CN210840208U - Circuit board - Google Patents

Abstract

The present application relates to a circuit board. The circuit board comprises a substrate layer structure, a first copper clad plate layer structure and a second copper clad plate layer structure, wherein the substrate layer structure comprises a first bonding layer, a second bonding layer arranged opposite to the first bonding layer and an intermediate layer positioned between the first bonding layer and the second bonding layer, the intermediate layer is respectively connected with the first bonding layer and the second bonding layer, and the intermediate layer is of a sponge structure; the first copper-clad plate layer structure comprises a first dielectric layer and a first copper foil layer which are arranged in a stacked mode, the first dielectric layer is bonded to the surface, deviating from the middle layer, of the first bonding layer, and the first copper foil layer is located on the surface, deviating from the first bonding layer, of the first dielectric layer; the second copper clad plate layer structure comprises a second dielectric layer and a second copper foil layer which are arranged in a stacked mode; first copper foil layer and second copper foil layer bond respectively and are fixed in the relative both sides of base member layer structure, and the holistic weight of base member layer structure is lighter in addition, makes the equipment of circuit board lighter, has solved the relatively poor problem of the simple to operate nature of antenna.

Description

Circuit board

Technical Field

The application relates to the technical field of structural parts of electrical equipment, in particular to a circuit board.

Background

The area of a printed circuit board required by an antenna applied to aerospace equipment such as an airborne radar device, a phased array system and a remote sensing satellite is large, and a large number of resistor elements are used in the printed circuit board, so that the weight of the aerospace equipment can be increased. For example, the mass of a conventional high-frequency antenna substrate reaches hundreds of kilograms, which results in poor installation convenience of the antenna.

SUMMERY OF THE UTILITY MODEL

Accordingly, it is necessary to provide a circuit board for solving the problem of poor convenience in mounting an antenna.

A circuit board, comprising:

the substrate layer structure comprises a first bonding layer, a second bonding layer and an intermediate layer, wherein the second bonding layer is arranged opposite to the first bonding layer, the intermediate layer is positioned between the first bonding layer and the second bonding layer, the intermediate layer is respectively connected with the first bonding layer and the second bonding layer, and the intermediate layer is in a sponge structure;

the first copper-clad plate layer structure comprises a first dielectric layer and a first copper foil layer which are arranged in a stacked mode, the first dielectric layer is bonded to the surface, deviating from the middle layer, of the first bonding layer, and the first copper foil layer is located on the surface, deviating from the first bonding layer, of the first dielectric layer;

the second copper clad plate layer structure comprises a second dielectric layer and a second copper foil layer which are stacked, wherein the second dielectric layer is bonded to one surface, deviating from the middle layer, of the second bonding layer, and the second copper foil layer is located on one surface, deviating from the second bonding layer, of the second dielectric layer.

In the circuit board, the middle layer is positioned between the first bonding layer and the second bonding layer and is of a sponge structure, so that the middle layer is lighter in weight; because the first dielectric layer bonds in the one side that deviates from the intermediate level of first adhesive linkage, the second dielectric layer bonds in the one side that deviates from the intermediate level of second adhesive linkage, make first copper foil layer bond in first adhesive linkage through first dielectric layer, and in the same way, the second copper foil layer bonds in the second adhesive linkage through the second dielectric layer, first copper foil layer and second copper foil layer bond respectively and are fixed in the relative both sides of base member layer structure like this, including the holistic weight of base member layer structure is lighter, make the equipment of circuit board lighter, the relatively poor problem of the simple to operate nature of antenna has been solved.

In one embodiment, the middle layer is an electromagnetic wave shielding cotton layer, so that the first copper clad plate layer structure and the second copper clad plate layer structure of the circuit board have good shielding performance.

In one embodiment, the first adhesive layer includes at least one of a prepreg layer or a photoresist layer, so that the first adhesive layer has low cost and good adhesive performance.

In one embodiment, the second adhesive layer includes at least one of a prepreg layer or a photoresist layer, so that the second adhesive layer has low cost and good adhesive performance.

In one embodiment, the first dielectric layer is a high-frequency microwave material layer, so that a high-frequency circuit is arranged on the first copper clad plate layer structure of the circuit board, and the frequency of radio waves generated by the circuit board is higher.

In one embodiment, the second dielectric layer is a high-frequency microwave material layer, so that a high-frequency circuit is arranged on the second copper-clad plate layer structure of the circuit board, and the frequency of radio waves generated by the circuit board is higher.

In one embodiment, the first copper foil layer is provided with a plurality of first grooves distributed at intervals at least on one surface adjacent to the first dielectric layer, so that the surface of the first copper foil layer adjacent to the first dielectric layer is rough, the contact area between the first copper foil layer and the first dielectric layer is large, and the first dielectric layer and the first copper foil layer are reliably connected.

