatus 2000 and theoptical network terminal 100. The connection between the localinformation processing device 2000 and theremote server 1000 is completed by theoptical fiber 101 and thenetwork cable 103; and the connection between theoptical fiber 101 and thenetwork cable 103 is completed by theoptical module 200 and theoptical network terminal 100.

Theoptical module 200 includes an optical port and an electrical port. The optical port is configured to connect with theoptical fiber 101, so that theoptical module 200 establishes a bidirectional optical signal connection with theoptical fiber 101; the electrical port is configured to be accessed into theoptical network terminal 100, so that theoptical module 200 establishes a bidirectional electrical signal connection with theoptical network terminal 100. Theoptical module 200 converts an optical signal and an electrical signal to each other, so that a connection is established between theoptical fiber 101 and theoptical network terminal 100. For example, an optical signal from theoptical fiber 101 is converted into an electrical signal by theoptical module 200 and then input to theoptical network terminal 100, and an electrical signal from theoptical network terminal 100 is converted into an optical signal by theoptical module 200 and input to theoptical fiber 101.

Theoptical network terminal 100 includes a housing (housing) having a substantially rectangular parallelepiped shape, and anoptical module interface 102 and anetwork cable interface 104 provided on the housing. Theoptical module interface 102 is configured to access theoptical module 200, so that theoptical network terminal 100 establishes a bidirectional electrical signal connection with theoptical module 200; thenetwork cable interface 104 is configured to access thenetwork cable 103 such that theoptical network terminal 100 establishes a bi-directional electrical signal connection with thenetwork cable 103. Theoptical module 200 is connected to thenetwork cable 103 via theoptical network terminal 100. For example, theoptical network terminal 100 transmits an electrical signal from theoptical module 200 to thenetwork cable 103, and transmits a signal from thenetwork cable 103 to theoptical module 200, so that theoptical network terminal 100 can monitor the operation of theoptical module 200 as an upper computer of theoptical module 200. The upper computer of theOptical module 200 may include an Optical Line Terminal (OLT) and the like in addition to theOptical network Terminal 100.

Theremote server 1000 establishes a bidirectional signal transmission channel with the localinformation processing device 2000 through theoptical fiber 101, theoptical module 200, theoptical network terminal 100, and thenetwork cable 103.

Fig. 2 is a structural diagram of an optical network terminal according to some embodiments, and fig. 2 only shows a structure of theoptical module 100 related to theoptical module 200 in order to clearly show a connection relationship between theoptical module 200 and theoptical network terminal 100. As shown in fig. 2, theoptical network terminal 100 further includes aPCB circuit board 105 disposed in the housing, acage 106 disposed on a surface of thePCB circuit board 105, and an electrical connector disposed inside thecage 106. The electrical connector is configured to access an electrical port of theoptical module 200; theheat sink 107 has a projection such as a fin that increases a heat radiation area.

Theoptical module 200 is inserted into acage 106 of theoptical network terminal 100, thecage 106 holds theoptical module 200, and heat generated by theoptical module 200 is conducted to thecage 106 and then diffused by aheat sink 107. After theoptical module 200 is inserted into thecage 106, an electrical port of theoptical module 200 is connected to an electrical connector inside thecage 106, and thus theoptical module 200 establishes a bidirectional electrical signal connection with theoptical network terminal 100. Further, the optical port of theoptical module 200 is connected to theoptical fiber 101, and theoptical module 200 establishes bidirectional electrical signal connection with theoptical fiber 101.

Fig. 3 is a block diagram of a light module according to some embodiments, and fig. 4 is an exploded view of a light module according to some embodiments. As shown in fig. 3 and 4, theoptical module 200 includes a housing, acircuit board 300 disposed in the housing, and an optical transceiver;

the shell comprises anupper shell 201 and alower shell 202, wherein theupper shell 201 is covered on thelower shell 202 to form the shell with twoopenings 204 and 205; the outer contour of the housing generally appears square.

