CN211897105U - Supporting structure, support and coating equipment - Google Patents

Abstract

The utility model provides a bearing structure, support and coating equipment, bearing structure is applied to a coating equipment and treats the coating work piece in order to support at least, and wherein this coating equipment includes a reaction chamber and has a reaction chamber, bearing structure is held in this reaction chamber and is supported in this reaction chamber, wherein bearing structure includes a board main part and at least one electrode piece, wherein the electrode piece set up in the board main part.

Description

Supporting structure, support and coating equipment

Technical Field

The utility model relates to the surface treatment field especially involves bearing structure, support and filming equipment.

Background

The film layer can protect the surface of the material so as to endow the material with good physical and chemical properties.

The Plasma Enhanced Chemical Vapor Deposition (PECVD) coating technology has the characteristics of low deposition temperature, high deposition rate and the like, and is a common technical means for preparing a film layer. The plasma enhanced chemical vapor deposition coating technology utilizes high-energy electrons in plasma to activate gas molecules, promotes free radical formation and ionization, generates a large amount of active particles such as high-energy particles with strong chemical activity, atoms or molecular ions and electrons, and the active particles react chemically to generate reaction products. Since the energetic electrons provide energy to the source material particles, chemical vapor deposition can occur without the need to provide much external thermal energy, thereby reducing the reaction temperature, which makes possible chemical reactions that are otherwise difficult or very slow.

In the coating process, a workpiece to be coated needs to be placed in the reaction cavity, and then reaction gas is introduced. And depositing the reaction gas on the surface of the workpiece to be coated to form a film layer under the action of the plasma. In this process, the reaction chamber needs to provide an electric field environment to generate plasma. In a typical coating apparatus, electrodes are disposed in the housing of the reaction chamber, one electrode plate of each pair of electrodes is connected to one pole of a power supply, and the other electrode plate is grounded or connected to the other pole of the power supply. When the power source is turned on, an electric field is generated between a pair of the electrodes and the gas raw material located therein is activated to form plasma. The workpiece to be coated is held in the reaction chamber and can be contacted with a reaction gas to be coated in a plasma atmosphere.

The quasi-static state of the discharge plasma between the parallel electrode plates is in nonlinear distribution, a large voltage drop exists in an ion sheath which is added on the electrode, the voltage drop of the plasma is small, ions in the plasma bombard the surface of the cathode in an accelerating way through the sheath, secondary electrons are released from the surface of the cathode and accelerated to enter the plasma, and the high-energy electrons collide with gas molecules and ionize the gas molecules. Meanwhile, ions between neutral groups collide with the neutral groups, and a series of complex chemical reactions occur, which determine the chemical composition of plasma (Chengyu, deposition mechanism for preparing diamond-like carbon film by RF-PECVD, vacuum electron technology, 1997,4: 17-22).

Therefore, the arrangement position of the electrodes and the relative position of the electrodes and the workpiece to be coated affect the final coating effect. In order to perform batch coating on a plurality of workpieces to be coated, a plurality of pairs of electrodes are generally arranged in the reaction chamber and a certain distance needs to be maintained between a plurality of pairs of the electrodes or between each pair of the electrodes and the workpiece to be coated. Undoubtedly, the electrodes occupy more of the receiving space of the reaction chamber.

Referring to CN102534568B, a typical plasma enhanced chemical vapor deposition apparatus is disclosed, which comprises: the device comprises a cavity body, a gas-liquid separator and a gas-liquid separator, wherein a cavity is limited in the cavity body, and an opening for introducing process gas and radio frequency or intermediate frequency into the cavity is formed in the top wall of the cavity body; the upper electrode is arranged at the upper part of the cavity in a liftable way and is used for introducing radio frequency or intermediate frequency into the cavity through the opening; the bearing part is arranged at the lower part of the chamber; and the carrier plate is horizontally placed on the bearing part. The liftable upper electrode is arranged in the cavity, and the carrier plate is placed on the bearing part, so that the wafer on the carrier plate is stably coated in the process, and the process stability is improved.

