CN213013067U - Deposition apparatus for depositing material on substrate and cathode driving unit - Google Patents

Abstract

Translated fromChinese

一种用以沉积材料的沉积设备(100)包括处理腔室(110)，处理腔室具有凸缘(120)。沉积设备(100)包括阴极驱动单元(130)。阴极驱动单元(130)耦接于凸缘(120)。阴极驱动单元(130)包括支撑构件(150)。阴极驱动单元(130)包括绝缘布置。绝缘布置的至少一部分分离支撑构件(150)与凸缘(120)。绝缘布置包括第一绝缘构件(262)及第二绝缘构件(264)，第二绝缘构件相邻于第一绝缘构件(262)。阴极驱动单元(130)包括第一密封件(210)，位于第一绝缘构件(262)及第二绝缘构件(264)之间。

A deposition apparatus (100) for depositing material includes a processing chamber (110) having a flange (120). The deposition apparatus (100) includes a cathode drive unit (130). The cathode driving unit (130) is coupled to the flange (120). The cathode drive unit (130) includes a support member (150). The cathode drive unit (130) includes an insulating arrangement. At least a portion of the insulating arrangement separates the support member (150) from the flange (120). The insulating arrangement includes a first insulating member (262) and a second insulating member (264), the second insulating member being adjacent to the first insulating member (262). The cathode drive unit (130) includes a first seal (210) located between the first insulating member (262) and the second insulating member (264).

Description

Deposition apparatus for depositing material on substrate and cathode driving unit

Technical Field

Embodiments of the present disclosure relate to layer deposition, such as a deposition process by sputtering from a target. Some embodiments are particularly directed to sputtering layers on large area substrates. Embodiments described herein relate generally to a sputter deposition apparatus including one or more cathode assemblies.

Background

In many applications it is necessary to deposit a thin layer on a substrate. The substrate may be coated in one or more chambers in a coating apparatus. The substrate may be coated in vacuum using vapor deposition techniques.

Many known methods are used to deposit materials on a substrate. For example, the substrate may be coated by a Physical Vapor Deposition (PVD) process, a Chemical Vapor Deposition (CVD) process, a Plasma Enhanced Chemical Vapor Deposition (PECVD) process, or the like. The process is performed in a processing apparatus or chamber in which the coated substrate is located. The deposition material is provided in the apparatus. Several materials and oxides, nitrides or carbides of several materials may be used for deposition on the substrate. The coated materials can be used in several applications and in several technical fields. For example, substrates for displays are often coated by PVD processes. Further applications include insulating panels, Organic Light Emitting Diode (OLED) panels, substrates with Thin Film Transistors (TFTs), color filters, or the like.

For PVD processes, the deposition material may be present in the target material in a solid state. By bombarding the target with high-energy particles, atoms of the target material, i.e. the material to be deposited, are ejected from the target. Atoms of the target material are deposited on the substrate to be coated. In PVD processes, the sputtered material, i.e. the material to be deposited on the substrate, can be arranged in different ways. For example, the target may be made of the material to be deposited, or may have a backing element. The deposited material is secured to this backing element. Including supporting or holding a target of deposited material in a predetermined position in a deposition chamber. In case a rotatable target is used, the target is connected to a rotating shaft or a connecting element, which connects the shaft and the target.

Segmented planes, monolithic planes, and rotatable targets may be used for sputtering. Due to the geometry and design of the cathode, rotatable targets generally have a higher utilization and increased operating time than planar targets. The use of the rotatable target can prolong the service life and reduce the cost.

Sputtering may be performed by magnetron sputtering, wherein a magnet assembly is used to confine the plasma to improve the sputtering conditions. Plasma confinement can be used to adjust the main distribution of material to be deposited on the substrate.

The deposition apparatus is a composite system having a plurality of different components, which may be electrical, mechanical or otherwise. Failure of one or more components of the deposition apparatus may compromise the quality of the deposited layer or cause damage or failure of the apparatus. Accordingly, there is a continuing need to improve the design of deposition apparatus.

SUMMERY OF THE UTILITY MODEL

According to an embodiment, a deposition apparatus for depositing a material on a substrate is provided. The deposition apparatus includes a process chamber having a flange. The deposition apparatus includes a cathode driving unit. The cathode driving unit is coupled to the flange. The cathode driving unit includes a support member. The cathode drive unit comprises an insulating arrangement. At least a portion of the insulating arrangement separates the support member from the flange. The insulating arrangement includes a first insulating member and a second insulating member adjacent to the first insulating member. The cathode driving unit includes a first sealing member disposed between the first insulating member and the second insulating member.

According to other embodiments, a cathode driving unit for a cathode assembly is provided. The cathode driving unit is used for being coupled with a flange of the processing chamber. The cathode drive unit comprises a support member for being at a high voltage during operation of the cathode drive unit. The cathode drive unit comprises an insulating arrangement. At least a portion of the insulating arrangement is arranged to separate the support member from the flange of the process chamber. The insulating arrangement includes a first insulating member and a second insulating member adjacent to the first insulating member. The cathode driving unit includes a first sealing member disposed between the first insulating member and the second insulating member.

According to another embodiment, a deposition apparatus for depositing a material on a substrate is provided. The deposition apparatus includes a process chamber having a flange. The deposition apparatus includes a cathode driving unit. The cathode driving unit is coupled to the flange. The cathode driving unit includes a support member. The cathode driving unit includes a first insulating member separating the support member from the flange of the process chamber. The first insulating member has a first side facing the flange and a second side facing the support member. The first insulating member has a through-hole extending from the first side to the second side. The cathode driving unit has a sealing member between the first insulating member and the flange. The seal between the first insulating member and the flange is here meant and depicted as a second seal of the cathode drive unit in the figure. The through hole is arranged at a radially outer position of the second seal member.