In some embodiments of the present disclosure, thelower housing 202 includes a bottom plate and two lower side plates located at two sides of the bottom plate and disposed perpendicular to the bottom plate; theupper housing 201 includes a cover plate, and two upper side plates disposed on two sides of the cover plate and perpendicular to the cover plate, and is combined with the two side plates by two side walls to cover theupper housing 201 on thelower housing 202.

The direction of the connecting line of the twoopenings 204 and 205 may be the same as the length direction of theoptical module 200, or may not be the same as the length direction of theoptical module 200. For example, theopening 204 is located at an end (left end in fig. 3) of theoptical module 200, and theopening 205 is also located at an end (right end in fig. 3) of theoptical module 200. Alternatively, theopening 204 is located at an end of theoptical module 200, and theopening 205 is located at a side of theoptical module 200. Wherein, theopening 204 is an electrical port, and the gold finger of thecircuit board 300 extends out of theelectrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); theopening 205 is an optical port configured to receive the externaloptical fiber 101, so that theoptical fiber 101 is connected to an optical transceiver inside theoptical module 200.

Theupper shell 201 and thelower shell 202 are combined in an assembly mode, so that devices such as thecircuit board 300 and the optical transceiver can be conveniently installed in the shells, and theupper shell 201 and thelower shell 202 can form packaging protection for the devices. In addition, when the devices such as thecircuit board 300 are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of the devices are convenient to arrange, and the automatic implementation production is facilitated.

In some embodiments, theupper housing 201 and thelower housing 202 are generally made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, theoptical module 200 further includes an unlockingcomponent 203 located on an outer wall of a housing thereof, and the unlockingcomponent 203 is configured to realize a fixed connection between theoptical module 200 and an upper computer or release the fixed connection between theoptical module 200 and the upper computer.

Illustratively, the unlockingmembers 203 are located on the outer walls of the two lower side plates of thelower housing 202, and include snap-fit members that mate with a cage of an upper computer (e.g., thecage 106 of the optical network terminal 100). When theoptical module 200 is inserted into the cage of the upper computer, theoptical module 200 is fixed in the cage of the upper computer by the engaging member of the unlockingmember 203; when the unlockingmember 203 is pulled, the engaging member of the unlockingmember 203 moves along with the unlocking member, and the connection relationship between the engaging member and the upper computer is changed, so that the engagement relationship between theoptical module 200 and the upper computer is released, and theoptical module 200 can be drawn out from the cage of the upper computer.

Thecircuit board 300 includes circuit traces, electronic components, and chips, and the electronic components and the chips are connected together by the circuit traces according to a circuit design to implement functions of power supply, electrical signal transmission, grounding, and the like. The electronic components may include, for example, capacitors, resistors, transistors, Metal-Oxide-Semiconductor Field-Effect transistors (MOSFETs). The chip may include, for example, a Micro Controller Unit (MCU), a limiting amplifier (limiting amplifier), a Clock and Data Recovery (CDR) chip, a power management chip, and a Digital Signal Processing (DSP) chip.

Thecircuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear a chip; the rigid circuit board can also be inserted into an electric connector in the cage of the upper computer.

Thecircuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. Thecircuit board 300 is inserted into thecage 106 and electrically connected to the electrical connector in thecage 106 by gold fingers. The gold fingers may be disposed on only one side of the circuit board 300 (e.g., the upper surface shown in fig. 4), or may be disposed on both upper and lower sides of thecircuit board 300, so as to adapt to the situation where the requirement of the number of pins is large. The golden finger is configured to establish an electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like. Of course, a flexible circuit board is also used in some optical modules. Flexible circuit boards are commonly used in conjunction with rigid circuit boards to supplement the rigid circuit boards.

Fig. 5 is a schematic assembly diagram of a circuit board and an optical transceiver in an optical module according to an embodiment of the present disclosure. As shown in fig. 5, the optical transceiver includes antosa 400 and anrosa 500, which are respectively used for transmitting and receiving optical signals. Thetosa 400 generally includes a light emitter, a lens and a light detector, where the lens and the light detector are respectively located at different sides of the light emitter, the front and back sides of the light emitter respectively emit light beams, and the lens is used to converge the light beams emitted from the front side of the light emitter, so that the light beams emitted from the light emitter are converged light to be conveniently coupled to an external optical fiber; the optical detector is used for receiving the light beam emitted by the reverse side of the optical emitter so as to detect the optical power of the optical emitter. Specifically, light emitted by the light emitter enters the optical fiber after being converged by the lens, and the light detector detects the light emitting power of the light emitter so as to ensure the constancy of the light emitting power of the light emitter.