The film preparation on the surface of the workpiece to be coated in the above manner will put high demands on the coating equipment itself, for example, the inside of the coating equipment needs to be provided with a lifting device for lifting the electrode, and the coating equipment needs to be designed to be longer for accommodating more workpieces to be coated at a time. Obviously, these requirements are not favorable for the industrial production of workpieces to be coated in large quantities and at low cost.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a bearing structure, support and coating film equipment, wherein bearing structure's at least part can be regarded as the electrode and use, bearing structure's at least part can play the supporting role to treating the coating film work piece.

Another object of the present invention is to provide a supporting structure, a bracket and a coating apparatus, wherein the supporting structure comprises a plate main body and at least one electrode, wherein the electrode is disposed on the plate main body, the electrode can be used as an electrode, and the plate main body can support the electrode.

Another object of the present invention is to provide a supporting structure, a bracket and a coating apparatus, wherein the electrode member comprises a plurality of interlaced electrode members, which are interlaced, the electrode members form a gas port, so as to facilitate the flow and diffusion of gas on opposite sides of the supporting structure.

Another object of the present invention is to provide a support structure, a bracket and a coating apparatus, wherein at least a portion of the support structure is a net structure, so as to facilitate the reduction of the weight of the bracket.

Another object of the present invention is to provide a supporting structure, a bracket and a coating apparatus, wherein the supporting member can support the workpiece to be coated in a lower position of the plate main body to separate adjacent workpieces to be coated, thereby facilitating reduction of mutual interference between the workpieces to be coated.

According to an aspect of the present invention, the present invention provides a supporting structure for a coating apparatus to support at least one workpiece to be coated, wherein the coating apparatus includes a reaction chamber and has a reaction chamber, wherein the supporting structure is accommodated in the reaction chamber and supported by the reaction chamber, wherein the supporting structure includes a plate main body and at least one electrode member, wherein the electrode member is disposed on the plate main body, and the electrode member is conductively connected to a discharge device of the coating apparatus to discharge as an electrode.

According to at least one embodiment of the present invention, the electrode member includes a plurality of electrode members, the electrode members are respectively arranged in the plate main body and a plurality of the electrode members are staggered to form a plurality of vents.

According to at least one embodiment of the present invention, at least one of the vents forms the plate body.

According to at least one embodiment of the present invention, the plate body has at least one accommodating space, wherein the electrode member is located in the accommodating space, and the workpiece to be coated is supported by the supporting member.

According to at least one embodiment of the present invention, the size range of the vent is 0.5mm to 3 mm.

According to the utility model discloses an on the other hand, the utility model provides a support is applied to a coating equipment in order to support at least one coating film work piece of treating, and wherein this coating equipment includes a reaction chamber and has a reaction chamber, the support includes:

a plurality of supporting structures, wherein the supporting structures comprise a plate main body and at least one electrode element, the electrode element is arranged on the plate main body, the plate main body is used for supporting the workpiece to be coated, and the electrode element is conductively connected with a discharge device of the coating equipment to be used as an electrode for discharging.

According to at least one embodiment of the present invention, at least one of the vents forms the plate body.

According to at least one embodiment of the present invention, the plate body has at least one accommodating space, wherein the electrode member is located in the accommodating space, and the workpiece to be coated is supported by the electrode member.

According to at least one embodiment of the present invention, the size range of the vent is 0.5mm to 3 mm.

According to at least one embodiment of the present invention, the support further comprises at least one connecting member, wherein the connecting member supports the support structure in the reaction chamber of the coating device, and the support structure is connected to the connecting member at intervals.

According to at least one embodiment of the present invention, at least one of the connecting members is conductively connected to one of the supporting structures, and the supporting structure is conductively connected to the discharging device of the film plating apparatus located outside the reaction chamber through the connecting member.

According to at least one embodiment of the present invention, each of the supporting structures is conductively connected to at least one of the connecting members, the supporting structure is conductively connected to a pulse power source of the coating apparatus located outside the reaction chamber through the connecting member, and the supporting structure serves as a cathode of the pulse power source.

