CN210016488U - Mobile terminal - Google Patents

Abstract

Translated fromChinese

本申请涉及一种移动终端，包括子机和主机。子机包括显示屏、第一电源模块和第一极高频通信芯片，第一电源模块能够为显示屏和第一极高频通信芯片供电。主机包括第二电源模块和第二极高频通信芯片，第二电源模块能够为第二极高频通信芯片供电。子机能够安装于主机以使第一极高频通信芯片与第二极高频通信芯片配对，以实现子机与主机的通信连接。子机能够从主机拆卸，且在子机从主机拆卸后，子机能够与主机通信连接。以上的移动终端，既能通过子机提升移动终端的轻薄化和便携性，又能使得移动终端具有较高的性能，且主机和子机之间的通信连接可以获得较高的质量和效率。

The present application relates to a mobile terminal, including a slave and a host. The sub-machine includes a display screen, a first power supply module and a first extremely high frequency communication chip, and the first power supply module can supply power to the display screen and the first extremely high frequency communication chip. The host includes a second power supply module and a second extremely high frequency communication chip, and the second power supply module can supply power for the second extremely high frequency communication chip. The slave can be installed on the host so that the first extremely high frequency communication chip is paired with the second extremely high frequency communication chip, so as to realize the communication connection between the slave and the host. The handset can be detached from the host, and after the handset is detached from the host, the handset can be communicatively connected with the host. The above mobile terminal can not only improve the lightness and portability of the mobile terminal through the sub-machine, but also make the mobile terminal have higher performance, and the communication connection between the host and the sub-machine can obtain higher quality and efficiency.

Description

Translated fromChinese

移动终端mobile terminal

技术领域technical field

本申请涉及移动终端的技术领域。The present application relates to the technical field of mobile terminals.

背景技术Background technique

智能手机等移动终端的轻薄化趋势越来越明显，且消费者对于智能手机的性能要求也在逐渐提高，但轻薄化与性能在某种程度上相互制约，使得传统的移动终端的设计遇到了瓶颈。The trend of thinning and thinning of mobile terminals such as smart phones is becoming more and more obvious, and the performance requirements of consumers for smart phones are gradually increasing. However, thinning and performance restrict each other to some extent, which makes the design of traditional mobile terminals meet bottleneck.

实用新型内容Utility model content

本申请实施例提供一种移动终端，以解决移动终端的轻薄化与性能相互制约技术问题。Embodiments of the present application provide a mobile terminal, so as to solve the technical problem that the thinning and performance of the mobile terminal are mutually restricted.

一种移动终端，包括：A mobile terminal, comprising:

子机，包括显示屏、第一电源模块和第一极高频通信芯片，所述第一电源模块能够为所述显示屏和所述第一极高频通信芯片供电；及a sub-machine, including a display screen, a first power supply module and a first extremely high frequency communication chip, and the first power supply module can supply power to the display screen and the first extremely high frequency communication chip; and

主机，包括第二电源模块和第二极高频通信芯片，所述第二电源模块能够为所述第二极高频通信芯片供电；所述子机能够安装于所述主机以使所述第一极高频通信芯片与所述第二极高频通信芯片配对，以实现所述子机与所述主机的通信连接；所述子机能够从所述主机拆卸，且在所述子机从所述主机拆卸后，所述子机能够与所述主机通信连接。The host includes a second power module and a second extremely high frequency communication chip, the second power module can supply power to the second extremely high frequency communication chip; the sub-machine can be installed on the host so that the first An extremely high frequency communication chip is paired with the second extremely high frequency communication chip to realize the communication connection between the slave and the host; the slave can be detached from the host, and when the slave is After the host is disassembled, the sub-machine can be communicatively connected with the host.

以上的移动终端，子机能够安装于主机且能够从主机拆卸，且拆卸后子机能够与主机通信连接，子机的电子元器件可以设置得较少以使子机较为轻薄，主机则可以放置于口袋或者其他地方。子机安装于主机时，第一极高频通信芯片能够与第二极高频通信芯片配对，以实现子机与主机的通信连接。采用第一极高频通信芯片和第二极高频通信芯片进行通信，主机和子机之间的通信连接可以获得较高的质量和效率。In the above mobile terminal, the handset can be installed on the host and can be removed from the host, and the handset can be connected to the host after disassembly. The electronic components of the handset can be set less to make the handset lighter and thinner, and the host can be placed in a pocket or elsewhere. When the slave is installed on the host, the first extremely high frequency communication chip can be paired with the second extremely high frequency communication chip, so as to realize the communication connection between the slave and the host. By adopting the first extremely high frequency communication chip and the second extremely high frequency communication chip for communication, the communication connection between the host computer and the slave computer can obtain higher quality and efficiency.

在其中一个实施例中，所述主机包括相背设置的前表面、后表面，和连接在所述前表面、所述后表面之间的侧周面，所述侧周面包括相背设置的顶侧面、底侧面，和相背设置的左侧面、右侧面；所述左侧面、所述右侧面分别位于所述顶侧面、所述底侧面之间；所述子机的背向所述显示屏的可显示区的一侧能够叠设于所述前表面，以使所述第一极高频通信芯片与所述第二极高频通信芯片配对。In one of the embodiments, the host includes a front surface and a rear surface arranged opposite to each other, and a side peripheral surface connected between the front surface and the rear surface, and the side peripheral surface includes a front surface and a rear surface arranged opposite to each other. The top side, the bottom side, and the left side and right side which are opposite to each other; the left side and the right side are respectively located between the top side and the bottom side; the back of the sub-machine The side facing the displayable area of the display screen can be stacked on the front surface, so that the first extremely high frequency communication chip is paired with the second extremely high frequency communication chip.

在其中一个实施例中，所述子机包括间隔设置的第一主板和第一副板，所述第一电源模块位于所述第一主板和所述第一副板之间且能够为所述第一主板和所述第一副板供电；所述子机包括摄像头模组，所述摄像头模组连接所述第一副板；所述第一极高频通信芯片连接于所述第一主板或所述第一副板。In one embodiment, the sub-machine includes a first main board and a first sub-board arranged at intervals, and the first power module is located between the first main board and the first sub-board and can be the The first main board and the first sub-board supply power; the sub-machine includes a camera module, and the camera module is connected to the first sub-board; the first extremely high-frequency communication chip is connected to the first main board or the first sub-board.

在其中一个实施例中，所述子机包括指纹识别组件，所述显示屏覆盖所述指纹识别组件；所述第一主板开设有通孔，所述指纹识别组件容置于所述通孔并与所述第一主板连接。In one embodiment, the sub-machine includes a fingerprint identification component, and the display screen covers the fingerprint identification component; the first main board is provided with a through hole, and the fingerprint identification component is accommodated in the through hole and connected with the first motherboard.

在其中一个实施例中，所述子机包括中板，所述显示屏、所述第一主板和所述第一副板分别连接所述中板，所述中板开设有贯穿孔，所述指纹识别组件穿设所述贯穿孔。In one embodiment, the sub-machine includes a middle board, the display screen, the first main board and the first sub board are respectively connected to the middle board, the middle board is provided with a through hole, the The fingerprint identification component penetrates the through hole.

在其中一个实施例中，所述主机包括间隔设置的第二主板和第二副板，所述第二电源模块位于所述第二主板和所述第二副板之间且能够为第二主板和第二副板供电；所述第二极高频通信芯片连接于所述第二副板或者所述第二主板。In one embodiment, the host includes a second main board and a second sub-board spaced apart, and the second power module is located between the second main board and the second sub-board and can be the second main board and the second sub-board to supply power; the second extremely high frequency communication chip is connected to the second sub-board or the second main board.

在其中一个实施例中，所述子机包括连接于所述第一主板的子机触点，所述主机包括连接于所述第二副板的主机触点，在所述子机安装于所述主机时，所述子机触点能够与所述主机触点接触导通，以使所述主机能够为所述子机充电。In one embodiment, the sub-machine includes a sub-machine contact connected to the first main board, the main machine includes a main-machine contact connected to the second sub-board, and the sub-machine is installed on the When the main unit is used, the contact of the sub unit can be in contact with the contact of the main unit, so that the main unit can charge the sub unit.

在其中一个实施例中，所述子机包括磁吸组件，所述主机包括吸附件，在所述子机安装于所述主机时，所述磁吸组件能够吸附于所述吸附件。In one embodiment, the sub-machine includes a magnetic attraction component, and the main unit includes an adsorption member, and when the sub-machine is installed on the main body, the magnetic attraction component can be adsorbed on the adsorption member.

