CN210377450U - Isolated communication circuit and induction cooker - Google Patents

Abstract

The utility model provides an keep apart communication circuit and electromagnetism stove is connected with first communication subassembly through the input of first opto-coupler isolation chip IC1, and the input of first opto-coupler isolation chip IC1 is parallelly connected with first resistance circuit, and the output of first opto-coupler isolation chip IC1 loops through first amplifier circuit and second resistance circuit and is connected with the second communication subassembly; the input end of the second optical coupling isolation chip IC2 is connected with the second communication assembly, the input end of the second optical coupling isolation chip IC2 is connected with a second resistor circuit in parallel, and the output end of the second optical coupling isolation chip IC2 is connected with the first communication assembly sequentially through a second amplifying circuit and a first resistor circuit; the input end of the third optical coupling isolation chip IC3 is connected with the second communication assembly, and the output end of the third optical coupling isolation chip IC3 is connected with the first communication assembly. The embodiment realizes the isolated communication of I2C through two signal wires, and has simple structure without modifying software.

Description

Isolated communication circuit and induction cooker

Technical Field

The embodiment of the utility model provides an relate to household electrical appliances technical field, especially relate to an keep apart communication circuit and electromagnetism stove.

Background

The I2C BUS (Inter-IC or IIC BUS, Inter-IC interconnect BUS) is a serial BUS developed by Philips (PHILIPS). I2C has now become an important global industry standard, approved and used by all major IC manufacturers. In computer network communication equipment, devices with an I2C bus interface are increasingly used.

Currently, the I2C bus has two signal lines: a Clock Line (SCL), and a bidirectional Data Line (SDA). The clock line SCL of all master and slave devices connected to the I2C bus is connected to the SCL of the bus, and the data line SDA thereof is connected to the bi-directional data line SDA line of the bus. The bus uses software addressing to identify each device (e.g., microcontroller, memory, LCD driver, clock chip, and other I2C bus devices), eliminating the chip select line for each device altogether, and thus making the wiring of the system very simple.

However, if the master device and the slave device need to be isolated from each other, two-wire communication has to be changed to three-wire communication for circuit simplification, but the problem of software program incompatibility is caused.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides an keep apart communication circuit and electromagnetism stove can realize keeping apart the communication through two signal lines in I2C bus communication, and simple structure need not modify software.

In a first aspect, the present invention provides an isolated communication circuit, including: the communication device comprises a first communication assembly, a second communication assembly, a first optical coupling isolation chip IC1, a second optical coupling isolation chip IC2, a third optical coupling isolation chip IC3, a first resistance circuit, a second resistance circuit, a first amplification circuit and a second amplification circuit; wherein

The input end of the first optical coupling isolation chip IC1 is connected with the first communication assembly, the input end of the first optical coupling isolation chip IC1 is connected with the first resistor circuit in parallel, and the output end of the first optical coupling isolation chip IC1 is connected with the second communication assembly sequentially through the first amplifying circuit and the second resistor circuit;

the input end of the second optical coupling isolation chip IC2 is connected with the second communication assembly, the input end of the second optical coupling isolation chip IC2 is connected with the second resistor circuit in parallel, and the output end of the second optical coupling isolation chip IC2 is connected with the first communication assembly sequentially through the second amplifying circuit and the first resistor circuit;

the input end of the third optical coupling isolation chip IC3 is connected with the second communication assembly, and the output end of the third optical coupling isolation chip IC3 is connected with the first communication assembly.

