CN210170072U - Ultrasonic probe - Google Patents

Abstract

An ultrasonic probe comprises an acoustic window, a matching layer, a piezoelectric layer, a backing block and a probe shell which are connected in sequence, wherein a first heat dissipation element is arranged in the backing block, the first heat dissipation element comprises a first end and a second end, the first end is adjacent to or extends to the upper surface of the backing block, the second end extends to the lower surface or the first side surface of the backing block, and the extending direction of the first heat dissipation element from the first end to the second end forms a first included angle with the thickness direction of the backing block from the upper surface of the backing block to the lower surface of the backing block. The reflection stroke of the sound wave in the backing block is increased, the waste sound wave radiated by the piezoelectric layer can be better absorbed by the backing block, the heat conduction area is increased, the heat conduction efficiency is improved, the heat exchange between the backing block and the middle part of the piezoelectric layer is sufficient, the heat dissipation effect of the ultrasonic probe is good, and the ultrasonic probe can be guaranteed to be still in a low-temperature state in the long-time use process.

Description

Ultrasonic probe

Technical Field

The application relates to medical detection equipment, in particular to an ultrasonic probe.

Background

Theultrasonic probe 1 has the working principle that the piezoelectric effect is utilized to convert the excitation electric pulse signal of the ultrasonic complete machine into an ultrasonic signal to enter the body of a patient, and then the ultrasonic echo signal reflected by the tissue is converted into an electric signal, so that the detection of the tissue is realized. During the conversion of the electro-acoustic signal, the operating ultrasound probe generates a large amount of heat, resulting in an increase in the temperature of the probe. On the one hand, the heating of the probe may affect the personal safety of the patient, and the regulation clearly stipulates that the temperature of the probe when in contact with the patient cannot exceed a certain temperature. On the other hand, if the probe works at a higher temperature for a long time, the aging of the probe is accelerated, and the service life of the probe is shortened. From the viewpoint of medical examination and diagnosis, it is desired to increase the examination depth of the probe. Improving the excitation voltage of the whole machine to the probe is an effective means for increasing the detection depth of the probe. However, an increase in the excitation voltage causes the probe to generate more heat. Thus, heating of the probe severely impacts patient comfort, probe life and performance.

Some current heat dissipation schemes for ultrasonic probes are to mount heat sinks on the sides or around the ultrasonic probe in an attempt to direct heat to the back end of the probe. The heat generated by the ultrasonic probe is mainly caused by incomplete electroacoustic conversion of the piezoelectric material, and the piezoelectric material is not a good thermal conductor, so that the heat is mainly accumulated in the middle of the probe array element. And the radiating fins on the side or periphery of the probe cannot be close to the center of the heat source sufficiently, and meanwhile, the sectional area of the radiating side plate is too small to perform sufficient heat exchange with the array element of the probe. The problem of probe heating is still not well solved.

Other ultrasound probe heat dissipation schemes regularly insert fins or arrays of fins in the backing material along the normal to the probe. Although the heat radiating fins can be close to the center of the heat source of the probe, the heat radiating fins are thick, so that the acoustics of the probe is greatly influenced, and the thin heat radiating effect is limited. It is difficult to combine probe performance with heat dissipation.

Disclosure of Invention

In one embodiment, an ultrasonic probe is provided, which includes an acoustic window, a matching layer, a piezoelectric layer, a backing block, and a probe housing, the acoustic window, the matching layer, the piezoelectric layer, the backing block, and the probe housing are sequentially connected, and the ultrasonic probe further includes a first heat dissipation element disposed in the backing block, the first heat dissipation element including a first end adjacent to or extending to an upper surface of the backing block and a second end extending to a lower surface or a first side surface of the backing block, wherein an extending direction of the first heat dissipation element from the first end to the second end forms a first included angle with a thickness direction of the backing block from the upper surface of the backing block to the lower surface of the backing block.

In one embodiment, the backing block is internally provided with a plurality of the first heat dissipation elements.

In one embodiment, the plurality of first heat dissipation elements are parallel to each other and arranged in a first direction perpendicular to a thickness direction of the backing block.

In one embodiment, the first heat dissipation element is a metal foil or a flexible graphite film.

In one embodiment, the thickness of the first heat dissipating element is no greater than 500 microns, or the thickness of the first heat dissipating element is no greater than 25 microns.

In one embodiment, the acoustic impedance of the first heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the first heat dissipating element differs from the acoustic impedance of the backing block by less than 1 mrayle.

In one embodiment, the backing block is further provided with a second heat dissipation element inside, the second heat dissipation element comprises a first end adjacent to or extending to the upper surface of the backing block and a second end extending to the lower surface or the second side surface of the backing block, and the extending direction of the second heat dissipation element from the first end of the second heat dissipation element to the second end of the second heat dissipation element forms a second included angle with the thickness direction of the backing block.

In one embodiment, the backing block is internally provided with a plurality of the second heat dissipating elements.

In one embodiment, the plurality of second heat dissipating elements are parallel to each other and arranged in a first direction perpendicular to a thickness direction of the backing block.

In one embodiment, the first heat dissipation element and the second heat dissipation element are connected to each other.

In one embodiment, the first end of the first heat dissipation element and the first end of the second heat dissipation element are connected to each other.

In one embodiment, the second heat dissipation element is a metal foil or a flexible graphite film.

In one embodiment, the thickness of the second heat dissipating element is no greater than 500 microns, or the thickness of the second heat dissipating element is no greater than 25 microns.

In one embodiment, the acoustic impedance of the second heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the second heat dissipating element differs from the acoustic impedance of the backing block by less than 1 mrayle.

In one embodiment, the backing block is further provided with a third heat dissipation element inside, the third heat dissipation element comprises a first end adjacent to or extending to the upper surface of the backing block and a second end extending to the lower surface or the third side surface of the backing block, and the extending direction of the third heat dissipation element from the first end of the third heat dissipation element to the second end of the third heat dissipation element forms a third included angle with the thickness direction of the backing block.