在其中一个实施例中，所述子机包括相背设置的前端面和后端面，及连接于所述前端面和所述后端面之间的侧端面，所述显示屏的可显示区朝向所述前端面；所述主机包括外壳及与所述外壳连接的支架，所述外壳开设有容置槽，所述支架能够相对所述外壳翻转至扣合状态和展开状态；其中，在扣合状态时所述支架收容于所述容置槽，在展开状态时所述子机能够垂直或者倾斜地放置于所述外壳且所述支架能够与所述后端面接触，所述外壳能够与所述侧端面接触。In one embodiment, the sub-machine includes a front end surface and a rear end surface disposed opposite to each other, and a side end surface connected between the front end surface and the rear end surface, and the displayable area of the display screen faces the the front end surface; the host includes a shell and a bracket connected with the shell, the shell is provided with an accommodating slot, and the bracket can be turned over to the buckled state and the unfolded state relative to the shell; wherein, in the buckled state When the bracket is accommodated in the accommodating slot, in the unfolded state, the sub-machine can be placed on the casing vertically or obliquely, the bracket can be in contact with the rear end surface, and the casing can be in contact with the side face contact.

在其中一个实施例中，所述主机包括无线调制解调模块、主机主控制器和主机无线收发模块；所述子机包括子机键盘、子机主控制器和子机无线收发模块；在所述手机的第一种工作状态下，所述子机键盘输出的控制命令，在所述子机主控制器控制下，经所述子机无线收发模块调制后，发给所述主机无线收发模块，在所述主机主控制器控制下，经所述无线调制解调模块调制后，发送到空中；来自空中的控制信号，经所述无线调制解调模块解调后，经过所述主机主控制器，由所述主机无线收发模块调制后发给所述子机，所述子机无线收发模块接收后，在所述子机主控制器的控制下，由所述显示屏显示。In one embodiment, the host includes a wireless modem module, a host main controller, and a host wireless transceiver module; the slave includes a slave keyboard, a slave main controller, and a slave wireless transceiver module; in the In the first working state of the mobile phone, the control command output by the keyboard of the sub-machine, under the control of the main controller of the sub-machine, is modulated by the wireless transceiver module of the sub-machine and sent to the wireless transceiver module of the host machine, Under the control of the host main controller, after being modulated by the wireless modem module, it is sent to the air; the control signal from the air, after being demodulated by the wireless modem module, passes through the host main controller. , which is modulated by the host wireless transceiver module and sent to the sub-machine. After the sub-machine wireless transceiver module receives it, it is displayed on the display screen under the control of the sub-machine main controller.

在其中一个实施例中，所述主机包括无线调制解调模块、主机主控制器、主机无线收发模块；所述子机包括子机主控制器、子机麦克、子机受话器、子机音频编码器、子机音频解码器、能够与所述主机无线收发模块通信的子机无线收发模块；在第二种工作状态下，来自所述子机麦克的音频信号，经所述子机音频编码器编码后传输到所述子机主控制器中，经所述子机主控制器控制下，被所述子机无线收发模块发送出去，由所述主机无线收发模块接收后，在所述主机主控制器的控制下，传送到所述无线调制解调模块，经所述无线调制解调模块调制后发送到空中；来自空中的信号，经所述无线调制解调模块解调后传送到所述主机主控制器中，在所述主机主控制器的控制下，传送到所述主机无线收发模块中，经所述主机无线收发模块调制后，发送到所述子机，所述子机无线收发模块解调出的音频信号，在所述子机主控制器控制下，经所述子机音频解码器解码后，由所述子机受话器输出。In one embodiment, the host includes a wireless modem module, a host main controller, and a host wireless transceiver module; the sub-machine includes a sub-machine main controller, a sub-machine microphone, a sub-machine receiver, and a sub-machine audio codec a receiver, a sub-machine audio decoder, and a sub-machine wireless transceiver module capable of communicating with the host wireless transceiver module; in the second working state, the audio signal from the sub-machine microphone is transmitted through the sub-machine audio encoder. After encoding, it is transmitted to the main controller of the sub-machine, and is sent out by the wireless transceiver module of the sub-machine under the control of the main controller of the sub-machine. Under the control of the controller, it is transmitted to the wireless modulation and demodulation module, and then sent to the air after being modulated by the wireless modulation and demodulation module; the signal from the air is demodulated by the wireless modulation and demodulation module and then transmitted to the wireless modulation and demodulation module. In the host main controller, under the control of the host main controller, it is transmitted to the host wireless transceiver module, and after being modulated by the host wireless transceiver module, it is sent to the sub-machine, and the sub-machine wireless transceiver The audio signal demodulated by the module, under the control of the main controller of the sub-machine, is decoded by the audio decoder of the sub-machine, and then output by the receiver of the sub-machine.

在其中一个实施例中，所述主机包括无线调制解调模块、主机主控制器、主机无线收发模块，所述主机主控制器能够与所述无线调制解调模块和所述主机无线收发模块通信；所述子机包括子机主控制器、与所述主机无线收发模块能够通信的子机无线收发模块，所述子机主控制器能够与所述子机无线收发模块通信；所述子机能够通过所述主机接入通信网络。In one embodiment, the host includes a wireless modem module, a host host controller, and a host wireless transceiver module, and the host host controller can communicate with the wireless modem module and the host wireless transceiver module ; The sub-machine includes a sub-machine main controller, a sub-machine wireless transceiver module that can communicate with the host wireless transceiver module, and the sub-machine main controller can communicate with the sub-machine wireless transceiver module; The sub-machine A communication network can be accessed through the host.

在其中一个实施例中，所述主机包括主机第一无线通信模块、主机主控制器、主机第二无线通信模块，所述主机主控制器能够与所述主机第一无线通信模块、所述主机第二无线通信模块通信；所述子机包括子机主控制器、子机无线通信模块，所述子机主控制器能够与所述子机无线通信模块通信，所述子机无线通信模块能够与所述主机第一无线通信模块进行通信；所述主机第二无线通信模块能够与基站通信。In one embodiment, the host includes a host first wireless communication module, a host main controller, and a host second wireless communication module, and the host main controller can communicate with the host first wireless communication module, the host The second wireless communication module communicates; the sub-machine includes a sub-machine main controller and a sub-machine wireless communication module, the sub-machine main controller can communicate with the sub-machine wireless communication module, and the sub-machine wireless communication module can communicate with the host first wireless communication module; the host second wireless communication module can communicate with the base station.

附图说明Description of drawings

为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

图1为一实施例中移动终端的立体图；1 is a perspective view of a mobile terminal in an embodiment;

图2为图1所示移动终端的子机从主机上拆卸后的立体图；Fig. 2 is the perspective view after the sub-machine of the mobile terminal shown in Fig. 1 is disassembled from the host;

图3为图2所示移动终端的子机拆除部分零部件后的主视图；3 is a front view of the sub-machine of the mobile terminal shown in FIG. 2 after removing some components;

图4为图2所示移动终端的子机的爆炸图；Fig. 4 is the exploded view of the sub-machine of the mobile terminal shown in Fig. 2;

图5为图2所示移动终端的主机拆除部分零部件后的立体图；5 is a perspective view of the main unit of the mobile terminal shown in FIG. 2 after removing some components;

图6为图5所示移动终端的主机拆除部分零部件后的另一视角的立体图；6 is a perspective view from another perspective after the main unit of the mobile terminal shown in FIG. 5 has removed some components;

图7为图2所示移动终端的子机倾斜放置于主机上的立体图；Fig. 7 is the perspective view that the sub-machine of the mobile terminal shown in Fig. 2 is placed obliquely on the main body;

图8为一实施例中移动终端在第一种工作状态下的流程图；8 is a flowchart of a mobile terminal in a first working state in an embodiment;

图9为图8所示移动终端在第一种工作状态下的另一流程图；Fig. 9 is another flow chart of the mobile terminal shown in Fig. 8 under the first working state;

图10为一实施例中移动终端在第二种工作状态下的流程图；10 is a flowchart of a mobile terminal in a second working state in an embodiment;

图11为图10所示移动终端在第二种工作状态下的另一流程图；Fig. 11 is another flow chart of the mobile terminal shown in Fig. 10 under the second working state;

图12为一实施例中移动终端的模块结构示意图；12 is a schematic diagram of a module structure of a mobile terminal in an embodiment;

图13为另一实施例中移动终端的模块结构示意图；13 is a schematic diagram of a module structure of a mobile terminal in another embodiment;

图14为又一实施例中移动终端的模块结构示意图。FIG. 14 is a schematic diagram of a module structure of a mobile terminal in another embodiment.