According to other embodiments, a cathode driving unit for a cathode assembly is provided. The cathode assembly has a rotation axis. The cathode driving unit is used for being coupled with a flange of the processing chamber. The cathode drive unit comprises a support member for being at a high voltage during operation of the cathode drive unit. The cathode driving unit includes a first insulating member arranged to separate the support member from the flange of the process chamber. The first insulating member has a first side for facing the flange and a second side facing the support member. The first insulating member has a through-hole extending from the first side to the second side. The cathode driving unit includes a sealing member at the first insulating member. The through hole is arranged at a radially outer position of the seal.

Drawings

A full and enabling disclosure, more particularly, being supplied to one of ordinary skill in the art in the remainder of the specification, including reference to the accompanying figures wherein:

FIG. 1 depicts a schematic view of a deposition apparatus according to various embodiments described herein;

2-3 depict schematic views of a cathode drive unit including a first seal according to various embodiments described herein;

4-5 depict schematic views of a cathode drive unit including a second seal according to various embodiments described herein; and

fig. 6 depicts a schematic diagram of a cathode drive unit including a first seal and a second seal according to various embodiments described herein.

Detailed Description

Reference will now be made in detail to the several embodiments, one or more examples of which are illustrated in the figures. In the description of the following figures, like reference numerals refer to like parts. In general, only the differences with respect to the individual embodiments are described. The examples are provided by way of illustration and are not meant as limitations. Furthermore, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the present description include such modifications and variations.

The figures are schematic views not drawn to scale. Some of the elements in the drawings may have exaggerated dimensions for the purpose of highlighting aspects of the present disclosure and/or for the purpose of clarity.

Various embodiments described herein relate to a deposition apparatus for depositing a material on a substrate. In a deposition process or a coating process, a layer of target material is deposited on a substrate. The substrate is coated with a material. The names "coating process" and "deposition process" are used synonymously herein.

Deposition apparatus according to various embodiments described herein may be used to deposit on vertically oriented substrates. The designation "vertically oriented" may include substrates arranged at small deviations from true vertical, for example angles of up to 10 ° or even 15 ° may exist between the substrate and true vertical.

Alternatively, the deposition apparatus may be used to deposit on a horizontally oriented substrate. The designation "horizontally oriented" may include substrates arranged at small deviations from true horizontal, for example angles of up to 10 ° or even 15 ° may exist between the substrate and true horizontal. For example, the deposition apparatus may be a coil coater (web coater) or an architectural glass coater (architectural glass coater).

Deposition apparatus according to various embodiments described herein may be used for deposition on large area substrates.

The substrate described herein may be a large area substrate. The term "substrate" as used herein includes substrates commonly used in display manufacturing. For example, the substrate described herein may be a substrate commonly used in LCDs (liquid crystal displays), OLED panels, and the like. For example, the large area substrate may be generation 4.5, generation 5, generation 6, generation 7.5, generation 8.5, or even generation 10. Generation 4.5 corresponds to about 0.67m²Substrate (0.73m x 0.92.92 m), generation 5 corresponds to about 1.4m²Substrate (1.1m x 1.3.3 m), generation 6 corresponds to about 2.8m²Substrate (1.85m x 1.5.5 m), generation 7.5 corresponds to about 4.29m²Substrate (1.95m x 2.2.2 m), generation 8.5 corresponds to about 5.7m²Substrate (2.2m x 2.5.5 m), generation 10 corresponds to about 8.7m²Substrate (2.85m x 3.05.05 m). Even higher generations, such as 11 th and 12 th generations, and corresponding substrate areas, may be implemented in a similar manner.

The term "substrate" as used herein may particularly comprise a substantially inflexible substrate, such as a wafer, a transparent crystal slice, such as sapphire or the like, or a glass plate. In particular, the substrate may be a glass substrate and/or a transparent substrate. The present disclosure is not so limited and the name "substrate" may also include flexible substrates, such as a web or foil. The designation "substantially non-flexible" is understood to distinguish it from "flexible". In particular, the substantially inflexible substrate may have a certain degree of flexibility, for example a glass sheet material having a thickness of 0.5mm or less, wherein the substantially inflexible substrate is less flexible than the flexible substrate.

The deposition apparatus according to embodiments described herein may comprise one or more cathode assemblies, in particular a plurality of cathode assemblies. A cathode assembly is to be understood as an assembly which is suitable as a cathode in a coating process, such as a sputter deposition process.

The cathode assembly described herein may be a rotatable cathode assembly. The cathode assembly may comprise a target, in particular a rotatable target. The rotatable target may be rotatable about the axis of rotation of the cathode assembly. The rotatable target may have a curved surface, for example a cylindrical surface. The rotatable target is rotatable about a rotation axis, which is the axis of the cylinder or tube. The cathode assembly can include a backing tube. The target material forming the target may comprise a material to be deposited on the substrate during the coating process, the target material may be fixed on the backing tube. Alternatively, the target material may be molded into the tube without being disposed on the backing tube.