In one embodiment, the backing block is internally provided with a plurality of the third heat dissipation elements.

In one embodiment, the plurality of third heat dissipation elements are parallel to each other and arranged in a second direction perpendicular to the thickness direction of the backing block.

In one embodiment, the third heat dissipating element is interconnected with the first heat dissipating element and/or the second heat dissipating element.

In one embodiment, the first end of the third heat dissipating element is interconnected with the first end of the first heat dissipating element and/or the first end of the second heat dissipating element.

In one embodiment, the third heat dissipation element is a metal foil or a flexible graphite film.

In one embodiment, the thickness of the third heat dissipating element is no greater than 500 micrometers, or the thickness of the third heat dissipating element is no greater than 25 micrometers.

In one embodiment, the acoustic impedance of the third heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the third heat dissipating element differs from the acoustic impedance of the backing block by less than 1 mrayle.

In one embodiment, the backing block is further provided with a fourth heat dissipation element inside, the fourth heat dissipation element comprises a first end adjacent to or extending to the upper surface of the backing block and a second end extending to the lower surface or the fourth side surface of the backing block, and the extending direction of the fourth heat dissipation element from the first end of the fourth heat dissipation element to the second end of the fourth heat dissipation element forms a fourth included angle with the thickness direction of the backing block.

In one embodiment, the backing mass is internally provided with a plurality of the fourth heat dissipation elements.

In one embodiment, the plurality of fourth heat dissipation elements are parallel to each other and aligned in a second direction perpendicular to the thickness direction of the backing block.

In one embodiment, the fourth heat dissipating element is interconnected with the first heat dissipating element and/or the second heat dissipating element and/or the third heat dissipating element.

In one embodiment, the first end of the fourth heat dissipating element is interconnected with the first end of the first heat dissipating element and/or the first end of the second heat dissipating element and/or the first end of the third heat dissipating element.

In one embodiment, the fourth heat-dissipating component is a metal foil or a flexible graphite film.

In one embodiment, the thickness of the fourth heat dissipation element is no greater than 500 microns, or the thickness of the fourth heat dissipation element is no greater than 25 microns.

In one embodiment, the acoustic impedance of the fourth heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the fourth heat dissipating element differs from the acoustic impedance of the backing block by less than 1 mrayle.

In one embodiment, the probe further comprises a fifth heat dissipating element attached to the upper surface of the backing block.

In one embodiment, the probe further comprises a sixth heat dissipating element attached to at least one other surface of the backing block than the upper surface.

In one embodiment, the fifth heat dissipation element is a metal foil or a flexible graphite film.

In one embodiment, the thickness of the fifth heat dissipating element is not greater than 500 micrometers, or the thickness of the fifth heat dissipating element is not greater than 25 micrometers.

In one embodiment, the acoustic impedance of the fifth heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the fifth heat dissipating element differs from the acoustic impedance of the backing block by less than 1 mrayle.

In one embodiment, the sixth heat dissipation element is a metal foil or a flexible graphite film.

In one embodiment, the probe further comprises a heat sink attached to at least one surface of the backing block other than the upper surface.

In one embodiment, the heat dissipation block is attached to the lower surface of the backing block.

In one embodiment, the heat dissipation block is a metal block.

In one embodiment, the heat sink block is an aluminum block.

In one embodiment, the heat dissipation device further comprises a seventh heat dissipation element, and the seventh heat dissipation film is attached to at least one surface of the heat dissipation block.

In one embodiment, the seventh heat dissipation element is a metal foil or a flexible graphite film.

According to the ultrasonic probe of the embodiment, the first heat dissipation element is arranged in the backing block and comprises a first end adjacent to or extending to the upper surface of the backing block and a second end extending to the lower surface or the first side surface of the backing block, wherein the extending direction of the first heat dissipation element from the first end to the second end forms a first included angle with the thickness direction of the backing block from the upper surface of the backing block to the lower surface of the backing block, so that the reflection stroke of the sound wave in the backing block is increased, the backing block is favorable for better absorbing useless sound waves radiated by the piezoelectric layer, the heat conduction area is increased, the heat conduction efficiency is improved, the heat exchange between the backing block and the middle part of the piezoelectric layer is sufficient, the heat dissipation effect of the ultrasonic probe is good, and the ultrasonic probe can be ensured to be still in a low-temperature state in a long-time use process.

Drawings

FIG. 1 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 2 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 3 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 4 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 5 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 6 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 7 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 8 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 9 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 10 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 11 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 12 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 13 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 14 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 15 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 16 is a schematic diagram of an ultrasound probe in one embodiment;

Detailed Description

The present invention will be described in further detail with reference to the following detailed description and accompanying drawings. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.

Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments. Also, the various steps or actions in the method descriptions may be transposed or transposed in order, as will be apparent to one of ordinary skill in the art. Thus, the various sequences in the specification and drawings are for the purpose of describing certain embodiments only and are not intended to imply a required sequence unless otherwise indicated where such sequence must be followed.

The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).

In one embodiment, an ultrasound probe is provided, as shown in fig. 1, theultrasound probe 1 of this embodiment mainly includes anacoustic window 2, amatching layer 3, apiezoelectric layer 4, abacking block 5 and a probe housing 6 (the probe housing 6 is not shown in the figure), wherein thematching layer 3 is connected to theacoustic window 2, thepiezoelectric layer 4 is connected to thematching layer 3, thebacking block 5 is connected to thepiezoelectric layer 4, wherein theacoustic window 2 can be designed to be a planar structure or a structure having a function of focusing ultrasonic waves, such as a convex structure, the acoustic window of the convex structure can be called an acoustic lens, thebacking block 5 includes anupper surface 51, alower surface 52, afirst side surface 53, asecond side surface 54, athird side surface 55 and afourth side surface 56, wherein the surface of thebacking block 5 attached to thepiezoelectric layer 4 is defined as theupper surface 51, and the other four side surfaces are shown in fig. 1, and the probe housing 6 at least partially houses the acoustic window,Matching layer 3,piezoelectric layer 4 andbacking block 5.

