CN215575808U - Optical transmission module of TO encapsulation - Google Patents

Abstract

The utility model relates TO the field of optical modules, in particular TO a TO packaged optical transmission module; the light emitting module comprises a packaging assembly, a main control circuit board provided with an EML laser and a detector, an optical assembly and a light output port, wherein the optical assembly is integrally arranged, the main control circuit board and the optical assembly are both arranged in the packaging assembly, the EML laser emits signal light, after the signal light is collimated and split by the optical assembly, one part of the signal light is focused to the light output port for output, and the other part of the signal light is folded to the detector for light detection; the optical assembly is matched with the TO cap, so that the optical coupling efficiency is effectively improved; through the design and the application that adopt integrated optical assembly for the module integrates more, the miniaturization, has reduced its space occupancy to the module, makes the main control circuit board have bigger overall arrangement space, further promotes high frequency transmission performance, and through the mode that adopts the detector to lead to, makes the operating condition feedback of EML laser instrument more accurate.

Description

Optical transmission module of TO encapsulation

Technical Field

The utility model relates TO the field of optical modules, in particular TO a TO packaged optical transmission module.

Background

In the optical communication industry, an optical transmission module mainly converts an electrical signal into a signal light, and converts the signal light into the electrical signal. With the development of low energy consumption and high density in the optical communication industry, related optical and point devices used by modules in the optical communication industry are also miniaturized more and more. The miniaturization of the devices has also led to the need for greater integration. This presents a significant challenge to product design and process. In a single-wave high-speed transmission optical module, package forms such as QSFP are generally adopted, and these package forms have a small volume, are internally equipped with a transmitter optical module (TOSA), a receiver optical module (ROSA), a driver, a control board (PCBA), a heat sink, and the like, and have a very compact structure, which leads to higher requirements for integration and miniaturization of each internal module.

Therefore, it is very important TO the art TO design an integrated and miniaturized optical transmit module of a TO package.

SUMMERY OF THE UTILITY MODEL

The technical problem TO be solved by the present invention is TO provide a miniaturized TO package optical transmitter module, which overcomes the defect that the optical module in the prior art has too large volume TO meet the requirement of integration development.

The technical scheme adopted by the utility model for solving the technical problems is as follows: the optical transmission module of TO encapsulation is provided, and the preferable scheme is as follows: the light emitting module comprises a packaging assembly, a main control circuit board provided with an EML laser and a detector, an optical assembly and a light output port, wherein the integrated optical assembly and the light output port are arranged, the main control circuit board and the optical assembly are arranged in the packaging assembly, the EML laser emits signal light, and after the signal light is collimated and split by the optical assembly, one part of the signal light is focused to the light output port to be output, and the other part of the signal light is refracted to the detector to be subjected to light detection.

Wherein, the preferred scheme is as follows: optical component includes collimating lens, beam splitter prism, optical isolator and C shape ring, collimating lens with beam splitter prism sets up for integrated into one piece, optical isolator with C shape ring all pastes the dress with beam splitter prism and fixes.

Wherein, the preferred scheme is as follows: the master control circuit board further comprises a thin film circuit carrier plate and a thermistor, and the EML laser, the detector and the thermistor are all arranged on the thin film circuit carrier plate.

Wherein, the preferred scheme is as follows: the EML laser and the detector are arranged on the same side of the thin-film circuit carrier plate, and after signal light is collimated and split by the optical assembly, part of the signal light is refracted and detected to realize optical detection.

Wherein, the preferred scheme is as follows: the thin film circuit carrier plate is also provided with a high-frequency impedance capacitor.

Wherein, the preferred scheme is as follows: encapsulation subassembly includes TO cap and TO seat, master control circuit board and optical assembly all assemble on the TO seat TO with the integrated setting of TO cap cooperation.

Wherein, the preferred scheme is as follows: and the TO cap is provided with a focusing lens, and signal light is focused by the focusing lens and then enters the light output port for output.

Wherein, the preferred scheme is as follows: and a semiconductor refrigerator is also arranged between the TO base and the master control circuit board and is attached TO the TO base through eutectic solder or silver adhesive.

Wherein, the preferred scheme is as follows: be provided with the gold thread that is used for being connected with the main control circuit board electricity on the TO seat.

Wherein, the preferred scheme is as follows: the optical transmission module further comprises an adjusting ring, and the TO cap and the optical output port are fixedly assembled through the adjusting ring.