The cathode assembly described herein may include a magnet assembly. The magnet assembly may be disposed inside the cathode assembly. The target material may surround the magnet assembly. The magnet assembly may be arranged such that target material sputtered by the cathode assembly is sputtered towards the substrate. The magnet assembly may generate a magnetic field. The magnetic field may cause one or more plasma regions to form in the vicinity of the magnetic field during the sputter deposition process. The position of the magnet assembly within the cathode assembly affects the direction in which target material is sputtered away from the cathode assembly during the sputter deposition process. The magnet assembly may be used to move during operation of the cathode assembly, particularly during the deposition process.

In operation, the uncooled cathode assembly may become hot, particularly the uncooled magnet assembly of the cathode assembly, because the target material bombarded by the ions surrounds the magnet assembly. The resulting impact causes the cathode assembly to heat up. In order to maintain the magnet assembly at a suitable operating temperature, cooling of the cathode assembly, in particular of the target material and the magnet assembly, may be provided.

Deposition apparatus according to various embodiments described herein may be used for vacuum deposition. The deposition apparatus may comprise a process chamber, in particular a vacuum chamber. The cathode assemblies described herein or at least a portion of the cathode assemblies can be disposed in a process chamber.

The deposition apparatus according to various embodiments described herein may include a cathode driving unit. The cathode driving unit may be used to drive the cathode assembly. In particular, the cathode drive unit may be used to drive the rotation of the target of the cathode assembly. The cathode drive unit may be secured to a wall of the process chamber, such as to a flange of the process chamber. The cathode assembly may be fixed to the cathode driving unit.

Fig. 1 shows a schematic view of adeposition apparatus 100 according to an example embodiment. Thedeposition apparatus 100 includes aprocess chamber 110, theprocess chamber 110 having aflange 120. Thecathode driving unit 130 is connected to theflange 120. Thecathode driving unit 130 supports thecathode assembly 140. Thecathode driving unit 130 may be used to drive the rotation of thecathode assembly 140 about the rotation axis and to supply a coolant to the cathode assembly to cool thecathode assembly 140. Thecathode driving unit 130 includes asupport member 150, for example, made of aluminum. During operation of thecathode drive unit 130, such as during a deposition process, thesupport member 150 is at a high voltage and theflange 120 is at a low voltage. In particular, the flange may be grounded. Thecathode drive unit 130 comprises aninsulation arrangement 160, theinsulation arrangement 160 separating thesupport member 150 for high voltage from theflange 120 for low voltage.

Fig. 2 is a schematic diagram illustrating an example of thecathode driving unit 130. Thecathode driving unit 130 illustrated in fig. 2 may be included in thedeposition apparatus 100 illustrated in fig. 1. Theinsulation arrangement 160 includes afirst insulation member 262 and asecond insulation member 264, thesecond insulation member 264 being adjacent to thefirst insulation member 262. The first insulatingmember 262 may, for example, include one or more dynamic vacuum seals. The first insulatingmember 262 may be replaceable from the inside of theprocess chamber 110. The second insulatingmember 264 may be used to connect thecathode driving unit 130 to theprocess chamber 110.

As shown in fig. 2, agap 250 may exist between the first and second insulatingmembers 262, 264. Thegap 250 shown in fig. 2 is shown schematically and exaggeratedly. In practice, the gap between the first and second insulatingmembers 262, 264 may be much less wide than thegap 250 shown in fig. 2. In particular, the first insulatingmember 262 may nearly contact the second insulatingmember 264.

During maintenance of thedeposition apparatus 100, replacement of thecathode assembly 140 with a new cathode assembly, or replacement of the target of thecathode assembly 140, for example, liquid and/or conductive material may reach theflange 120 and the insulatingarrangement 160. For example, the liquid may be a small amount of coolant that has been sputtered onto theflange 120 during maintenance or replacement of the cathode assembly. The conductive material may comprise conductive particles of target material that have been deposited on the flange during the deposition process. Liquid and/or conductive particles can be exemplified as migrating from theflange 120 into thegap 250 between the first and second insulatingmembers 262, 264 during maintenance. According to various embodiments described herein, thefirst seal 210 is disposed between the first and second insulatingmembers 262, 264. Thefirst seal 210 seals thegap 250 between the first and second insulatingmembers 262, 264. Thefirst seal 210 may be a static vacuum seal. Thefirst seal 210 prevents liquid and/or conductive particles from moving from theflange 120 to thesupport member 150 via thegap 250. Thefirst seal 210 prevents liquid and/or conductive particles from reaching thesupport member 150.

Fig. 3 is a schematic diagram of a portion of an exemplarycathode drive unit 130.Solid arrows 310 depict possible paths for liquid particles and/or conductive particles fromflange 120 into the gap between first and second insulatingmembers 262, 264. Thefirst seal 210 prevents liquid and/or conductive particles from moving through the gap to thesupport member 150. Thefirst seal 210 prevents liquid and/or conductive particles from reaching thesupport member 150.

The dashed arrows in fig. 3 depict possible paths of liquid and/or conductive particles in the cathode drive unit that do not include thefirst seal 210. As indicated by the dashedarrow 320, the liquid and/or conductive particles will be able to continue to move through the gap and will reach thesupport member 150 if thefirst seal 210 is not provided. The conductive path will be formed by the liquid and/or conductive particles. The conductive path connects thelow voltage flange 120 to the highvoltage support member 150. An arc may form between theflange 120 and thesupport member 150. That is, thefirst seal 210 prevents an arc from forming between theflange 120 and thesupport member 150.