The isolated communication circuit provided by this embodiment is connected to the first communication component through the input end of the first optical coupling isolation chip, and the input end of the first optical coupling isolation chip is connected in parallel with the first resistor circuit, and the output end of the second optical coupling isolation chip is connected to the first communication component through the first resistor circuit, so that the input end of the first optical coupling isolation chip and the output end of the second optical coupling isolation chip share a data signal line, and the input end of the second optical coupling isolation chip is connected to the second communication component through the input end of the second optical coupling isolation chip, and the input end of the second optical coupling isolation chip IC2 is connected in parallel with the second resistor circuit, and the output end of the first optical coupling isolation chip is connected to the second communication component through the second resistor circuit, so that the output end of the first optical coupling isolation chip and the input end of the second optical coupling isolation chip share a data signal line, thereby realizing bidirectional data transmission between the first communication component and the second communication component through one signal line, the output end of the first optical coupling isolation chip IC1 is provided with a first amplifying circuit, and the output end of the second optical coupling isolation chip IC2 is provided with a second amplifying circuit, so that a first-stage amplifying circuit is added, and when the first optical coupling isolation chip IC1 and the second optical coupling isolation chip IC2 cannot be saturated, level signals can be normally transmitted; the input end of the third optical coupling isolation chip is connected with the second communication assembly, the output end of the third optical coupling isolation chip is connected with the first communication assembly, the first communication assembly and the second communication assembly are used for transmitting clock signals through a clock line, devices do not need to be added, software does not need to be improved, and I2C bus communication is achieved.

In one possible design, the first amplifying circuit includes a bias resistor R41 and a transistor Q4, the bias resistor R41 is respectively connected to the output terminal of the first optocoupler isolation chip IC1 and the base of the transistor Q4, and the collector of the transistor Q4 is respectively connected to the first power supply and the second resistor circuit;

the second amplifying circuit comprises a bias resistor R10 and a triode Q6, the bias resistor R10 is connected with the output end of the second optical coupling isolation chip IC2 and the base electrode of the triode Q6 respectively, and the collector electrode of the triode Q6 is connected with a second power supply and the first resistor circuit respectively.

This biasing resistance R41 can adjust the electric current of triode Q4's base for triode Q4 work is at suitable operating point, includes biasing resistance and triode Q4 through first amplifier circuit, and simple structure easily realizes.

In one possible design, the first optical coupler isolation chip IC1 includes a first photodiode and a first phototransistor, the first photodiode is connected to the first communication component, and two ends of the first photodiode are respectively connected to the first resistor circuit;

and the collector electrode of the first phototriode is connected with a third power supply, and the emitter electrode of the first phototriode is connected with the first amplifying circuit.

In one possible design, the second optical coupler isolation chip IC2 includes a second photodiode and a second phototransistor, the second photodiode is connected to the second communication module, and two ends of the second photodiode are respectively connected to the second resistor circuit;

and the collector electrode of the second phototriode is connected with a power supply, and the emitter electrode of the second phototriode is connected with the second amplifying circuit.

The optical isolation communication is realized through the photodiode and the photosensitive diode, the structure is simple and easy to realize, and the input end and the output end of the optical coupler are transmitted through optical signals, so that the two parts are electrically and completely isolated, and no electric signal is fed back or interfered, so that the performance is stable, and the anti-interference capability is strong.

In one possible design, further comprising: one end of the resistor R46 is connected with the first power supply, and the other end of the resistor R46 is respectively connected with the collector of the triode Q4 and the input end of the second optocouplerisolation chip IC 2.

The resistor R46 has the functions of a pull-up resistor and a current-limiting resistor, and realizes two functions through one resistor, so that the circuit structure is simple, and the cost is saved.

In one possible design, further comprising: one end of the resistor R43 is connected with the second power supply, and the other end of the resistor R43 is respectively connected with the collector of the triode Q6 and the input end of the first optocouplerisolation chip IC 1.

The resistor R43 has the functions of a pull-up resistor and a current-limiting resistor, and realizes two functions through one resistor, so that the circuit structure is simple, and the cost is saved.

In one possible design, further comprising: a first filter capacitor C6 and a second filter capacitor C7, wherein

One end of the first filter capacitor C6 is connected with the input end of the first optically-coupled isolation chip IC1, and the other end of the first filter capacitor C6 is grounded;

one end of the second filter capacitor C7 is connected with the input end of the second optical coupling isolation chip IC2, and the other end of the second filter capacitor C7 is grounded.

This first filter electric capacity C6 can filter the output of first opto-coupler isolation chip IC1 to the deburring, this second filter electric capacity C7 can filter the output of second opto-coupler isolation chip IC2, with the deburring, thereby has guaranteed communication quality.