As shown in fig. 2 and 3, the inside of thebacking block 5 is provided with a firstheat dissipation element 7, the firstheat dissipation element 7 includes a first end adjacent to or extending to the upper surface of thebacking block 5 and a second end extending to the lower surface of thebacking block 5, wherein the extending direction of the firstheat dissipation element 7 from the first end to the second end forms a first included angle with the thickness direction of thebacking block 5 from the upper surface of thebacking block 5 to the lower surface of thebacking block 5.

The first end of the upper surface of thebacking block 5 may be close to the upper surface of thebacking block 5 or may be in contact with the upper surface, which is more heat conductive when the firstheat dissipation member 7 is in contact with the upper surface.

The direction of extension from the first end of the upper surface of thebacking block 5 to the second end of the lower surface of thebacking block 5 is the direction of linear extension from the first end to the second end.

The thickness direction of thebacking block 5 from the upper surface of thebacking block 5 to the lower surface of thebacking block 5 is the thickness direction of thebacking block 5 perpendicular to the upper and lower surfaces of thebacking block 5.

A first angle formed by a direction extending linearly from a first end of the upper surface to a second end of the lower surface of thebacking block 5 and a thickness direction of thebacking block 5 perpendicular to the upper surface and the lower surface of thebacking block 5 is acute.

In one embodiment, as shown in fig. 4, the firstheat dissipation element 7 may be arranged in two layers, and the second end of the firstheat dissipation element 7 may also be a second end extending to the first side surface of thebacking block 5, which is beneficial to guide the heat in the middle of the piezoelectric layer to the side surface of the backing block as fast as possible.

In one embodiment, a plurality of firstheat dissipation elements 7 are disposed inside thebacking block 5, and the relative positions of the firstheat dissipation elements 7 may be arbitrarily arranged, may intersect, and may not intersect.

In one embodiment, as shown in fig. 3, thebacking block 5 is provided with a plurality of firstheat dissipation elements 7 as described above inside, and the firstheat dissipation elements 7 are parallel to each other and arranged in a first direction perpendicular to the thickness direction of thebacking block 5, the first direction being a perpendicular direction from the first side surface to the second side surface.

The firstheat dissipation element 7 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, such as a flexible graphite film with high thermal conductivity, the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W/m.k, far exceeding the thermal conductivity of metal foils such as copper and aluminum. The thickness of the first heat dissipation element may be not greater than 500 micrometers. Still further, in one embodiment, the first heat spreading film may have a thickness of no greater than 25 microns.

The acoustic impedance of the firstheat dissipating element 7 may be equal to or similar to the acoustic impedance of thebacking mass 5, for example, the acoustic impedance of the firstheat dissipating element 7 may be the same as the acoustic impedance of thebacking mass 5 or differ by less than 1 mrayl. In this way, the influence of the first heat-radiating element on the acoustic performance of the probe can be reduced.

The embodiment provides an ultrasonic probe, which comprises an acoustic window 2, a matching layer 3, a piezoelectric layer 4, a backing block 5 and a probe shell 6 which are connected in sequence, wherein a first heat dissipation element 7 is arranged inside the backing block 5, the first heat dissipation element 7 comprises a first end which is adjacent to or extends to the upper surface of the backing block 5 and a second end which extends to the lower surface of the backing block 5, the extending direction of the first heat dissipation element 7 from the first end to the second end and the thickness direction of the backing block 5 from the upper surface of the backing block 5 to the lower surface of the backing block 5 form a first included angle, the reflection stroke of sound waves in the backing block 5 is increased, the backing block 5 is favorable for better absorbing useless sound waves radiated by the piezoelectric layer, meanwhile, the heat conduction area is increased, the heat conduction efficiency is improved, the heat exchange between the backing block 5 and the middle part of the piezoelectric layer 4 is sufficient, the heat can be timely and quickly, the ultrasonic probe has good heat dissipation effect and can be ensured to be still in a low-temperature state in the long-time use process.

In one embodiment, an ultrasound probe is provided, and the ultrasound probe of this embodiment is added with the secondheat dissipation element 8 on the basis of the above embodiments.

As shown in fig. 2 and 3, a secondheat dissipation element 8 is additionally arranged inside thebacking block 5, and the secondheat dissipation element 8 comprises a first end adjacent to or extending to the upper surface of thebacking block 5 and a second end extending to the lower surface of thebacking block 5, wherein the extending direction of the second heat dissipation element from the first end to the second end forms a second included angle with the thickness direction of thebacking block 5 from the upper surface of thebacking block 5 to the lower surface of thebacking block 5.

The first end of the upper surface of thebacking block 5 may be close to the upper surface of thebacking block 5 or may be in contact with the upper surface, which is more heat conductive when the firstheat dissipation member 7 is in contact with the upper surface.

The direction of extension from the first end of the upper surface of thebacking block 5 to the second end of the lower surface of thebacking block 5 is the direction of linear extension from the first end to the second end.

The thickness direction of thebacking block 5 from the upper surface of thebacking block 5 to the lower surface of thebacking block 5 is the thickness direction of thebacking block 5 perpendicular to the upper and lower surfaces of thebacking block 5.

A second angle formed by a direction extending linearly from the first end of the upper surface to the second end of the lower surface of thebacking block 5 and a thickness direction of thebacking block 5 perpendicular to the upper surface and the lower surface of thebacking block 5 is acute.

In one embodiment, as shown in fig. 4, the second end of the secondheat dissipating element 8 may also be disposed to extend to the second end of the second side surface of thebacking block 5.

