CN212182364U - Flexible AMOLED panel packaging structure - Google Patents

Abstract

The utility model discloses a flexible AMOLED panel packaging structure: the method comprises the following steps: the packaging structure comprises a packaging layer, a barrier wall, an OLED device, a TFT circuit and a flexible glass substrate; the OLED device and the TFT circuit are arranged on the flexible glass substrate; the blocking wall is arranged around the OLED device and the TFT circuit in a surrounding mode, a gap is reserved between the blocking wall and the TFT circuit and between the blocking wall and the OLED device, and the packaging layer is arranged on the OLED device, the TFT circuit and the blocking wall. According to the invention, the separation wall is established at the periphery of the OLED device to separate the gap at the outer side of the OLED device, so that the problem of sealing failure of the thin film packaging structure caused by extending of the gap is prevented. By establishing the reliable film packaging structure of the AMOLED display device, the defects of the existing film packaging structure are overcome, and the sealing performance of the film packaging structure is improved, so that the purposes of prolonging the service life and improving the luminous efficiency of the AMOLED display are achieved.

Description

Flexible AMOLED panel packaging structure

Technical Field

The utility model relates to a OLED encapsulates the field, especially relates to a flexible AMOLED panel packaging structure.

Background

AMOLED is all called as: an Active-matrix organic light-emitting diode, translated as: active matrix organic light emitting diode or active matrix organic light emitting diode) is a display technology. Wherein the "OLED" is an Organic Light Emitting Diode (OLED) display; "AM" is the active matrix body or active matrix body refers to the pixel addressing technique behind. Compared with the traditional TFT-LCD display, the display has the excellent characteristics of self luminescence, no need of a backlight source, high contrast, thin thickness, wide viewing angle, high reaction speed, applicability to a flexible display screen, simple structure and the like, and becomes the mainstream display screen technology at present.

The core difficulty of the AMOLED display technology lies in the light emitting performance and the use efficiency of the OLED device, and as the light emitting material used by the OLED device is extremely sensitive to water and oxygen, once the water and oxygen contact the OLED device, the light emitting efficiency of the OLED device is reduced, even the OLED device directly fails. The current packaging technology is divided into a flexible panel package and a rigid panel package according to the glass substrate material, wherein the rigid panel package mainly includes: laser Frit packaging, UV glue & filler packaging, and the like, while flexible panel packaging includes: single-layer film packaging, multilayer film packaging and the like.

At present, the most applied package of the flexible panel is the multilayer thin film package technology, the multilayer thin film structure is mainly formed by stacking three or five thin film structures, the thin film structure comprises an organic buffer layer and an inorganic sealing layer, and the adopted main technologies are a Plasma Enhanced Chemical Vapor Deposition (PECVD) technology, a plasma enhanced atomic deposition (PEALD) technology, a vacuum evaporation technology and an inkjet printing technology (IJP).

Disclosure of Invention

Therefore, it is desirable to provide a flexible AMOLED panel package structure that blocks water and oxygen from entering the OLED display, and ensures the quality of the AMOLED display, the product life of the AMOLED display, and the light emitting efficiency.

To achieve the above object, the inventors provide a flexible AMOLED panel package structure, including: the packaging structure comprises a packaging layer, a barrier wall, an OLED device, a TFT circuit and a flexible glass substrate;

the OLED device and the TFT circuit are arranged on the flexible glass substrate;

the blocking wall is arranged around the OLED device and the TFT circuit in a surrounding mode, a gap is reserved between the blocking wall and the TFT circuit and between the blocking wall and the OLED device, and the packaging layer is arranged on the OLED device, the TFT circuit and the blocking wall.

Further, the reinforced sealing layer is also included; the reinforced sealing layer is arranged on the packaging layer.

Furthermore, the barrier walls are three stepped barrier walls, the barrier walls close to the OLED device are lower than the outermost barrier walls, and a gap is formed between each two adjacent barrier walls.

Further, the top of the barrier wall is provided with nano-corrugations.

Further, the encapsulation layer comprises from inside to outside: a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, and a third inorganic layer.

Different from the prior art, the technical scheme provides a flexible AMOLED panel packaging structure. Since the film package is formed by forming the inorganic sealing layer and the organic buffer layer one by one, each layer is a unitary film, once a crack begins to appear at the edge of the film, the crack will continuously extend along the crack toward the inside of the film, and finally the sealing performance of the film package structure is failed. According to the invention, the separation wall is established at the periphery of the OLED device to separate the gap at the outer side of the OLED device, so that the problem of sealing failure of the thin film packaging structure caused by extending of the gap is prevented. By establishing the reliable film packaging structure of the AMOLED display device, the defects of the existing film packaging structure are overcome, and the sealing performance of the film packaging structure is improved, so that the purposes of prolonging the service life and improving the luminous efficiency of the AMOLED display are achieved.