In one possible design, the third light-coupled isolation chip IC3 includes a third photodiode and a third phototransistor;

the third photodiode is connected with the second communication component, and the third phototriode is connected with the first communication component.

In a second aspect, the present invention provides an induction hob including an isolated communication circuit as described above in the first aspect or in various possible designs of the first aspect.

In one possible design, the first communication component is a motherboard chip and the second communication component is a lamp panel chip.

The electromagnetism stove that this embodiment provided, through including foretell isolation communication circuit, can realize the isolation communication of mainboard chip and lamp plate chip, realized that mainboard chip and lamp plate chip all have two IO mouths and can carry out I2C bus communication, need not increase the device and also need not improve software.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.

FIG. 1 is a schematic diagram of an isolated communication circuit provided by the prior art;

fig. 2 is a first schematic diagram of an isolated communication circuit provided by the present invention;

fig. 3 is a schematic diagram two of the isolated communication circuit provided by the present invention.

Description of reference numerals:

10-a first communication component;

20-a second communication component;

30-a first resistance circuit;

40-a second resistance circuit;

50-a first amplification circuit;

60-a second amplifying circuit.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Fig. 1 is a schematic diagram of an isolation communication circuit provided in the prior art, and as shown in fig. 1, an example of communication between a motherboard chip and a lamp panel chip requiring isolation is described. Wherein, the lamp plate chip is the master device, and the mainboard chip is from the device. The isolation process is realized through the optical coupling isolation chip, and the transmission of the optical coupling isolation chip is unidirectional transmission, so that the isolation communication circuit is provided with three optical coupling isolation chips and three communication lines correspondingly.

As shown in fig. 1, a clock line and two data lines are disposed between the motherboard chip and the lamp panel chip. The data output interface DAT/O of the mainboard chip corresponds to the data line to the data access interface DAT/IN of the lamp panel chip, and data transmission is carried out through the first optical couplingisolation chip IC 1. And a data output interface DAT/O of the lamp panel chip corresponds to another data line to a data access interface DAT/IN of the mainboard chip, and data transmission is carried out through a second optical couplingisolation chip IC 2. A Clock line is arranged between the lamp panel chip and the mainboard chip, and the lamp panel chip transmits Clock signals (Clock, CLK) through the third optical couplingisolation chip IC 3.

Therefore, when the prior art communicates through the I2C bus, in order to implement isolated communication, 3 input/output IO ports are needed to complete data communication, that is, two-wire communication needs to be changed into three-wire communication. However, in the conventional bus, the two-wire communication is addressed by software, but for the three-wire communication, the compatibility of the software cannot be obtained, and the software needs to be addressed, so that an isolated communication circuit capable of two-wire communication needs to be provided under the condition that the circuit structure is simple.

Fig. 2 is a first schematic diagram of the isolated communication circuit provided by the present invention. When the two communication assemblies of the embodiment perform isolated communication through the I2C bus, only two signal lines are needed to complete the communication. As shown in fig. 2, the isolated communication circuit includes: the communication module comprises afirst communication module 10, asecond communication module 20, a first optical coupling isolation chip IC1, a second optical coupling isolation chip IC2, a third optical coupling isolation chip IC3, afirst resistance circuit 30, asecond resistance circuit 40, afirst amplifying circuit 50 and asecond amplifying circuit 60.

The input end of the first optical coupling isolation chip IC1 is connected with thefirst communication component 10, the input end of the first optical coupling isolation chip IC1 is connected with thefirst resistance circuit 30 in parallel, and the output end of the first optical coupling isolation chip IC1 is connected with thesecond communication component 20 sequentially through thefirst amplification circuit 50 and thesecond resistance circuit 40;

the input end of the second optical coupling isolation chip IC2 is connected with thesecond communication component 20, the input end of the second optical coupling isolation chip IC2 is connected with thesecond resistance circuit 40 in parallel, and the output end of the second optical coupling isolation chip IC2 is connected with thefirst communication component 10 sequentially through thesecond amplifying circuit 60 and thefirst resistance circuit 30;

the input end of the third optical coupling isolation chip IC3 is connected with thesecond communication assembly 20, and the output end of the third optical coupling isolation chip IC3 is connected with thefirst communication assembly 10.