According to at least one embodiment of the present invention, at least one of the support structures is conductively connected to a pulse power source of the coating apparatus as a cathode via one of the connectors, and at least one of the support structures is conductively connected to the pulse power source as an anode via another of the connectors.

According to at least one embodiment of the invention, the support structure as cathode and the support structure as anode are arranged alternately.

According to at least one embodiment of the present invention, the support further comprises at least one insulating member, wherein the insulating member is disposed at the bottom end of the connecting member to support the connecting member in the reaction chamber.

According to another aspect of the utility model, the utility model provides a coating equipment supplies at least one coating film work piece coating film of treating, wherein coating equipment includes:

a reaction chamber, wherein the reaction chamber is provided with a reaction chamber;

a discharge device, wherein the discharge device is used for providing an electric field for the reaction chamber;

a gas supply part for supplying a gas to the reaction chamber; and

a support, wherein the support comprises a plurality of support structures, wherein the support structures comprise a plate body and at least one electrode element, wherein the electrode element is arranged on the plate body, the electrode element is conductively connected to a discharge device of the coating device to discharge as an electrode, wherein the support structures are conductively connected to the discharge device to discharge as an electrode, and the coated workpiece is supported on the plate body and coated in the reaction chamber by chemical vapor deposition.

Drawings

Fig. 1 is a schematic view of a stand according to a preferred embodiment of the present invention.

Fig. 2 is a schematic view of a plate structure of the bracket according to the above preferred embodiment of the present invention.

Fig. 3A is a schematic view of another embodiment of the plate structure of the bracket according to the above preferred embodiment of the present invention.

Fig. 3B is another schematic view of the plate structure of the bracket according to the above preferred embodiment of the present invention.

Fig. 4 is a schematic view of a coating apparatus according to a preferred embodiment of the present invention.

Fig. 5 is a schematic view of another embodiment of the coating apparatus according to the above preferred embodiment of the present invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in a generic and descriptive sense only and not for purposes of limitation, as the terms are used in the description to indicate that the referenced device or element must have the specified orientation, be constructed and operated in the specified orientation, and not for the purpose of limitation.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

The utility model provides a supportingstructure 11 and asupport 10, whereinsupport 10 can be placed and use in a coating equipment 1, coating equipment 1 can be used to prepare various types of rete, DLC rete for example.

The coating equipment 1 can form a film layer on the surface of a workpiece to be coated by chemical deposition by utilizing a plasma enhanced chemical deposition (PECVD) technology. Specifically, the workpiece to be coated is placed in areaction chamber 20 of the coating apparatus 1 for plasma enhanced chemical vapor deposition to form the film on the surface of the workpiece to be coated.

Plasma Enhanced Chemical Vapor Deposition (PECVD) processes have many advantages over other existing deposition processes: (1) the dry type film deposition does not need to use an organic solvent; (2) the plasma acts on the surface of the substrate in an etching way, so that the deposited film has good adhesion with the substrate; (3) the coating can be uniformly deposited on the surface of the irregular matrix, and the gas phase permeability is extremely strong; (4) the coating has good designability, and compared with the micron-scale control precision of a liquid phase method, the chemical vapor phase method can control the thickness of the coating at a nanoscale scale; (5) the coating structure is easy to design, the chemical vapor method uses plasma for activation, a specific initiator is not required to be designed for initiating the composite coatings of different materials, and various raw materials can be compounded together by regulating and controlling input energy; (6) the compactness is good, the chemical vapor deposition method usually activates a plurality of active sites in the plasma initiation process, and is similar to the situation that a plurality of functional groups are arranged on one molecule in the solution reaction, and a cross-linking structure is formed among molecular chains through the plurality of functional groups; (7) as a coating treatment technical means, the coating treatment method has excellent universality, and the selection range of coating objects and raw materials used for coating is wide.

Referring to fig. 1 to 2 and to fig. 4, in particular, thesupport 10 includes a plurality of layers of thesupport structure 11, wherein the plurality of layers of thesupport structure 11 are held in areaction chamber 200 of areaction chamber 20 of the coating apparatus 1.

