CN216057628U - PCB circuit board of engine controller - Google Patents

Abstract

The utility model discloses a PCB circuit board of an engine controller. The PCB circuit board main body comprises a top layer, and the top layer comprises a first device placing area; the first connector, the power filter circuit and the Boost circuit are sequentially arranged in the first device placement area along a first direction; the micro control module is arranged on a first edge of the first device placing area and on one side, away from the power supply filter circuit, of the Boost circuit, wherein the extending direction of the first edge is parallel to the first direction. The technical scheme provided by the utility model can meet the requirement of electromagnetic compatibility without adding a common-mode filter inductor on a power line, and reduces the hardware cost.

Description

PCB circuit board of engine controller

Technical Field

The embodiment of the utility model relates to the technical field of circuit board arrangement, in particular to a PCB (printed circuit board) of an engine controller.

Background

The engine controller is the most critical controller in the field of power assemblies and belongs to a safety part. In the process of designing hardware, the reliability and stability of the controller in the whole life cycle need to be considered, wherein one key index is electromagnetic Compatibility (EMC). EMC is divided into two parts: the first part is the ability of the controller to radiate/conduct Electromagnetic disturbance to the outside (Electromagnetic Interference EMI); the second part is the sensitivity of the controller to external ElectromagneTIc disturbances (Electromagetic susceptibilities EMS).

Because the engine controller has complex functions and numerous drivers, electromagnetic compatibility is often a key and difficult problem of hardware design. The existing design is that common mode filter inductance, pi type filter circuit and filter capacitance are added to improve the EMC performance of the controller. Particularly, a common-mode filter inductor is added to a power line, but the use of the common-mode filter inductor in the scheme causes higher cost and larger size, and the common-mode filter inductor generates heat seriously, which increases the temperature rise of the controller.

Disclosure of Invention

The utility model provides a PCB circuit board of an engine controller, which can meet electromagnetic compatibility without adding a common-mode filter inductor on a power line and reduce hardware cost.

The embodiment of the utility model provides a PCB circuit board of an engine controller, which comprises: the PCB comprises a PCB main body, a first connector, a power filter circuit, a Boost circuit and a micro control module;

the PCB circuit board main body comprises a top layer, and the top layer comprises a first device placing area;

the first connector, the power filter circuit and the Boost circuit are sequentially arranged in the first device placement area along a first direction; the micro control module is arranged on a first edge of the first device placing area and on one side, away from the power supply filter circuit, of the Boost circuit, wherein the extending direction of the first edge is parallel to the first direction.

Optionally, the power filter circuit includes an energy storage capacitor, and the energy storage capacitor is disposed between the Boost circuit and the first connector and is close to one side of a power input pin of the first connector.

Optionally, the Boost circuit includes a first inductor, a first capacitor, a second capacitor, a third capacitor, a first resistor, a second resistor, a first diode, and a first switch;

the wiring of the circuit connection of the first switch, the first resistor, the first capacitor and the second resistor is arranged on the top layer of the PCB circuit board main body;

the second capacitor and the first inductor are sequentially arranged along a second direction, and the second capacitor and the third capacitor are sequentially arranged along the first direction; the second capacitor is disposed between the third capacitor and the power filter circuit, wherein the first direction intersects the second direction.

Optionally, the micro control module includes a crystal oscillator and a micro control unit, and the crystal oscillator is adjacent to a crystal oscillator pin of the micro control unit.

Optionally, the micro control module further includes a core voltage circuit; the nuclear voltage circuit comprises a second switch, a second inductor, a fourth capacitor, a fifth capacitor and a third switch;

and the wiring of the circuit connection of the second switch, the second inductor, the fourth capacitor, the fifth capacitor, the second inductor, the fourth capacitor and the third switch is arranged on the top layer of the PCB circuit board main body.

Optionally, the PCB of the engine controller further includes at least one electrostatic capacitor, the first connector includes a pin pad, the electrostatic capacitor is connected to the pin pad, and a distance between the electrostatic capacitor and the pin pad is less than 10 mm.

Optionally, the PCB of the engine controller further includes a second connector, a U-chip, and at least two H-bridge circuit modules; the PCB circuit board main body further comprises a bottom layer, and the bottom layer comprises a second device placing area;

the second connector and the first H-bridge circuit module are sequentially arranged along a first direction; the first H-bridge circuit module, the U-chip and the second H-bridge circuit module are sequentially arranged in the second device placement area along a second direction; wherein the first direction intersects the second direction.

Optionally, the PCB of the engine controller further includes a diode freewheeling circuit and a CAN filter circuit;

the diode freewheeling circuit is arranged on one side of the first H-bridge circuit module, which is far away from the second connector; the CAN filter circuit is arranged on one side of the first H-bridge circuit module far away from the U-chip.

Optionally, the PCB of the engine controller further includes an oil injection chip, a CAN transceiver, an oxygen sensor, an oxygen heating circuit, and an oil injection driving circuit; the oil injection chip, the CAN transceiver and the oxygen sensor are arranged in the first device placing area; the oxygen heating circuit and the oil injection driving circuit are arranged in the second device placing area;

the oxygen sensor and the CAN transceiver are both arranged on one side of the Boost circuit, which is far away from the power supply filter circuit, and are sequentially arranged in the first device placing area along a first direction;

the oil injection chip is arranged on one side of the CAN transceiver, which is far away from the micro control module;

the oxygen heating circuit is arranged on one side of the CAN filter circuit, which is far away from the first H-bridge circuit module; the oil injection driving circuit is arranged on one side, far away from the second connector, of the oxygen heating circuit, and the projection of the oil injection driving circuit on the second device placing area is intersected with the projection of the oil injection chip on the first device placing area.