Thefirst resistance circuit 30 and thesecond resistance circuit 40 are circuits including resistances, and the resistances included in thefirst resistance circuit 30 and thesecond resistance circuit 40 may be connected in series or in parallel, or some resistances may be connected in series or some resistances may be connected in parallel. The present embodiment does not particularly limit the implementation manner of thefirst resistance circuit 30 and thesecond resistance circuit 40.

First optical coupling isolation chip IC1, second optical coupling isolation chip IC2 and third optical coupling isolation chip IC3 are the chip including the optical coupling isolator, and the one-way data transmission can be realized to the optical coupling isolation chip. The light emitting device of the optical coupler is a photodiode, and the optical receiver is a phototriode. When current passes through the light emitting diode, a light source is formed, the light source irradiates the surface of the phototriode, so that the phototriode generates collector current, and the magnitude of the current is in direct proportion to the intensity of illumination, namely the magnitude of forward current flowing through the photodiode. The end with the photodiode is the input end, and the end with the phototriode is the output end.

The first optical coupling isolation chip IC1 can enable thefirst communication module 10 to send data to thesecond communication module 20, and the second optical coupling isolation chip IC2 can enable thesecond communication module 20 to send data to thefirst communication module 10. The third optically coupled isolated chip IC3 enables thesecond communication assembly 20 to send a clock signal to thefirst communication assembly 10.

In the present embodiment, thefirst communication module 10 and thesecond communication module 20 can perform bidirectional data transmission via one signal line. Specifically, a line at the input end of the first optical coupling isolation chip IC1 and the output end of the second optical coupling isolation chip IC2 share a signal line, and a line at the output end of the first optical coupling isolation chip IC1 and a line at the input end of the second optical coupling isolation chip IC2 share a signal line, so that only one signal line is needed to transmit data.

Thefirst resistor circuit 30 is connected in parallel to the input end of the first optical coupler isolation chip IC1, and is connected to the output end of the second optical couplerisolation chip IC 2. When thesecond communication assembly 20 transmits data to thefirst communication assembly 10 through the second optical coupler isolation chip IC2, the level signal is transmitted to thefirst communication assembly 10 through thefirst resistance circuit 30, and thefirst resistance circuit 30 can transmit the level signal on one hand and can prevent the first optical coupler isolation chip IC1 from being short-circuited on the other hand.

Thesecond resistor circuit 40 is connected in parallel with the input end of the second optical coupling isolation chip IC2 and is connected with the output end of the first optical couplingisolation chip IC 1. When thefirst communication assembly 20 transmits data to thesecond communication assembly 20 through the first optical coupler isolation chip IC1, the level signal is transmitted to thesecond communication assembly 20 through thesecond resistance circuit 40, and thesecond resistance circuit 40 can transmit the level signal on one hand and can prevent the second optical coupler isolation chip IC2 from being short-circuited on the other hand.

Thus, thefirst communication module 10 and thesecond communication module 20 can perform bidirectional communication through one signal line by thefirst resistance circuit 30 and thesecond resistance circuit 40.

Under some scenes, the first optical coupler isolation chip IC1 and the second optical coupler isolation chip IC2 have the problem that the amplification factor is not enough and the saturation cannot be realized, so that the level signal cannot be normally transmitted. Therefore, the output end of the first optical coupling isolation chip IC1 is provided with thefirst amplifying circuit 50, the output end of the second optical coupling isolation chip IC2 is provided with thesecond amplifying circuit 60, namely, the first-stage amplifying circuit is added, and when the first optical coupling isolation chip IC1 and the second optical coupling isolation chip IC2 cannot be saturated, level signals can be normally transmitted.