The workpiece to be coated can be placed in one or more layers in themulti-layer support structure 11 of thesupport 10.

Thesupport 10 includes at least one connectingmember 12, wherein the connectingmember 12 is disposed around thesupport structures 11 for supporting each of thesupport structures 11 at a predetermined height. Theadjacent support structures 11 are kept at a preset distance, so that reactants enter between theadjacent support structures 11 to be deposited on the surface of the workpiece to be coated, which is supported on thesupport structures 11.

In the present embodiment, thesupport structure 11 is rectangular in shape. It will be appreciated by those skilled in the art that the shape of thesupport structure 11 may be, but is not limited to, triangular, circular, or other shapes. Preferably, the shape of the cross section formed by the inner wall of thereaction chamber 20 of the shape of thesupport structure 11 is similar, on the one hand to facilitate the utilization of the space of thereaction chamber 200, and on the other hand to facilitate the equal distance from the periphery of thesupport structure 11 to the inner wall of thereaction chamber 20, so as to facilitate the uniformity of gas diffusion.

In this embodiment, the number of the connectingmembers 12 is four, and the connecting members are respectively located at four corners of the supportingstructure 11 to support the supportingstructure 11. Further, the connectingmember 12 may be implemented as a pillar capable of standing on thereaction chamber 20.

The supportingstructure 11 can support a plurality of workpieces to be coated, and both front and back sides of the workpieces to be coated placed on the supportingstructure 11 can be coated in the coating apparatus 1.

It is noted that at least a portion of thesupport structure 11 may be used as an electrode and that at least a portion of thesupport structure 11 may be used as a support. The portion of the support structure used as an electrode and the portion used as a support may be different or the same.

In particular, the support structure comprises aplate body 111 and at least onepole element 112, wherein thepole element 112 is arranged to theplate body 111. Theelectrode member 112 is conductively connected to adischarge device 40 of the plating apparatus 1 to discharge as an electrode. The platemain body 111 can support the workpiece to be coated.

Theelectrode member 112 includes a plurality ofelectrode members 1121 and has a plurality ofvents 110, wherein theelectrode members 1121 are staggered to form thevents 110.

Specifically, theplate body 111 forms a plurality of receivingspaces 1110, wherein the receivingspaces 1110 may be formed by drilling or theplate body 111 forms the receivingspaces 1110 in an integral molding process.

Theelectrode member 1121 may be located in the receivingspace 1110 and connected to the platemain body 111. In detail, theelectrode members 1121 alternately cross theaccommodating space 1110 so that the workpiece to be plated can be supported on theelectrode members 1121 and held in theaccommodating space 1110.

It is understood that in other embodiments of the present invention, the workpiece to be coated may be supported by the platemain body 111, so that the platemain body 111 performs a supporting function, and theelectrode 112 performs a discharging function, which are independent of each other.

Each of theaccommodating spaces 1110 can accommodate at least one workpiece to be coated. By theplate body 111, the adjacent workpieces to be coated can be separated to keep each workpiece to be coated in a relatively independent space.

The raw material gas may pass through theaccommodating space 1110 from top to bottom or from bottom to top, then pass through thevent 110 to diffuse between the layers, and be supported by theelectrode member 1121 such that the workpiece to be coated, which is held in theaccommodating space 1110, can be coated.

Of course, it is understood that the workpiece to be plated may be placed at the position of the platemain body 111, and the position of theelectrode member 1121 may function as a discharge and a raw material gas may pass therethrough.

Theelectrode member 1121 is made of a conductive material, and when the workpiece to be plated is placed on theelectrode member 1121, theelectrode member 1121 may be conductively connected to thedischarge device 40 to serve as a cathode. The platemain body 111 may be made of a conductive material, or may be insulating. When the platemain body 111 is made of an insulating material, the electric field around the workpiece to be plated is formed depending on theelectrode member 1121. The platemain body 111 may function as a shield for theadjacent receiving space 1110.