Compared with the prior art, the optical module and the TO cap are matched TO realize collimation shaping and focusing coupling of the signal light in a limited space, so that the optical coupling efficiency is greatly improved, the light loss is reduced, and the driving current of the signal light can be reduced when the optical module is used in a module, so that the power consumption of the whole module is reduced; further, through the design and the application that adopt integrated optical assembly for the module integrates more, the miniaturization, further reduces taking up the module space, and the space of practicing thrift can let the main control circuit board have bigger spatial layout, further promotes high frequency transmission performance, and further, adopts the leading mode of detector, and the operating condition of EML laser instrument has been fed back to more accurate, very big convenience and the algorithm of having simplified module automatic processing control.

Drawings

The utility model will be further described with reference to the accompanying drawings and examples, in which:

FIG. 1 is a first schematic structural diagram of an optical transmitter module according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a main control circuit board in the embodiment of the present invention;

FIG. 3 is a schematic diagram of a semiconductor cooler in an embodiment of the present invention;

fig. 4 is a schematic structural view of a package assembly in an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of an optical assembly in an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a light emitting module in the embodiment of the present invention.

Detailed Description

The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

As shown in fig. 1 to 3, an optical transmitter module according to an embodiment of the present invention is provided.

The utility model provides a TO packaged's optical transmission module, refers TO fig. 1 and fig. 2, optical transmission module includesencapsulation subassembly 1, sets up maincontrol circuit board 2 andoptical assembly 3 inencapsulation subassembly 1 TO and have single mode fiber'slight delivery outlet 4, be provided withEML laser 21 anddetector 22 on the maincontrol circuit board 2,EML laser 21 transmission signal light, signal light is through 3 collimations of optical assembly and beam split back, and partly roll over TOoptical assembly 3 and focus, and through 4 outputs of light delivery outlet, another part light rolls overTO detector 22 TO carry out the monitoring of signal light.

In particular, the light emitting module is in the form of a TO package, thepackage 1 is in particular aTO package 1, and the maincontrol circuit board 2 and theoptical component 3 are each modularly assembled into theTO package 1. The optical transmission module further comprises an adjustingring 5, and theTO encapsulation assembly 1 is fixedly assembled with theoptical output port 4 through the adjustingring 5. The maincontrol circuit board 2 is mainly used for emitting and detecting signal light, and includes anEML laser 21 and adetector 22 for emitting signal light, where theEML laser 21 is a laser including an EMA (electro absorption modulator) and a DFB laser chip. Theoptical assembly 3 is mainly used for collimating and splitting the signal light. TheEML laser 21 emits signal light, the signal light enters theoptical assembly 3, theoptical assembly 3 performs collimation and light splitting on the signal light, 95% of the signal light is collimated and folded towards the anticlockwise 90-degree direction, the signal light can directly enter thelight output port 4 through theTO packaging assembly 1 in a focusing mode, and then the signal light is output through a single-mode optical fiber of thelight output port 4. Theoptical assembly 3 collimates and folds the remaining 5% of the signal light in a 90 ° clockwise direction, and the part of the light is emitted into thedetector 22 to realize signal light detection of theEML laser 21, and uses the signal light as feedback in the form of current, which can realize detection of the operating state of theEML laser 21 and the module compensation control signal.

Wherein, because small, generally the TO form encapsulation can only take one focusing lens TO couple optical TO single mode fiber in, so, its coupling efficiency is lower, in this embodiment, through setting upoptical assembly 3 and after carrying out the collimation plastic TO signal light, in the focusing coupling income single mode fiber of rethread TOencapsulation subassembly 1, its coupling efficiency promoted greatly. The application of the double lenses greatly improves the optical coupling efficiency, reduces the optical loss, and can reduce the driving current of the signal light when used in the module, thereby helping the whole module to reduce the power consumption.

Further, and referring to fig. 2, the maincontrol circuit board 2 further includes a thinfilm circuit carrier 23 and athermistor 24, and theEML laser 21, thedetector 22 and thethermistor 24 are all disposed on the thinfilm circuit carrier 23. And, the EMLlaser 21 and thedetector 22 are both disposed on the same side of the thinfilm circuit carrier 23.