The isolated communication circuit provided by this embodiment is connected to the first communication component through the input end of the first optical coupling isolation chip, and the input end of the first optical coupling isolation chip is connected in parallel with the first resistor circuit, and the output end of the second optical coupling isolation chip is connected to the first communication component through the first resistor circuit, so that the input end of the first optical coupling isolation chip and the output end of the second optical coupling isolation chip share a data signal line, and the input end of the second optical coupling isolation chip is connected to the second communication component through the input end of the second optical coupling isolation chip, and the input end of the second optical coupling isolation chip IC2 is connected in parallel with the second resistor circuit, and the output end of the first optical coupling isolation chip is connected to the second communication component through the second resistor circuit, so that the output end of the first optical coupling isolation chip and the input end of the second optical coupling isolation chip share a data signal line, thereby realizing bidirectional data transmission between the first communication component and the second communication component through one signal line, the output end of the first optical coupling isolation chip IC1 is provided with a first amplifying circuit, and the output end of the second optical coupling isolation chip IC2 is provided with a second amplifying circuit, so that a first-stage amplifying circuit is added, and when the first optical coupling isolation chip IC1 and the second optical coupling isolation chip IC2 cannot be saturated, level signals can be normally transmitted; the input end of the third optical coupling isolation chip is connected with the second communication assembly, the output end of the third optical coupling isolation chip is connected with the first communication assembly, the first communication assembly and the second communication assembly are used for transmitting clock signals through a clock line, devices do not need to be added, software does not need to be improved, and I2C bus communication is achieved.

Fig. 3 is a schematic diagram two of the isolated communication circuit provided by the present invention. In this embodiment, thefirst resistor circuit 30 includes a resistor R42, and thesecond resistor circuit 40 includes a resistor R45, which are not described herein for other implementations of thefirst resistor circuit 30 and thesecond resistor circuit 40.

By thefirst resistor circuit 30 including the resistor R42 and thesecond resistor circuit 40 including the resistor R45, the resistor circuit has a simple structure, is easy to implement, and has low cost.

In a possible implementation manner, thefirst amplifying circuit 50 includes a bias resistor R41 and a transistor Q4, the bias resistor R41 is respectively connected to the output terminal of the first optocoupler isolation chip IC1 and the base of the transistor Q4, and the collector of the transistor Q4 is respectively connected to the first power supply and the second resistor 45;

thesecond amplifying circuit 60 comprises a bias resistor R10 and a transistor Q6, the bias resistor R10 is respectively connected with the output end of the second optocoupler isolation chip IC2 and the base of the transistor Q6, and the collector of the transistor Q6 is respectively connected with the second power supply and thefirst resistor circuit 30.

In the present embodiment, the first andsecond amplification circuits 50 and 60 are amplification circuits implemented based on a triode. Taking thefirst amplifier circuit 50 as an example for description, thesecond amplifier circuit 60 is similar, and the description thereof is omitted here.

Thefirst amplifying circuit 50 includes a bias resistor R41 and a transistor Q4. The bias resistor R41 is capable of adjusting the current at the base of transistor Q4 so that transistor Q4 operates at the proper operating point. The operating point is the potential (which can be obtained by calculation) required for the base, emitter and collector of the transistor Q4 by the setting of the external circuit. Specifically, a small current is applied to the base of transistor Q4, and a larger current is obtained at the collector. The transistor Q4 of this embodiment can be selected according to the current available at the base, which ensures that the transistor Q4 can be saturated. The first amplifying circuit comprises a biasing resistor and a triode Q4, so that the structure is simple and easy to realize.

As shown in fig. 3, the first optical coupler isolation chip IC1 includes a first photodiode and a first phototransistor, the first photodiode is connected to the first communication module, and two ends of the first photodiode are respectively connected to the resistor R42; the collector of the first phototransistor is connected to a third power supply and the emitter of the first phototransistor is connected to afirst amplifier circuit 50. The second optical coupling isolation chip IC2 includes a second photodiode and a second phototransistor, the second photodiode is connected to thesecond communication module 20, and two ends of the second photodiode are respectively connected to thesecond resistor circuit 40; the collector of the second phototransistor is connected to the power supply and the emitter of the second phototransistor is connected to thesecond amplifier circuit 60.