具体实施方式Detailed ways

为了便于理解本申请，下面将参照相关附图对本申请进行更全面的描述。附图中给出了本申请的较佳的实施例。但是，本申请可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本申请的公开内容的理解更加透彻全面。In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the related drawings. The preferred embodiments of the present application are shown in the accompanying drawings. However, the application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that a thorough and complete understanding of the disclosure of this application is provided.

作为在此使用的“终端设备”指包括但不限于经由以下任意一种或者数种连接方式连接的能够接收和/或发送通信信号的装置：As used herein, "terminal equipment" refers to a device capable of receiving and/or sending communication signals, including but not limited to, connected via any one or several of the following connection methods:

(1)经由有线线路连接方式，如经由公共交换电话网络(Public SwitchedTelephone Networks，PSTN)、数字用户线路(Digital Subscriber Line，DSL)、数字电缆、直接电缆连接；(1) Connection via wired line, such as via public switched telephone network (Public SwitchedTelephone Networks, PSTN), digital subscriber line (Digital Subscriber Line, DSL), digital cable, direct cable connection;

(2)经由无线接口方式，如蜂窝网络、无线局域网(Wireless Local AreaNetwork，WLAN)、诸如DVB-H网络的数字电视网络、卫星网络、AM-FM广播发送器。(2) Via a wireless interface, such as a cellular network, a wireless local area network (Wireless Local Area Network, WLAN), a digital TV network such as a DVB-H network, a satellite network, and an AM-FM broadcast transmitter.

被设置成通过无线接口通信的终端设备可以被称为“移动终端”。移动终端的示例包括但不限于以下电子装置：A terminal device arranged to communicate via a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

(1)卫星电话或蜂窝电话；(1) Satellite telephone or cellular telephone;

(2)可以组合蜂窝无线电电话与数据处理、传真以及数据通信能力的个人通信系统(Personal Communications System,PCS)终端；(2) Personal Communications System (PCS) terminals that can combine cellular radio telephones with data processing, facsimile, and data communication capabilities;

(3)无线电电话、寻呼机、因特网/内联网接入、Web浏览器、记事簿、日历、配备有全球定位系统(Global Positioning System，GPS)接收器的个人数字助理(PersonalDigital Assistant，PDA)；(3) Radiotelephone, pager, Internet/Intranet access, Web browser, memo pad, calendar, Personal Digital Assistant (PDA) equipped with a Global Positioning System (Global Positioning System, GPS) receiver;

(4)常规膝上型和/或掌上型接收器；(4) conventional laptop and/or palm-sized receivers;

(5)常规膝上型和/或掌上型无线电电话收发器等。(5) Conventional laptop and/or palm radiotelephone transceivers and the like.

参考图1和图2，在一实施例中，移动终端10为智能手机。移动终端10包括子机100和主机200。同时参考图3和图4，子机100包括显示屏110、第一电源模块130和第一极高频通信芯片150，第一电源模块130能够为显示屏110和第一极高频通信芯片150供电，显示屏110可用于显示信息并为用户提供交互界面。同时参考图5和图6，主机200包括第二电源模块220和第二极高频通信芯片240，第二电源模块220能够为第二极高频通信芯片240供电。参考图1，子机100能够安装于主机200以使第一极高频通信芯片150与第二极高频通信芯片240配对，以实现子机100与主机200的通信连接。参考图2，子机100还能够从主机200拆卸，且在子机100从主机200拆卸后，子机100能够与主机200通信连接。1 and 2, in one embodiment, themobile terminal 10 is a smart phone. Themobile terminal 10 includes aslave 100 and ahost 200 . Referring to FIG. 3 and FIG. 4 at the same time, thehandset 100 includes adisplay screen 110 , a firstpower supply module 130 and a first extremely highfrequency communication chip 150 , and the firstpower supply module 130 can be thedisplay screen 110 and the first extremely highfrequency communication chip 150 Powered on, thedisplay screen 110 can be used to display information and provide an interactive interface for the user. Referring to FIG. 5 and FIG. 6 at the same time, thehost 200 includes a secondpower supply module 220 and a second extremely highfrequency communication chip 240 , and the secondpower supply module 220 can supply power to the second extremely highfrequency communication chip 240 . Referring to FIG. 1 , theslave 100 can be installed on thehost 200 to pair the first ultra-highfrequency communication chip 150 with the second ultra-highfrequency communication chip 240 to realize the communication connection between theslave 100 and thehost 200 . Referring to FIG. 2 , thehandset 100 can also be detached from thehost 200 , and after thehandset 100 is detached from thehost 200 , thehandset 100 can be communicatively connected with thehost 200 .

第一极高频通信芯片150和第二极高频通信芯片240均为极高频通信芯片。极高频通信芯片为内部封装有EHF(extremely high frequency,极高频率)天线的IC(IntegratedCircuit，集成电路)芯片，两个极高频通信芯片之间足够接近时才能够完成配对以进行无线通信。极高频通信芯片的实例为EHF共同链路芯片。术语“共同链路芯片”、“共同链路芯片封装”及“EHF通信链路芯片封装”用以指代嵌入于IC封装中的EHF天线。极高频通信芯片的实例可参考描述于第2012/0263244号及第2012/0307932号美国专利申请公开案中的信息，也可参见公布号为CN103563166A、CN104145380A中国专利文献中披露的信息。The first extremely highfrequency communication chip 150 and the second extremely highfrequency communication chip 240 are both extremely high frequency communication chips. The extremely high frequency communication chip is an IC (Integrated Circuit) chip with an EHF (extremely high frequency, extremely high frequency) antenna encapsulated inside. When the two extremely high frequency communication chips are close enough to each other, the pairing can be completed for wireless communication. . An example of an extremely high frequency communication chip is an EHF common link chip. The terms "common link chip", "common link chip package" and "EHF communication link chip package" are used to refer to an EHF antenna embedded in an IC package. For examples of extremely high frequency communication chips, reference may be made to the information described in US Patent Application Publication Nos. 2012/0263244 and 2012/0307932, as well as information disclosed in Chinese patent documents with publication numbers CN103563166A and CN104145380A.

极高频通信芯片的实例可以参见授权公告号为CN105264785B的中国授权专利文献。极高频通信芯片内封装有极高频天线，配置有极高频通信芯片的子机100可以基于高载波频率(例如，60GHz)与配置有极高频通信芯片的终端设备实现数据的高速无线传输(例如，最高可达6GB/s的传输速度)。An example of the extremely high frequency communication chip can be found in the Chinese authorized patent document with the authorization announcement number CN105264785B. The EHF communication chip is packaged with an EHF antenna, and thehandset 100 equipped with the EHF communication chip can realize high-speed wireless data transmission based on a high carrier frequency (for example, 60 GHz) and a terminal device configured with the EHF communication chip. transfer (e.g. up to 6GB/s transfer speed).

可以理解的是，基于高载波频率的近距离无线通信具有低功耗、体积小、传输速率快、非接触传输等优点，还可以实现即插即用模块的功能，可以大幅提高的信号完整性，支持更灵活的系统实现，降低待机功耗，增加带宽幅度与数据传输的安全性，兼容对高速视频信号的支持等特点。It can be understood that the short-range wireless communication based on high carrier frequency has the advantages of low power consumption, small size, fast transmission rate, non-contact transmission, etc., and can also realize the function of plug-and-play module, which can greatly improve the signal integrity. , support more flexible system implementation, reduce standby power consumption, increase bandwidth range and data transmission security, compatible with support for high-speed video signals, etc.

可以理解的是，高载波频率可以是能够实现高速的数据无线传输的载波频率。高载波频率可以是某个明确的载波频率，也可以是一个载波频段，例如30GHz-300GHz，本申请实施例对此不做具体限定。可选地，该高载波频率为60GHz。It can be understood that the high carrier frequency may be a carrier frequency capable of realizing high-speed wireless data transmission. The high carrier frequency may be a certain definite carrier frequency, or may be a carrier frequency band, such as 30 GHz-300 GHz, which is not specifically limited in this embodiment of the present application. Optionally, the high carrier frequency is 60GHz.