It is understood that the source gas may be a reactive gas selected based on the film requirements, for example, when the workpiece surface is required to be coated with a DLC film, the reactive gas may be C_xH_yWherein x is an integer of 1 to 10 and y is an integer of 1 to 20. The reaction gas may be a single gas or a mixed gas. Alternatively, the reaction gas may be methane, ethane, propane, butane, ethylene, acetylene, propylene, or propyne, which is gaseous at normal pressure, or may be vapor formed by evaporation under reduced pressure or heating. That is, the raw material which is liquid at the normal temperature may be supplied to thereaction chamber 200 in a gaseous state through agas supply part 30.

The source gas may be a plasma source gas, and may be, but is not limited to, an inert gas such as, but not limited to, helium or argon, nitrogen, or a fluorocarbon such as, but not limited to, carbon tetrafluoride. The plasma source gas may be a single gas, or may be a mixture of two or more gases.

The source gas may be an assist gas, and the assist gas may cooperate with the reactive gas to form a film layer, so as to impart desired properties to the film layer, such as strength, flexibility, etc. The assist gas may be a non-hydrocarbon gas such as nitrogen, hydrogen, fluorocarbon gas, and the like. The auxiliary gas may be supplied to thereaction chamber 20 simultaneously with the reaction gas, or may be introduced in a sequential order according to the requirement. The addition of the auxiliary gas can adjust the proportion of each element in the film layer and the proportion of carbon-hydrogen bonds, carbon-nitrogen bonds and nitrogen-hydrogen bonds, thereby changing the property of the film layer.

At least a portion of the source gas may be diffused from thevent 110 location of thesupport structure 11. Thevents 110 are positioned and sized in a particular arrangement to facilitate the diffusion of the source gases and the resulting coating effect.

In the present embodiment, the diameter of thevents 110 ranges from about 0.5mm to about 3mm, and the distance betweenadjacent vents 110 may be 60mm to about 90 mm.

The length and width dimensions of thesupport structures 11 may range from 500mm to 600mm, and the spacing betweenadjacent support structures 11 may range from 10mm to 200 mm.

Further, the coating apparatus 1 includes adischarge device 40, wherein thedischarge device 40 includes apulse power source 41 and a radiofrequency power source 42, wherein thepulse power source 41 is used for providing a pulse electric field, the radiofrequency power source 42 is used for providing a radio frequency electric field, and the radiofrequency power source 42 can be loaded on the electrode plate for generating the radio frequency electric field. Or the radiofrequency power supply 42 is arranged outside the cavity to be used as an inductively coupled plasma power supply so as to provide an alternating magnetic field. Thepulse power supply 41 and therf power supply 42 may be used individually or in combination.

It should be noted that, in the PECVD process, since the energy of therf power source 42 itself is low, the effect of generating plasma by discharging therf power source 42 alone in industrial mass production is not ideal, and as thereaction chamber 20 of the coating apparatus 1 is enlarged and the number of the works to be coated is increased, the adverse effects of non-uniform coating occur.

Pulsed discharge is also a common way in Plasma Enhanced Chemical Vapor Deposition (PECVD) processes. The pulse discharge energy is higher, and as thereaction cavity 20 of the coating device 1 is enlarged and the number of the workpieces to be coated is increased, the voltage requirement on thepulse power supply 41 is higher to enhance the processing capacity. However, thepulsed power supply 41 with a high voltage may generate stronger bombardment on the surface of the workpiece to be coated, so that the surface of the workpiece to be coated may be damaged.

In this embodiment, thepulse power source 41 and therf power source 42 can be used simultaneously, so as to increase the energy of the plasma reaching the surface of the workpiece to be coated to obtain a dense film layer on the basis of obtaining a high ionization rate plasma.

Further, theholder 10 is provided with at least one insulatingmember 13, wherein the insulatingmember 13 is made of an insulating material, such as teflon. The insulatingmember 13 is provided at the bottom end of the connectingmember 12. When theentire holder 10 is accommodated in thereaction chamber 20, the insulatingmember 13 may be supported by thereaction chamber 20, so that theholder 10 and thereaction chamber 20 cannot be conducted.