The isolated communication circuit further includes: resistor R46 and resistor R43. One end of the resistor R46 is connected with a first power supply, and the other end of the resistor R46 is respectively connected with the collector of the triode Q4 and the input end of the second optocouplerisolation chip IC 2. One end of the resistor R43 and one end of the resistor R43 are connected with a second power supply, and the other ends of the resistor R43 and the resistor R43 are respectively connected with a collector of the triode Q6 and an input end of the first optical couplingisolation chip IC 1.

It should be explained that the optocoupler isolated chips of this embodiment all include a photodiode and a phototransistor, wherein the positive electrode of the photodiode is the 1 st pin, the negative electrode is the 2 nd pin, the emitter of the phototransistor is the 3 rd pin, and the collector of the phototransistor is the 4 th pin.

The connection of the I2C device to the bus output must be either open collector or open drain to perform the wired and logic function, which requires the power source VCC to be connected through a pull-up resistor. Therefore, the output terminal of IC1, which is thepin 3 of IC1, is connected to a resistor R46 (pull-up resistor), and the output terminal of IC2, which is thepin 3 of IC2, is connected to a resistor R43 (pull-up resistor). Meanwhile, the resistor R46 is also a current limiting resistor of the input terminal of the IC2, i.e., thepin 1 for the IC2, and the resistor R43 is also a current limiting resistor of theinput terminal 1 for the IC1 for theIC 1. The resistor R43 and the resistor R46 have the functions of a pull-up resistor and a current-limiting resistor, and two functions are realized through one resistor, so that the circuit structure is simple, and the cost is saved.

As can be seen from the above, the input end of the first optical coupling isolation chip IC1 shares the resistor R43 with the output end of the second optical coupling isolation chip IC2, and the input end of the second optical coupling isolation chip IC2 shares the resistor R46 with the output end of the first optical couplingisolation chip IC 1.

From the perspective of ensuring the amplification factor of the phototriode, then for first optical coupling isolation chip IC1, it is required that resistance R43 is as small as possible, and resistance R46 is as large as possible, for second optical coupling isolation chip IC2, it is required that resistance R46 is as small as possible, and resistance R43 is as large as possible, for the requirements of first optical coupling isolation chip IC1 and second optical coupling isolation chip IC2, the requirements of the two on resistance R43 and resistance R46 are opposite, therefore, in order to satisfy the requirements of first optical coupling isolation chip IC1 and second optical coupling isolation chip IC2 simultaneously, it is required that resistance R43 is equal to resistance R46. Optionally, the resistor R43 is smaller than the resistor R42, and the resistor R46 is smaller than the resistor R45. Because the resistor R42 and the resistor R45 can ensure the work of the optical coupling isolation chip and can realize the transmission of high and low levels, the resistance value is relatively large.

In the present embodiment, the resistor R43 is equal to the resistor R46, but the problem that the phototransistor cannot be saturated due to the amplification factor exists, so the present embodiment adds the first amplifying circuit and the second amplifying circuit.

When the first communication component needs to transmit data, the data DAT port of the first communication component is in an output mode, the data DAT port of the second communication component is in an input mode, when the DAT port of the first communication assembly outputs 0, the 2 nd pin of the IC1 inputs low level, the first photodiode is conducted to emit light, the 3 and 4 pins of the first phototriode are turned on, the current passes through the bias resistor R41, the base electrode and the emitter electrode of the triode Q4 form a passage, after the triode Q4 is saturated, the collector of the transistor Q4 outputs a low level of 0V, which is transmitted to the DAT port of the second communication component through the resistor R45, when the DAT port of the firstcommunication assembly outputs 1, the 2 nd pin of the IC1 inputs high level, the first photodiode is cut off and does not emit light, thepins 3 and 4 of the first phototriode have no current output, the triode Q4 is cut off, the collector of the transistor Q4 is at a high level of 5V, and outputs a high level to the DAT port of the second communication component via the resistor R45.

