技术领域technical field
本实用新型涉及电路板的散热配置，特别是关于一种电路板散热总成。The utility model relates to a heat dissipation configuration of a circuit board, in particular to a heat dissipation assembly of a circuit board.
背景技术Background technique
电路板，特别是计算机主机板，设置有高功率运行的电子芯片。该些电子芯片需要以散热器加以散热，以避免该电子芯片无法运作，且产生的高热也会进一步影响其它电子元件。Circuit boards, especially computer motherboards, are provided with electronic chips that operate at high power. These electronic chips need to be dissipated by a heat sink to prevent the electronic chips from being inoperable, and the high heat generated will further affect other electronic components.
现有的计算机主机板背后会加装金属件，增加主机板的机械强度，以利散热器的安装。此金属件可以提供额外的气冷散热表面，但是，金属件跟需要散热的电子芯片之间并没有直接接触，只能利用螺栓、铜柱导热至散热器进行散热，对散热的加强效果并不明显。Metal parts are added to the back of the existing computer motherboard to increase the mechanical strength of the motherboard and facilitate the installation of the radiator. This metal part can provide an additional air-cooled heat dissipation surface. However, there is no direct contact between the metal part and the electronic chip that needs to be dissipated. Only bolts and copper pillars can be used to conduct heat to the radiator for heat dissipation, which does not enhance the heat dissipation effect. obvious.
亦有利用热管连接散热器与金属件的设计。但是，热管往往需要分拆为多段再以其它金属块连接，才能连接位于不同面的散热器以及金属件。或是，主机板必须具备开孔以供弯曲热管穿过。热管穿过开孔的设置，会限制热管的形态，否则热管会无法穿过开孔连接散热器与金属件。同时，热管与金属件的连接，往往也容易出现接触热阻过高，而影响热传导的问题。There are also designs that utilize heat pipes to connect radiators and metal parts. However, the heat pipe often needs to be split into multiple sections and then connected with other metal blocks in order to connect radiators and metal parts on different sides. Alternatively, the motherboard must have openings for the curved heat pipes to pass through. The setting of the heat pipe passing through the opening will limit the shape of the heat pipe, otherwise the heat pipe will not be able to pass through the opening to connect the heat sink and the metal parts. At the same time, the connection between the heat pipe and the metal parts is often prone to the problem of high contact thermal resistance, which affects heat conduction.
实用新型内容Utility model content
鉴于上述问题，本实用新型提出一种电路板散热总成，包含一电路板、一散热器、一金属背板、一热管以及一压块。In view of the above problems, the utility model proposes a circuit board cooling assembly, which includes a circuit board, a heat sink, a metal back plate, a heat pipe and a pressure block.
电路板具有一正面以及一背面，且正面上有至少一发热区。散热器设置于发热区。金属背板与电路板的背面保持一间隔距离设置。热管具有一第一端、一弯折段以及一第二端，第一端连接散热器，第二端接触金属背板，且弯折段于电路板的一侧边缘连接第一端与第二端。压块固定于金属背板并压制第二端于金属背板。The circuit board has a front and a back, and there is at least one heating area on the front. The radiator is arranged in the heating area. The metal backplane is set at a distance from the backside of the circuit board. The heat pipe has a first end, a bent section and a second end, the first end is connected to the radiator, the second end is in contact with the metal backboard, and the bent section is connected to the first end and the second end at one edge of the circuit board. end. The pressing block is fixed on the metal backboard and presses the second end on the metal backboard.
于至少一实施例中，电路板散热总成更包含多个连接柱，电路板与金属背板之间以多个连接柱进行连接。In at least one embodiment, the heat dissipation assembly of the circuit board further includes a plurality of connection columns, and the circuit board and the metal backplane are connected by the plurality of connection columns.
于至少一实施例中，金属背板遮盖电路板的背面的全部。In at least one embodiment, the metal backplate covers the entirety of the backside of the circuit board.
于至少一实施例中，金属背板遮盖电路板的背面的局部。In at least one embodiment, the metal backplane covers a portion of the backside of the circuit board.
于至少一实施例中，金属背板于电路板的投影，重叠于散热器于电路板的投影。In at least one embodiment, the projection of the metal backplane on the circuit board overlaps the projection of the heat sink on the circuit board.