In view of the above, according to an embodiment, adeposition apparatus 100 for depositing a material on a substrate is provided. Thedeposition apparatus 100 includes aprocess chamber 110, theprocess chamber 110 having aflange 120. Thedeposition apparatus 100 includes acathode driving unit 130. Thecathode driving unit 130 may be a cathode driving unit for thecathode assembly 140. Thecathode driving unit 130 is coupled to theflange 120. Thecathode driving unit 130 includes asupport member 150. Thecathode drive unit 130 includes an insulating arrangement. At least a portion of the insulating arrangement separates thesupport member 150 from theflange 120. The insulating arrangement includes a first insulatingmember 262 and a second insulatingmember 264, the second insulatingmember 264 being adjacent to the first insulatingmember 262. Thecathode driving unit 130 includes afirst sealing member 210, and thefirst sealing member 210 is disposed between a first insulatingmember 262 and a second insulatingmember 264.

According to other embodiments, acathode driving unit 130 for thecathode assembly 140 is provided. Thecathode driving unit 130 is configured to be coupled to theflange 120 of theprocess chamber 110. Thecathode driving unit 130 includes asupport member 150 for being at a high voltage during operation of thecathode driving unit 130. Thecathode drive unit 130 includes an insulating arrangement. At least a portion of the insulating arrangement is arranged to separate thesupport member 150 from theflange 120 of theprocess chamber 110. The insulating arrangement includes a first insulatingmember 262 and a second insulatingmember 264, the second insulatingmember 264 being adjacent to the first insulatingmember 262. Thecathode driving unit 130 includes afirst sealing member 210, and thefirst sealing member 210 is disposed between the first and second insulatingmembers 262 and 264.

The various embodiments described herein provide the advantage that by having thefirst seal 210, the formation of an arc-passinggap 250 extending between thesupport member 150 and theflange 120 is avoided. A short circuit between thesupport member 150 and theflange 120 can be prevented. In view of this, the embodiments described herein avoid malfunction of thecathode driving unit 130 and damage to thecathode driving unit 130.

Thecathode drive unit 130 described herein may be used to provide power to thecathode assembly 140. Thecathode driving unit 130 may include or may be connected to a power supply for supplying power to thecathode assembly 140. Thecathode drive unit 130 may additionally or alternatively be used to provide water or coolant to thecathode assembly 140 and/or to contain a volume of coolant. Thecathode driving unit 130 may include or may be connected to a water or coolant supply for supplying water or coolant to thecathode assembly 140. Thecathode drive unit 130 may additionally or alternatively be used to drive the rotation of the target of thecathode assembly 140. Thecathode drive unit 130 may include an actuator to drive rotation of the target. The cathode drive unit may be used to perform any combination of the functions described above.

Thecathode driving unit 130 as described herein may also be referred to as an end block or a cathode driving block.

Thesupport member 150 described herein may be configured to be at a high voltage during operation of thecathode drive unit 130, such as when thecathode drive unit 130 drives thecathode assembly 140 during a deposition process. The high voltage described herein may be a voltage of 400V or more, particularly a voltage of 1000V or more, more particularly a voltage of 1500V or more. For example, thesupport member 150 may have a voltage of from 400V to 600V and up to 1500V as an ignition voltage (ignition voltage) during deposition.

Theflange 120 of theprocessing chamber 110 may be used to be at a low voltage during the deposition process. In particular, since theflange 120 is part of theprocessing chamber 110, the flange may be substantially at ground potential during the deposition process.

Thefirst seal 210 described herein may be used to prevent an arc from forming between thesupport member 150 and theflange 120. Thefirst seal 210 may contact the first and second insulatingmembers 262 and 264. Thefirst seal 210 may seal thegap 250 between the first and second insulatingmembers 262, 264. Thefirst seal 210 may prevent liquid, such as a coolant, or conductive particles, such as a conductive target material, from reaching thesupport member 150 via the gap. The conductive target material is, for example, Indium Tin Oxide (ITO). Thefirst seal 210 may be used to avoid the formation of an arc that connects thesupport member 150 and theflange 120 via a gap.

Thefirst seal 210 described herein may be a static seal. Thefirst seal 210 is not used to rotate with the target of thecathode assembly 140. Thefirst seal 210 may be stationary relative to the first insulatingmember 262, the second insulatingmember 264, thesupport member 150, and/or theflange 120.

Thefirst seal 210 described herein may be a band-shaped first seal. Thefirst seal 210 may be an O-ring. Thefirst seal 210 may surround therotation shaft 290 of thecathode assembly 140.

The insulating arrangement described herein may be secured to thesupport member 150. The insulating arrangement, or at least a portion of the insulating arrangement, may be arranged above thesupport member 150. The first insulatingmember 262 may be disposed above thesupport member 150 to separate thesupport member 150 from theflange 120 of theprocess chamber 110.

The first insulatingmember 262 described herein may have a first surface. The second insulatingmember 264 may have a second surface facing the first surface. Thefirst seal 210 may be arranged between the first surface and the second surface. The first surface and the second surface may be mating surfaces. Thefirst seal 210 may contact the first surface and the second surface.

The first insulatingmember 262 described herein may be fastened to thesupport member 150 by one or more fasteners, for example.

The first and/or second insulatingmembers 262, 264 described herein may be stationary relative to thesupport member 150. That is, the first and/or second insulatingmembers 262 and 264 may not rotate with the target of thecathode assembly 140. The first and/or second insulatingmembers 262, 264 may be stationary relative to one another. The first and/or second insulatingmembers 262, 264 may be adapted to be stationary relative to theflange 120.