In one embodiment, the second copper foil layer is provided with a plurality of second grooves distributed at intervals at least on one surface adjacent to the second dielectric layer, so that the surface of the second copper foil layer adjacent to the second dielectric layer is rough, the contact area between the second copper foil layer and the second dielectric layer is large, and the second dielectric layer and the second copper foil layer are reliably connected.

In one embodiment, the first dielectric layer and the first copper foil layer are integrally formed, so that the structure of the circuit board is compact.

In one embodiment, the second dielectric layer and the second copper foil layer are integrally formed, so that the structure of the circuit board is compact.

Drawings

Fig. 1 is a schematic structural diagram of a circuit board according to an embodiment;

fig. 2 is a schematic view of a first copper foil layer of the circuit board shown in fig. 1 being crimped by an auxiliary die.

Detailed Description

To facilitate an understanding of the present application, a wiring board will be described more fully below with reference to the associated drawings. Preferred embodiments of the wiring board are shown in the drawings. However, the wiring board may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the wiring boards herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1, acircuit board 10 of an embodiment includes abase layer structure 100, a first copper cladboard layer structure 200, and a second copper cladboard layer structure 300. The base layer structure includes a firstadhesive layer 110, a secondadhesive layer 120 disposed opposite the first adhesive layer, and anintermediate layer 130 disposed between the first adhesive layer and the second adhesive layer. The middle layer is connected with the first bonding layer and the second bonding layer respectively. The middle layer is of a sponge structure, so that the middle layer is light in weight.

As shown in fig. 1, in one embodiment, the first copper clad laminate structure includes a firstdielectric layer 210 and a firstcopper foil layer 220 disposed in a stacked arrangement. The first medium layer is bonded to the surface, away from the middle layer, of the first bonding layer. The first copper foil layer is located on one surface, away from the first bonding layer, of the first dielectric layer, so that the first copper foil layer is connected with the first bonding layer through the first dielectric layer.

As shown in fig. 1, in one embodiment, the second copper clad laminate structure includes a seconddielectric layer 310 and a secondcopper foil layer 320 disposed in a stacked arrangement. The second medium layer is bonded to the surface, away from the middle layer, of the second bonding layer. The second copper foil layer is located on one surface, away from the second bonding layer, of the second dielectric layer, so that the second copper foil layer is connected with the second bonding layer through the second dielectric layer.

In the circuit board, the middle layer is positioned between the first bonding layer and the second bonding layer and is of a sponge structure, so that the middle layer is lighter in weight. Because the first dielectric layer bonds in the one side that deviates from the intermediate level of first adhesive linkage, the second dielectric layer bonds in the one side that deviates from the intermediate level of second adhesive linkage, make first copper foil layer bond in first adhesive linkage through first dielectric layer, and in the same way, the second copper foil layer bonds in the second adhesive linkage through the second dielectric layer, first copper foil layer and second copper foil layer bond respectively and are fixed in the relative both sides of base member layer structure like this, including the holistic weight of base member layer structure is lighter, make the equipment of circuit board lighter, the relatively poor problem of the simple to operate nature of antenna has been solved.

As shown in fig. 1 and 2, in one embodiment, the first dielectric layer is bonded to the first adhesive layer by pressing with anauxiliary mold 20 of a pressing machine, so that the first dielectric layer is reliably bonded to the first adhesive layer. In one embodiment, the second dielectric layer is bonded to the second adhesive layer by pressing with an auxiliary mold of a pressing machine, so that the second dielectric layer is reliably bonded to the second adhesive layer.

In order to enable the first copper clad plate layer structure and the second copper clad plate layer structure of the circuit board to have good shielding performance, in one embodiment, the intermediate layer is an electromagnetic wave shielding cotton layer, so that the first copper clad plate layer structure and the second copper clad plate layer structure of the circuit board have good shielding performance. In this embodiment, the material of the electromagnetic wave shielding cotton layer is electromagnetic wave shielding cotton.

In one embodiment, the first adhesive layer includes at least one of a prepreg layer or a photoresist layer, so that the first adhesive layer has low cost and good adhesive performance. In this embodiment, the first adhesive layer is a prepreg layer. It is understood that in other embodiments, the first adhesive layer may also be a photoresist layer. Specifically, the first adhesive layer is an AD glue layer. In one embodiment, the resin of the first adhesive layer is epoxy resin, so that the cost of the first adhesive layer is low.

In one embodiment, the second adhesive layer includes at least one of a prepreg layer or a photoresist layer, so that the second adhesive layer has low cost and good adhesive performance. In this embodiment, the second adhesive layer is a prepreg layer. It is understood that in other embodiments, the second adhesive layer may also be a photoresist layer. Specifically, the material of the second adhesive layer is AD glue. In one embodiment, the resin of the second adhesive layer is epoxy resin, so that the cost of the second adhesive layer is low.