在一个实施例中，第一极高频通信芯片150可以包括第一换能器和第一集成电路(IC)，第一换能器用于将电磁信号转换为射频电信号，第一集成电路用于耦合到第一换能器。第一集成电路包括接收器电路和信号检测器电路，接收器电路用于从第一换能器接收第一射频电信号，且将第一射频电信号变换为第一基带信号，且在控制信号具有第一状态时输出第一基带信号，且在控制信号具有不同于第一状态的第二状态时不输出第一基带信号。信号检测器电路响应于表示所接收的第一射频电信号的监视器信号，以用于在监视器信号指示所接收的第一射频电信号是可接受信号时产生具有第一状态的控制信号，且在监视器信号指示所接收的第一射频电信号不是可接受信号时产生具有第二状态的控制信号。此类型的极高频通信芯片为具有接收电磁信号的极高频通信芯片。In one embodiment, the first extremely highfrequency communication chip 150 may include a first transducer and a first integrated circuit (IC), the first transducer is used for converting electromagnetic signals into radio frequency electrical signals, and the first integrated circuit uses for coupling to the first transducer. The first integrated circuit includes a receiver circuit and a signal detector circuit, the receiver circuit is used for receiving a first radio frequency electrical signal from the first transducer, and converting the first radio frequency electrical signal into a first baseband signal, and in the control signal The first baseband signal is output when having the first state, and the first baseband signal is not output when the control signal has a second state different from the first state. a signal detector circuit responsive to a monitor signal representing the received first radio frequency electrical signal for generating a control signal having a first state when the monitor signal indicates that the received first radio frequency electrical signal is an acceptable signal, And the control signal having the second state is generated when the monitor signal indicates that the received first radio frequency electrical signal is not an acceptable signal. This type of EHF communication chip is an EHF communication chip that has the ability to receive electromagnetic signals.

第二极高频通信芯片240可以包括第二换能器和第二集成电路，第二换能器用于将射频电信号转换为电磁信号，第二换能器充分靠近第一换能器以让第一换能器接收由第二换能器产生的电磁信号。第二集成电路用于耦合到第二换能器，第二集成电路含有发射器电路，用于接收第二基带信号且将第二基带信号变换为第二射频电信号，且将第二射频电信号传导到第二换能器。此类型的极高频通信芯片为具有发送电磁信号的极高频通信芯片。The second extremely highfrequency communication chip 240 may include a second transducer for converting radio frequency electrical signals into electromagnetic signals and a second integrated circuit, the second transducer being sufficiently close to the first transducer to allow The first transducer receives the electromagnetic signal generated by the second transducer. A second integrated circuit for coupling to the second transducer, the second integrated circuit containing a transmitter circuit for receiving a second baseband signal and converting the second baseband signal to a second radio frequency electrical signal, and converting the second radio frequency electrical The signal is conducted to the second transducer. This type of extremely high frequency communication chip is an extremely high frequency communication chip with a transmitting electromagnetic signal.

当然，第一极高频通信芯片150可以设置两个，其中一个为具有接收电磁信号的极高频通信芯片，另一个为具有发送电磁信号的极高频通信芯片。第二极高频通信芯片240可以对应设置两个，其中一个为具有发送电磁信号的极高频通信芯片，另一个为具有接收电磁信号的极高频通信芯片。当然，第一极高频通信芯片150或第二极高频通信芯片240可以为同时具有发射信号和接收信号的功能的极高频通信芯片。当第一极高频通信芯片150为同时具有发射信号和接收信号的功能的极高频通信芯片时，第一极高频通信芯片150可以包括换能器和集成电路(IC)，换能器用于在射频电信号与电磁信号之间转换。集成电路用于耦合到换能器，集成电路含有发射器电路和接收器电路，发射器电路能够将基带信号变换为射频电信号，且将射频电信号传导到换能器，再由换能器将射频电信号变换为电磁信号并发射出去；换能器接收电磁信号后可以变换为射频电信号，接收器电路能够从换能器接收射频电信号，并将射频电信号变换为基带信号。第一极高频通信芯片150还可以包括电磁能量引导组合件，电磁能量引导组合件相对于换能器而安装，以用于在包含换能器的区中且在远离集成电路的方向上引导电磁能量。Of course, two firstEHF communication chips 150 may be provided, one of which is an EHF communication chip for receiving electromagnetic signals, and the other is an EHF communication chip for transmitting electromagnetic signals. Two second extremely highfrequency communication chips 240 may be provided correspondingly, one of which is an extremely high frequency communication chip for transmitting electromagnetic signals, and the other is an extremely high frequency communication chip for receiving electromagnetic signals. Of course, the first extremely highfrequency communication chip 150 or the second extremely highfrequency communication chip 240 may be an extremely high frequency communication chip having functions of transmitting signals and receiving signals at the same time. When the first extremely highfrequency communication chip 150 is an extremely high frequency communication chip having the functions of transmitting signals and receiving signals at the same time, the first extremely highfrequency communication chip 150 may include a transducer and an integrated circuit (IC). It is used to convert between radio frequency electrical signals and electromagnetic signals. The integrated circuit is used for coupling to the transducer. The integrated circuit contains a transmitter circuit and a receiver circuit. The transmitter circuit can convert the baseband signal into a radio frequency electrical signal, and conduct the radio frequency electrical signal to the transducer, which is then transmitted by the transducer. The radio frequency electrical signal is converted into an electromagnetic signal and transmitted; the transducer can convert the electromagnetic signal into a radio frequency electrical signal after receiving the electromagnetic signal, and the receiver circuit can receive the radio frequency electrical signal from the transducer and convert the radio frequency electrical signal into a baseband signal. The firstEHF communication chip 150 may also include an electromagnetic energy directing assembly mounted relative to the transducer for directing in the region containing the transducer and in a direction away from the integrated circuit electromagnetic energy.

具体地，当第一极高频通信芯片150为同时具有发射信号和接收信号的功能的极高频通信芯片时，第一极高频通信芯片150可以包括第一换能器、第二换能器、第一集成电路和第二集成电路。第一换能器用于将电磁信号转换为射频电信号，第一集成电路用于耦合到第一换能器。第一集成电路包括接收器电路和信号检测器电路，接收器电路用于从第一换能器接收第一射频电信号，且将第一射频电信号变换为第一基带信号，且在控制信号具有第一状态时输出第一基带信号，且在控制信号具有不同于第一状态的第二状态时不输出第一基带信号。信号检测器电路响应于表示所接收的第一射频电信号的监视器信号，以用于在监视器信号指示所接收的第一射频电信号是可接受信号时产生具有第一状态的控制信号，且在监视器信号指示所接收的第一射频电信号不是可接受信号时产生具有第二状态的控制信号。第二换能器用于将射频电信号转换为电磁信号，第二换能器充分靠近第一换能器以让第一换能器接收由第二换能器产生的电磁信号。第二集成电路用于耦合到第二换能器，第二集成电路含有发射器电路，用于接收第二基带信号且将第二基带信号变换为第二射频电信号，且将第二射频电信号传导到第二换能器。Specifically, when the first extremely highfrequency communication chip 150 is an extremely high frequency communication chip having functions of transmitting signals and receiving signals at the same time, the first extremely highfrequency communication chip 150 may include a first transducer, a second transducer a device, a first integrated circuit, and a second integrated circuit. The first transducer is used to convert the electromagnetic signal to a radio frequency electrical signal, and the first integrated circuit is used to couple to the first transducer. The first integrated circuit includes a receiver circuit and a signal detector circuit, the receiver circuit is used for receiving a first radio frequency electrical signal from the first transducer, and converting the first radio frequency electrical signal into a first baseband signal, and in the control signal The first baseband signal is output when having the first state, and the first baseband signal is not output when the control signal has a second state different from the first state. a signal detector circuit responsive to a monitor signal representing the received first radio frequency electrical signal for generating a control signal having a first state when the monitor signal indicates that the received first radio frequency electrical signal is an acceptable signal, And the control signal having the second state is generated when the monitor signal indicates that the received first radio frequency electrical signal is not an acceptable signal. The second transducer is used to convert the radio frequency electrical signal into an electromagnetic signal, and the second transducer is sufficiently close to the first transducer for the first transducer to receive the electromagnetic signal generated by the second transducer. A second integrated circuit for coupling to the second transducer, the second integrated circuit containing a transmitter circuit for receiving a second baseband signal and converting the second baseband signal to a second radio frequency electrical signal, and converting the second radio frequency electrical The signal is conducted to the second transducer.