Fig. 6 is a schematic structural diagram of a tosa according to an embodiment of the present disclosure, fig. 7 is an exploded schematic diagram of the tosa according to an embodiment of the present disclosure, and fig. 8 is a cross-sectional view of the tosa according to an embodiment of the present disclosure. As shown in fig. 6, 7, and 8, thetosa 400 is packaged in a coaxial TO package, the optical emitter is a laser chip, the optical detector is a photodiode, the tosa further includes acap 410 and acase 420, an opening is formed at one end of thecase 420, thecap 410 covers the end of thecase 420 with the opening, and is in contact connection with a side surface of thecase 420, so that thecap 410 covers thecase 420 TO form a second cavity, and the optical devices such as the tosa, the optical detector, and the like of thetosa 400 are disposed in the second cavity. A first cavity is formed in thetube housing 420, and a socket is formed at the other end of thetube housing 420 and is communicated with the first cavity, so that theelectrical connector 600 can enter the first cavity through the socket.

In some embodiments, theelectrical connector 600 may be inserted directly into the first cavity of thepackage 420 through the socket, such that theelectrical connector 600 is electrically connected to the optical device, such as the light emitting chip, the optical detector, etc., in thecap 410 to drive the light emitting chip to emit the signal light.

In some embodiments, a flexible circuit board may be added, one end of the flexible circuit board may be inserted into the first cavity of thepackage 420 through the socket, and the other end of the flexible circuit board is electrically connected to theelectrical connector 600, so that theelectrical connector 600 transmits a driving signal to the light emitting chip in thecap 410 through the flexible circuit board to drive the light emitting chip to emit signal light.

Aceramic substrate 460 is disposed in the second cavity of thecap 410, alight emitting chip 470 is disposed on a side surface of theceramic substrate 460, one end of thelight emitting chip 470 may be electrically connected to a ground pad on theelectrical connector 600 through an opening, and the other end of thelight emitting chip 470 may be electrically connected to a data pad on theelectrical connector 600 through an opening, so that the electrical connection between the light emittingchip 470 and theelectrical connector 600 is achieved to drive thelight emitting chip 470 to emit a light signal.

In some embodiments, theelectrical connector 600 is inserted into the first cavity of thepackage 420, and theceramic substrate 460 and thelight emitting chip 470 disposed in the second cavity of thecap 410 are directly electrically connected to theelectrical connector 600 by wire bonding, instead of the conventional method of transmitting data signals through pins, so that the tosa has good high-frequency transmission characteristics; and theceramic substrate 460, thelight emitting chip 470, theelectrical connector 600 and other optical devices are encapsulated by thecap 410 and thepackage 420, so that the optical module has a better electromagnetic shielding effect.

In some embodiments, thetosa 400 may further include anengaging circuit 423, the engagingcircuit 423 is disposed in the first cavity of thepackage 420, theelectrical connector 600 is inserted into the first cavity of thepackage 420 through the socket, and a first signal pad is disposed at an end of theengaging circuit 423 facing the opening and a second signal pad is disposed at an end of theengaging circuit 423 facing the socket. As such, one end of thelight emitting chip 470 may be electrically connected to the ground pad in the first signal pad through the opening, and the other end of thelight emitting chip 470 may be electrically connected to the data pad in the first signal pad through the opening; the second signal pad is electrically connected to a pad on theelectrical connector 600 by wire bonding, so as to electrically connect thelight emitting chip 470 and theelectrical connector 600 through the connectingcircuit 423.

In some embodiments, when theengaging circuit 423 is disposed in the first cavity of thepackage 420, the engagingcircuit 423 may be disposed completely in the first cavity, or a part of theengaging circuit 423 may be disposed in the first cavity and another part may be disposed in the second cavity of thecap 410, so that the length of the wire bonding between the light emittingchip 470 and theengaging circuit 423 can be reduced.