Theentire support 10 is conductively connected to thedischarge device 40 as a cathode, and thereaction chamber 20 may be grounded or conductively connected to thedischarge device 40 as an anode.

For example, theholder 10 may be conductively connected to thepulse power source 41 of thedischarge device 40 to serve as a cathode of thepulse power source 41, at least a portion of thereaction chamber 20 may be conductively connected to thepulse power source 41 of thedischarge device 40 to serve as an anode of thepulse power source 41, and thereaction chamber 20 may be grounded.

Therf power source 42 may be independent of thestent 10 or at least one of thesupport structures 11 of thestent 10 may be conductively coupled to therf power source 42.

The workpiece to be coated is placed on thesupport structure 11 serving as a cathode, so that positive ions in the plasma can be accelerated to move towards thesupport structure 11 serving as the cathode under the action of an electric field, and a compact film layer is formed on the surface of the workpiece to be coated.

In this process, the raw material gas can be diffused through thevent 110 of thesupport structure 11 at a predetermined position.

Illustratively, the source gas diffuses through thevent 110 of thesupport structure 11 at the second level, and thus enters between thesupport structure 11 at the second level and thesupport structure 11 at the third level. While the source gas between thesupport structure 11 of the second layer and thesupport structure 11 of the third layer may be diffused through thevent 110 of thesupport structure 11 of the third layer or through thevent 110 of thesupport structure 11 of the second layer.

It is noted that the workpiece to be coated has a front side and a back side, wherein the workpiece to be coated is supported by thesupport structure 11 with the front side facing upward. A source gas may be deposited to the back side of the workpiece to be coated through a gap between the workpiece to be coated and thesupport structure 11. Since at least a portion of the back surface of the workpiece to be coated is exposed to thevent 110 of thesupport structure 11, at least a portion of the raw material gas can pass through thevent 110 from top to bottom and then be deposited on the back surface of the workpiece to be coated, thereby enabling simultaneous coating of the front surface and the back surface of the workpiece to be coated.

Further, it is noted that, in the present embodiment, thesupport structure 11 is held at various height positions of thereaction chamber 200 of thereaction chamber 20 by theconnection members 12.

In other embodiments of the present invention, the supportingstructure 11 can be directly mounted to thereaction chamber 20, for example, referring to fig. 5, the supportingstructure 11 can be detachably mounted to thereaction chamber 20, for example, in a clamping manner, and thereaction chamber 20 can be provided with a groove. Thesupport structure 11 may be horizontally mounted to thereaction chamber 20, or vertically mounted to thereaction chamber 20.

Further, it should be noted that in the present embodiment, each of the supportingstructures 11 is made of an electrically conductive material, such as a stainless steel material, and at least one of the connectingmembers 12 may also be made of an electrically conductive material. The electricallyconductive support structures 11 are respectively conductively connected to the electrically conductive connectingelements 12, so that eachsupport structure 11 can be conductively connected to the outside by means of the conductive connection of the connectingelement 12 to the outside.

In this way, the cumbersome steps of wiring each of thesupport structures 11 to connect to the outside are eliminated, and the discharge control of thecradle 10 is facilitated.

Referring to fig. 3A and 3B, and to fig. 1 and 4, another embodiment of thestent 10 according to the present invention is illustrated. In this embodiment, thesupport structure 11 includes afirst support portion 113 and asecond support portion 114, wherein thefirst support portion 113 is supported by thesecond support portion 114, thefirst support portion 113 is used for supporting the workpiece to be coated, and thesecond support portion 114 is used for gas distribution.

Specifically, thefirst support portion 113 includes the platemain body 111 and a plurality of theelectrode members 112, wherein the plurality of theelectrode members 1121 of theelectrode members 112 alternately form the air vents 110, or the platemain body 111 and theelectrode members 1121 alternately form the air vents 110.

Theplate body 111 forms a plurality of receivingspaces 1110, wherein the receivingspaces 1110 may be formed by drilling or theplate body 111 forms the receivingspaces 1110 in an integral molding process.