在一实施例中，第一极高频通信芯片150大致呈矩形块状，第二极高频通信芯片240大致呈矩形块状。当第一极高频通信芯片150与第二极高频通信芯片240足够接近以完成配对时，穿过第一极高频通信芯片150的形心的法线与第二极高频通信芯片240的表面存在交点，且该交点与第二极高频通信芯片240的形心之间的距离小于等于2.5毫米，第一极高频通信芯片150的形心与第二极高频通信芯片240的形心之间的距离小于等于8.5毫米，上述设置能够实现第一极高频通信芯片150与第二极高频通信芯片240之间的可靠的通信，以利于主机200与子机100之间的数据传输。In one embodiment, the firstEHF communication chip 150 is approximately in the shape of a rectangular block, and the secondEHF communication chip 240 is approximately in the shape of a rectangular block. When the firstEHF communication chip 150 and the secondEHF communication chip 240 are close enough to complete the pairing, the normal line passing through the centroid of the firstEHF communication chip 150 and the secondEHF communication chip 240 There is an intersection point on the surface of , and the distance between the intersection point and the centroid of the second extremely highfrequency communication chip 240 is less than or equal to 2.5 mm, the centroid of the first extremely highfrequency communication chip 150 and the second extremely highfrequency communication chip 240 The distance between the centroids is less than or equal to 8.5 mm. The above setting can realize reliable communication between the first extremely highfrequency communication chip 150 and the second extremely highfrequency communication chip 240, so as to facilitate the communication between thehost computer 200 and theslave computer 100. data transmission.

以上的移动终端10，子机100能够安装于主机200且能够从主机200拆卸，且拆卸后子机100能够与主机200通信连接，子机100的电子元器件可以设置得较少以使子机100较为轻薄。主机200可以设置大容量的电池或者存储单元，且主机200可以放置于口袋或者其他地方并与子机100无线通信连接。主机200可以接入蜂窝通信网络或者WiFi(WirelessFidelity)，并与子机100进行数据交互传输。子机100与主机200分离时，子机100可以正常使用并实现基本的功能，子机100安装于主机200时，能够获得完整的移动终端10并使移动终端10具有大电池容量、大存储空间等优点。换言之，上述结构的移动终端10既能通过子机100提升移动终端10的轻薄化和便携性，又能使得移动终端10具有较高的性能。当子机100安装于主机200时，由于第一极高频通信芯片150能够与第二极高频通信芯片240配对以实现子机100与主机200的通信连接，上述设置使得主机200和子机100之间的通信连接可以获得较高的质量和效率。In the abovemobile terminal 10, thehandset 100 can be installed on and detached from thehost 200, and thehandset 100 can be communicatively connected to thehost 200 after the detachment. 100 is lighter. Thehost 200 can be provided with a large-capacity battery or a storage unit, and thehost 200 can be placed in a pocket or other places and connected to thehandset 100 in wireless communication. Thehost 200 can access a cellular communication network or WiFi (Wireless Fidelity), and perform data interactive transmission with theslave 100 . When thehandset 100 is separated from thehost 200, thehandset 100 can be used normally and realize basic functions. When thehandset 100 is installed on thehost 200, a completemobile terminal 10 can be obtained and themobile terminal 10 has a large battery capacity and a large storage space. Etc. In other words, themobile terminal 10 with the above structure can not only improve the slimness and portability of themobile terminal 10 through thehandset 100 , but also enable themobile terminal 10 to have higher performance. When theslave 100 is installed on thehost 200, since the first ultra-highfrequency communication chip 150 can be paired with the second ultra-highfrequency communication chip 240 to realize the communication connection between theslave 100 and thehost 200, the above setting enables thehost 200 and theslave 100 The communication connection between them can obtain higher quality and efficiency.

参考图2，主机200大致呈矩形块状，主机200包括相背设置的前表面211、后表面213，和连接在前表面211、后表面213之间的侧周面，侧周面包括相背设置的顶侧面212、底侧面214，和相背设置的左侧面216、右侧面218，左侧面216、右侧面218分别位于顶侧面212、底侧面214之间。子机100的背向显示屏110的可显示区的一侧能够叠设于前表面211，以使第一极高频通信芯片150与第二极高频通信芯片240配对。在一实施例中，主机200的前表面211一侧呈中间低、周向高的凹槽状，子机100安装于主机200时，主机200的凹槽可以容置子机100的部分结构，并且主机200的周向凸出的结构能够围设于子机100的外周，以使子机100能够方便地在主机200上定位。例如，上述定位有利于第一极高频通信芯片150与第二极高频通信芯片240的配对。Referring to FIG. 2 , themain unit 200 is roughly in the shape of a rectangular block. Themain unit 200 includes afront surface 211 and arear surface 213 arranged opposite to each other, and a side peripheral surface connected between thefront surface 211 and therear surface 213 , and the side peripheral surface includes the opposite side surfaces. The top side 212 and the bottom side 214 are provided, and the left side 216 and the right side 218 are provided opposite to each other. The left side 216 and the right side 218 are respectively located between the top side 212 and the bottom side 214 . The side of thehandset 100 facing away from the displayable area of thedisplay screen 110 can be stacked on thefront surface 211 , so that the firstEHF communication chip 150 and the secondEHF communication chip 240 are paired. In one embodiment, one side of thefront surface 211 of themain unit 200 is in the shape of a groove that is low in the middle and high in the circumferential direction. When thesub unit 100 is installed on themain unit 200, the groove of themain unit 200 can accommodate part of the structure of thesub unit 100, and the main unit is The circumferentially protruding structure of 200 can be arranged around the outer periphery of the sub-machine 100 , so that the sub-machine 100 can be conveniently positioned on thehost 200 . For example, the above positioning facilitates the pairing of the firstEHF communication chip 150 and the secondEHF communication chip 240 .

进一步，参考图3和图4，子机100可以包括磁吸组件160，主机200包括吸附件，在子机100安装于主机200时，磁吸组件160能够吸附于吸附件。具体地，磁吸组件160和吸附件中的一个为磁铁，另一个可以为铁磁金属或者为磁铁。磁性金属可以为铁、钴、镍或者其合金。在图3所示实施例中，磁吸组件160为磁铁。主机200包括外壳210，前表面211、后表面213、侧周面对应地位于外壳210上。主机200的外壳210可以采用铁磁金属制成，以将主机200的外壳210作为吸附件。磁吸组件160和吸附件的设置，有利于子机100在主机200上可靠的定位。Further, referring to FIG. 3 and FIG. 4 , thesub-machine 100 may include amagnetic attraction component 160 , and themain unit 200 includes an adsorption component. When the sub-machine 100 is installed on themain unit 200 , themagnetic attraction component 160 can be adsorbed on the adsorption component. Specifically, one of the magnetic attractingcomponent 160 and the attracting member is a magnet, and the other may be a ferromagnetic metal or a magnet. The magnetic metal may be iron, cobalt, nickel or alloys thereof. In the embodiment shown in FIG. 3 , themagnetic attraction component 160 is a magnet. Thehost 200 includes ahousing 210 , and thefront surface 211 , therear surface 213 , and the side peripheral surfaces are correspondingly located on thehousing 210 . Theshell 210 of thehost 200 may be made of ferromagnetic metal, so that theshell 210 of thehost 200 can be used as a suction part. The arrangement of the magnetic attractingcomponent 160 and the attracting member is beneficial to the reliable positioning of the sub-machine 100 on thehost 200 .