Specifically, one end of theengaging circuit 423 is disposed in the first cavity of thepackage 420, and the other end of theengaging circuit 423 passes through the opening and is disposed in the second cavity of thecap 410; the end of the joiningcircuit 423 located in the second cavity is provided with a first signal pad, one end of thelight emitting chip 470 is electrically connected with a data pad in the first signal pad through a routing, and the other end of thelight emitting chip 470 is electrically connected with a ground pad in the first signal pad through a routing. The end of the connectingcircuit 423 located in the first cavity is provided with a second signal pad, and the second signal pad is electrically connected to the pad on theelectrical connector 600 through a routing wire.

In some embodiments, to facilitate fixing theceramic substrate 460 and theengaging circuit 423, a fixingprotrusion 424 is disposed on a side of thepackage 420 facing thecap 410, the fixingprotrusion 424 and an opening on thepackage 420 are located on the same side of thepackage 420, and thecap 410 is covered on the fixingprotrusion 424. Theceramic substrate 460 and theengaging circuit 423 are fixed on the fixingboss 424, respectively, and one end of theengaging circuit 423 is inserted into the first cavity of thepackage 420 through the opening.

In some embodiments, alens 430 is further disposed in the second cavity of thecap 410, thelens 430 is embedded on the inner wall of thecap 410, and thelens 430 is located in the light emitting direction of thelight emitting chip 470, so that the signal light generated by thelight emitting chip 470 under the driving of theelectrical connector 600 emitting the driving signal is converged by thelens 430 and then emitted.

Fig. 9 is a partial schematic structural diagram of a tosa according to an embodiment of the present disclosure, fig. 10 is a partial front view of the tosa according to an embodiment of the present disclosure, and fig. 11 is an electrical connection diagram of the tosa according to an embodiment of the present disclosure. As shown in fig. 9, 10 and 11, athin film resistor 480 and a firstsignal plating layer 4610 are further disposed on theceramic substrate 460, one end of thethin film resistor 480 is electrically connected to one end of thelight emitting chip 470 by a wire bonding, and the other end of thethin film resistor 480 is electrically connected to a ground pad in thefirst signal pad 4232 by a wire bonding; one end of the firstsignal plating layer 4610 is electrically connected to the other end of thelight emitting chip 470 by wire bonding, and the other end of the firstsignal plating layer 4610 is electrically connected to the data pad in thefirst signal pad 4232 by wire bonding.

In some embodiments, one end of thethin film resistor 480 is provided with afirst bonding pad 4810, the other end is provided with asecond bonding pad 4820, one end of thelight emitting chip 470 is electrically connected to thefirst bonding pad 4810 by wire bonding, and thesecond bonding pad 4820 is electrically connected to the ground bonding pad in the firstsignal bonding pad 4232 by wire bonding, so as to connect thethin film resistor 480 into the loop of thelight emitting chip 470.

In some embodiments, the first signal plating 4610 disposed on theceramic substrate 460 extends from a side away from thepackage 420 to a side close to thepackage 420, and one end of the first signal plating 4610 away from thepackage 420 is electrically connected to the other end of thelight emitting chip 470 by wire bonding, so as to reduce the length of the wire bonding between the first signal plating 4610 and thelight emitting chip 470; one end of the first signal plating 4610 near thepackage 420 is electrically connected to a data pad in thefirst signal pads 4232 by wire bonding to provide a high frequency signal to thelight emitting chip 470.

In some embodiments, thethin film resistor 480 and the firstsignal plating layer 4610 on theceramic substrate 460 are located on different sides of thelight emitting chip 470, thethin film resistor 480 is located on the left side of thelight emitting chip 470, and the firstsignal plating layer 4610 is located on the right side of thelight emitting chip 470, so as to reduce the total length of the wire bonding in the circuit connection of thelight emitting chip 470.