于至少一实施例中，第二端为扁平状，且具有一第一接触面以及一第二接触面，分别接触压块与金属背板。In at least one embodiment, the second end is flat and has a first contact surface and a second contact surface, respectively contacting the pressing block and the metal back plate.
于至少一实施例中，第一接触面与压块之间设置导热介质，及/或第二接触面与金属背板之间设置导热介质。In at least one embodiment, a heat conduction medium is disposed between the first contact surface and the pressing block, and/or a heat conduction medium is disposed between the second contact surface and the metal back plate.
于至少一实施例中，压块与第二端位于金属背板与电路板之间。In at least one embodiment, the pressure block and the second end are located between the metal backplane and the circuit board.
于至少一实施例中，压块具有一固定部以及延伸于固定部的一压制部，固定部固定于金属背板，且压制部压制第二端。In at least one embodiment, the pressing block has a fixing portion and a pressing portion extending from the fixing portion, the fixing portion is fixed to the metal back plate, and the pressing portion presses the second end.
于至少一实施例中，固定部的厚度大于压制部的厚度，且压制部与金属背板之间具有一压制空间，第二端位于压制空间。In at least one embodiment, the fixing portion is thicker than the pressing portion, and there is a pressing space between the pressing portion and the metal back plate, and the second end is located in the pressing space.
于至少一实施例中，电路板具有一缺口槽，位于电路板的侧边缘，且缺口槽于侧边缘为开放，弯折段穿过缺口槽。In at least one embodiment, the circuit board has a notch located at the side edge of the circuit board, and the notch is open at the side edge, and the bent section passes through the notch.
当散热器于发热区吸热之后，除了利用散热效能进行散热之外，也可以通过热管传递热能至金属背板，以让金属背板利用大表面积进行气冷散热，而加强散热效果。此外，利用压块结合金属背板以及热管，也可以让安装过程简化，并且压块结合于金属背板的可靠性。After the heat sink absorbs heat in the heat-generating area, in addition to using the heat dissipation performance to dissipate heat, it can also transfer heat energy to the metal backplane through the heat pipe, so that the metal backplane can use a large surface area for air cooling and heat dissipation, thereby enhancing the heat dissipation effect. In addition, the combination of the pressing block with the metal backplane and the heat pipe can also simplify the installation process and increase the reliability of the combination of the pressing block and the metal backplane.
以下结合附图和具体实施例对本实用新型进行详细描述，但不作为对本实用新型的限定。The utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the utility model.
附图说明Description of drawings
图1为本实用新型实施例的立体分解图。Fig. 1 is a three-dimensional exploded view of an embodiment of the utility model.
图2为本实用新型实施例的立体图。Fig. 2 is a perspective view of an embodiment of the utility model.
图3为本实用新型实施例的剖面图。Fig. 3 is a cross-sectional view of an embodiment of the present invention.
图4为本实用新型实施例的剖面分解图。Fig. 4 is a cross-sectional exploded view of the embodiment of the utility model.
图5为本实用新型另一实施例的立体分解图。Fig. 5 is a three-dimensional exploded view of another embodiment of the present invention.
图6为本实用新型又一实施例的立体分解图。Fig. 6 is a three-dimensional exploded view of another embodiment of the present invention.
其中，附图标记：Among them, reference signs:
100 电路板散热总成 110 电路板100 Circuit board cooling assembly 110 Circuit board
110a 正面 110b 背面110a Front 110b Back
112 发热区 114 缺口槽112 Heater zone 114 Notched groove
116 连接柱 120 散热器116 Connection post 120 Radiator
130 金属背板 140 热管130 Metal Backplate 140 Heatpipe
141 第一端 142 第二端141 First end 142 Second end
1421 第一接触面 1422 第二接触面1421 First contact surface 1422 Second contact surface
143 弯折段 144 导热介质143 Bending section 144 Heat transfer medium
150 压块 152 固定部150 Press block 152 Fixed part
154 压制部 156 螺栓154 Compression part 156 Bolt
具体实施方式Detailed ways
请参阅图1、图2与图3所示，为本实用新型实施例所提出的一种电路板散热总成100，包含一电路板110、一散热器120、一金属背板130、一热管140以及一压块150。Please refer to Fig. 1, Fig. 2 and Fig. 3, which is a circuit board cooling assembly 100 proposed by the embodiment of the utility model, including a circuit board 110, a radiator 120, a metal back plate 130, and a heat pipe 140 and a pressing block 150 .