Optionally, the PCB of the engine controller further includes an ignition circuit, a signal input circuit, and a driving circuit; the ignition circuit, the signal input circuit and the driving circuit are arranged in the second device placing area;

the ignition circuit is arranged on one side of the oil injection driving circuit, which is far away from the oxygen heating circuit;

the driving circuit is arranged on one side of the U-chip far away from the second connector module; the driving circuit and the signal input circuit are sequentially arranged in the second device placing area along the first direction.

According to the technical scheme provided by the embodiment of the utility model, the first connector, the power supply filter circuit, the Boost circuit and the micro control module are arranged, so that the power supply filter circuit is close to the first connector, the radiation emission quantity of a low frequency band is reduced, the micro control module is arranged in the position of the first device placing area far away from the power supply filter circuit, and the electromagnetic interference between the micro control module and the power supply filter circuit is reduced. Through the reasonable layout of the PCB, the electromagnetic compatibility of the controller can be effectively improved, the electromagnetic compatibility can be met without adding a common-mode filter inductor on a power line, and the hardware cost is reduced.

Drawings

FIG. 1 is a schematic top-layer structure diagram of a PCB of an engine controller according to an embodiment of the present invention

Fig. 2 is a schematic diagram of an EMC experiment result of a long distance according to an embodiment of the present invention.

Fig. 3 is a schematic diagram of an EMC experiment result with a short distance according to an embodiment of the present invention.

Fig. 4 is a schematic circuit structure diagram of a Boost circuit according to an embodiment of the present invention.

Fig. 5 is a schematic structural diagram of a core voltage circuit according to an embodiment of the present invention.

Fig. 6 is a schematic structural diagram of a bottom layer of a PCB circuit board of an engine controller according to an embodiment of the present invention.

Fig. 7 is a schematic structural diagram of a bottom layer of a PCB circuit board of another engine controller according to an embodiment of the present invention.

Fig. 8 is a schematic structural diagram of a power supply unit in aU-chip 620 according to an embodiment of the present invention.

Fig. 9 is a schematic structural diagram of a top layer of a PCB circuit board of another engine controller according to an embodiment of the present invention.

Fig. 10 is a schematic circuit diagram of an oxygen sensor heating circuit according to an embodiment of the present invention.

Fig. 11 is a schematic structural diagram of an oil injection driving circuit according to an embodiment of the present invention.

Fig. 12 is a schematic structural diagram of a PCB layout of an oil injection driving circuit according to an embodiment of the present invention.

Fig. 13 is a schematic layout flow diagram of a PCB circuit board of an engine controller according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Fig. 1 is a schematic top-layer structure diagram of a PCB circuit board of an engine controller according to an embodiment of the present invention, referring to fig. 1, including: the PCB comprises a PCB main body, afirst connector 120, apower filter circuit 130, aBoost circuit 140 and amicro-control module 150.

The PCB circuit board body includes a top layer including a firstdevice placement region 110.

Thefirst connector 120, thepower filter circuit 130, and theBoost circuit 140 are sequentially arranged in the first device placement area along the first direction. Themicro control module 150 is disposed at a first edge of the first device placement region, and is disposed at a side of theBoost circuit 140 away from thepower filter circuit 130, wherein an extending direction of the first edge is parallel to the first direction.

Specifically, the PCB of the engine controller adopts double-sided cloth boards, namely a top layer and a bottom layer. The first device placement area is an area for placing top-layer devices on the PCB. In the mounting process, because the PCB needs to be subjected to reflow soldering, the devices with higher height and larger volume are arranged in the first device placing area on the top layer of the PCB. Exemplarily, the PCB circuit board is designed to be rectangular, wherein the size of the PCB circuit board is: 175X 180X 2, namely the width of the PCB is 175mm, the length of the PCB is 180mm, the thickness of the PCB is 2mm, a point A of a first device placing area on the top layer of the PCB is defined as a coordinate origin, coordinates are (0.0mm ), a plane coordinate system is established according to the point A, the first direction is the positive direction of the Y axis, and the second direction is the positive direction of the X axis. Thefirst connector 120 is used for providing a connection interface, and is connected with devices such as a sensor, a controller, a relay, a control valve and a motor outside the PCB through a connection harness, so that information interaction between the PCB of the engine controller and the outside is realized. Thefirst connector 120 has coordinates of (87.5mm, 13.3 mm). When thefirst connector 120 is used for device model selection, parameters such as dust prevention, water prevention, shock prevention, current flow capacity and PIN number need to be considered. Thepower filter circuit 130 and theBoost circuit 140 are sequentially arranged on the upper portion of thefirst connector 120 along a first direction, i.e., the Y-axis direction, themicro control module 150 belongs to a module which requires an important attention for EMC, and themicro control module 150 is far away from thepower filter circuit 130, wherein themicro control module 150 may be placed near a first edge of the first device placement area, wherein the first edge may be an AB edge or a CD edge. Themicro control module 150 may also be placed away from thepower filter circuit 130 and near the corners of the first device placement area, i.e., corners B and C. The exemplary placement of themicro-control module 150 at the C-angle, as opposed to themicro-control module 150 being located in a separate area, may reduce electromagnetic effects on nearby devices and also avoid electromagnetic cross-talk between themicro-control module 150 and thepower filter circuit 130.

According to the technical scheme provided by the embodiment of the utility model, the first connector, the power supply filter circuit, the Boost circuit and the micro control module are arranged, so that the power supply filter circuit is close to the first connector, the low-frequency radiation emission quantity of the power supply filter circuit is reduced, the micro control module is arranged in the first device placing area far away from the power supply filter circuit, and the electromagnetic interference between the micro control module and the power supply filter circuit is reduced. Through the reasonable layout of the PCB, the electromagnetic compatibility of the controller can be effectively improved, the electromagnetic compatibility can be met without adding a common-mode filter inductor on a power line, and the hardware cost is reduced.

Optionally, the power filter circuit includes an energy storage capacitor, and the energy storage capacitor is disposed between the Boost circuit and the first connector and is close to one side of the power input pin of the first connector.