Drawings

FIG. 1 is a flow chart of a flexible AMOLED panel packaging method;

fig. 2 is a structural diagram of a flexible AMOLED panel package structure.

Description of reference numerals:

1. TFT circuit and OLED device;

10. a flexible glass substrate;

2. a barrier wall;

201. a first barrier wall; 202. a second barrier wall; 203. a third barrier wall;

3. a packaging layer;

301. a first inorganic layer; 302. a first organic layer; 303. a second inorganic layer;

304. a second organic layer; 305. a third inorganic layer;

4. and strengthening the sealing layer.

Detailed Description

To explain technical contents, structural features, and objects and effects of the technical solutions in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.

Referring to fig. 1 and fig. 2, in the present embodiment, a method for packaging a flexible AMOLED panel is provided, including: manufacturing abarrier wall 2 on aflexible glass substrate 10 with a TFT circuit and anOLED device 1, wherein thebarrier wall 2 is annularly arranged around the TFT circuit and theOLED device 1 to form a closed figure such as: rectangular, etc. and has a spacing from, i.e. no contact with, the TFT circuit,OLED device 1. The blockingwalls 2 are used to further block water and oxygen from entering the OLED device and theTFT circuit 1, and it should be noted that in this embodiment, the blockingwalls 2 not only serve to block water and oxygen, but also can prevent water and oxygen from entering the device by preventing theencapsulation layer 3 from further cracking. Specifically, when cracks begin to appear at the edge of theencapsulation layer 3, the cracks will continuously extend into theencapsulation layer 3 along the cracks, and thebarrier walls 2 will prevent the cracks from extending into theOLED device 1, so as to ensure the sealing performance of theencapsulation layer 3 and prolong the service life of the AMOLED display screen. Thepackaging layer 3 covers thebarrier wall 2, the TFT circuit and theOLED device 1 and is used for preventing water and oxygen from contacting theOLED device 1 and the TFT circuit. Theencapsulation layer 3 completely covers theOLED device 1, the TFT circuit, and theblocking wall 2, and it should be noted that theblocking wall 2 is located at any position between the edge of theOLED device 1 and the outer edge of theencapsulation layer 3. The technical scheme provides a flexible AMOLED panel packaging method. Since the film package is formed by forming the inorganic sealing layer and the organic buffer layer one by one, each layer is a unitary film, once a crack begins to appear at the edge of the film, the crack will continuously extend along the crack toward the inside of the film, and finally the sealing performance of the film package structure is failed. According to the invention, theseparation wall 2 is established at the periphery of theOLED device 1 to separate the gap at the outer side of theOLED device 1, so that the problem of sealing failure of a thin film packaging structure caused by extending of the gap is prevented. By establishing the reliable film packaging structure of the AMOLED display device, the defects of the existing film packaging structure are overcome, and the sealing performance of the film packaging structure is improved, so that the purposes of prolonging the service life and improving the luminous efficiency of the AMOLED display are achieved.

Since the light emitting material used in theOLED device 1 is extremely sensitive to water and oxygen, once water and oxygen come into contact with theOLED device 1, the light emitting efficiency of theOLED device 1 is reduced, and even theOLED device 1 directly fails. Referring to fig. 1, the manufacturing of thepackage layer 3 in the present embodiment further includes the following steps: a firstinorganic layer 301 is fabricated. A firstorganic layer 302 is formed on the firstinorganic layer 301. A secondinorganic layer 303 is formed to completely cover the firstinorganic layer 301 and the firstorganic layer 302. A secondorganic layer 304 is formed to completely cover the secondinorganic layer 303. A thirdinorganic layer 305 is formed to completely cover the secondorganic layer 304. In this embodiment, the firstinorganic layer 301 completely covers theOLED device 1 and the TFT circuit, the firstorganic layer 302 is disposed on the upper surface of the firstinorganic layer 301, the secondinorganic layer 303 completely covers the firstinorganic layer 301 and the firstorganic layer 302, and the secondorganic layer 304 completely covers the secondinorganic layer 303. The thirdinorganic layer 305 completely covers the secondorganic layer 304.