In some embodiments, thetosa 400 further includes a fixingframe 450, the fixingframe 450 is disposed between the fixingboss 424 and theceramic substrate 460, one side of the fixingframe 450 is fixed on the side of the fixingboss 424, and theceramic substrate 460 is fixed on the other side of the fixingframe 450, so that theceramic substrate 460 is fixed on the fixingboss 424 by the fixingframe 450.

The fixingframe 450 is provided with acapacitor 490, thesecond bonding pad 4820 at one end of thethin film resistor 480 is electrically connected to one end of thecapacitor 490 through a wire bonding, and the other end of thecapacitor 490 is electrically connected to a ground bonding pad in the firstsignal bonding pad 4232 through a wire bonding. That is, one end of thelight emitting chip 470 is electrically connected to thefirst bonding pad 4810 of thethin film resistor 480 by a wire bonding, thesecond bonding pad 4820 of thethin film resistor 480 is electrically connected to one end of thecapacitor 490 by a wire bonding, and the other end of thecapacitor 490 is electrically connected to the ground pad in thefirst signal pad 4232 by a wire bonding, so that thelight emitting chip 470 is electrically connected to thefirst signal pad 4232 by the transition of thethin film resistor 480 and thecapacitor 490.

In some embodiments, thetosa 400 further includes asemiconductor cooler 440, thesemiconductor cooler 440 is disposed between the fixingboss 424 and the fixingframe 450, thesemiconductor cooler 440 is disposed on the fixingboss 424, the fixingframe 450 is disposed on the cooling surface of thesemiconductor cooler 440, such that the heat generated by the operation of thelight emitting chip 470 is transmitted to thesemiconductor cooler 440 through theceramic substrate 460 and the fixingframe 450, the heat transmitted to thesemiconductor cooler 440 and the heat generated by the operation of thesemiconductor cooler 440 are transmitted to the fixingboss 424 and then to thepackage 420, such that the heat dissipation efficiency of thetosa 400 can be improved.

An anode electrode and a cathode electrode are arranged on the side surface of thesemiconductor refrigerator 440, and the anode and the cathode are respectively and electrically connected with corresponding bonding pads on the firstsignal bonding pad 4232 through routing so as to drive thesemiconductor refrigerator 440 to work and refrigerate.

In some embodiments, theoptical transmitting chip 470 is monolithically integrated by a Distributed Feedback Laser (DFB) and Electro-Absorption (EA) modulator, seeking to achieve wavelength matching of the DFB Laser and EA modulator to ensure that the output light of the Laser can pass through the modulator substantially without loss in the zero modulation bias state. One end of the EA area is electrically connected with one end of the firstsignal plating layer 4610 through a routing, and the other end of the firstsignal plating layer 4610 is electrically connected with a data pad in thefirst signal pad 4232 at one end of the linkingcircuit 423 through a routing so as to transmit a high-frequency signal to the EA area; the other end of the EA region is electrically connected to thefirst bonding pad 4810 at one end of thethin film resistor 480 by a wire, thesecond bonding pad 4820 at the other end of thethin film resistor 480 is electrically connected to one end of thecapacitor 490 on the fixingframe 450 by a wire, and the other end of thecapacitor 490 is electrically connected to the ground bonding pad in the firstsignal bonding pad 4232 at one end of the linkingcircuit 423 by a wire, so as to form a loop connection of thelight emitting chip 470. And theDFB laser 4710 on theoptical transmitting chip 470 can be directly electrically connected to the corresponding pad of thefirst signal pads 4232 by wire bonding to electrically connect theDFB laser 4710.

Specifically, a gold plating layer is further arranged on theceramic substrate 460, a firstsignal plating layer 4610 and a second signal plating layer are arranged on the gold plating layer, the second signal plating layer can be positioned below thelight emitting chip 470, one end of theDFB laser 4710 on thelight emitting chip 470 is electrically connected with one end of the second signal plating layer through a routing wire, and the other end of the second signal plating layer is electrically connected with a corresponding signal pad in thefirst signal pad 4232 through a routing wire; the portions of the gold-plated layer not provided with the firstsignal plating layer 4610 and the second signal plating layer can be electrically connected with corresponding grounding pads in thefirst signal pads 4232 through routing, so that the electrical connection between theDFB laser 4710 and the connectingcircuit 423 is realized.