Based on the above embodiments, specifically, the power supply filter circuit includes at least two energy storage capacitors with large capacitance values. In general, a large-capacitance energy storage capacitor may include an aluminum electrolytic capacitor. A first aluminum electrolytic capacitor is placed at a position close to the power input pin of the first connector. The first aluminum electrolytic capacitor is as close as possible to the power input pin of thefirst connector 120 without affecting the patch and without interfering with the first connector. The closer the capacitor is to the power input pin, the less low frequency noise the PCB of the engine controller will have. Illustratively, the coordinates of the first aluminum electrolytic capacitor are set to (95.1mm, 37.8mm) in the first sample, and the coordinates of the first aluminum electrolytic capacitor are set to (112.1mm, 68.5mm) in the second sample, and the first aluminum in the second sample is electrically separated from the power input pin compared to the first sample. Fig. 2 is a schematic diagram of an EMC experiment result with a long distance provided by an embodiment of the present invention, fig. 3 is a schematic diagram of an EMC experiment result with a short distance provided by an embodiment of the present invention, and referring to fig. 2 and fig. 3, by comparing the EMC experiment results, the radiation emission amount in a low frequency band is significantly reduced (a curve portion in the EMC experiment result with a short distance is lower than a curve portion in the EMC experiment result with a long distance).

Optionally, the power filter circuit further includes a plurality of electrostatic capacitors. The position of the electrostatic capacitor needs to be close to the power input pin of the first connector, and one electrostatic capacitor is correspondingly arranged on one power input pin. In the Y-axis direction, i.e. the upper portion, and the X-axis direction, i.e. the right side, of the first aluminum electrolytic capacitor, a plurality of ceramic capacitors with small capacitance values may be placed.

Based on the above embodiment, illustratively, a first differential-mode filter inductor is disposed on the upper portion of a ceramic capacitor, and the coordinates of the first differential-mode filter inductor are (97.3mm, 52.7 mm). A ceramic capacitor is arranged on the upper portion of the first differential-mode filter inductor, a second aluminum electrolytic capacitor is arranged on the right side of the first differential-mode filter inductor, namely in the X-axis direction of the first differential-mode filter inductor, and the coordinates of the second aluminum electrolytic capacitor are (112.7mm, 53.4 mm). The second aluminum electrolytic capacitor, the first differential mode filter inductor and the first aluminum electrolytic capacitor jointly form a first-stage pi-shaped filter circuit.

And a second differential mode filter inductor is arranged on the upper part of the first differential mode filter inductor, wherein the coordinates of the second differential mode filter inductor are (97.3mm, 69.2 mm). And a third aluminum electrolytic capacitor is arranged on the upper part of the second differential mode filter inductor, wherein the coordinates of the third aluminum electrolytic capacitor are (97.6mm, 84.4mm), and a fourth aluminum electrolytic capacitor is arranged on the right side of the third aluminum electrolytic capacitor C14, wherein the coordinates of the fourth aluminum electrolytic capacitor are (110.9mm, 81.6 mm). The second differential mode filter inductor, the third aluminum electrolytic capacitor and the fourth aluminum electrolytic capacitor jointly form a second-stage pi-shaped filter circuit.

Based on the above embodiments, fig. 4 is a schematic circuit structure diagram of a Boost circuit provided in an embodiment of the present invention, referring to fig. 4, the Boost circuit includes a first inductor L3, a first capacitor C16, a second capacitor C17, a third capacitor C18, a first resistor R1, a second resistor R2, a first diode D1, and a first switch 1;

the wiring of the circuit connection of the first switch 1, the first resistor R1, the first capacitor C16 and the second resistor R2 is arranged on the top layer of the PCB circuit board main body;

the second capacitor C17 and the first inductor L3 are arranged in sequence along a second direction, and the second capacitor C17 and the third capacitor C18 are arranged in sequence along the first direction; the second capacitor is disposed between the third capacitor and the power filter circuit, wherein the first direction intersects the second direction.

Specifically, after the second stage of the pi-type filter circuit, the power supply of the Boost circuit is VBAT. Referring to fig. 1, in the PCB layout, theBoost circuit 140 is disposed on a side of thepower filter circuit 130 away from thefirst connector 120 along the first direction. In the layout process, the first inductor L3 needs to be placed on the side of the third aluminum electrolytic capacitor far from the first connector, i.e. on the upper part of the third aluminum electrolytic capacitor. The first inductor L3, the first diode D1, the second capacitor C17, and the third capacitor C18 need to be placed as close as possible to each other, wherein the second capacitor C17 and the first inductor L3 are placed in sequence along the second direction, i.e., the X-axis direction, and the second capacitor C17 and the third capacitor C18 are placed in sequence along the first direction, i.e., the Y-axis direction. Illustratively, in practical design, the second capacitor C17 is placed on the right side of the first inductor L3, wherein the first inductor L3 has coordinates of (97.3mm, 99.7mm) and the second capacitor C17 has coordinates of (114.3mm, 97.9 mm). The third capacitor C18 is placed on top of the second capacitor C17, where the coordinates of the third capacitor C18 are (114.3mm, 117.0 mm). Referring to fig. 3, a first terminal of the first inductor L3 is connected to the power source VBAT, and a second terminal of the first inductor L3 is connected to a first terminal of the first switch 1, a first terminal of the second resistor R2, and an anode of the first diode D1, respectively. The second end of the first switch 1 is connected with the first resistor R1 and then grounded, the second end of the second resistor R2 is connected with the first capacitor C16 and then grounded, the cathode of the first diode D1 is respectively connected with the first poles of the second capacitor C17 and the third capacitor C18, the first poles of the second capacitor C17 and the third capacitor C18 are both connected with the VBOOST power supply, and the second poles of the second capacitor C17 and the third capacitor C18 are connected with the ground. When the first switch 1 is turned on, the current flows through the first inductor L3, the first switch 1 and the first resistor R1 to ground, and the first inductor L3 stores energy. When the first switch 1 is turned off, the first inductor L3 releases energy to charge the second capacitor C17 and the third capacitor C18 through the first diode D1. The second capacitor C17 and the third capacitor C18 are energy-storing aluminum electrolytic capacitors. The second resistor R2 and the first capacitor C16 are connected in series to absorb high-frequency noise generated when the first switch 1 is turned on and off, so in the layout of the PCB circuit board, the circuit of the first switch 1, the first resistor R1, the first capacitor C16 and the second resistor R2 is as short as possible, and the circuit distribution needs to be arranged on a circuit board on the same layer of the PCB circuit board.