When the second communication component needs to send data, the data DAT port of the second communication component is in an output mode, the data DAT port of the first communication component is in an input mode, when the DAT port of the second communication assembly outputs 0, the 2 nd pin of the IC2 inputs low level, the second photodiode is conducted to emit light, the 3 and 4 pins of the second phototriode are turned on, the current passes through the bias resistor R41, the base electrode and the emitter electrode of the triode Q6 form a passage, after the triode Q6 is saturated, the collector of the transistor Q6 outputs a low level of 0V, which is passed through a resistor R42 to the DAT port of the first communication module, when the DAT port of the secondcommunication assembly outputs 1, the 2 nd pin of the IC2 inputs high level, the second photodiode is cut off and does not emit light, thepins 3 and 4 of the second phototriode have no current output, the triode Q6 is cut off, the collector of the transistor Q6 is at a high level of 5V, which is output to the DAT port of the first communication module via the resistor R42.

With continued reference to fig. 3, the third optical coupler isolation chip IC3 includes a third photodiode and a third phototransistor; the third photodiode is connected to thesecond communication module 20, and the third phototransistor is connected to thefirst communication module 10.

Thesecond communication module 20 sends the clock signal (CLK) to thefirst communication module 10 through the third optical coupler isolation chip IC3, and the specific sending process is not described herein again. The resistor R10 is a pull-up resistor, and the resistors R50 and R41 are current-limiting resistors.

In a specific implementation, when the I2C bus is not working, SDA (data line) and SCL (clock line) are both high, and when SCL is kept high, SDA goes from high to LOW indicating that data transmission is started, and SCL is kept high indicating that data transmission is stopped when SDA goes from LOW to high.

The optical coupling isolation chip that this embodiment provided has realized optical isolation communication through photodiode and photodiode, and simple structure easily realizes, transmits through light signal between optical coupler's the input and the output moreover, therefore keeps apart completely in electric between the two parts, does not have the feedback and the interference of signal of telecommunication, so stable performance, the interference killing feature is strong.

With continued reference to fig. 3, the isolated communication circuit further includes: a first filter capacitor C6 and a second filter capacitor C7. One end of a first filter capacitor C6 is connected with the input end of a first optical coupling isolation chip IC1, and the other end of the first filter capacitor C6 is grounded; one end of the second filter capacitor C7 is connected with the input end of the second optical coupling isolation chip IC2, and the other end of the second filter capacitor C7 is grounded.

This first filter electric capacity C6 can filter the output of first opto-coupler isolation chip IC1 to the deburring, this second filter electric capacity C7 can filter the output of second opto-coupler isolation chip IC2, with the deburring, thereby has guaranteed communication quality.

The isolated communication circuit provided by the embodiment can be applied to household appliances needing isolated communication, such as an induction cooker, an electric kettle, an electric cooker and the like, and the embodiment does not particularly limit the types of the household appliances. The isolated communication circuit provided in this embodiment may also be applied to other fields, and for a specific field, this embodiment is not described herein again.

The present embodiment is described herein by taking an electromagnetic oven as an example, and the electromagnetic oven includes the isolated communication circuit as described above. The induction cooker is a common household appliance for heating, and when the induction cooker works, high-frequency alternating current is utilized to pass through the coil panel so as to enable the bottom of a pot placed on the induction cooker to generate eddy current, so that the pot arranged on the induction cooker is heated.

Specifically, be provided with mainboard chip and lamp plate chip usually in the electromagnetism stove, the mainboard chip is used for realizing specific heating function, and the lamp plate chip is used for acquireing operation indication, sends heating instruction etc. to the mainboard chip.

Foretell first communication subassembly can be the mainboard chip of electromagnetism stove, and foretell second communication subassembly can be the lamp plate chip of electromagnetism stove. This lamp plate chip can regard as main device, and the mainboard chip can regard as from the device. For a specific communication process, reference may be made to the foregoing embodiments, which are not described herein again.

The electromagnetism stove that this embodiment provided, through including foretell isolation communication circuit, can realize the isolation communication of mainboard chip and lamp plate chip, realized that mainboard chip and lamp plate chip all have two IO mouths and can carry out I2C bus communication, need not increase the device and also need not improve software.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the embodiments of the present invention, and not to limit the same; although embodiments of the present invention have been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the embodiments of the present invention.