In one embodiment, the first adhesive layer comprises a mixed layer structure of a prepreg layer and a photosensitive adhesive layer, so that the second adhesive layer has better adhesive property. In one embodiment, the second adhesive layer comprises a mixed layer structure of a prepreg layer and a photosensitive adhesive layer, so that the second adhesive layer has better adhesive performance.

In order to make the frequency of the radio wave generated by the circuit board higher, in one embodiment, the first dielectric layer is a high-frequency microwave material layer, so that a high-frequency circuit is arranged on the first copper-clad plate layer structure of the circuit board, and the frequency of the radio wave generated by the circuit board is higher. In this embodiment, the first dielectric layer is made of a high frequency microwave material.

In order to make the frequency of the radio wave generated by the circuit board higher, in one embodiment, the second dielectric layer is a high-frequency microwave material layer, so that a high-frequency circuit is arranged on the second copper-clad plate layer structure of the circuit board, and the frequency of the radio wave generated by the circuit board is higher. In this embodiment, the second dielectric layer is made of a high frequency microwave material. The circuit board is a high-frequency circuit board, the technical problem that a high-frequency material is bonded on a spongy structure is solved, the weight of the circuit board is further reduced, and the light development of equipment is promoted.

In one embodiment, the first copper foil layer is provided with a plurality of first grooves distributed at intervals at least on one surface adjacent to the first dielectric layer, so that the surface of the first copper foil layer adjacent to the first dielectric layer is rough, the contact area between the first copper foil layer and the first dielectric layer is large, and the first dielectric layer and the first copper foil layer are reliably connected. In this embodiment, the first copper foil layer is a copper foil with a relatively low roughness on at least one side adjacent to the first dielectric layer. Further, the first copper foil layer is an ultra-low roughness copper foil.

In one embodiment, the second copper foil layer is provided with a plurality of second grooves distributed at intervals at least on one surface adjacent to the second dielectric layer, so that the surface of the second copper foil layer adjacent to the second dielectric layer is rough, the contact area between the second copper foil layer and the second dielectric layer is large, and the second dielectric layer and the second copper foil layer are reliably connected. In this embodiment, the second copper foil layer is a copper foil with a relatively low roughness on at least one side adjacent to the second dielectric layer. Further, the second copper foil layer is an ultra-low roughness copper foil.

In one embodiment, the first dielectric layer and the first copper foil layer are integrally formed, so that the structure of the circuit board is compact. In other embodiments, the first dielectric layer and the first copper foil layer may be formed separately and connected by glue.

In one embodiment, the second dielectric layer and the second copper foil layer are integrally formed, so that the structure of the circuit board is compact. In other embodiments, the second dielectric layer and the second copper foil layer may be formed separately and connected by glue.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.

Claims (10)

1. A circuit board, comprising:

the substrate layer structure comprises a first bonding layer, a second bonding layer and an intermediate layer, wherein the second bonding layer is arranged opposite to the first bonding layer, the intermediate layer is positioned between the first bonding layer and the second bonding layer, the intermediate layer is respectively connected with the first bonding layer and the second bonding layer, and the intermediate layer is in a sponge structure;

the first copper-clad plate layer structure comprises a first dielectric layer and a first copper foil layer which are arranged in a stacked mode, the first dielectric layer is bonded to the surface, deviating from the middle layer, of the first bonding layer, and the first copper foil layer is located on the surface, deviating from the first bonding layer, of the first dielectric layer;

the second copper clad plate layer structure comprises a second dielectric layer and a second copper foil layer which are stacked, wherein the second dielectric layer is bonded to one surface, deviating from the middle layer, of the second bonding layer, and the second copper foil layer is located on one surface, deviating from the second bonding layer, of the second dielectric layer.

2. The wiring board of claim 1, wherein the intermediate layer is an electromagnetic wave shielding cotton layer.

3. The wiring board of claim 1, wherein the first adhesive layer comprises at least one of a prepreg layer or a photoresist layer.

4. The wiring board of claim 1, wherein the second adhesive layer comprises at least one of a prepreg layer or a photoresist layer.

5. The wiring board of claim 1, wherein the first dielectric layer is a high frequency microwave material layer.

6. The wiring board of claim 1, wherein the second dielectric layer is a high frequency microwave material layer.

7. The wiring board of claim 1, wherein the first copper foil layer is formed with a plurality of first grooves spaced apart at least on a side adjacent to the first dielectric layer.

8. The wiring board of claim 1, wherein the second copper foil layer is formed with a plurality of second grooves spaced apart at least on a side adjacent to the second dielectric layer.

9. The wiring board of claim 1, wherein the first dielectric layer and the first copper foil layer are integrally formed.

10. The wiring board of claim 1, wherein the second dielectric layer and the second copper foil layer are integrally formed.

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