Optionally, the micro control module includes a crystal oscillator and a micro control unit, and the crystal oscillator is disposed adjacent to a crystal oscillator pin of the micro control unit.

Specifically, referring to fig. 1, themicro control module 150 is far away from thepower filter circuit 130, wherein themicro control module 150 may be disposed near a first edge of the first device disposing region, wherein the first edge may be an AB edge or a CD edge. Themicro control module 150 may also be placed away from thepower filter circuit 130 and near the corners of the first device placement area, i.e., corners B and C. Illustratively, placing themicro control module 150 in the upper right corner of the PCB board, i.e., corner C, themicro control module 150 has coordinates of (144.5m, 156.7 mm). Themicro control module 150 is relatively located in a separate area to reduce electromagnetic effects on adjacent devices. The crystal oscillator is arranged near, i.e. close to, the corresponding pins of the micro control unit of themicro control module 150, and no traces are provided under the crystal oscillator. Other devices are not placed in a certain range around the packaging of the micro control unit, and exemplarily, other devices are not placed in a range of 3mm around the packaging of the micro control unit, so that later maintenance and repair are facilitated.

Fig. 5 is a schematic structural diagram of a core voltage circuit provided in an embodiment of the present invention, and referring to fig. 5, the micro control module further includes a core voltage circuit. The core voltage circuit comprises a second switch 2, a second inductor L4, a fourth capacitor C21, a fifth capacitor C19 and athird switch 3.

The second switch 2, the second inductor L4, the fourth capacitor C21 and the fifth capacitor C19 form a first loop. The second inductor L4, the fourth capacitor C21 and thethird switch 3 form a second loop. The wiring of the first loop and the second loop is arranged on the top layer of the PCB circuit board main body.

Specifically, the core voltage circuit is essentially a Buck circuit, the second switch 2 and thethird switch 3 are controlled by the micro control module, and the control signals of the second switch 2 and thethird switch 3 are high-frequency PWM signals, so that the core voltage circuit should not be too far away from themicro control module 150, otherwise, the EMI problem may be introduced due to too long routing distance of the control signals of the second switch 2 and thethird switch 3. The output voltage of the nuclear voltage circuit is adjusted by adjusting the duty ratio of the control signal of the second switch 2. Referring to fig. 5, a first terminal of the fifth capacitor C19 is connected to a 5V power supply, and a second terminal of the fifth capacitor C19 is grounded. The first end of the second switch 2 is connected to the first end of the fifth capacitor C19, the second end of the second switch 2 is connected to the first end of thethird switch 3 and then to the first end of the second inductor L4, and the second end of the second inductor L4 is connected to a 1.3V power supply. The second terminal of thethird switch 3 is grounded, the first pole of the ninth capacitor C20 is connected to the first terminal of the second inductor L4, and the second pole of the ninth capacitor C20 is grounded. The first pole of the fourth capacitor C21 is connected to the second terminal of the second inductor L4, and the second pole of the fourth capacitor C21 is grounded. The second switch 2 and thethird switch 3 cannot be turned off or closed at the same time, when the second switch 2 is closed, thethird switch 3 is turned off, the circuit is connected to a 5V power supply, and current flows through the second switch 2 and the second inductor L4 to a load powered by 1.3V. When the second switch 2 is turned off, thethird switch 3 is closed, and the current flows through the fourth capacitor C21, thethird switch 3 and the second inductor L4 to form a closed loop, so as to play a role of freewheeling. When the PCB is arranged, the arrangement of two loops needs to be considered in an important way. The second switch 2, the second inductor L4, the fourth capacitor C21 and the fifth capacitor C19 form a first loop. The second inductor L4, the fourth capacitor C21 and thethird switch 3 form a second loop. The wiring of the two loops is required to be as short as possible during PCB layout, and the devices of the first loop and the second loop need to be arranged on the same layer, namely the top layer or the bottom layer, so that the radiation emission energy of the buck circuit can be reduced. For example, the second switch 2 and thethird switch 3 may use MOSFET switch tubes, and in this embodiment, the second switch 2 and thethird switch 3 may be integrated in a package, and a Partnumber device of the company of the english-flimsy may be used, wherein the model is BSZ15DC02 KDH.

Optionally, the PCB of the engine controller further includes at least one electrostatic capacitor, the first connector includes a pin pad, the electrostatic capacitor is connected to the pin pad, and a distance between the electrostatic capacitor and the pin pad is less than 10 mm.

Specifically, each PIN of thefirst connector 120 corresponds to an electrostatic capacitor, the electrostatic capacitor is placed near the PIN of the PIN tube of the first connector, the distance between the electrostatic capacitor and the PIN pad of the corresponding connector is not more than 10mm, and the lead inductance is increased by overlong routing between the electrostatic capacitor and the PIN pad.

Based on the above embodiments, fig. 6 is a schematic structural diagram of a bottom layer of a PCB circuit board of an engine controller according to an embodiment of the present invention, and referring to fig. 6, the PCB circuit board of the engine controller further includes asecond connector 610, aU-chip 620, and at least two H-bridge circuit modules. The PCB circuit board body further includes a bottom layer including a seconddevice placement region 650.