In one embodiment, a plurality of secondheat dissipation elements 8 as described above are further disposed inside thebacking block 5, and the relative positions of the secondheat dissipation elements 8 may be arbitrarily arranged, may intersect, or may not intersect.

In one embodiment, as shown in fig. 3, a plurality of secondheat dissipation elements 8 as described above are further provided inside thebacking block 5, and the secondheat dissipation elements 8 are parallel to each other and arranged in a first direction perpendicular to the thickness direction of thebacking block 5, the first direction being from the first side surface to the second side surface.

In one embodiment, the first and secondheat dissipating elements 7 and 8 inside thebacking block 5 are connected to each other. The first end of the firstheat dissipation element 7 may be connected to the first end of the secondheat dissipation element 8, the middle portions of the two ends of the first heat dissipation element may be connected to the middle portions of the two ends of the second heat dissipation element, the middle portions of the first end of the firstheat dissipation element 7 may be connected to the middle portions of the two ends of the secondheat dissipation element 8, or the middle portions of the two ends of the firstheat dissipation element 7 may be connected to the first end of the secondheat dissipation element 8.

In one embodiment, as shown in fig. 3, the first end of the firstheat dissipating element 7 inside thebacking block 5 is interconnected with the first end of the secondheat dissipating element 8.

The secondheat dissipation element 8 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, such as a flexible graphite film with high thermal conductivity, the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W/m.k, far exceeding the thermal conductivity of metal foils such as copper and aluminum. The thickness of the secondheat dissipation element 8 may be not more than 500 micrometers. Further, in one embodiment, the thickness of the secondheat dissipation element 8 may be no greater than 25 microns.

The acoustic impedance of the secondheat dissipating element 8 may be equal to or similar to the acoustic impedance of thebacking mass 5, for example, the acoustic impedance of the secondheat dissipating element 8 may be the same as the acoustic impedance of thebacking mass 5 or differ by less than 1 megarayl. In this way, the influence of the second heat-radiating element on the acoustic performance of the probe can be reduced.

This embodiment provides an ultrasonic probe, backingblock 5 addssecond radiating element 8 on the basis of above-mentioned embodiment,first radiating element 7 andsecond radiating element 8 use simultaneously will further increase the reflection stroke of sound wave inbacking block 5, be favorable tobacking block 5 better absorption piezoelectric layer radiated useless sound wave, further increase heat conduction area simultaneously, makebacking block 5 abundant with the heat exchange inpiezoelectric layer 4 middle part, can in time lead-in the heat intobacking block 5 periphery or rear end fast, make this ultrasonic probe's radiating effect good, can guarantee that ultrasonic probe still is in the low temperature state in the long-time use.

In one embodiment, an ultrasound probe is provided, and the ultrasound probe of this embodiment is added with a thirdheat dissipation element 9 on the basis of the above embodiments.

As shown in fig. 2 and 3, the inside of thebacking block 5 is further provided with a thirdheat dissipation element 9, the thirdheat dissipation element 9 includes a first end adjacent to or extending to the upper surface of thebacking block 5 and a second end extending to the lower surface of thebacking block 5, wherein an extending direction of the thirdheat dissipation element 9 from the first end to the second end forms a third angle with a thickness direction of thebacking block 5 from the upper surface of thebacking block 5 to the lower surface of thebacking block 5.

The first end of the upper surface of thebacking block 5 may be close to the upper surface of thebacking block 5 or may be in contact with the upper surface, and the heat conduction efficiency may be higher when the first heat dissipation member is in contact with the upper surface.

The direction of extension from the first end of the upper surface of thebacking block 5 to the second end of the lower surface of thebacking block 5 refers to the direction of linear extension from the first end to the second end.

The thickness direction of thebacking block 5 from the upper surface of thebacking block 5 to the lower surface of thebacking block 5 refers to the perpendicular direction along the thickness of thebacking block 5 from the upper surface to the lower surface of thebacking block 5.

A third angle formed by a direction extending linearly from the first end of the upper surface to the second end of the lower surface of thebacking block 5 and a direction perpendicular to the thickness of thebacking block 5 from the upper surface to the lower surface of thebacking block 5 is acute.

In one embodiment, the second end of the thirdheat radiating member 9 may also be provided to extend to the second end of the third side surface of thebacking block 5.

In one embodiment, a plurality of thirdheat dissipation elements 9 as described above are further disposed inside thebacking block 5, and the mutual position relationship of the thirdheat dissipation elements 9 may be arbitrarily arranged, may intersect, and may not intersect.

In one embodiment, as shown in fig. 3, a plurality of thirdheat dissipation elements 9 as described above are further provided inside thebacking block 5, and the third heat dissipation elements are parallel to each other and arranged in a second direction perpendicular to the thickness direction of thebacking block 5, the second direction being a direction from the third side surface to the fourth side surface.

In one embodiment, the thirdheat dissipation element 9 and the firstheat dissipation element 7 inside thebacking block 5 are connected to each other, the thirdheat dissipation element 9 and the secondheat dissipation element 8 inside thebacking block 5 are connected to each other, and the thirdheat dissipation element 9 and the firstheat dissipation element 7 and the secondheat dissipation element 8 are connected to each other simultaneously inside thebacking block 5.

In one embodiment, the first end of the thirdheat dissipation element 9 inside thebacking block 5 may be connected to the first end of the firstheat dissipation element 7, the first end of the thirdheat dissipation element 9 inside thebacking block 5 may be connected to the first end of the secondheat dissipation element 8, and the first end of the thirdheat dissipation element 9 inside thebacking block 5 may be connected to both the first end of the firstheat dissipation element 7 and the first end of the secondheat dissipation element 8.