Athermistor 4100 may be further disposed on the fixingframe 450, one end of thethermistor 4100 is electrically connected to the gold plating layer by a wire, and the other end of thethermistor 4100 is electrically connected to a corresponding ground pad in thefirst signal pad 4232 by a wire. That is, one end of theDFB laser 4710 on theoptical transmitting chip 470 is electrically connected to one end of the second signal plating layer by a wire bonding, and the other end of the second signal plating layer is electrically connected to a corresponding signal pad in thefirst signal pad 4232 by a wire bonding; the other end of theDFB laser 4710 is electrically connected to the gold plating on theceramic substrate 460 by a wire bond, the gold plating is electrically connected to one end of thethermistor 4100 by a wire bond, and the other end of thethermistor 4100 is electrically connected to a corresponding ground pad in thefirst signal pad 4232 by a wire bond to transmit signals to theDFB laser 4710 through thelink circuit 423.

Fig. 12 is a schematic structural diagram of a package in a tosa according to an embodiment of the present disclosure. As shown in fig. 12, the side of thehousing 420 where the fixingboss 424 is located is provided with anopening 4213, and theopening 4213 is communicated with thefirst cavity 4211 of thehousing 420, so that theengaging circuit 423 can be inserted into thefirst cavity 4211 of thehousing 420 through theopening 4213. Asocket 4214 is provided on the side of thehousing 420 opposite theopening 4213, thesocket 4214 communicating with thefirst cavity 4211 of thehousing 420 such that theelectrical connector 600 may be inserted into thefirst cavity 4211 of thehousing 420 through thesocket 4214.

In some embodiments, thetosa 400 may further include acover plate 422, awindow 4212 is disposed on a side of thetube housing 420 adjacent to theopening 4213, thewindow 4212 is in communication with thefirst cavity 4211 of thetube housing 420, and thecover plate 422 is covered and connected with thewindow 4212. Thus, when theadapter circuit 423 is inserted into thefirst cavity 4211 of thehousing 420 through theopening 4213 and theelectrical connector 600 is inserted into thefirst cavity 4211 of thehousing 420 through thesocket 4214, the installation position of theadapter circuit 423 and theelectrical connector 600 can be checked through thewindow 4212, and then thecover 422 is covered on thewindow 4212 of thehousing 420 to seal thefirst cavity 4211 of thehousing 420.

Fig. 13 is a cross-sectional view of a tube housing in an optical module according to an embodiment of the present application. As shown in fig. 13, alimit boss 4215 is disposed in thefirst cavity 4211 of thehousing 420, thelimit boss 4215 is disposed corresponding to theopening 4213, thelimit boss 4215 extends from the side where thesocket 4214 is located to the side where theopening 4213 is located, and an upper surface of thelimit boss 4215 is spaced from the front of theopening 4213. When the connectingcircuit 423 is inserted into thefirst cavity 4211 through theopening 4213, the bottom surface of the connectingcircuit 423 may abut against the upper surface of thelimit boss 4215, or may be located above the upper surface of thelimit boss 4215; when theelectrical connector 600 is inserted into thefirst cavity 4211 through thesocket 4214, the upper side of theelectrical connector 600 may be flush with the upper surface of thelimit boss 4215 to limit the insertion of theengaging circuit 423 and theelectrical connector 600 into thefirst cavity 4211 of thehousing 420.

In some embodiments, theengagement circuit 423 is provided with aceramic bump 4231, theceramic bump 4231 is located between thefirst signal pad 4232 and thesecond signal pad 4233, and theceramic bump 4231 is embedded in theopening 4213 of thepackage 420. Specifically, thefirst signal pad 4232 is located on one side of theceramic bump 4231, thesecond signal pad 4233 is located on the other side of theceramic bump 4231, and theengaging circuit 423 and theceramic bump 4231 fill theopening 4213, that is, the sum of the front and back thickness dimensions of theengaging circuit 423 and theceramic bump 4231 is equal to or less than the front and back thickness dimension of theopening 4213.