Thesecond connectors 610 and the first H-bridge circuit modules are arranged in sequence along the first direction. The first H-bridge circuit module, theU-chip 620, and the second H-bridge circuit module are sequentially arranged in the seconddevice placing region 650 along the second direction. Wherein the first direction intersects the second direction.

Specifically, the PCB of the engine controller adopts double-sided cloth boards, namely a top layer and a bottom layer. The seconddevice placement area 650 is an area where the bottom devices on the PCB are placed, and thesecond connector 610, theU-chip 620, and the at least two H-bridge circuit modules are all placed in the seconddevice placement area 650. Similarly, point a of the seconddevice placement area 650 on the bottom layer of the PCB is defined as the origin of coordinates (0.0mm ), a planar coordinate system is established according to point a, the first direction is the positive direction of the Y axis, and the second direction is the positive direction of the X axis. Wherein the four vertices of the seconddevice placement region 650 correspond to the four vertex positions of the first device placement region. For theU-chip 620, its main functions include power supply, driving, CAN transceiving, etc., and it is a chip that needs to be considered in the PCB circuit layout, and the periphery of the chip includes many peripheral circuits, including MOSFET, capacitor, and resistor, etc. Illustratively, the coordinates of theU-chip 620 may be (138.4mm, 84.8mm), and considering that theU-chip 620 requires external devices for use, theU-chip 620 is located close to thesecond connector 610, thereby reducing the trace length. For an H-bridge circuit. Often need a plurality of H bridge circuit cooperations to use at engine controller, combine PCB circuit board space, set up two parts H bridge circuit module, distribute H bridge circuit in two H bridge circuit modules. Illustratively, the embodiment of the present invention provides 5H-bridge circuits, wherein two H-bridge circuits are placed in the corresponding second H-bridge circuit block 640 at the right side of theU-chip 620, i.e. near the DC side. The other three H-bridge circuits are placed in the first H-bridge circuit block 630 on the side of theU-chip 620 away from the second H-bridge circuit block 640 on the right side. The H-bridge circuit can adopt an H-bridge driving chip. The H-bridge driver chip needs to be close to thesecond connector 610, so that the routing length is reduced as much as possible, and differential routing is needed for the drive output of the H-bridge driver chip. In order to improve the EMC performance of the controller PCB, a 100nF capacitor may be added to each of the drive output PINs of the H-bridge driver chip, wherein one H-bridge driver chip may drive one motor and includes two drive output PINs, and the capacitor needs to be placed close to the PIN PINs of thesecond connector 610. Illustratively, the coordinates of the first H-bridge driver chip are (159.3mm, 40.7mm), the coordinates of the second H-bridge driver chip are (159.3mm, 63.2mm), the coordinates of the third H-bridge driver chip are (78.1mm, 40.7mm), the coordinates of the fourth H-bridge driver chip are (78.1mm, 62.0mm), and the coordinates of the fifth H-bridge driver chip are (78.1mm, 101.3 mm).

Based on the above embodiment, fig. 7 is a schematic structural diagram of a bottom layer of a PCB circuit board of another engine controller according to an embodiment of the present invention, and referring to fig. 7, the PCB circuit board of the engine controller further includes adiode freewheel circuit 710 and aCAN filter circuit 720.

Thediode freewheel circuit 710 is disposed on a side of the first H-bridge circuit module remote from thesecond connector 610. TheCAN filter circuit 720 is disposed on a side of the first H-bridge circuit block away from theU-chip 620.

Specifically, fig. 8 is a schematic structural diagram of a power supply unit in theU-chip 620 according to the embodiment of the present invention, and referring to fig. 8, theU-chip 620 further includes a power supply unit, the power supply unit mainly includes a buck circuit for generating an on-board 6V voltage, wherein a first pole of the seventh capacitor C22 is connected to a +12V power supply, and a second pole of the seventh capacitor C22 is grounded. A first terminal of thefourth switch 4 is connected to the first terminal of the seventh capacitor C22, and a second terminal of thefourth switch 4 is connected to the first terminal of the third resistor R3, the cathode of the second diode D2, and the first terminal of the third inductor L5, respectively. The second end of the third inductor L5 is connected to the +6V power supply load, and the second end of the third resistor R3 is connected to the eighth capacitor C23 and then grounded. The anode of the second diode D2 is grounded. A first pole of the sixth capacitor C24 is connected to the second terminal of the third inductor L5, and a second pole of the sixth capacitor C24 is grounded.

When thefourth switch 4 is closed, current flows through thefourth switch 4 and the third inductor L5 into the +6V power supply load. When thefourth switch 4 is turned off, the current has two loops, namely a fourth loop formed by a third inductor L5, a sixth capacitor C24 and a second diode D2, and a fifth loop formed by a third inductor L5, a sixth capacitor C24, an eighth capacitor C23 and a third resistor R3, and the two loops play a role of freewheeling. When the circuit layout of the PCB is performed, the layout of three loops, namely, the third loop formed by thefourth switch 4, the third inductor L5, the sixth capacitor C24 and the seventh capacitor C22, needs to be considered. A fourth loop consisting of the third inductor L5, the sixth capacitor C24 and the second diode D2. A fifth loop consisting of the third inductor L5, the sixth capacitor C24, the eighth capacitor C23 and the third resistor R3. The three circuits are as short as possible in the PCB circuit layout, and related components of the third circuit, the fourth circuit and the fifth circuit need to be arranged on the same layer, namely the top layer or the bottom layer, so as to reduce the radiation emission energy of the buck circuit. Illustratively, thefourth switch 4 typically uses a MOSFET transistor.