Specifically, the thin filmcircuit carrier plate 23 is mainly used for installing and setting theEML laser 21, thedetector 22 and thethermistor 24, theEML laser 21 can be attached to the thin filmcircuit carrier plate 23 through AuSn eutectic solder, and other components such as thethermistor 24 and thedetector 22 are attached through silver paste according to the product design requirements. Thethermistor 24 is mainly used for feeding back the temperature of the laser chip of theEML laser 21 so as to perform accurate and stable temperature control on the laser chip. Conventionally, theEML laser 21 and thedetector 22 are assembled in the following manner: thedetector 22 is attached to the back surface of theEML laser 21, and since theEML laser 21 is composed of an EMA (electro absorption modulator) and a DFB laser chip, the signal light of the DFB laser chip needs to be output via the EMA, and the backward change and the forward change of theEML laser 21 cannot be completely consistent, the situation of the signal light cannot be accurately reflected. Therefore, thedetector 22 is arranged in front, the working state of theEML laser 21 is fed back more accurately, and meanwhile, the algorithm for automatic processing control of the module is greatly convenient and simplified.

Further, a high-frequency impedance capacitor is further disposed on the thinfilm circuit carrier 23 to realize stable driving of theEML laser 21.

Specifically, the thinfilm circuit carrier 23 serves as a carrier, which realizes a loading function and a heat dissipation function of components, and the high-frequency impedance capacitor is mainly used for reducing the influence of current ripples on signal light, thereby realizing stable driving of theEML laser 21.

Further, and referring to fig. 3, asemiconductor cooler 6 is also disposed between thepackage assembly 1 and the maincontrol circuit board 2.

Specifically, the semiconductor refrigerator is a device for producing cold by using the thermo-electric effect of a semiconductor, and is also called as a thermoelectric refrigerator. When two different metals are connected by a conductor and direct current is applied, the temperature at one junction is reduced and the temperature at the other junction is increased. In this embodiment, thesemiconductor cooler 6 is used in conjunction with thethermistor 24 to feed back and achieve precise and stable temperature control of theEML laser 21.

Further, optical component includes collimating lens, beam splitter prism, optical isolator and C shape ring, collimating lens with beam splitter prism sets up for integrated into one piece, optical isolator with C shape ring all pastes fixedly with beam splitter prism.

Specifically, collimating lens mainly used carries out the collimation TO signal light, beam splitting prism mainly used carries out the beam split TO signal light TO make its 95% signal light collimation and roll over TO anticlockwise 90 directions, this part signal light can directly get intolight output port 4 through the focus ofTO encapsulation subassembly 1, and the rethreadlight output port 4's single mode fiber outputs. The remaining 5% of the signal light is collimated and folded at 90 ° clockwise, and this part of the light will be incident on thedetector 22 to realize signal light detection by theEML laser 21. The optical isolator is mainly used for changing the polarization direction of light, so that the light is transmitted, the reflected light is reduced, and then the reflected light enters theEML laser 21, and therefore theEML laser 21 can stably provide signal light.

Wherein, need to explain be, collimating lens, beam splitter prism, optical isolator and C shape ring formula as an organic whole set up specifically do: the optical isolator is characterized in that the beam splitter prism is used as a main body, the collimating lens is arranged on the left side of the beam splitter prism, the optical isolator is arranged on the top of the beam splitter prism, the C-shaped ring is arranged on the bottom of the beam splitter prism, the components are prefabricated and assembled before being used for products, and the collimating lens is integrally formed by adopting processes such as photoetching and corrosion when the beam splitter prism is manufactured and belongs to sub-component parts. Other components are mounted in a passive mode, and tolerance requirements are loose.

Through setting up collimating lens, beam splitting prism, optical isolator and the annular integral type of C for this optical emission module integrates more, miniaturization, further reduces taking up of module space, and the space of practicing thrift can let module maincontrol circuit board 2 have bigger spatial layout, further promotes high frequency transmission performance.

As shown in fig. 4, a package assembly is provided in accordance with an embodiment of the present invention.

Referring TO fig. 4, thepackage assembly 1 includes aTO cap 11 and aTO socket 12, and the maincontrol circuit board 2 and theoptical component 3 are both assembled on theTO socket 12 and are matched with each other through theTO socket 12 and theTO cap 11 TO realize integration.