The thirdheat dissipation element 9 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, such as a flexible graphite film with high thermal conductivity, the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W/m · K, far exceeding the thermal conductivity of metal foils such as copper and aluminum. The thickness of the thirdheat dissipation element 9 may be not more than 500 micrometers. Further, in one embodiment, the thickness of the thirdheat dissipation element 8 may be no greater than 25 micrometers.

The acoustic impedance of the thirdheat dissipating element 9 may be equal to or similar to the acoustic impedance of thebacking mass 5, for example, the acoustic impedance of the thirdheat dissipating element 9 may be the same as the acoustic impedance of thebacking mass 5 or may differ by less than 1 mrayl. In this way, the influence of the third heat-radiating element on the acoustic performance of the probe can be reduced.

The embodiment provides an ultrasonic probe, on the basis of the above embodiment, the thirdheat dissipation element 9 is additionally arranged inside thebacking block 5, and the use of the firstheat dissipation element 7, the secondheat dissipation element 8 and the thirdheat dissipation element 9 can further increase the reflection stroke of sound waves in thebacking block 5, which is beneficial to thebacking block 5 to better absorb useless sound waves radiated by the piezoelectric layer, and further increase the heat conduction area, so that the heat exchange between thebacking block 5 and the middle part of thepiezoelectric layer 4 is sufficient, heat can be timely and quickly conducted into the periphery or the rear end of thebacking block 5, so that the heat dissipation effect of the ultrasonic probe is good, and the ultrasonic probe can be ensured to be still in a low-temperature state in the long-time use process.

In one embodiment, an ultrasound probe is provided, and the ultrasound probe of this embodiment is added with the fourthheat dissipation element 10 on the basis of the above embodiments.

As shown in fig. 2 and 3, the inside of thebacking block 5 is further provided with a fourth heat dissipation element, and the fourthheat dissipation element 10 includes a first end adjacent to or extending to the upper surface of thebacking block 5 and a second end extending to the lower surface of thebacking block 5, wherein the extending direction of the fourthheat dissipation element 10 from the first end to the second end forms a fourth angle with the thickness direction of thebacking block 5 from the upper surface of thebacking block 5 to the lower surface of thebacking block 5.

The first end of the upper surface of thebacking block 5 may be close to the upper surface of thebacking block 5 or may be in contact with the upper surface, and the heat conduction efficiency is higher when the firstheat dissipation member 7 is in contact with the upper surface.

The direction of extension from the first end of the upper surface of thebacking block 5 to the second end of the lower surface of thebacking block 5 refers to the direction of linear extension from the first end to the second end.

The thickness direction of thebacking block 5 from the upper surface of thebacking block 5 to the lower surface of thebacking block 5 refers to the perpendicular direction along the thickness of thebacking block 5 from the upper surface to the lower surface of thebacking block 5.

A fourth angle formed by a direction in which the first end of the upper surface of thebacking block 5 extends straight to the second end of the lower surface and a direction perpendicular to the thickness of thebacking block 5 from the upper surface to the lower surface of thebacking block 5 is acute.

In one embodiment, the second end of the fourthheat dissipation element 10 may also be arranged to extend to the second end of the fourth side surface of thebacking mass 5.

In one embodiment, a plurality of the fourthheat dissipation elements 10 as described above are further disposed inside thebacking block 5, and the mutual position relationship of the fourthheat dissipation elements 10 may be arbitrarily arranged, may intersect, and may not intersect.

In one embodiment, as shown in fig. 3, a plurality of the fourthheat dissipation elements 10 are further disposed inside thebacking block 5, and the fourthheat dissipation elements 10 are parallel to each other and are arranged along a second direction perpendicular to the thickness direction of thebacking block 5.

In one embodiment, the fourthheat dissipation element 10 inside thebacking block 5 is connected to any one of the firstheat dissipation element 7, the secondheat dissipation element 8 and the thirdheat dissipation element 9, the fourthheat dissipation element 10 is connected to any two of the firstheat dissipation element 7, the secondheat dissipation element 8 and the thirdheat dissipation element 9, and the fourthheat dissipation element 10 is connected to the firstheat dissipation element 7, the secondheat dissipation element 8 and the thirdheat dissipation element 9 simultaneously.

In one embodiment, the first end of the fourthheat dissipation element 10 inside thebacking block 5 is connected to any one of the first end of the firstheat dissipation element 7, the first end of the secondheat dissipation element 8, and the first end of the thirdheat dissipation element 9, the first end of the fourthheat dissipation element 10 is connected to any two of the first end of the firstheat dissipation element 7, the first end of the secondheat dissipation element 8, and the first end of the thirdheat dissipation element 9, and the first end of the fourthheat dissipation element 10 is connected to the first end of the firstheat dissipation element 7, the first end of the secondheat dissipation element 8, and the first end of the thirdheat dissipation element 9 simultaneously. As shown in fig. 3, the first end of the fourth heat dissipation element is connected to the first end of the third heat dissipation element.

The fourthheat dissipation element 10 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, such as a flexible graphite film with high thermal conductivity, the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W/m.k, far exceeding the thermal conductivity of metal foils such as copper and aluminum. The thickness of the fourthheat dissipation element 10 may be not more than 500 micrometers. Still further, in one embodiment, the thickness of the fourthheat dissipation element 10 may be no greater than 25 microns.

The acoustic impedance of the fourthheat dissipating element 10 may be equal to or similar to the acoustic impedance of thebacking mass 5, for example, the acoustic impedance of the fourthheat dissipating element 10 may be the same as the acoustic impedance of thebacking mass 5 or may differ by less than 1 megarayl. In this way, the influence of the fourthheat dissipation element 10 on the acoustic performance of the probe can be reduced.