The driving units in theU-chip 620 are divided into three major parts, a low-side driving circuit, a high-side driving circuit and a pre-driving circuit. The most of the driving circuits need to add thediode freewheel 710, thediode freewheel 710 needs to be placed close to thesecond connector 610, and thediode freewheel 710 is placed on the side of the first H-bridge circuit module 630 away from thesecond connector 610 to reduce the freewheel loop area. The freewheeling diode in thediode freewheeling circuit 710 of the low-side driver circuit has its anode connected to thesecond connector 610 and its cathode connected to the power supply VBAT. The freewheeling diode of thediode freewheel circuit 710 of the high-side driver circuit has its anode grounded and its cathode connected to thesecond connector 610. The pre-driving circuit realizes the function of low-side driving through peripheral devices, wherein the anode of a fly-wheel diode is connected with a connector, and the cathode of the fly-wheel diode is connected with a power supply VBAT.

In the CAN transceiver unit in theU-chip 620, the corresponding external TVS diode, capacitor, terminal matching resistor and common mode filter inductor need to be placed in theCAN filter circuit 720, theCAN filter circuit 720 is disposed away from theU-chip 620, but is placed close to thesecond connector 610, wherein the common mode filter inductor needs to be away from theU-chip 620, wherein two signal lines CANH and CANL of the CAN transceiver unit need to be differentially routed, and the differential impedance is 120 ohms.

Based on the above embodiment, fig. 9 is a schematic structural diagram of a top layer of a PCB circuit board of another engine controller according to an embodiment of the present invention, referring to fig. 9 and continuing to refer to fig. 7, the PCB circuit board of the engine controller further includes anoil injection chip 910, aCAN transceiver 920, anoxygen sensor 930, anoxygen heating circuit 730, and an oilinjection driving circuit 740.Oil spout chip 910, CANtransceiver 920, andoxygen sensor 930 are placed in firstdevice placement area 110. Theoxygen heating circuit 730 and the oilinjection driving circuit 740 are disposed in the seconddevice disposition region 650.

Theoxygen sensor 930 and theCAN transceiver 920 are disposed on a side of theBoost circuit 140 away from thepower filter circuit 130, and are sequentially arranged in the firstdevice placement area 110 along the first direction.

Oil-spraying chip 910 is disposed on the side ofCAN transceiver 920 away frommicro-control module 150.

Theoxygen heating circuit 730 is disposed on the side of theCAN filter circuit 720 remote from the first H-bridge circuit module. Oiljet drive circuit 740 is disposed on a side ofoxygen heating circuit 730 remote fromsecond connector 610, wherein a projection of oiljet drive circuit 740 on the second device placement area intersects a projection ofoil jet chip 910 on the first device placement area.

Specifically,oxygen sensor 930 includes a front oxygen sensor that requires a dedicated oxygen sensor chip to be matched and a rear oxygen sensor that employs a "two-point" discrete circuit. In the PCB layout, the front oxygen sensor chip is placed in the middle of the firstdevice placement area 110 on the top layer of the PCB, wherein the coordinates of theoxygen sensor 930 are (112.0mm, 147.5mm), and the front oxygen sensor has a small EMC influence on the whole controller, which is a secondary consideration in the PCB layout.

TheCAN transceiver 920 is placed on top of theoxygen sensor 930, where the coordinates of theCAN transceiver 920 are (104.9mm, 164.2 mm). The outside TVS diode, the electric capacity, the terminal matching resistance and the common mode filter inductance that CAN transceiver 920 of area function of awakening up corresponds CAN be placed inCAN filter circuit 720, the outside device that CAN transceiver 920 corresponds CAN keep away fromCAN transceiver 920 of area function of awakening up, but must be close to the connector and place, wherein, common mode filter inductance need keep away fromCAN transceiver 920 of area function of awakening up, two signal lines of CANH and CANL ofCAN transceiver 920 need the difference to be walked the line, and differential impedance is 120 ohm.

Theoil injection chip 910 is arranged opposite to themicro control module 150 in the firstcomponent placement area 110, wherein the first switch 1 in the Boost circuit can be controlled by the oil injection chip. For example, referring to fig. 1, if themicro control module 150 is placed at the upper right corner of the PCB, i.e., corner C, theoil spraying chip 910 is placed at the upper left corner of the PCB, i.e., corner B.Oil injection chip 910 cannot be too far away from oilinjection driving circuit 740 andBoost circuit 140, so that electromagnetic influence caused by too long wiring is avoided, and thereforeoil injection chip 910 and oilinjection driving circuit 740 are respectively distributed on the same corresponding side of firstdevice placement area 110 and seconddevice placement area 650. The projections of oil-spraying chip 910 and oil-sprayingdriving circuit 740 are overlapped or crossed, so as to reduce the length of the wiring. The coordinates of oil-spraying chip 910 are (50.0mm, 166.2 mm). Theoil injection chip 910 is matched with a peripheral circuit together, and has the functions of generating high pressure in a plate, controlling an oil injection nozzle, controlling a high-pressure oil pump and the like.

For theoxygen heating circuit 730, the purpose of the circuit is to heat theoxygen sensor 930. Theoxygen heating circuit 730 controls the on/off of the external MOSFET switch by a control signal, which is a PWM signal, to heat theoxygen sensor 930. Fig. 10 is a schematic circuit structure diagram of the oxygen sensor heating according to an embodiment of the present invention, where one end of theoxygen sensor 930 is connected to the power supply V _ VBR, the other end of theoxygen sensor 930 is connected to thethird PIN 611 of thesecond connector 610 of the controller, thethird PIN 611 is connected to one end of theeighth switch 8, and the other end of theeighth switch 8 is grounded. The coordinates of thethird pin 611 are (143.05mm,22.8mm), and the coordinates of theeighth switch 8 are (145.5mm, 39.4 mm).