Claims (10)

1. An isolated communication circuit, comprising: the communication device comprises a first communication assembly (10), a second communication assembly (20), a first optical coupling isolation chip IC1, a second optical coupling isolation chip IC2, a third optical coupling isolation chip IC3, a first resistor circuit (30), a second resistor circuit (40), a first amplifying circuit (50) and a second amplifying circuit (60); wherein

The input end of the first optical coupling isolation chip IC1 is connected with the first communication assembly (10), the input end of the first optical coupling isolation chip IC1 is connected with the first resistor circuit (30) in parallel, and the output end of the first optical coupling isolation chip IC1 is connected with the second communication assembly (20) sequentially through the first amplifying circuit (50) and the second resistor circuit (40);

the input end of the second optical coupling isolation chip IC2 is connected with the second communication assembly (20), the input end of the second optical coupling isolation chip IC2 is connected with the second resistor circuit (40) in parallel, and the output end of the second optical coupling isolation chip IC2 is connected with the first communication assembly (10) sequentially through the second amplifying circuit (60) and the first resistor circuit (30);

the input end of the third optical coupling isolation chip IC3 is connected with the second communication assembly (20), and the output end of the third optical coupling isolation chip IC3 is connected with the first communication assembly (10).

2. The circuit of claim 1, wherein the first amplifying circuit (50) comprises a bias resistor R41 and a transistor Q4, the bias resistor R41 is respectively connected to the output terminal of the first optocoupler isolated chip IC1 and the base of the transistor Q4, and the collector of the transistor Q4 is respectively connected to a first power supply and the second resistor circuit (40);

the second amplifying circuit (60) comprises a bias resistor R10 and a triode Q6, the bias resistor R10 is respectively connected with the output end of the second optical coupling isolation chip IC2 and the base electrode of the triode Q6, and the collector electrode of the triode Q6 is respectively connected with a second power supply and the first resistor circuit (30).

3. The circuit according to claim 1, wherein the first optical coupling isolation chip IC1 comprises a first photodiode and a first phototriode, the first photodiode is connected with the first communication component (10), and two ends of the first photodiode are respectively connected with the first resistance circuit (30);

and the collector electrode of the first phototriode is connected with a third power supply, and the emitter electrode of the first phototriode is connected with the first amplifying circuit (50).

4. The circuit of claim 1, wherein the second optical coupling isolation chip IC2 comprises a second photodiode and a second phototransistor, the second photodiode is connected to the second communication component (20), and two ends of the second photodiode are respectively connected to the second resistor circuit (40);

and the collector electrode of the second phototriode is connected with a power supply, and the emitter electrode of the second phototriode is connected with the second amplifying circuit (60).

5. The circuit of claim 2, further comprising: one end of the resistor R46 is connected with the first power supply, and the other end of the resistor R46 is respectively connected with the collector of the triode Q4 and the input end of the second optocoupler isolation chip IC 2.

6. The circuit of claim 2, further comprising: one end of the resistor R43 is connected with the second power supply, and the other end of the resistor R43 is respectively connected with the collector of the triode Q6 and the input end of the first optocoupler isolation chip IC 1.

7. The circuit of any of claims 1-6, further comprising: a first filter capacitor C6 and a second filter capacitor C7, wherein

One end of the first filter capacitor C6 is connected with the input end of the first optically-coupled isolation chip IC1, and the other end of the first filter capacitor C6 is grounded;

one end of the second filter capacitor C7 is connected with the input end of the second optical coupling isolation chip IC2, and the other end of the second filter capacitor C7 is grounded.

8. The circuit of any of claims 1-3, wherein the third optocoupler isolated chip IC3 comprises a third photodiode and a third phototransistor;

the third photodiode is connected with the second communication component (20), and the third phototriode is connected with the first communication component (10).

9. An induction hob, characterized in, that it comprises an isolated communication circuit according to any one of the claims 1-8.

10. The induction cooker according to claim 9, wherein the first communication component (10) is a motherboard chip and the second communication component (20) is a light panel chip.

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