Of course, theencapsulation layer 3 can also be three layers, and the steps are as follows: a firstinorganic layer 301 is fabricated. A firstorganic layer 302 is formed on the firstinorganic layer 301. A secondinorganic layer 303 is formed to completely cover the firstinorganic layer 301 and the firstorganic layer 302. It should be noted that thebarrier walls 2 are also located at any position between the edge of theOLED device 1 and the outer edge of theencapsulation layer 3. The inorganic layer has a sealing effect, is used for blocking water and oxygen, has an effect of protecting theOLED device 1, is usually generated by adopting a plasma enhanced chemical vapor deposition or plasma enhanced atomic deposition, and can be made of inorganic materials such as silicon nitride and silicon oxide. The organic layer has a buffering effect, is used for releasing the stress of the film package, and can also have a flattening effect on the film package, so that the packaging structure is more reliable and complete, the organic layer can be generated by adopting an ink-jet printing technology, and the organic layer can be made of organic polymers such as polymethyl methacrylate, polyvinylidene chloride, polyethylene naphthalate and the like. Thepackaging layer 3 is used for blocking water and oxygen from entering the AMOLED display screen, so that the purposes of prolonging the service life of the AMOLED display and improving the luminous efficiency are achieved.

Referring to fig. 1, the method for packaging a flexible AMOLED panel in the present embodiment further includes the steps of: and depositing a reinforcedsealing layer 4. The reinforcedsealing layer 4 is an inactive transparent metal oxide film layer to enhance the sealing performance of the whole film packaging structure. The strengtheningsealing layer 4 is located at the outermost periphery of thepackaging layer 3, completely covers thepackaging layer 3, is used for strengthening the sealing performance of the packaging structure, and is generated in a plasma-enhanced atomic deposition mode, and the material is generally inactive transparent metal oxide such as aluminum oxide, titanium oxide, zirconium oxide, magnesium oxide and the like.

Referring to fig. 1 and 2, in the flexible AMOLED panel packaging method of the present embodiment, thebarrier walls 2 are formed to include three steppedbarrier walls 2, namely afirst barrier wall 201, asecond barrier wall 202, and athird barrier wall 203; thefirst barrier ribs 201 are close to theOLED device 1, thefirst barrier ribs 201, thesecond barrier ribs 202 and thethird barrier ribs 203 are sequentially increased, and a space is formed between each layer ofbarrier ribs 2. The three-layer steppedbarrier wall 2, which is continuously raised from inside to outside, blocks all possible cracks outside theOLED device 1. It should be noted that in practical use, the height of theencapsulation layer 3 is increased due to continuous stacking, which inevitably results in that the height of thebarrier ribs 2 is increased along with the increase of the height of theencapsulation layer 3. Of course, the number of thebarrier walls 2 may be determined according to the size of theencapsulation layer 3, and may be a single layer or multiple layers. In some embodiments, thefirst barrier ribs 201 are located within the firstinorganic layer 301; thesecond barrier ribs 202 are disposed outside the firstinorganic layer 301, and thesecond barrier ribs 202 are disposed around the firstinorganic layer 301, are in contact with the firstinorganic layer 301, and are located in the secondinorganic layer 303; thethird barrier rib 203 is disposed around the secondorganic layer 304, contacts the secondorganic layer 304, and is located in the thirdinorganic layer 305. The multiple layers of thebarrier walls 2 are used for isolating the crack outside theOLED device 1, so as to prevent the problem of the sealing failure of the thin film encapsulation structure caused by the crack extending.

Referring to fig. 2, in the present embodiment, a flexible AMOLED panel package structure is further provided, including: thepackaging layer 3, thebarrier ribs 2, theOLED device 1, the TFT circuit and the flexible glass substrate. TheOLED device 1 and the TFT circuit are arranged on the flexible glass substrate. The blockingwall 2 is arranged around theOLED device 1 and the TFT circuit in a surrounding mode and is not in contact with theOLED device 1 and the TFT circuit, and thepackaging layer 3 is arranged on theOLED device 1, the TFT circuit and the blockingwall 2. Thebarrier wall 2 is disposed at any position in thepackage layer 3, and the height thereof corresponds to the position where it is disposed, such as: when thebarrier walls 2 are arranged close to theOLED device 1, the height thereof is low; when positioned away from theOLED device 1, its height is higher. In this embodiment, theencapsulation layer 3 completely covers thebarrier ribs 2, theOLED device 1 and the TFT circuit. Thebarrier wall 2 is used for preventing thepackaging layer 3 from further cracking and plays a role of isolating water and oxygen. Since the film package is formed by forming the inorganic sealing layer and the organic buffer layer one by one, each layer is a unitary film, once a crack begins to appear at the edge of the film, the crack will continuously extend along the crack toward the inside of the film, and finally the sealing performance of the film package structure is failed. According to the invention, theseparation wall 2 is established at the periphery of theOLED device 1 to separate the gap at the outer side of theOLED device 1, so that the problem of sealing failure of a thin film packaging structure caused by extending of the gap is prevented. By establishing the reliable film packaging structure of the AMOLED display device, the defects of the existing film packaging structure are overcome, and the sealing performance of the film packaging structure is improved, so that the purposes of prolonging the service life and improving the luminous efficiency of the AMOLED display are achieved.