As for the oil injection driving circuit, fig. 11 is a schematic structural diagram of an oil injection driving circuit according to an embodiment of the present invention, and referring to fig. 11, thefourth switch 4, thesixth switch 6, and theseventh switch 7 are controlled by an oilinjection driving circuit 740. The power supply VBAT is about 12V and the high voltage power supply VT1 is about 65V. The cathode of the third diode D3 is connected to the power VBAT, the anode of the third diode D3 is connected to one end of thefifth switch 5, the other end of thefifth switch 5 is connected to one end of thesixth switch 6 and one end of the fourth resistor R4, the other end of thesixth switch 6 is connected to the high-voltage power VT1, the other end of the fourth resistor R4 is connected to the cathode of the fourth diode D4 and thefirst pin 612, the anode of the fourth diode D4 is grounded, thefirst pin 612 is connected to one end of theoil nozzle 1110, the other end of theoil nozzle 1110 is connected to thesecond pin 613, thesecond pin 613 is connected to the anode of the fourth diode D4 and one end of theswitch 7, the cathode of the fourth diode D4 is connected to the high-voltage power VT1, the other end of theseventh switch 7 is connected to one end of the fifth resistor R5, and the other end of the fifth resistor R5 is grounded. To enable thefuel injector 1110 to open quickly, thesixth switch 6 and theseventh switch 7 are first opened, thesixth switch 6 is then closed, thefifth switch 5 is opened, and the injector is kept open using a small current until the end of the metered fuel injection. The third diode D3 has the function of preventing reverse connection, the fourth diode D4 and the fifth diode D5 have the function of free-wheeling, and the fourth resistor R4 and the fifth resistor R5 are sampling resistors. Fig. 12 is a schematic structural diagram of a PCB layout of an oil injection driving circuit according to an embodiment of the present invention, and referring to fig. 12 in conjunction with fig. 7, all devices in an oilinjection driving circuit 740 are disposed in a seconddevice disposition region 650 of a bottom layer of the PCB. The third diode D3, thefifth switch 5, the fourth resistor R4, thesixth switch 6, the fifth diode D5, theseventh switch 7, and the fifth resistor R5 are sequentially arranged in the second direction, and the fourth diode D4 is disposed at a lower portion of thesixth switch 6. For example, the coordinates of third diode D3 in fuelinjection driving circuit 740 may be (63.0mm, 64.5mm), the coordinates offifth switch 5 may be (55.2mm, 64.9mm), the coordinates of fourth resistor R4 may be (47.6mm, 64.3mm), the coordinates ofsixth switch 6 may be (39.1mm, 66.9mm), the coordinates of fourth diode D4 may be (40.0mm, 61.7mm), the coordinates of fifth diode D5 may be (29.0mm, 66.1mm), the coordinates ofseventh switch 7 may be (19.2mm, 66.4mm), and the coordinates of fifth resistor R5 may be (11.7mm, 63.8 mm). The PCB of the controller of this embodiment may be provided with 8-way oil injection driving circuits, and the 8-way oil injection driving circuits are sequentially arranged along the first direction in the PCB layout, and are placed at the divided region of the oil injection driving circuit, i.e., at the position of the oilinjection driving circuit 740.

With continued reference to fig. 7, the PCB circuit board of the engine controller further includes anignition circuit 750, a signal input circuit, and a driving circuit. Theignition circuit 750, thesignal input circuit 760, and the drivingcircuit 770 are disposed in the seconddevice disposition region 650.

Ignition circuit 750 is disposed on a side of the fuel injection driver circuit remote fromoxygen heater circuit 730.

Driver circuit 770 is located on the side ofU-chip 620 remote from the second connector module. The drivingcircuit 770 and thesignal input circuit 760 are sequentially arranged in the seconddevice placing region 650 along the first direction.

Specifically, for theignition circuit 750, a logic ignition chip dedicated to BOSCH is used to realize a predetermined function, and the coordinates of the ignition chip are (68.7mm, 159.0 mm). Thesignal input circuit 760 can input signals such as analog quantity, digital quantity and frequency quantity, the electrostatic capacitance corresponding to thesignal input circuit 760 needs to be placed close to the PIN corresponding to thesecond connector 610, otherwise, too long wiring brings large lead inductance, and the filter capacitance of thesignal input circuit 760 needs to be placed close to themicro control module 150 to remove noise on the signal line. Thesignal input circuit 760 and themicro control module 150 are distributed on the same side of the seconddevice placement area 650 and the firstdevice placement area 110, respectively. A dedicated intelligent low-side driver chip may be used for thedriver circuit 770, and the distance from the driver chip to thesecond connector 610 and the placement of the peripheral freewheeling diode need to be considered during the layout of the PCB.

Optionally, fig. 13 is a schematic diagram of a layout flow of a PCB of an engine controller according to an embodiment of the present invention, and referring to fig. 13, a layout is performed by using a connector module to perform positioning layout, and a layout is provided with an electrostatic capacitor close to the connector module. The power supply filter circuit is laid out, wherein the layout relates to the layout of devices with larger volume and higher height of the energy storage capacitor and the power inductor, for example, a first aluminum electrolytic capacitor is placed at a position close to a power supply input pin of a first connector. The H-bridge chip layout usually needs a plurality of H-bridge circuits to be matched for use in an engine controller, two parts of H-bridge circuit modules are arranged by combining the space of a PCB (printed circuit board), and the H-bridge circuits are distributed in the two H-bridge circuit modules. The H-bridge circuit can adopt an H-bridge driving chip. The H-bridge driving chip needs to be close to the second connector, the wiring length is reduced as much as possible, and differential wiring is needed for the driving output of the H-bridge driving chip. In order to improve the EMC performance of the controller PCB circuit board, a 100nF capacitor can be added to each drive output pin of the H-bridge drive chip. The power supply unit, the driving unit, the CAN transceiver unit, the peripheral driving circuit and the corresponding freewheeling diode of the U-chip are distributed, the distribution of the Buck circuit which is the power supply unit of the U-chip is mainly considered, and the diode freewheeling circuit is arranged on one side, away from the second connector, of the first H-bridge circuit module. The CAN filter circuit is arranged on one side of the first H-bridge circuit module far away from the U-chip. Among them, the layout of three loops needs to be considered for the power supply unit in theU-chip 620, and the relevant components in the loops need to be arranged on the same layer, i.e. the top layer or the bottom layer, so as to reduce the radiation emission energy of the buck circuit.