The embodiment provides an ultrasonic probe, on the basis of the above embodiment, the fourthheat dissipation element 10 is additionally arranged inside thebacking block 5, and the use of the firstheat dissipation element 7, the secondheat dissipation element 8, the thirdheat dissipation element 9 and the fourthheat dissipation element 10 can further increase the reflection stroke of sound waves in thebacking block 5, which is beneficial to thebacking block 5 to better absorb useless sound waves radiated by the piezoelectric layer, and further increase the heat conduction area, so that the heat exchange between thebacking block 5 and the middle part of the piezoelectric layer is sufficient, and heat can be timely and quickly introduced into the periphery or the rear end of thebacking block 5, so that the heat dissipation effect of the ultrasonic probe is good, and the ultrasonic probe can be ensured to be still in a low-temperature state in the long-time use process.

The present embodiment provides an ultrasound probe, and the ultrasound probe of the present embodiment adds the fifthheat dissipation element 11 on the basis of the above-described embodiments.

As shown in fig. 5, the fifthheat dissipation element 11 is attached to the upper surface of thebacking block 5, and the fifthheat dissipation element 11 is disposed between thepiezoelectric layer 4 and thebacking block 5.

The fifthheat dissipation element 11 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, such as a flexible graphite film with high thermal conductivity, the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W/m · K, far exceeding the thermal conductivity of metal foils such as copper and aluminum. The thickness of the fifthheat dissipation element 11 may be not greater than 500 micrometers. Further, in one embodiment, the thickness of the fifthheat dissipation element 11 may be not greater than 25 μm.

The acoustic impedance of the fifthheat dissipating element 11 may be equal to or similar to the acoustic impedance of thebacking mass 5, for example, the acoustic impedance of the fifthheat dissipating element 11 may be the same as the acoustic impedance of thebacking mass 5 or differ by less than 1 mrayl. In this way, the influence of the fifthheat dissipating element 11 on the acoustic performance of the probe can be reduced.

In the ultrasonic probe of the present embodiment, on the basis of the above embodiment, the fifthheat dissipation element 11 is additionally disposed on thebacking block 5, the fifthheat dissipation element 11 is disposed between thepiezoelectric layer 4 and thebacking block 5, and the heat concentrated in the middle of thepiezoelectric layer 4 is rapidly transferred to the backing block and the heat dissipation elements in the backing block through the fifthheat dissipation element 11, so as to increase the heat conduction area, improve the heat conduction efficiency, and further improve the heat dissipation effect.

The present embodiment provides an ultrasonic probe, in which a sixthheat dissipation element 12 is added on the basis of the above embodiments.

The sixthheat dissipating element 12 is attached to at least one surface of thebacking block 5 other than the upper surface. As shown in fig. 6, the sixthheat dissipation element 12 is attached to thelower surface 52 of thebacking block 5; as shown in fig. 10, the sixthheat dissipating element 12 is attached to thefirst side surface 53 and thesecond side surface 54 of thebacking block 5; as shown in fig. 11, the sixthheat dissipating element 12 is attached to thelower surface 52, thefirst side surface 53, and thesecond side surface 54 of thebacking block 5; as shown in fig. 12, the sixthheat dissipating member 12 is attached to thelower surface 52, thefirst side surface 53, thesecond side surface 54, and thethird side surface 55 of thebacking block 5.

The sixthheat dissipation element 12 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, such as a flexible graphite film with high thermal conductivity, the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W/m · K, far exceeding the thermal conductivity of metal foils such as copper and aluminum.

The sixthheat dissipating element 12 is attached to at least one surface of thebacking block 5 other than the upper surface. The sixthheat dissipation element 12 is attached to the other surface of the backing block except the upper surface, and the attachment position of the sixth heat dissipation element has little influence on the acoustic performance of the probe.

In the ultrasonic probe of the present embodiment, on the basis of the above embodiment, the sixthheat dissipation element 12 is additionally disposed on thebacking block 5, the sixthheat dissipation element 12 is attached to the other surfaces of the backing block except the upper surface, and the heat concentrated in the middle of thepiezoelectric layer 4 is rapidly transferred to the side surface of thebacking block 5 through the sixthheat dissipation element 12, so that the heat conduction area is increased, the heat conduction efficiency is improved, and the heat dissipation effect is further improved.

The present embodiment provides an ultrasound probe, and the ultrasound probe of the present embodiment adds theheat dissipation block 13 on the basis of the above-described embodiments.

Theheat dissipation block 13 is attached to at least one surface of thebacking block 5 other than the upper surface.

As shown in fig. 6, 7, 8 and 9, theheat dissipation block 13 is attached to thelower surface 52 of thebacking block 5; as shown in fig. 13 and 14, theheat dissipation block 13 is attached to thelower surface 52 and the first and second side surfaces 53 and 54 of thebacking block 5; as shown in fig. 15, theheat dissipation block 13 is attached to five surfaces of thebacking block 5 except the upper surface.

The radiatingblock 13 is a metal block or a graphite block with high heat conductivity and large specific heat capacity, and the radiatingblock 13 is preferably an aluminum block.

In the ultrasonic probe provided by the embodiment, theheat dissipation block 13 is additionally arranged on thebacking block 5 on the basis of the above embodiment, theheat dissipation block 13 is attached to the other five surfaces of thebacking block 5 except the upper surface, so that the heat dissipation effect is further improved, theheat dissipation block 13 can be connected with the heat dissipation structure at the rear end of thebacking block 5, and then the heat dissipation block is attached to other components of the ultrasonic probe to form the ultrasonic probe with a good heat dissipation effect, so that the heat capacity of the heat dissipation structure can be increased, and the heat dissipation effect is prevented from being influenced by temperature jump.

The present embodiment provides an ultrasound probe, and the ultrasound probe of the present embodiment adds a seventhheat dissipation element 14 on the basis of the above-described embodiments.

The seventhheat dissipating element 14 is attached to at least one surface of theheat dissipating block 13.