Theelectrode member 1121 may be located in the receivingspace 1110 and connected to the platemain body 111. In detail, theelectrode members 1121 alternately cross theaccommodating space 1110 so that the workpiece to be plated can be supported on theelectrode members 1121 and held in theaccommodating space 1110.

Each of theaccommodating spaces 1110 can accommodate at least one workpiece to be coated. By theplate body 111, the adjacent workpieces to be coated can be separated to keep each workpiece to be coated in a relatively independent space. Thesecond support portion 114 includes theplate body 111 and has a plurality of thevents 110, wherein thevents 110 are formed at theplate body 111. Theplate body 111 is formed with at least onegas transmission passage 1100, wherein thegas vent 110 is communicated with thegas transmission passage 1100.

Thevent 110 is formed at thesecond support portion 114 and faces thesupport structure 11 of the next layer. When the workpiece to be coated is placed on thefirst support part 113 of thesupport structure 11, thesecond support part 114 of another layer of thesupport structure 11 is positioned above the workpiece to be coated.

When the gas leaves thesecond support 114 from thegas vent 110, at least a part of the gas can be ionized to form plasma under the action of the rf electric field and/or the pulsed electric field, and then positive ions in the plasma can be accelerated toward thefirst support 113 located below, so as to be deposited on the surface of the workpiece to be coated supported on thefirst support 113 of thesupport structure 11.

Further, thesecond support 114 may be conductively connected to therf power source 42, so that the gas can be ionized at thesecond support 114 and then accelerated toward the workpiece to be coated by thefirst support 113 as a cathode.

In this way, in addition to thesupport structures 11 of the first layer, thesupport structures 11 of each layer can be placed with the workpieces to be coated, so as to facilitate an increased space utilization of thesupport 10.

Further, the first supportingportion 113 of each of the supportingstructures 11 may be conductively connected to one of the connectingmembers 12 so as to be conveniently conducted with the outside, and the second supportingportion 114 of each of the supportingstructures 11 may be conductively connected to another one of the connectingmembers 12 so as to be conveniently conducted with the outside. Meanwhile, the first supportingportion 113 and the second supportingportion 114 of each supportingstructure 11 are insulated from each other.

Further, referring to fig. 4, the coating apparatus 1 further comprises anair extractor 50, afeeding device 60 and acontrol device 70, wherein theair extractor 50 and thefeeding device 60 are respectively communicably connected to thereaction chamber 20, and theair extractor 50, thefeeding device 60 and the dischargingdevice 40 are respectively controllably connected to thecontrol device 70. Thegas pumping device 50 is used for pumping gas to change the degree of vacuum in thereaction chamber 20. Thecontrol device 70 is used for controlling parameters such as the feeding flow rate, the proportion, the pressure, the discharge magnitude, the discharge frequency and the like in thereaction chamber 20, so that the whole coating process can be controlled.

According to another aspect of the present invention, the present invention provides a method of operating thesupport 10, comprising the steps of:

at least one layer of thesupport structure 11 of thesupport 10 is connected to thepulse power source 41 to discharge around at least one workpiece to be coated to form the pulse electric field, wherein thesupport structure 11 serves as a cathode of the pulse electric field.

According to some embodiments of the present invention, in the above method, the supportingstructure 11 and thepulse power source 41 located outside thereaction chamber 20 are turned on by at least one of the pillars supported by the supportingstructure 11, wherein thebracket 10 is located in thereaction chamber 20.

According to some embodiments of the present invention, the method of operating thesupport 10 further comprises the steps of:

at least one layer of thesupport structure 11 of thestent 10 conducts thepulse power source 41 to serve as an anode of thepulse power source 41, so as to form the pulse electric field between the anode serving as thepulse power source 41 and a cathode serving as thepulse power source 41.

According to some embodiments of the present invention, the working method of theelectrode holder 10 further comprises the steps of:

at least one layer of thesupport structure 11 of thestent 10 conducts the radiofrequency power source 42 to serve as an anode of the radiofrequency power source 42, so that the radio frequency electric field and the pulse electric field are formed between the anode serving as the radiofrequency power source 42 and the cathode serving as thepulse power source 41.