The fuel injection chip, the fuel injection driving circuit and the Boost circuit are arranged, the layout of the Boost circuit is mainly considered, the layout of the Boost circuit needs to be considered in cooperation with the power supply filter circuit, and the power supply filter circuit and the Boost circuit are sequentially arranged in the first device placing area along the first direction. An oxygen sensor and an oxygen heating circuit layout. And the driving circuit is distributed and is arranged on one side of the U-chip far away from the second connector module. The driving circuit and the signal input circuit are sequentially arranged in the second device placement area along the first direction. The layout of the freewheeling diode in the diode freewheel circuit needs to be considered in conjunction with the layout of the driver circuit. The layout of the CAN transceiver and the CAN filter circuit, and the external TVS diode, the capacitor, the terminal matching resistor and the common mode filter inductor corresponding to the CAN transceiver CAN be placed in the CAN filter circuit. The layout of themicro control module 150, wherein the placing direction of themicro control module 150 mainly considers the influence of the signal flow direction, and the layout of the signal input circuit.

Finally, it should be noted that: the above examples are only for illustrating the technical solutions of the present invention, and are not limited thereto. Although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: modifications of the technical solutions described in the embodiments or equivalent replacements of some technical features may still be made. And such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (10)

1. A PCB circuit board of an engine controller, comprising: the PCB comprises a PCB main body, a first connector, a power filter circuit, a Boost circuit and a micro control module;

the PCB circuit board main body comprises a top layer, and the top layer comprises a first device placing area;

the first connector, the power filter circuit and the Boost circuit are sequentially arranged in the first device placement area along a first direction; the micro control module is arranged on a first edge of the first device placing area and on one side, away from the power supply filter circuit, of the Boost circuit, wherein the extending direction of the first edge is parallel to the first direction.

2. The PCB circuit board of engine controller according to claim 1, wherein the power filter circuit comprises an energy storage capacitor disposed between the Boost circuit and the first connector and near a power input pin side of the first connector.

3. The PCB circuit board of engine controller according to claim 1, wherein the Boost circuit comprises a first inductor, a first capacitor, a second capacitor, a third capacitor, a first resistor, a second resistor, a first diode and a first switch;

the wiring of the circuit connection of the first switch, the first resistor, the first capacitor and the second resistor is arranged on the top layer of the PCB circuit board main body;

the second capacitor and the first inductor are sequentially arranged along a second direction, and the second capacitor and the third capacitor are sequentially arranged along the first direction; the second capacitor is disposed between the third capacitor and the power filter circuit, wherein the first direction intersects the second direction.

4. The PCB circuit board of an engine controller of claim 1,

the micro control module comprises a crystal oscillator and a micro control unit, wherein the crystal oscillator is adjacent to a crystal oscillator pin of the micro control unit.

5. The PCB circuit board of engine controller of claim 1, wherein the micro control module further comprises a core voltage circuit; the nuclear voltage circuit comprises a second switch, a second inductor, a fourth capacitor, a fifth capacitor and a third switch;

and the wiring of the circuit connection of the second switch, the second inductor, the fourth capacitor, the fifth capacitor, the second inductor, the fourth capacitor and the third switch is arranged on the top layer of the PCB circuit board main body.

6. The engine controller PCB of claim 1, further comprising at least one electrostatic capacitor, wherein the first connector comprises a pin pad, wherein the electrostatic capacitor is connected to the pin pad, and wherein the distance between the electrostatic capacitor and the pin pad is less than 10 mm.

7. The PCB of engine controller of claim 1, further comprising a second connector, a U-chip and at least two H-bridge circuit modules; the PCB circuit board main body further comprises a bottom layer, and the bottom layer comprises a second device placing area;

the second connector and the first H-bridge circuit module are sequentially arranged along a first direction; the first H-bridge circuit module, the U-chip and the second H-bridge circuit module are sequentially arranged in the second device placement area along a second direction; wherein the first direction intersects the second direction.

8. The PCB of engine controller of claim 7, further comprising a diode freewheel circuit and a CAN filter circuit;

the diode freewheeling circuit is arranged on one side of the first H-bridge circuit module, which is far away from the second connector; the CAN filter circuit is arranged on one side of the first H-bridge circuit module far away from the U-chip.

9. The PCB circuit board of an engine controller according to claim 8, further comprising an oil injection chip, a CAN transceiver, an oxygen sensor, an oxygen heating circuit, and an oil injection driving circuit; the oil injection chip, the CAN transceiver and the oxygen sensor are arranged in the first device placing area; the oxygen heating circuit and the oil injection driving circuit are arranged in the second device placing area;

the oxygen sensor and the CAN transceiver are both arranged on one side of the Boost circuit, which is far away from the power supply filter circuit, and are sequentially arranged in the first device placement area along the first direction;

the oil injection chip is arranged on one side of the CAN transceiver, which is far away from the micro control module;

the oxygen heating circuit is arranged on one side of the CAN filter circuit, which is far away from the first H-bridge circuit module; the oil injection driving circuit is arranged on one side, far away from the second connector, of the oxygen heating circuit, and the projection of the oil injection driving circuit on the second device placing area is intersected with the projection of the oil injection chip on the first device placing area.

10. The PCB circuit board of an engine controller according to claim 9, further comprising an ignition circuit, a signal input circuit, and a driving circuit; the ignition circuit, the signal input circuit and the driving circuit are arranged in the second device placing area;

the ignition circuit is arranged on one side of the oil injection driving circuit, which is far away from the oxygen heating circuit;

the driving circuit is arranged on one side of the U-chip far away from the second connector module; the driving circuit and the signal input circuit are sequentially arranged in the second device placing area along a first direction.

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