进一步，参考图2，子机100大致呈矩形块状，子机100包括相背设置的前端面121和后端面123，及连接于前端面121和后端面123之间的侧端面125，显示屏110的可显示区朝向前端面121。进一步，子机100可以包括玻璃盖板，玻璃盖板盖设于显示屏110，玻璃盖板的背向显示屏110的一侧构成前端面121的全部或者部分。参考图4，子机100可以包括后盖170，后盖170盖设于第一电源模块130，后盖170的背向显示屏110的一侧的表面构成后表面213的全部或者部分。同时参考图7，主机200包括与外壳210连接的支架260，外壳210的前表面211开设有容置槽261，外壳210内形成有用于安装主机200电子元器件的安装空间。支架260能够相对外壳210翻转至扣合状态和展开状态。参考图2，在扣合状态时支架260收容于容置槽261内。参考图7，在展开状态时子机100能够垂直或者倾斜地放置于外壳210上且支架260能够与后端面123接触，外壳210能够与侧端面125接触。利用支架260可以支撑子机100，以方便用户使用子机100观看视频或者玩游戏等。Further, referring to FIG. 2 , thesub-machine 100 is roughly in the shape of a rectangular block. Thesub-machine 100 includes afront end surface 121 and arear end surface 123 arranged opposite to each other, and aside end surface 125 connected between thefront end surface 121 and therear end surface 123 . The display screen The displayable area of 110 faces thefront face 121 . Further, thesub-machine 100 may include a glass cover plate, the glass cover plate is covered on thedisplay screen 110 , and the side of the glass cover plate facing away from thedisplay screen 110 constitutes all or part of thefront surface 121 . Referring to FIG. 4 , thehandset 100 may include arear cover 170 covering thefirst power module 130 , and a surface of therear cover 170 facing away from thedisplay screen 110 constitutes all or part of therear surface 213 . 7 , thehost 200 includes abracket 260 connected to thehousing 210 , afront surface 211 of thehousing 210 defines anaccommodating slot 261 , and an installation space for installing the electronic components of thehost 200 is formed in thehousing 210 . Thebracket 260 can be turned relative to thehousing 210 to a snap-fit state and an unfolded state. Referring to FIG. 2 , thebracket 260 is accommodated in theaccommodating groove 261 in the buckled state. Referring to FIG. 7 , in the unfolded state, thehandset 100 can be placed on thecasing 210 vertically or obliquely, thebracket 260 can be in contact with therear end surface 123 , and thecasing 210 can be in contact with theside end surface 125 . The sub-machine 100 can be supported by thebracket 260, so as to facilitate the user to use the sub-machine 100 to watch videos or play games.

参考图3，子机100包括间隔设置的第一主板141和第一副板143，第一主板141的面积大于第一副板143。子机100包括摄像头模组145，摄像头模组145连接第一副板143，第一极高频通信芯片150连接于第一主板141。第一电源模块130位于第一主板141和第一副板143之间且能够为第一主板141和第一副板143供电。具体地，第一电源模块130可以通过柔性线路板连接于第一主板141或者第一副板143，并为第一主板141或者第一副板143供电。当然，第一主板141或者第一副板143中的一个可以设置电源管理模块，第一电源模块130通过柔性线路板与电源管理模块电性连接，第一主板141和第一副板143中的另一个再通过柔性线路板电性连接至电源管理模块，以使第一电源模块130能够得到有效的管理和控制。当然，在其他实施方式中，第一极高频通信芯片150可以连接于第一副板143。Referring to FIG. 3 , thesub-machine 100 includes a firstmain board 141 and a first sub-board 143 arranged at intervals, and the area of the firstmain board 141 is larger than that of thefirst sub-board 143 . Thesub-machine 100 includes acamera module 145 , thecamera module 145 is connected to thefirst sub-board 143 , and the first extremely highfrequency communication chip 150 is connected to the firstmain board 141 . Thefirst power module 130 is located between the firstmain board 141 and thefirst sub-board 143 and can supply power to the firstmain board 141 and thefirst sub-board 143 . Specifically, thefirst power module 130 may be connected to the firstmain board 141 or the first sub-board 143 through a flexible circuit board, and supply power to the firstmain board 141 or thefirst sub-board 143 . Of course, one of the firstmain board 141 or the first sub-board 143 can be provided with a power management module. Thefirst power module 130 is electrically connected to the power management module through a flexible circuit board. The firstmain board 141 and thefirst sub-board 143 The other is electrically connected to the power management module through the flexible circuit board, so that thefirst power module 130 can be effectively managed and controlled. Of course, in other embodiments, the first extremely highfrequency communication chip 150 may be connected to thefirst sub-board 143 .

在一实施例中，子机100包括指纹识别组件147，显示屏110覆盖指纹识别组件147。第一主板141开设有通孔148，指纹识别组件147容置于通孔148并与第一主板141连接，第一电源模块130能够为指纹识别组件147供电。指纹识别组件147可用于检测用户的指纹信息并验证用户的身份。由于显示屏110覆盖指纹识别组件147，显示屏110所在一侧具有较高的外观整体性。由于指纹识别组件147容置于第一主板141的通孔148内，因此无需将指纹识别组件147叠设于第一主板141，因此有利于子机100的厚度的减薄，以利于子机100的轻薄化设计。In one embodiment, thehandset 100 includes afingerprint identification component 147 , and thedisplay screen 110 covers thefingerprint identification component 147 . Thefirst motherboard 141 defines a throughhole 148 , and thefingerprint identification component 147 is accommodated in the throughhole 148 and connected to thefirst motherboard 141 . Thefirst power module 130 can supply power to thefingerprint identification component 147 . Thefingerprint recognition component 147 can be used to detect the user's fingerprint information and verify the user's identity. Since thedisplay screen 110 covers thefingerprint identification component 147, the side where thedisplay screen 110 is located has a high appearance integrity. Since thefingerprint identification component 147 is accommodated in the throughhole 148 of the firstmain board 141 , there is no need to stack thefingerprint identification component 147 on the firstmain board 141 , which is beneficial to reduce the thickness of thesub-machine 100 and facilitate the sub-machine 100 thin and light design.

进一步，参考图4，子机100可以包括中板180，中板180的材质可以为铝合金或者不锈钢等。显示屏110、第一主板141和第一副板143连接于中板180，中板180能够对显示屏110、第一主板141和第一副板143起到支撑作用，以利于显示屏110、第一主板141和第一副板143的安装与固定。进一步，中板180对应于指纹识别组件147的安装位置开设有贯穿孔181，指纹识别组件147穿设贯穿孔181，这种结构有利于子机100的厚度的减薄，以利于子机100的轻薄化设计。当然，中板180不是必须的。例如，子机100可以设置围设于显示屏110外周的边框，显示屏110、第一主板141和第一副板143连接于边框，这种结构同样能够实现显示屏110、第一主板141和第一副板143的可靠定位，且这种结构有利于子机100的轻薄化设计。Further, referring to FIG. 4 , thesub-machine 100 may include amiddle plate 180 , and the material of themiddle plate 180 may be aluminum alloy or stainless steel. Thedisplay screen 110 , the firstmain board 141 and thefirst sub-board 143 are connected to themiddle board 180 , and themiddle board 180 can support thedisplay screen 110 , the firstmain board 141 and the first sub-board 143 so as to facilitate thedisplay screen 110 , the firstmain board 141 and thefirst sub-board 143 . Installation and fixing of the firstmain board 141 and thefirst sub-board 143 . Further, themiddle plate 180 is provided with a throughhole 181 corresponding to the installation position of thefingerprint identification component 147 , and thefingerprint identification component 147 is penetrated with the throughhole 181 . Thin and light design. Of course, themiddle plate 180 is not necessary. For example, thesub-machine 100 may be provided with a frame surrounding the outer periphery of thedisplay screen 110, and thedisplay screen 110, the firstmain board 141 and thefirst sub-board 143 are connected to the frame. This structure can also realize thedisplay screen 110, the firstmain board 141 and the Reliable positioning of thefirst sub-board 143 , and this structure is beneficial to the lightweight and thin design of thesub-machine 100 .

参考图5，主机200包括间隔设置的第二主板231和第二副板233，第二主板231的面积大于第二副板233，第二电源模块220位于第二主板231和第二副板233之间且能够为第二主板231和第二副板233供电，第二极高频通信芯片240连接于第二副板233。具体地，第二电源模块220可以通过柔性线路板连接于第二主板231或者第二副板233，并为第二主板231或者第二副板233供电。当然，第二主板231或者第二副板233中的一个可以设置电源管理模块，第二电源模块220通过柔性线路板与电源管理模块电性连接，第二主板231和第二副板233中的另一个再通过柔性线路板电性连接至电源管理模块，以使第二电源模块220能够得到有效的管理和控制。当然，在其他实施方式中，第二极高频通信芯片240可以连接于第二主板231。Referring to FIG. 5 , thehost 200 includes a secondmain board 231 and a second sub-board 233 arranged at intervals, the area of the secondmain board 231 is larger than that of thesecond sub-board 233 , and thesecond power module 220 is located on the secondmain board 231 and thesecond sub-board 233 The secondmain board 231 and the second sub-board 233 can be powered therebetween, and the second extremely highfrequency communication chip 240 is connected to thesecond sub-board 233 . Specifically, thesecond power module 220 may be connected to the secondmain board 231 or the second sub-board 233 through a flexible circuit board, and supply power to the secondmain board 231 or thesecond sub-board 233 . Of course, one of the secondmain board 231 or the second sub-board 233 can be provided with a power management module. Thesecond power module 220 is electrically connected to the power management module through a flexible circuit board. The secondmain board 231 and thesecond sub-board 233 The other is electrically connected to the power management module through the flexible circuit board, so that thesecond power module 220 can be effectively managed and controlled. Of course, in other embodiments, the second extremely highfrequency communication chip 240 may be connected to the secondmain board 231 .