The first insulatingmember 262 described herein may be secured to theflange 120 by one or more fasteners.

The insulating arrangement described herein may surround the axis ofrotation 290 of thecathode assembly 140. The first insulatingmember 262 may surround therotation shaft 290. The second insulatingmember 264 may surround therotation shaft 290.

Thecathode assembly 140 described herein can be a sputtering cathode assembly. Thecathode drive unit 130 described herein may be a cathode drive unit for a sputtering cathode assembly. Thedeposition apparatus 100 described herein may be a sputter deposition apparatus.

Thecathode drive unit 130 described herein may include a volume to contain a coolant to cool the cathode assembly. For example, during maintenance or replacement of thecathode assembly 140, liquid particles of coolant may reach the insulating arrangement. Thefirst seal 210 may serve to prevent the coolant from flowing to thesupport member 150 through a gap between the first and second insulatingmembers 262 and 264. Arcing between thesupport member 150 and theflange 120 may be avoided.

Thesupport member 150 described herein may be used to support and/or house one or more components of thecathode drive unit 130. Thesupport member 150 may support one or more shafts of thecathode drive unit 130, such as thefirst shaft 610 and/or thesecond shaft 620 described herein. Thesupport member 150 may support the first and/or second insulatingmembers 262, 264 as described herein. Thesupport member 150 may support a bearing for supporting the cathode assembly.

Thesupport member 150 described herein may comprise or be made of a conductive material, such as aluminum.

The first and/or second insulatingmembers 262, 264 described herein may include or be made of an insulating material, such as Polyetheretherketone (PEEK).

Thefirst seal 210 described herein may comprise or be made of an elastomeric material such as Nitrile-butadiene Rubber (NBR), fluoro-Rubber (FKM), and the like.

Theprocessing chamber 110 described herein may be a vacuum chamber.

Thedeposition apparatus 100 according to various embodiments described herein may include acathode assembly 140. Thecathode assembly 140 may be fixed to thecathode driving unit 130. Thecathode assembly 140, or at least a portion of thecathode assembly 140, may be disposed in theprocess chamber 110.

Thedeposition apparatus 100 according to various embodiments described herein may include an array of cathode drive units. The array of cathode drive units may comprise 2, 3, 4, 5, 6 or more cathode drive units, for example 16 cathode drive units. The array of cathode drive units may be a substantially linear array. The cathode drive units of the array of cathode drive units may be arranged substantially along a line.

Theflange 120 described herein may be disposed on a wall portion of theprocess chamber 110. Theprocessing chamber 110 may include a plurality of flanges. The plurality of flanges may include 2, 3, 4, 5, 6, or more flanges. Each cathode drive unit of the array of cathode drive units may be coupled to a respective flange of the plurality of flanges.

Theprocess chamber 110 may include an array of cathode assemblies. The array of cathode assemblies may comprise 2, 3, 4, 5, 6 or more cathode assemblies. Each cathode assembly of the array of cathode assemblies may be supported by a respective cathode drive unit of the array of cathode drive units. The array of cathode assemblies may be a substantially linear array. The cathode assemblies of the array of cathode assemblies may be arranged substantially along a line.

Each cathode drive unit of the array of cathode drive units may be similar tocathode drive unit 130 described herein. Each cathode drive unit of the array of cathode drive units may be coupled to a respective flange of the plurality of flanges. Each cathode drive unit may comprise a support member for being at a high voltage during operation of the cathode drive unit. Each cathode drive unit may comprise an insulating arrangement arranged above the support member. At least a portion of the insulating arrangement may separate the support member from the flange. The insulating arrangement may comprise a first insulating member and a second insulating member, the second insulating member being adjacent to the first insulating member. Each cathode driving unit may include a first sealing member disposed between the first insulating member and the second insulating member.

Fig. 4 is a schematic diagram illustrating an example of thecathode driving unit 130 described herein. Thecathode driving unit 130 shown in fig. 4 may be included in thedeposition apparatus 100 shown in fig. 1. Thecathode driving unit 130 shown in fig. 4 includes a supportingmember 150 and a first insulatingmember 262. The first insulatingmember 262 has afirst side 422 and asecond side 424, thefirst side 422 facing theflange 120 and thesecond side 424 facing thesupport member 150. A throughhole 430 is provided in the first insulatingmember 262. The through-hole 430 extends from thefirst side 422 to thesecond side 424. As shown in fig. 4, the through-hole 430 may include afirst fastening member 432, thefirst fastening member 432 fixing the first insulatingmember 262 to thesupport member 150.

Thecathode driving unit 130 illustrated in fig. 4 includes asecond seal 410, and thesecond seal 410 is disposed between the first insulatingmember 262 and theflange 120. Thesecond seal 410 seals agap 450 between the first insulatingmember 262 and theflange 120. Thegap 450 shown in fig. 4 is shown in a schematic and exaggerated manner. In practice, the gap between the first insulatingmember 262 and theflange 120 may be much less wide than the gap shown in fig. 4. In particular, the first insulatingmember 262 may almost contact theflange 120.