Referring to fig. 2, in some embodiments, a strengtheningseal layer 4 is further included; the reinforcedsealing layer 4 is disposed on theencapsulation layer 3. The strengtheningsealing layer 4 is located at the outermost periphery of thepackaging layer 3, completely covers thepackaging layer 3, is used for strengthening the sealing performance of the packaging structure, and is generated in a plasma-enhanced atomic deposition mode, and the material is generally inactive transparent metal oxide such as aluminum oxide, titanium oxide, zirconium oxide, magnesium oxide and the like.

In some embodiments, the top of thebarrier wall 2 is nano-corrugated. The top of each ring of thebarrier ribs 2 is designed to be nano-corrugated to enhance the adhesion strength between the inorganic layer and thebarrier ribs 2. Further prevent the entering of water and oxygen, and make the AMOLED display screen invalid.

Referring to fig. 2, in the present embodiment, thebarrier walls 2 are three steppedbarrier walls 2, thebarrier walls 2 close to theOLED device 1 are lower than theoutermost barrier walls 2, and a space is provided between each of thebarrier walls 2. The three-layer steppedbarrier wall 2, which is continuously raised from inside to outside, blocks all possible cracks outside theOLED device 1. Preventing the extension of cracks in theencapsulation layer 3 and further preventing the ingress of water and oxygen, only the device fails.

Referring to fig. 2, in the present embodiment, thepackage layer 3 includes, from inside to outside: a firstinorganic layer 301, a firstorganic layer 302, a secondinorganic layer 303, a secondorganic layer 304, and a thirdinorganic layer 305. In this embodiment, the firstinorganic layer 301 completely covers theOLED device 1 and the TFT circuit, the firstorganic layer 302 is disposed on the upper surface of the firstinorganic layer 301, the secondinorganic layer 303 completely covers the firstinorganic layer 301 and the firstorganic layer 302, and the secondorganic layer 304 completely covers the secondinorganic layer 303. The thirdinorganic layer 305 completely covers the secondorganic layer 304. The inorganic layer has a sealing effect, is used for blocking water and oxygen, has an effect of protecting theOLED device 1, is usually generated by adopting a plasma enhanced chemical vapor deposition or plasma enhanced atomic deposition, and can be made of inorganic materials such as silicon nitride and silicon oxide. The organic layer has a buffering effect, is used for releasing the stress of the film package, and can also have a flattening effect on the film package, so that the packaging structure is more reliable and complete, the organic layer can be generated by adopting an ink-jet printing technology, and the organic layer can be made of organic polymers such as polymethyl methacrylate, polyvinylidene chloride, polyethylene naphthalate and the like. Thepackaging layer 3 is used for blocking water and oxygen from entering the AMOLED display screen, so that the purposes of prolonging the service life of the AMOLED display and improving the luminous efficiency are achieved.

It should be noted that, although the above embodiments have been described herein, the scope of the present invention is not limited thereby. Therefore, based on the innovative concept of the present invention, the changes and modifications of the embodiments described herein, or the equivalent structure or equivalent process changes made by the contents of the specification and the drawings of the present invention, directly or indirectly apply the above technical solutions to other related technical fields, all included in the scope of the present invention.

Claims (5)

1. A flexible AMOLED panel packaging structure, comprising: the packaging structure comprises a packaging layer, a barrier wall, an OLED device, a TFT circuit and a flexible glass substrate;

the OLED device and the TFT circuit are arranged on the flexible glass substrate;

the blocking wall is arranged around the OLED device and the TFT circuit in a surrounding mode, a gap is reserved between the blocking wall and the TFT circuit and between the blocking wall and the OLED device, and the packaging layer is arranged on the OLED device, the TFT circuit and the blocking wall.

2. The flexible AMOLED panel package structure of claim 1, further comprising a reinforcing sealing layer; the reinforced sealing layer is arranged on the packaging layer.

3. The flexible AMOLED panel packaging structure of claim 1, wherein the barrier walls are three stepped barrier walls, the barrier walls close to the OLED devices are lower than the outermost barrier walls, and a space is provided between each two of the barrier walls.

4. The flexible AMOLED panel package structure of claim 1, wherein the top of the barrier wall is nano-corrugated.

5. The flexible AMOLED panel package structure of claim 1, wherein the encapsulation layer comprises, from inside to outside: a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, and a third inorganic layer.

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