进一步，参考图3和图4，子机100包括连接于第一主板141的子机触点149，同时参考图5和图6，主机200包括连接于第二副板233的主机触点235，在子机100安装于主机200时，子机触点149能够与主机触点235接触导通，以使主机200能够为子机100充电。具体地，在一实施例中，子机触点149、主机触点235分别包括多个用于导电的金属触点，在子机100安装于主机200时，子机触点149和主机触点235能够一一对应接触连接，第一电源模块130能够与子机触点149导通，第二电源模块220能够与主机触点235导通，以使主机200能够为子机100充电。由于主机200可以设置大容量的电池，上述结构有利于主机200为子机100充电，提升了子机100充电的便利性，进而有利于子机100保留充足的电量，以方便用户的使用。当然，由于主机200可以通过主机触点235和子机触点149为子机100充电，子机100的第一电源模块130的电池容量可以适当减小，以利于第一电源模块130的轻薄化，进而利于子机100的轻薄化设计。Further, referring to FIGS. 3 and 4 , thesub-machine 100 includes asub-machine contact 149 connected to the firstmain board 141 , while referring to FIGS. 5 and 6 , themain machine 200 includes a main-machine contact 235 connected to thesecond sub-board 233 , When thehandset 100 is installed on thehost 200 , thecontacts 149 of the handset can be in contact with thecontacts 235 of the host, so that thehost 200 can charge thehandset 100 . Specifically, in an embodiment, thesub-machine contact 149 and themain machine contact 235 respectively include a plurality of metal contacts for conducting electricity. When the sub-machine 100 is installed on themain machine 200, thesub-machine contact 149 and themain machine contact 235 can be connected in one-to-one correspondence, thefirst power module 130 can be connected to theslave contacts 149 , and thesecond power module 220 can be connected to thehost contacts 235 , so that thehost 200 can charge theslave 100 . Since thehost 200 can be provided with a large-capacity battery, the above structure facilitates thehost 200 to charge thehandset 100 , improves the convenience of charging thehandset 100 , and helps thehandset 100 retain sufficient power for convenient use by users. Of course, since thehost 200 can charge theslave 100 through thehost contacts 235 and theslave contacts 149, the battery capacity of thefirst power module 130 of theslave 100 can be appropriately reduced to facilitate the thinning of thefirst power module 130. This further facilitates the lightweight and thin design of thesub-machine 100 .

参考图8至图14，以下对主机200与子机100之间的通信方式，及主机200与外部设备的通信方式予以说明。8 to 14 , the communication method between thehost computer 200 and theslave computer 100 and the communication method between thehost computer 200 and the external device will be described below.

参考图8和图9，在一实施例中，主机200包括无线调制解调模块、主机主控制器、主机无线收发模块。子机100包括子机键盘、子机主控制器和子机无线收发模块。在移动终端10的第一种工作状态下，子机键盘输出的控制命令，在子机主控制器控制下，经子机无线收发模块调制后，发给主机无线收发模块，在主机主控制器控制下，经无线调制解调模块调制后，发送到空中。来自空中的控制信号，经无线调制解调模块解调后，经过主机主控制器，由主机无线收发模块调制后发给子机100，子机无线收发模块接收后，在子机主控制器的控制下，由显示屏110显示。可以理解的是，子机键盘可以为触摸键盘，也可以通过具有触屏操作功能的显示屏110实现。Referring to FIG. 8 and FIG. 9 , in one embodiment, thehost 200 includes a wireless modem module, a host host controller, and a host wireless transceiver module. Thehandset 100 includes a handset keyboard, a handset main controller and a handset wireless transceiver module. In the first working state of themobile terminal 10, the control command output by the keyboard of the sub-machine, under the control of the main controller of the sub-machine, is modulated by the wireless transceiver module of the sub-machine, and then sent to the wireless transceiver module of the host computer. Under the control, after being modulated by the wireless modulation and demodulation module, it is sent to the air. The control signal from the air, after being demodulated by the wireless modulation and demodulation module, passes through the main controller of the host, and is modulated by the wireless transceiver module of the host and then sent to theslave 100. Under the control, displayed by thedisplay screen 110 . It can be understood that, the keyboard of the sub-machine may be a touch keyboard, and may also be implemented by adisplay screen 110 having a touch screen operation function.

参考图10和图11，在一实施例中，主机200包括无线调制解调模块、主机主控制器、主机无线收发模块，子机100包括子机主控制器、子机麦克、子机受话器、子机音频编码器、子机音频解码器、能够与主机无线收发模块通信的子机无线收发模块。在第二种工作状态下，来自子机麦克的音频信号，经子机音频编码器编码后传输到子机主控制器中，经子机主控制器控制下，被子机无线收发模块发送出去，由主机无线收发模块接收后，在主机主控制器的控制下，传送到无线调制解调模块，经无线调制解调模块调制后发送到空中。来自空中的信号，经无线调制解调模块解调后传送到主机主控制器中，在主机主控制器的控制下，传送到主机无线收发模块中，经主机无线收发模块调制后，发送到子机100，子机无线收发模块解调出的音频信号，在子机主控制器控制下，经子机音频解码器解码后，由子机受话器输出。可以理解的是，子机音频编码器可以是单独的硬件单元，也可以集成在子机麦克中，也可以集成在子机主控制器中，就其功能而言可以是兼具有音频解码功能的音频编解码器；子机音频解码器可以是单独的硬件单元，也可以集成在子机受话器中，也可以集成在子机主控制器中，就其功能而言可以是兼具有音频编码功能的音频编解码器。10 and 11 , in one embodiment, thehost 200 includes a wireless modem module, a host main controller, and a host wireless transceiver module, and thesub 100 includes a sub main controller, a sub microphone, a sub receiver, A sub-machine audio encoder, a sub-machine audio decoder, and a sub-machine wireless transceiver module capable of communicating with the host machine wireless transceiver module. In the second working state, the audio signal from the sub-machine microphone is encoded by the sub-machine audio encoder and transmitted to the sub-machine main controller, and is sent out by the sub-machine wireless transceiver module under the control of the sub-machine main controller. After being received by the host wireless transceiver module, under the control of the host main controller, it is transmitted to the wireless modulation and demodulation module, and then sent to the air after being modulated by the wireless modulation and demodulation module. The signal from the air is demodulated by the wireless modulation and demodulation module and transmitted to the host main controller, under the control of the host main controller, transmitted to the host wireless transceiver module, modulated by the host wireless transceiver module, and sent to the subordinate In thehandset 100, the audio signal demodulated by the wireless transceiver module of the handset is output by the handset receiver after being decoded by the handset audio decoder under the control of the handset main controller. It can be understood that the sub-machine audio encoder can be a separate hardware unit, can also be integrated in the sub-machine microphone, or can be integrated in the sub-machine main controller. In terms of its function, it can also have an audio decoding function. The audio codec of the sub-machine; the sub-machine audio decoder can be a separate hardware unit, can also be integrated in the sub-machine receiver, or can be integrated in the sub-machine main controller, in terms of its function, it can have both audio coding functional audio codec.

参考图12和图13，在一实施例中，主机200包括无线调制解调模块、主机主控制器、主机无线收发模块，主机主控制器能够与无线调制解调模块和主机无线收发模块通信。子机100包括子机主控制器、与主机无线收发模块能够通信的子机无线收发模块，子机主控制器能够与子机无线收发模块通信。子机100能够通过主机200接入通信网络。12 and 13, in one embodiment, thehost 200 includes a wireless modem module, a host host controller, and a host wireless transceiver module, and the host host controller can communicate with the wireless modem module and the host wireless transceiver module. Thesub-machine 100 includes a sub-machine main controller, a sub-machine wireless transceiver module capable of communicating with the host-machine wireless transceiver module, and the sub-machine main controller can communicate with the sub-machine wireless transceiver module. Theslave 100 can access the communication network through thehost 200 .