Specifically, be provided with focusing lens on theTO cap 11, signal light shines intolight delivery outlet 4 after focusing lens focuses and exports, wherein, through the collimating lens with in focusing lens and theoptical assembly 3 on theTO cap 11 cooperate the setting in order TO form double lens, this application has greatly promoted optical coupling efficiency, and then effectively reduces the loss of light, also can reduce the drive current TO signal light when using in the module simultaneously TO help whole module TO reduce the consumption. And a gold wire electrically connected with the maincontrol circuit board 2 is further arranged on theTO base 12.

Referring to fig. 2, the maincontrol circuit board 2 is assembled in the following manner: theEML laser 21 is attached to a thinfilm circuit carrier 23 by AuSn eutectic solder, and other components, such as thethermistor 24 and thedetector 22 in this embodiment, are attached by silver paste according to the product design requirements.

Referring TO fig. 3 and 4, thesemiconductor cooler 6 and theTO base 12 are assembled in the following manner: thesemiconductor refrigerator 6 is attached TO theTO base 12 through low-temperature eutectic solder or silver paste according TO design requirements.

Referring TO fig. 3 and 4, the maincontrol circuit board 2 and theTO base 12 are assembled in the following manner: the thin filmcircuit carrier plate 23 with the mounted components is firstly mounted on thesemiconductor refrigerator 6 through the silver adhesive, and further gold wire binding is carried out according to the design requirements of the product to realize electrification.

Referring to fig. 5, the integratedoptical assembly 3 is assembled in the following manner: the integratedoptical assembly 3 is directly attached to the thinfilm circuit carrier 23 according to the product design requirements.

Referring to fig. 6, the assembly method of thepackage assembly 1 is as follows: the TO cap 11 with the focusing lens is sealed and welded on theTO base 12 according TO the design requirements of products, and after the step is completed, the maincontrol circuit board 2, thesemiconductor refrigerator 6 and the integratedoptical assembly 3 can be sealed, and light can be converged.

Referring to fig. 1, the light emitting module is assembled in the following manner: the assembledpackage assembly 1 is coupled with thelight output port 4 and connected through the adjustingring 5, and can be fixed in a welding manner.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, but rather as embodying the utility model in a wide variety of equivalent variations and modifications within the scope of the appended claims.

Claims (10)

1. An optical transmit module of a TO package, comprising: the light emitting module comprises a packaging assembly, a main control circuit board provided with an EML laser and a detector, an optical assembly and a light output port, wherein the integrated optical assembly and the light output port are arranged, the main control circuit board and the optical assembly are arranged in the packaging assembly, the EML laser emits signal light, and after the signal light is collimated and split by the optical assembly, one part of the signal light is focused to the light output port to be output, and the other part of the signal light is refracted to the detector to be subjected to light detection.

2. The optical transmit module of claim 1, wherein: optical component includes collimating lens, beam splitter prism, optical isolator and C shape ring, collimating lens with beam splitter prism sets up for integrated into one piece, optical isolator with C shape ring all pastes the dress with beam splitter prism and fixes.

3. The optical transmit module of claim 1, wherein: the master control circuit board further comprises a thin film circuit carrier plate and a thermistor, and the EML laser, the detector and the thermistor are all arranged on the thin film circuit carrier plate.

4. The optical transmit module of claim 3, wherein: the EML laser and the detector are arranged on the same side of the thin-film circuit carrier plate, and after signal light is collimated and split by the optical assembly, part of the signal light is refracted and detected to realize optical detection.

5. The optical transmit module of claim 3, wherein: the thin film circuit carrier plate is also provided with a high-frequency impedance capacitor.

6. The optical transmit module of claim 1, wherein: encapsulation subassembly includes TO cap and TO seat, master control circuit board and optical assembly all assemble on the TO seat TO with the integrated setting of TO cap cooperation.

7. The optical transmit module of claim 6, wherein: and the TO cap is provided with a focusing lens, and signal light is focused by the focusing lens and then enters the light output port for output.

8. The optical transmit module of claim 6, wherein: and a semiconductor refrigerator is also arranged between the TO base and the master control circuit board and is attached TO the TO base through eutectic solder or silver adhesive.

9. The optical transmit module of claim 6, wherein: be provided with the gold thread that is used for being connected with the main control circuit board electricity on the TO seat.

10. The optical transmit module of claim 6, wherein: the optical transmission module further comprises an adjusting ring, and the TO cap and the optical output port are fixedly assembled through the adjusting ring.

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