Fig. 14 is a partial assembly cross-sectional view of a tosa and a circuit board according to an embodiment of the present invention, and fig. 15 is a schematic diagram illustrating electrical connection between the tosa and the circuit board according to an embodiment of the present invention. As shown in fig. 14 and 15, the connecting circuit 423 is inserted into the first cavity 4211 through the opening 4213 at one end of the package 420, the connecting circuit 423 is fixed on the fixing boss 424, the semiconductor refrigerator 440 is fixed on the fixing boss 424, the fixing frame 450 is fixed on the refrigerating surface of the semiconductor refrigerator 440, the ceramic substrate 460 is fixed on the side surface of the fixing frame 450, the light emitting chip 470 is fixed on the side surface of the ceramic substrate 460, one end of the light emitting chip 470 is electrically connected with one end of the first signal plating layer 4610 on the ceramic substrate 460 by wire bonding, and the other end of the first signal plating layer 4610 is electrically connected with the data pad in the first signal pad 4232 on the connecting circuit 423 by wire bonding; then, the other end of the light emitting chip 470 is electrically connected to the first bonding pad 4810 at one end of the thin film resistor 480 by a wire bonding, the second bonding pad 4820 at the other end of the thin film resistor 480 is electrically connected to one end of the capacitor 490 on the fixing frame 450 by a wire bonding, and the other end of the capacitor 490 is electrically connected to the ground pad in the first signal bonding pad 4232 by a wire bonding, so as to electrically connect the light emitting chip 470 and the connecting circuit 423.

Theelectrical connector 600 is then inserted into thefirst cavity 4211 through thesocket 4214 at one end of thepackage 420, and thesecond signal pads 4233 at one end of theengaging circuit 423 and thepads 610 at one end of theelectrical connector 600 are correspondingly connected one by one to electrically connect theengaging circuit 423 and theelectrical connector 600, so that theelectrical connector 600 and thelight emitting chip 470 are electrically connected.

Then, thecap 410 is covered on the side of thepackage 420 having theopening 4213, and the optical devices such as thesemiconductor cooler 440, the fixingframe 450, theceramic substrate 460, thelight emitting chip 470, etc. are covered in thecap 410, so that thecap 410 and thepackage 420 form a closed space to ensure the hermetic package of thetosa 400.

In some embodiments, there may also be a non-hermetic fit between thecap 410 and thepackage 420 to achieve a non-hermetic package of thetosa 400.

In some embodiments, the structure of the package may be adjusted and changed as long as it can place the optical devices such as the ceramic substrate, the light emitting chip, the connection circuit, etc. in the first cavity of the package, so that the light emitting sub-module has a better electromagnetic shielding effect, which all belong to the protection scope of the embodiment of the present application.

In some embodiments, the electrical connector for transmitting signals inserted into the package through the socket is not limited to a circuit board, a flexible circuit board, but may also be a ceramic circuit board, an aluminum substrate, or other signal transmission media, as long as it can transmit signals between the circuit board and the light emitting chip, which all fall within the protection scope of the embodiments of the present application.

The light emission secondary module comprises a tube shell, a tube cap, a light emission chip and a connecting circuit, wherein a first cavity is arranged in the tube shell, an opening and a socket are arranged on the side wall of the tube shell, the opening and the socket are communicated with the first cavity, and an electric connector is inserted into the first cavity through the socket; the pipe cap cover is buckled with the opening to form a second cavity; the light emitting chip is arranged in the second cavity, the linking circuit is arranged in the first cavity, one end of the linking circuit is electrically connected with the light emitting chip through the opening, and the other end of the linking circuit is electrically connected with the electric connector. The packaging mode of the light emission submodule is changed, the tube shell is added, the first cavity is arranged in the tube shell, the tube cap covers the tube shell to form the second cavity, the connecting circuit is arranged in the first cavity, the light emission chip is arranged in the second cavity, the electric connector is inserted into the first cavity, one end of the connecting circuit is electrically connected with the light emission chip through the opening, the other end of the connecting circuit is electrically connected with the electric connector, namely, the electric connector is used for transmitting data signals for the light emission chip, the traditional method that the data signals are transmitted through the pins is replaced, and the light emission submodule has good high-frequency transmission characteristics; and optical devices such as a light emitting chip, an electric connector and the like are packaged through a pipe cap and a pipe shell, so that the optical module has a better electromagnetic shielding effect.