进一步，参考图14，主机200包括主机第一无线通信模块、主机主控制器、主机第二无线通信模块，主机主控制器能够与主机第一无线通信模块、主机第二无线通信模块通信。子机100包括子机主控制器、子机无线通信模块，子机主控制器能够与子机无线通信模块通信，子机无线通信模块能够与主机第一无线通信模块进行通信，主机第二无线通信模块能够与基站(Base Station)通信。在一实施例中，主机第一无线通信模块和子机无线通信模块均为低功率蓝牙(Bluetooth)通信模块。在其他实施方式中，主机第一无线通信模块和子机无线通信模块可以均为无线局域网(WiFi，Wireless Fidelity)通信模块。Further, referring to FIG. 14 , thehost 200 includes a host first wireless communication module, a host main controller, and a host second wireless communication module, and the host main controller can communicate with the host first wireless communication module and the host second wireless communication module. Thesub-machine 100 includes a sub-machine main controller and a sub-machine wireless communication module, the sub-machine main controller can communicate with the sub-machine wireless communication module, the sub-machine wireless communication module can communicate with the main machine first wireless communication module, and the main machine second wireless communication module. The communication module can communicate with a base station. In an embodiment, the first wireless communication module of the host and the wireless communication module of the slave are both low-power Bluetooth (Bluetooth) communication modules. In other embodiments, the first wireless communication module of the host and the wireless communication module of the slave may both be wireless local area network (WiFi, Wireless Fidelity) communication modules.

以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity, all possible combinations of the technical features in the above-described embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be regarded as the scope described in this specification.

以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对申请专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。The above-mentioned embodiments only represent several embodiments of the present application, and the descriptions thereof are relatively specific and detailed, but should not be construed as a limitation on the scope of the patent application. It should be pointed out that for those skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the scope of protection of the patent of the present application shall be subject to the appended claims.

Claims (13)

1. A mobile terminal, comprising:

the submachine comprises a display screen, a first power supply module and a first extremely high frequency communication chip, wherein the first power supply module can supply power to the display screen and the first extremely high frequency communication chip; and

the host comprises a second power supply module and a second high-frequency communication chip, wherein the second power supply module can supply power to the second high-frequency communication chip; the sub machine can be arranged on the main machine so that the first extremely-high frequency communication chip is paired with the second extremely-high frequency communication chip to realize the communication connection between the sub machine and the main machine; the sub-unit is detachable from the main unit, and after the sub-unit is detached from the main unit, the sub-unit can be in communication connection with the main unit.

2. The mobile terminal of claim 1, wherein the host comprises a front surface and a back surface that are opposite to each other, and a lateral surface connected between the front surface and the back surface, the lateral surface comprising a top side and a bottom side that are opposite to each other, and a left side and a right side that are opposite to each other; the left side surface and the right side surface are respectively positioned between the top side surface and the bottom side surface; one side of the sub-machine, which is back to the displayable area of the display screen, can be overlapped on the front surface, so that the first extremely-high frequency communication chip is paired with the second extremely-high frequency communication chip.

3. The mobile terminal according to claim 1, wherein the sub-machine comprises a first main board and a first sub-board which are arranged at intervals, and the first power supply module is located between the first main board and the first sub-board and can supply power to the first main board and the first sub-board; the submachine comprises a camera module, and the camera module is connected with the first subplate; the first extremely high frequency communication chip is connected to the first main board or the first sub-board.

4. The mobile terminal according to claim 3, wherein the sub-machine comprises a fingerprint identification component, and the display screen covers the fingerprint identification component; the first main board is provided with a through hole, and the fingerprint identification assembly is accommodated in the through hole and connected with the first main board.

5. The mobile terminal according to claim 4, wherein the sub-machine comprises a middle plate, the display screen, the first main board and the first sub-board are respectively connected to the middle plate, the middle plate is provided with a through hole, and the fingerprint identification component is inserted through the through hole.

6. The mobile terminal of claim 3, wherein the host comprises a second main board and a second auxiliary board which are arranged at intervals, and the second power module is located between the second main board and the second auxiliary board and can supply power to the second main board and the second auxiliary board; the second pole high frequency communication chip is connected to the second sub-board or the second main board.

7. The mobile terminal of claim 6, wherein the handset comprises a handset contact connected to the first main board, wherein the main board comprises a main board contact connected to the second sub board, and wherein the handset contact is capable of contacting the main board contact when the handset is mounted to the main board, so that the main board can charge the handset.

8. The mobile terminal according to any one of claims 1 to 7, wherein the sub-unit comprises a magnetic component, the main unit comprises an adsorbing member, and the magnetic component can be adsorbed to the adsorbing member when the sub-unit is mounted on the main unit.

9. The mobile terminal according to any one of claims 1 to 7, wherein the sub-machine comprises a front end face and a rear end face which are arranged oppositely, and a side end face connected between the front end face and the rear end face, and the displayable area of the display screen faces the front end face; the host comprises a shell and a bracket connected with the shell, wherein the shell is provided with a containing groove, and the bracket can be turned to a buckling state and an unfolding state relative to the shell; the support is contained in the containing groove in the buckling state, the sub machine can be vertically or obliquely placed on the shell in the unfolding state, the support can be in contact with the rear end face, and the shell can be in contact with the side end face.

10. The mobile terminal of claim 1, wherein the host comprises a wireless modem module, a host main controller and a host wireless transceiver module; the submachine comprises a submachine keyboard, a submachine main controller and a submachine wireless transceiving module; in a first working state of the mobile phone, a control command output by the keyboard of the submachine is modulated by the wireless submachine transceiving module under the control of the submachine main controller and then sent to the wireless host transceiving module, and is modulated by the wireless modem module under the control of the host main controller and then sent to the air; the control signal coming from the air is demodulated by the wireless modulation and demodulation module, then is sent to the submachine after being modulated by the host machine wireless transceiver module through the host machine main controller, and is displayed by the display screen under the control of the submachine main controller after being received by the submachine wireless transceiver module.

11. The mobile terminal of claim 1, wherein the host comprises a wireless modem module, a host main controller, and a host wireless transceiver module; the sub-machine comprises a sub-machine main controller, a sub-machine microphone, a sub-machine receiver, a sub-machine audio encoder, a sub-machine audio decoder and a sub-machine wireless transceiving module which can be communicated with the main machine wireless transceiving module; in a second working state, an audio signal from the submachine microphone is coded by the submachine audio coder and then transmitted to the submachine main controller, is sent out by the submachine wireless transceiver module under the control of the submachine main controller, is received by the host computer wireless transceiver module, is transmitted to the wireless modem module under the control of the host computer main controller, and is sent to the air after being modulated by the wireless modem module; the signal from the air is transmitted to the main machine main controller after being demodulated by the wireless modulation and demodulation module, is transmitted to the main machine wireless receiving and transmitting module under the control of the main machine main controller, is transmitted to the submachine after being modulated by the main machine wireless receiving and transmitting module, and the audio signal demodulated by the submachine wireless receiving and transmitting module is output by the submachine telephone receiver after being decoded by the submachine audio decoder under the control of the submachine main controller.

12. The mobile terminal of claim 1, wherein the host comprises a wireless modem module, a host controller, and a host wireless transceiver module, wherein the host controller is capable of communicating with the wireless modem module and the host wireless transceiver module; the submachine comprises a submachine main controller and a submachine wireless transceiving module which can communicate with the host machine wireless transceiving module, and the submachine main controller can communicate with the submachine wireless transceiving module; the sub-machine can access a communication network through the main machine.

13. The mobile terminal of claim 1, wherein the host comprises a host first wireless communication module, a host main controller, and a host second wireless communication module, the host main controller being capable of communicating with the host first wireless communication module and the host second wireless communication module; the submachine comprises a submachine main controller and a submachine wireless communication module, the submachine main controller can communicate with the submachine wireless communication module, and the submachine wireless communication module can communicate with the host computer first wireless communication module; the host second wireless communication module is capable of communicating with a base station.

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