As shown in fig. 10 and 11, theheat dissipating block 13 is attached to thelower surface 52 of thebacking block 5, and the seventhheat dissipating element 14 is attached to thefirst side surface 131 and thesecond side surface 132 of theheat dissipating block 13, wherein the surface of theheat dissipating block 13 attached to thelower surface 52 of the backing block is theupper surface 131 of theheat dissipating block 13, the surface opposite to the backing block is thelower surface 132, and thefirst side surface 133 and thesecond side surface 134 of theheat dissipating block 13 are shown in fig. 10.

As shown in fig. 16, theheat dissipating blocks 13 are attached to thelower surface 52 and the first and second side surfaces 53 and 54 of thebacking block 5, and a seventh heat dissipating member is attached to each of the heat dissipating blocks on the side surface thereof opposite to the backing block.

The seventhheat dissipation element 14 is a metal foil with a high thermal conductivity or a flexible graphite film with a high thermal conductivity, preferably a flexible graphite film with a high thermal conductivity, the thermal conductivity of the flexible graphite film with a high thermal conductivity is 1500-1800W/m · K, far exceeding the thermal conductivity of metal foils such as copper and aluminum.

In the ultrasonic probe provided by the embodiment, the seventhheat dissipation element 14 is added on the basis of the above embodiment, so that the heat conduction efficiency is further improved, theheat dissipation block 13 can be connected with the heat dissipation and structure at the rear end of thebacking block 5, the heat capacity of the heat dissipation mechanism can be increased, and the heat dissipation effect is prevented from being influenced by sudden temperature change.

Claims (46)

1. An ultrasound probe, comprising:

an acoustic window;

a matching layer connected to the acoustic window;

a piezoelectric layer connected to the matching layer;

a backing block comprising an upper surface, a lower surface, a first side surface, a second side surface, a third side surface, and a fourth side surface, the upper surface of the backing block being connected to the piezoelectric layer;

a probe housing at least partially housing the acoustic window, the matching layer, the piezoelectric layer, and a backing block;

wherein the backing block is internally provided with a first heat dissipation element, the first heat dissipation element comprises a first end adjacent to or extending to the upper surface of the backing block and a second end extending to the lower surface or the first side surface of the backing block, and the extending direction of the first heat dissipation element from the first end to the second end forms a first included angle with the thickness direction of the backing block from the upper surface of the backing block to the lower surface of the backing block.

2. The ultrasound probe of claim 1, wherein a plurality of the first heat dissipating elements are disposed within the backing block.

3. The ultrasound probe of claim 2, wherein the plurality of first heat dissipating elements are parallel to each other and aligned in a first direction perpendicular to a thickness direction of the backing block.

4. The ultrasound probe of any of claims 1 to 3, wherein the first heat spreading element is a metal foil or a flexible graphite film.

5. The ultrasound probe of any of claims 1 to 3, wherein: the thickness of the first heat dissipation element is not more than 500 micrometers, or the thickness of the first heat dissipation element is not more than 25 micrometers.

6. The ultrasound probe of any of claims 1 to 3, wherein: the acoustic impedance of the first heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the first heat dissipating element differs from the acoustic impedance of the backing block by less than 1 megarayl.

7. The ultrasound probe of claim 1, wherein: the backing block is internally provided with a second heat dissipation element, the second heat dissipation element comprises a first end and a second end, the first end is adjacent to or extends to the upper surface of the backing block, the second end extends to the lower surface or the second side surface of the backing block, and the extending direction of the second heat dissipation element from the first end of the second heat dissipation element to the second end of the second heat dissipation element forms a second included angle with the thickness direction of the backing block.

8. The ultrasound probe of claim 7, wherein a plurality of the second heat dissipating elements are disposed within the backing block.

9. The ultrasound probe of claim 8, wherein the plurality of second heat dissipating elements are parallel to each other and aligned in a first direction perpendicular to a thickness direction of the backing block.

10. The ultrasound probe of claim 7, wherein: the first heat dissipation element and the second heat dissipation element are connected with each other.

11. The ultrasound probe of claim 10, wherein: the first end of the first heat dissipation element and the first end of the second heat dissipation element are connected with each other.

12. The ultrasound probe of any of claims 7 to 11, wherein the second heat spreading element is a metal foil or a flexible graphite film.

13. The ultrasound probe of any of claims 7 to 11, wherein: the thickness of the second heat dissipation element is not greater than 500 micrometers, or the thickness of the second heat dissipation element is not greater than 25 micrometers.

14. The ultrasound probe of any of claims 7 to 11, wherein: the acoustic impedance of the second heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the second heat dissipating element differs from the acoustic impedance of the backing block by less than 1 megarayl.

15. The ultrasound probe of claim 1, wherein: the backing block is also internally provided with a third heat dissipation element, the third heat dissipation element comprises a first end adjacent to or extending to the upper surface of the backing block and a second end extending to the lower surface or the third side surface of the backing block, and the extending direction of the third heat dissipation element from the first end of the third heat dissipation element to the second end of the third heat dissipation element forms a third included angle with the thickness direction of the backing block.

16. The ultrasound probe of claim 15, wherein a plurality of the third heat dissipating elements are disposed within the backing block.

17. The ultrasound probe of claim 16, wherein the plurality of third heat dissipating elements are parallel to each other and aligned along a second direction perpendicular to the thickness direction of the backing block.

18. The ultrasound probe of any of claims 15 to 17, wherein: the third heat dissipation element is interconnected with the first heat dissipation element.

19. The ultrasound probe of claim 18, wherein: the first end of the third heat dissipation element is interconnected with the first end of the first heat dissipation element.

20. The ultrasound probe of claim 7, wherein the backing block is further provided with a third heat dissipation element inside, the third heat dissipation element comprising a first end adjacent to or extending to the upper surface of the backing block and a second end extending to the lower surface or the third side surface of the backing block, wherein an extending direction of the third heat dissipation element from the first end of the third heat dissipation element to the second end of the third heat dissipation element forms a third angle with the thickness direction of the backing block.