During maintenance of thedeposition apparatus 100 or replacement of thecathode assembly 140 with a new cathode assembly, for example, liquid and/or conductive material may reach theflange 120 as described above. Liquid and/or conductive particles may move into thegap 450 between the first insulatingmember 262 and theflange 120. Without thesecond seal 410, the liquid and/or conductive particles would be able to move through thegap 450 and through the through-hole 430, and would reach thesupport member 150. An arc is formed between thelow voltage flange 120 and the highvoltage support member 150 through the through-hole 430. According to various embodiments described herein, thesecond seal 410 seals thegap 450 at a location radially inward of the location of the through-hole 430. Thesecond seal 410 blocks liquid and/or conductive particles moving through thegap 450 before the liquid and/or conductive particles can reach the through-hole 430. Thesecond seal 410 prevents liquid and/or conductive particles from moving from theflange 120 to thesupport member 150 through the throughhole 430. Arcing between theflange 120 and thesupport member 150 may be avoided.

In view of the above, according to other embodiments, adeposition apparatus 100 for depositing a material on a substrate is provided. Thedeposition apparatus 100 includes aprocess chamber 110 having aflange 120. Thedeposition apparatus 100 includes acathode driving unit 130. Thecathode driving unit 130 may be a cathode driving unit for thecathode assembly 140 having therotation shaft 290. Thecathode driving unit 130 is coupled to theflange 120. Thecathode driving unit 130 includes asupport member 150. Thesupport member 150 may be used to be at a high voltage during operation of thecathode driving unit 130. Thecathode driving unit 130 includes a first insulatingmember 262, and the first insulatingmember 262 separates thesupport member 150 from theflange 120 of theprocess chamber 110. The first insulatingmember 262 has afirst side 422 and asecond side 424, thefirst side 422 facing the flange and thesecond side 424 facing thesupport member 150. The first insulatingmember 262 has a through-hole 430, the through-hole 430 extending from thefirst side 422 to thesecond side 424. Thecathode driving unit 130 has a sealing member between the first insulatingmember 262 and theflange 120. The seal between the first insulatingmember 262 and theflange 120 is here meant and depicted as thesecond seal 410 of thecathode drive unit 130. The through-hole 430 is disposed at a radially outer position of thesecond seal 410.

According to other embodiments, acathode drive unit 130 for acathode assembly 140 is provided, thecathode assembly 140 having arotation axis 290. Thecathode driving unit 130 is configured to be coupled to theflange 120 of theprocess chamber 110. Thecathode driving unit 130 includes asupport member 150, and thesupport member 150 is to be at a high voltage during operation of thecathode driving unit 130. Thecathode driving unit 130 includes a first insulatingmember 262, and the first insulatingmember 262 is disposed to separate thesupport member 150 from theflange 120 of theprocess chamber 110. The first insulatingmember 262 has afirst side 422 and asecond side 424, thefirst side 422 facing theflange 120 and thesecond side 424 facing thesupport member 150. The first insulatingmember 262 has a through-hole 430, the through-hole 430 extending from thefirst side 422 to thesecond side 424. Thecathode driving unit 130 includes a sealing member at the first insulatingmember 262, which is also referred to herein as asecond sealing member 410. The through-hole 430 is arranged at a radially outer position of the seal.

By providing thesecond seal 410 at a location radially inward of the through-hole 430, arcing that may occur extending between thesupport member 150 and theflange 120 through thegap 450 may be avoided. A short circuit between thesupport member 150 and theflange 120 can be avoided. In view of this, the various embodiments described herein avoid the malfunction of thecathode driving unit 130 and the damage to thecathode driving unit 130.

Further, by providing a second seal at a location radially inward of the through-hole 430, additional space is provided for forming the through-hole 430. Larger throughholes 430 may be provided so that larger (stronger) fasteners may be used to secure the first insulatingmember 262 to thesupport member 150. In view of this, an improved fastening of the first insulatingmember 262 to thesupport member 150 may be provided.

The various embodiments described herein include the meaning of radial distance, which is the radial distance relative to the axis ofrotation 290 of thecathode assembly 140. The through-hole 430 is arranged at a radially outer position of thesecond seal 410 and may be understood as meaning that a portion of thesecond seal 410 is located between the through-hole 430 and therotating shaft 290 of thecathode assembly 140. The radial distance from the through-hole 430 to therotational axis 290 may be greater than the radial distance from this portion of thesecond seal 410 to therotational axis 290.

Thesecond seal 410 described herein may be a static vacuum seal. Thesecond seal 410 may be used to prevent arcing between thesupport member 150 and theflange 120. Thesecond seal 410 may contact the first insulatingmember 262 and theflange 120. Thesecond seal 410 may seal agap 450 between thecathode driving unit 130 and theflange 120, particularly a gap between the first insulatingmember 262 and theflange 120. Thesecond seal 410 may prevent liquid, such as a coolant, or conductive particles, such as a conductive target material, such as ITO, from reaching the through-hole 430 via the gap. Thesecond seal 410 may serve to prevent liquid or conductive particles from reaching thesupport member 150 through the through-hole 430. Thesecond seal 410 may be used to prevent the formation of an arc that connects thesupport member 150 and theflange 120 via the through-hole 430.

Thesecond seal 410 described herein may be disposed on thefirst side 422 of the first insulatingmember 262.

The through-hole 430 described herein may be configured to receive afirst fastener 432. Thefirst fastener 432 is used to fasten the first insulatingmember 262 to thesupport member 150. The first insulatingmember 262 may be fastened to thesupport member 150 by afirst fastener 432 disposed in the throughhole 430.

The first insulatingmember 262 described herein may have a plurality of through-holes extending from thefirst side 422 of the first insulatingmember 262 to thesecond side 424 of the first insulatingmember 262. Each through-hole of the plurality of through-holes may be disposed at a radially outer position of thesecond seal 410. Each through hole may be configured to receive a respective first fastener. The first fastener is used to fasten the first insulatingmember 262 to thesupport member 150. The first insulatingmember 262 may be fastened to thesupport member 150 by a plurality of first fasteners provided in the plurality of through holes.