In some embodiments, the structure of the tosa is not limited TO the coaxial TO package, and the COB, BOX or other package forms adopt the tube shell TO improve the electromagnetic shielding effect, which all belong TO the protection scope of this patent.

Based on the tosa in the above embodiment, the present application further provides an optical module, where the optical module includes the tosa in the above embodiment and a circuit board, and the circuit board can be directly inserted into a tube shell of the tosa through a socket and electrically connected to a light emitting chip of a second cavity in a tube cap; one end of the connecting circuit can be electrically connected with the light emitting chip, the other end of the connecting circuit can be electrically connected with the circuit board, and the circuit board transmits a driving signal to the light emitting chip through the connecting circuit.

In the optical module provided by the application, the packaging mode of the optical emission submodule in the optical module is changed, a tube shell is added, a first cavity is arranged in the tube shell, a tube cap covers the tube shell to form a second cavity, a linking circuit is arranged in the first cavity, a light emitting chip is arranged in the second cavity, an electric connector is inserted into the first cavity, one end of the linking circuit is electrically connected with the light emitting chip through an opening, and the other end of the linking circuit is electrically connected with the electric connector, namely the data signal is transmitted to the light emitting chip through the electric connector, and the traditional data signal transmission through a pin is replaced, so that the light emitting submodule has good high-frequency transmission characteristics; and optical devices such as a light emitting chip, an electric connector and the like are packaged through a pipe cap and a pipe shell, so that the optical module has a better electromagnetic shielding effect.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims (10)

1. A tosa, comprising:

the shell comprises a shell, a first cavity and a second cavity, wherein the first cavity is arranged in the shell, an opening and a socket are arranged on the side wall of the shell, and the socket enables an electric connector to enter the first cavity;

the pipe cap covers and buckles the opening to form a second cavity;

the light emitting chip is arranged in the second cavity;

and the linking circuit is arranged in the first cavity, is electrically connected with the light emitting chip through the opening and is electrically connected with the electric connector.

2. The tosa of claim 1, wherein the engaging circuit has a first signal pad at one end and a second signal pad at the other end, the light emitting chip is electrically connected to the first signal pad through the opening, and the electrical connector is electrically connected to the second signal pad.

3. The tosa of claim 1, wherein one end of the engaging circuit is disposed in the second cavity through the opening, and the other end of the engaging circuit is disposed in the first cavity;

the light emitting chip is electrically connected with the first signal bonding pad, and the electric connector is electrically connected with the second signal bonding pad.

4. The tosa of claim 3, wherein the mating circuit is provided with a ceramic bump between the first signal pad and the second signal pad, the ceramic bump being embedded within the opening.

5. The tosa of claim 3, wherein a fixing boss is further disposed in the second cavity, and one end of the fixing boss is fixed to a sidewall of the tube shell; the light emitting chip and the connecting circuit are both arranged on the fixed boss.

6. The tosa of claim 5, further comprising:

the semiconductor refrigerator is arranged on the side surface of the fixed boss and is electrically connected with the first signal bonding pad;

the fixing frame is arranged on the refrigerating surface of the semiconductor refrigerator;

the ceramic substrate is arranged on the side surface of the fixing frame; the light emitting chip is arranged on the side surface of the ceramic substrate.

7. The tosa of claim 1, wherein the first cavity has a limiting boss disposed therein, the limiting boss corresponding to the socket, and the electrical connector is fixed to a side surface of the limiting boss.

8. The tosa of claim 1, wherein the connecting circuit is a ceramic connector and the electrical connector is a circuit board.

9. The tosa of claim 1, further comprising a lens embedded in the second cavity and located in a light exiting direction of the light emitting chip.

10. A light module comprising a tosa of any one of claims 1-9 and an electrical connector that plugs into a housing of the tosa.

Images