21. The ultrasound probe of claim 20, wherein: the third heat dissipation element is interconnected with the second heat dissipation element, or the third heat dissipation element is interconnected with the first heat dissipation element and the second heat dissipation element.

22. The ultrasound probe of claim 21, wherein: the first end of the third heat dissipation element is connected to the first end of the second heat dissipation element, or the first end of the third heat dissipation element is connected to the first end of the first heat dissipation element and the first end of the second heat dissipation element.

23. The ultrasound probe of any of claims 15 or 20, wherein the third heat spreading element is a metal foil or a flexible graphite film.

24. The ultrasound probe of any of claims 15 or 20, wherein: the thickness of the third heat dissipation element is not more than 500 micrometers, or the thickness of the third heat dissipation element is not more than 25 micrometers.

25. The ultrasound probe of any of claims 15 or 20, wherein: the acoustic impedance of the third heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the third heat dissipating element differs from the acoustic impedance of the backing block by less than 1 megarayl.

26. The ultrasound probe of claim 1, wherein: the back lining block is also internally provided with a fourth heat dissipation element, the fourth heat dissipation element comprises a first end which is adjacent to or extends to the upper surface of the back lining block and a second end which extends to the lower surface or the fourth side surface of the back lining block, and the extending direction of the fourth heat dissipation element from the first end of the fourth heat dissipation element to the second end of the fourth heat dissipation element forms a fourth included angle with the thickness direction of the back lining block.

27. The ultrasound probe of claim 26, wherein a plurality of the fourth heat dissipating elements are disposed within the backing block.

28. The ultrasound probe of claim 27, wherein the fourth plurality of heat dissipation elements are parallel to each other and aligned along a second direction perpendicular to the thickness direction of the backing block.

29. The ultrasound probe of any of claims 26 to 28, wherein: the fourth heat dissipation element is interconnected with the first heat dissipation element.

30. The ultrasound probe of claim 29, wherein: the first end of the fourth heat dissipation element is interconnected with the first end of the first heat dissipation element.

31. The ultrasound probe of claim 7, wherein the backing block is further provided with a fourth heat dissipation element inside, the fourth heat dissipation element comprising a first end adjacent to or extending to the upper surface of the backing block and a second end extending to the lower surface or the fourth side surface of the backing block, wherein the fourth heat dissipation element extends from the first end of the fourth heat dissipation element to the second end of the fourth heat dissipation element at a fourth angle with respect to the thickness direction of the backing block.

32. The ultrasound probe of claim 31, wherein the fourth heat dissipation element is interconnected with the second heat dissipation element or the fourth heat dissipation element is interconnected with the first heat dissipation element and the second heat dissipation element.

33. The ultrasound probe of claim 32, wherein the first end of the fourth heat spreading element is interconnected with the first end of the second heat spreading element or the first end of the fourth heat spreading element is interconnected with the first end of the first heat spreading element and the first end of the second heat spreading element.

34. The ultrasound probe of claim 15, wherein the backing block is further provided with a fourth heat dissipation element inside, the fourth heat dissipation element comprising a first end adjacent to or extending to the upper surface of the backing block and a second end extending to the lower surface or the fourth side surface of the backing block, wherein the fourth heat dissipation element extends from the first end of the fourth heat dissipation element to the second end of the fourth heat dissipation element at a fourth angle with respect to the thickness direction of the backing block.

35. The ultrasound probe of claim 34, wherein the fourth heat dissipation element is interconnected with the third heat dissipation element or the fourth heat dissipation element is interconnected with the first heat dissipation element and the third heat dissipation element.

36. The ultrasound probe of claim 35, wherein the first end of the fourth heat spreading element is interconnected with the first end of the third heat spreading element or the first end of the fourth heat spreading element is interconnected with the first end of the first heat spreading element and the first end of the third heat spreading element.

37. The ultrasound probe of claim 20, wherein the backing block is further provided with a fourth heat dissipation element inside, the fourth heat dissipation element comprising a first end adjacent to or extending to the upper surface of the backing block and a second end extending to the lower surface or the fourth side surface of the backing block, wherein the fourth heat dissipation element extends from the first end of the fourth heat dissipation element to the second end of the fourth heat dissipation element at a fourth angle with respect to the thickness direction of the backing block.

38. The ultrasound probe of claim 37, wherein the fourth heat spreading element interconnects the first, second, and third heat spreading elements.

39. The ultrasound probe of claim 38, wherein the first end of the fourth heat spreading element is interconnected with the first end of the first heat spreading element, the first end of the second heat spreading element, and the first end of the third heat spreading element.

40. An ultrasound probe according to any of claims 26, 31, 34 or 37, wherein the fourth heat-dissipating element is a metal foil or a flexible graphite film.

41. The ultrasound probe of any of claims 26, 31, 34, or 37, wherein: the thickness of the fourth heat dissipation element is no greater than 500 micrometers, or the thickness of the fourth heat dissipation element is no greater than 25 micrometers.

42. The ultrasound probe of any of claims 26, 31, 34, or 37, wherein: the acoustic impedance of the fourth heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the fourth heat dissipating element differs from the acoustic impedance of the backing block by less than 1 megarayl.

43. The ultrasound probe of claim 1, further comprising a fifth heat dissipating element attached to an upper surface of the backing block.

44. The ultrasound probe of claim 1, wherein the probe further comprises a sixth heat dissipating element attached to at least one surface of the backing block other than the top surface.

45. The ultrasound probe of claim 1, further comprising a heat slug attached to at least one surface of the backing mass other than the upper surface.

46. The ultrasound probe of claim 45, further comprising a seventh heat dissipating element, wherein the seventh heat dissipating membrane is attached to at least one surface of the heat dissipating block.

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