The first insulatingmember 262 described herein may have a third surface. The third surface may be located on thefirst side 422 of the first insulatingmember 262. Theflange 120 may have a fourth surface facing the third surface. Thesecond seal 410 may be arranged between the third surface and the fourth surface.

Thesecond seal 410 described herein may be a static seal. Thesecond seal 410 may be static with respect to the first insulatingmember 262, the second insulatingmember 264, thesupport member 150, and/or theflange 120.

Thesecond seal 410 described herein may be a band seal. Thesecond seal 410 may be a seal in the form of an O-ring, particularly a seal in the form of an O-ring having a varying distance to therotational axis 290 of the cathode assembly. Thesecond seal 410 may surround therotating shaft 290 of thecathode assembly 140. Thesecond seal 410 may surround afirst shaft 610 of thecathode drive unit 130 as described herein. Thefirst seal 210 may surround asecond shaft 620 of thecathode drive unit 130 as described herein.

Fig. 5 illustrates a top view of an exemplarycathode driving unit 130.

The first insulatingmember 262 described herein may be used to be fastened to theflange 120 by the second fastener. The second fastener can be disposed in anaperture 510 in the first insulatingmember 262, as shown for example in fig. 5. The second fastener and/oraperture 510 may be located at a radially inner position of thesecond seal 410. The second fastening member is disposed at a radially inner position of thesecond sealing member 410, which can be understood as meaning that the second fastening member is disposed between a portion of thesecond sealing member 410 and therotating shaft 290 of the cathode assembly. The radial distance from the second fastener to therotational axis 290 may be less than the radial distance from this portion of thesecond seal 410 to therotational axis 290.

The first insulatingmember 262 described herein may be configured to be fastened to theflange 120 by a plurality of second fasteners. Each second fastener may be located at a radially inner position of thesecond seal 410.

Thesecond seal 410 described herein may have a varying distance, particularly a varying radial distance, to therotational axis 290 of thecathode assembly 140, as shown for example in fig. 5. A first portion of thesecond seal 410 may be spaced a first radial distance from therotational axis 290. A second portion of thesecond seal 410 may be spaced a second radial distance from therotational axis 290, the second radial distance being less than the first radial distance. A third portion of thesecond seal 410 may be spaced a third radial distance from therotational axis 290, the third radial distance being greater than the second radial distance.

Thesecond seal 410 described herein may comprise or be made of an elastomeric material such as Nitrile-butadiene Rubber (NBR), fluoro-Rubber (FKM), and the like.

Thecathode drive unit 130 described herein can include thefirst seal 210 described herein, thesecond seal 410 described herein, or both thefirst seal 210 and thesecond seal 410.

Thecathode drive unit 130 described herein may include an insulating arrangement. An insulation arrangement as described herein may include afirst insulation member 262 and asecond insulation member 264, thesecond insulation member 264 being adjacent to thefirst insulation member 262. The first insulatingmember 262 may have afirst side 422 and asecond side 424, thefirst side 422 facing theflange 120 and thesecond side 424 facing thesupport member 150. The first insulatingmember 262 may have a through-hole 430, the through-hole 430 extending from thefirst side 422 to thesecond side 424. Thecathode drive unit 130 may include afirst seal 210 as described herein. Thefirst seal 210 may be disposed between the first and second insulatingmembers 262, 264. Thecathode drive unit 130 may alternatively or additionally include asecond seal 410 as described herein. Thesecond seal 410 may be disposed on thefirst side 422 of the first insulatingmember 262. The through-hole 430 is disposed at a radially outer position of thesecond seal 410.

FIG. 6 depicts a schematic view of adeposition apparatus 100 according to various embodiments described herein. Thedeposition apparatus 100 includes acathode driving unit 130, and thecathode driving unit 130 includes afirst sealing member 210 and asecond sealing member 410 described herein.

Thecathode driving unit 130 described herein may include afirst shaft 610. Thefirst shaft 610 may be used to provide power to thecathode assembly 140, and thecathode assembly 140 is fixed to thecathode driving unit 130, as shown in fig. 6 for example. Thefirst shaft 610 may be used to drive rotation of the target of thecathode assembly 140. Thefirst shaft 610 may be connected to a target, such as a tubular target. Thefirst shaft 610 may be connected to a power source, particularly a high voltage power source. Thefirst shaft 610 may be used to be supplied with a high voltage during the operation of thecathode driving unit 130.

Thefirst shaft 610 may extend in the same direction as therotational axis 290 of thecathode assembly 140. The insulating arrangement, the firstinsulating means 262 and/or the secondinsulating means 264 may surround thefirst shaft 610. Thefirst seal 210 may surround thefirst shaft 610.

Thecathode drive unit 130 described herein may include asecond shaft 620, as shown for example in fig. 6. Thesecond shaft 620 may be used to orient and/or align the magnet assembly of thecathode assembly 140. By orienting and/or aligning the magnet assembly, the sputtering direction of the target material exiting the target can be ensured. Thesecond shaft 620 may be connected to the magnet assembly. The magnet assembly may be static or movable during sputtering. For example, the magnet assembly may "wobble" (move more than an angle +/-30 °) when the substrate is static.