According to some embodiments of the present invention, the method of operating thesupport 10 further comprises the steps of:

releasing gas by at least one layer of saidsupport structure 11; and

the gas is ionized so as to be accelerated toward the coating tool under the action of the cathode of thepulse power supply 41.

It will be understood by those skilled in the art that the embodiments of the present invention as described above and shown in the drawings are given by way of example only and are not limiting of the present invention. The objects of the present invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the embodiments without departing from the principles, embodiments of the present invention may have any deformation or modification.

Claims (16)

1. A support structure for a coating apparatus for supporting at least one workpiece to be coated, wherein the coating apparatus comprises a reaction chamber and has a reaction chamber, characterized in that the support structure is accommodated in the reaction chamber and supported in the reaction chamber, wherein the support structure comprises a plate body and at least one electrode element, wherein the electrode element is arranged in the plate body, and the electrode element is conductively connected to a discharge device of the coating apparatus for discharge as an electrode.

2. The support structure of claim 1, wherein the electrode element includes a plurality of electrode members respectively disposed to the plate body and interleaved to form a plurality of air vents.

3. The support structure of claim 2, wherein at least one of the vents forms the plate body.

4. A support structure according to claim 1 or 2, wherein the plate body has at least one receiving space in which the electrode element is located, the workpiece to be coated being supported on the support structure.

5. The support structure of claim 2, wherein the size of the vent ranges from 0.5mm to 3 mm.

6. A support is applied to a coating device to support at least one workpiece to be coated, wherein the coating device comprises a reaction cavity and is provided with the reaction cavity, and the support is characterized by comprising:

a plurality of supporting structures, wherein the supporting structures comprise a plate body and at least one electrode element, wherein the electrode element is arranged on the plate body, and the electrode element is conductively connected to a discharge device of the coating equipment to be used as an electrode discharge.

7. The bracket of claim 6, wherein at least one vent forms the plate body.

8. The holder according to claim 6, wherein the plate body has at least one accommodation space, wherein the electrode member is located in the accommodation space, and the workpiece to be coated is supported by the electrode member.

9. The stent of claim 7, wherein the size of the vent ranges from 0.5mm to 3 mm.

10. The holder according to any one of claims 6 to 9, further comprising at least one connector, wherein the connector supports the support structure in the reaction chamber of the coating device, and the support structure is connected to the connector at intervals.

11. The support of claim 10, wherein at least one of said connectors is conductively coupled to one of said support structures, said support structure being conductively coupled to the discharge device of the coating apparatus located outside the reaction chamber through said connector.

12. The rack of claim 10, wherein each of the support structures is conductively connected to at least one of the connectors, the support structures are conductively connected to a pulsed power supply of the coating apparatus located outside the reaction chamber through the connectors, and the support structures serve as cathodes of the pulsed power supply.

13. The stand of claim 10, wherein at least one of said support structures is conductively connected to a pulsed power source of the coating apparatus as a cathode via one of said connectors and at least one of said support structures is conductively connected to the pulsed power source as an anode via another of said connectors.

14. The stent of claim 13, wherein the support structures that are cathodes and the support structures that are anodes are alternately arranged.

15. The rack of claim 10, further comprising at least one insulating member, wherein the insulating member is disposed at a bottom end of the connecting member to support the connecting member in the reaction chamber.

16. A coating equipment for coating at least one workpiece to be coated is characterized by comprising:

a reaction chamber, wherein the reaction chamber is provided with a reaction chamber;

a discharge device, wherein the discharge device is used for providing an electric field for the reaction chamber;

a gas supply part for supplying a gas to the reaction chamber; and

a support, wherein the support comprises a plurality of support structures, wherein the support structures comprise a plate body and at least one electrode element, wherein the electrode element is arranged on the plate body, the electrode element is conductively connected to a discharge device of the coating device to discharge as an electrode, wherein the support structures are conductively connected to the discharge device to discharge as an electrode, and the coated workpiece is supported on the plate body and coated in the reaction chamber by chemical vapor deposition.

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