Thesecond shaft 620 may extend in the same direction as therotational axis 290 of thecathode assembly 140 and/or as thefirst shaft 610. Thefirst shaft 610 may surround at least a portion of thesecond shaft 620. Thefirst shaft 610 may be an outer shaft. Thesecond shaft 620 may be an inner shaft. Thefirst shaft 610 may be substantially coaxial with thesecond shaft 620. The insulating arrangement, the first insulatingmember 262 and/or the second insulatingmember 264 may surround thesecond shaft 620. Thefirst seal 210 may surround thesecond shaft 620.

Thecathode drive unit 130 described herein may include bearings to support thecathode assembly 140. Thecathode assembly 140 may be fixed to thecathode driving unit 130 at a bearing. The bearings may be used to be at a high voltage during operation of thecathode drive unit 130. The bearing may contact thefirst shaft 610 of thecathode assembly 140. The bearing may contact thesupport member 150 or be supported by thesupport member 150.

Thefirst shaft 610 is used for connecting a high voltage power supply. In view of the contact between thefirst shaft 610 and the bearing and the contact between the bearing and thesupport member 150, the high voltage of thefirst shaft 610 is transmitted to thesupport member 150 through the bearing. In view of this, thesupport member 150 is also at a high voltage during the operation of thecathode driving unit 130.

While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims (20)

1. A deposition apparatus for depositing material on a substrate, comprising:

a process chamber having a flange; and

a cathode drive unit coupled to the flange, the cathode drive unit comprising:

a support member;

an insulating arrangement, at least a portion of the insulating arrangement separating the support member and the flange, the insulating arrangement comprising a first insulating member and a second insulating member, the second insulating member being adjacent to the first insulating member; and

a seal between the first insulating member and the second insulating member.

2. The deposition apparatus of claim 1, wherein the support member is to be at a high voltage during operation of the cathode drive unit.

3. The deposition apparatus of claim 1, wherein the seal is to avoid arcing between the support member and the flange.

4. The deposition apparatus according to any one of claims 1 to 3, wherein the seal seals a gap between the first insulating member and the second insulating member.

5. A deposition apparatus according to any one of claims 1 to 3, wherein the seal is a band seal, around the axis of rotation of the cathode assembly.

6. The deposition apparatus according to any of claims 1 to 3, wherein the deposition apparatus is configured to deposit on a vertically positioned substrate.

7. The deposition apparatus of any of claims 1 to 3, wherein the deposition apparatus is to deposit on a large area substrate.

8. A cathode drive unit for a cathode assembly, the cathode drive unit configured to be coupled to a flange of a process chamber, the cathode drive unit comprising:

a support member to be at a high voltage during operation of the cathode driving unit;

an insulating arrangement, wherein at least a portion of the insulating arrangement is configured to separate the support member from the flange of the process chamber, the insulating arrangement comprising a first insulating member and a second insulating member, the second insulating member being adjacent to the first insulating member; and

a seal between the first insulating member and the second insulating member.

9. A deposition apparatus for depositing material on a substrate, comprising:

a process chamber having a flange; and

a cathode drive unit coupled to the flange, the cathode drive unit comprising:

a support member;

a first insulating member separating the support member and the flange, the first insulating member having a first side facing the flange and a second side facing the support member, the first insulating member having a through hole extending from the first side to the second side; and

a seal between the first insulating member and the flange, wherein the through-hole is arranged at a radially outer position of the seal.

10. The deposition apparatus of claim 9, wherein the support member is to be at a high voltage during operation of the cathode drive unit.

11. The deposition apparatus of claim 9, wherein the seal is to avoid arcing between the support member and the flange.

12. The deposition apparatus according to any one of claims 9 to 11, wherein the seal seals a gap between the cathode driving unit and the flange.

13. A deposition apparatus according to any one of claims 9 to 11, wherein the seal is a band seal, around the axis of rotation of the cathode assembly.

14. The deposition apparatus according to any one of claims 9 to 11, wherein the first insulating member is fastened to the support member by a first fastener, the first fastener being disposed in the through hole.

15. A deposition apparatus according to any one of claims 9 to 11, wherein the seal has a varying distance to the axis of rotation of the cathode assembly.

16. The deposition apparatus according to any one of claims 9 to 11, wherein the seal is a second seal, wherein the cathode driving unit further comprises:

an insulating arrangement comprising the first insulating member and a second insulating member, the second insulating member being adjacent to the first insulating member; and

a first seal disposed between the first and second insulating members.

17. The deposition apparatus according to any of claims 9 to 11, wherein the deposition apparatus is configured to deposit on a plurality of vertically positioned substrates.

18. The deposition apparatus according to any of claims 9 to 11, wherein the deposition apparatus is configured to deposit on a plurality of large area substrates.

19. A cathode drive unit for a cathode assembly having a rotating shaft, the cathode drive unit for coupling to a flange of a process chamber, the cathode drive unit comprising:

a support member to be at a high voltage during operation of the cathode driving unit;

a first insulating member configured to separate the support member from the flange of the process chamber, the first insulating member having a first side to face the flange and a second side to face the support member, the first insulating member having a through hole extending from the first side to the second side; and

a seal at the first insulating member, wherein the through-hole is arranged at a radially outer position of the seal.

20. The cathode drive unit according to claim 19, wherein the seal is a second seal, wherein the cathode drive unit further comprises:

an insulating arrangement comprising the first insulating member and a second insulating member, the second insulating member being adjacent to the first insulating member; and

a first seal disposed between the first and second insulating members.

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