如图1以及图3所示，电路板110具有一正面110a以及一背面110b。正面110a上具有至少一发热区112。所述发热区112用于设置发热元件，例如以高电功率运行的电子芯片。所述电子芯片包含但不限于中央处理器、绘图处理器、系统逻辑芯片或内建式(On-board)内存模块。所述电路板110可为一主机板，但不排除为具有其它用途的电路。As shown in FIG. 1 and FIG. 3 , the circuit board 110 has a front surface 110 a and a back surface 110 b. There is at least one heating area 112 on the front side 110a. The heat generating area 112 is used for arranging heat generating elements, such as electronic chips operating with high electric power. The electronic chip includes but is not limited to a central processing unit, a graphics processing unit, a system logic chip or an on-board memory module. The circuit board 110 can be a motherboard, but it is not excluded to be a circuit with other purposes.
如图1、图2与图3所示，散热器120设置于正面110a的发热区112，用以接触发热元件，以吸收发热元件发出的热量，而对发热元件进行散热冷却。散热器120形式不拘，可为具有多个散热鳍片的鳍片散热器，也可以是水冷系统的水冷头。金属背板130对应于电路板110的背面110b设置，并且与电路板110的背面110b保持一间隔距离设置。金属背板130通常会与电路板110保持平行。于本实用新型实施例中，电路板散热总成100更包含多个连接柱116，例如铜柱，电路板110与金属背板130之间以多个连接柱116进行连接，使得金属背板130与背面110b保持一间隔距离设置。As shown in FIG. 1 , FIG. 2 and FIG. 3 , the heat sink 120 is disposed on the heating area 112 of the front surface 110 a for contacting the heating element to absorb the heat emitted by the heating element to dissipate heat and cool the heating element. The form of the radiator 120 is not limited, and it can be a finned radiator with multiple cooling fins, or a water cooling head of a water cooling system. The metal back plate 130 is disposed corresponding to the back side 110 b of the circuit board 110 and is set at a distance from the back side 110 b of the circuit board 110 . The metal backplane 130 is usually kept parallel to the circuit board 110 . In the embodiment of the present utility model, the circuit board heat dissipation assembly 100 further includes a plurality of connecting columns 116, such as copper columns, and the circuit board 110 and the metal backplane 130 are connected by a plurality of connecting columns 116, so that the metal backplane 130 Keep a distance from the back surface 110b.
如图1、图2与图3所示，热管140具有一第一端141、一弯折段143以及一第二端142。第一端141连接散热器120，第二端142接触金属背板130，且弯折段143于电路板110的一侧边缘连接第一端141与第二端142。As shown in FIG. 1 , FIG. 2 and FIG. 3 , the heat pipe 140 has a first end 141 , a bent section 143 and a second end 142 . The first end 141 is connected to the heat sink 120 , the second end 142 is in contact with the metal back plate 130 , and the bent section 143 is connected to the first end 141 and the second end 142 at one edge of the circuit board 110 .
如图1所示，第一端141、弯折段143以及第二端142结合而成的热管140呈现U型，弯折段143是绕过电路板110的侧边缘，使得第一端141以及第二端142分别位于电路板110的正面110a以及背面110b。散热器120上会设有穿孔，且穿孔的孔径略小于第一端141的外径，使得第一端141可以于插入穿孔后，以紧配合方式结合于散热器120。散热器120上也可以设置夹持机构，以夹持方式夹持第一端141。As shown in FIG. 1 , the heat pipe 140 formed by combining the first end 141, the bent section 143 and the second end 142 presents a U shape, and the bent section 143 goes around the side edge of the circuit board 110, so that the first end 141 and the second end 142 are U-shaped. The second ends 142 are respectively located on the front side 110 a and the back side 110 b of the circuit board 110 . The heat sink 120 is provided with a through hole, and the diameter of the hole is slightly smaller than the outer diameter of the first end 141 , so that the first end 141 can be combined with the heat sink 120 in a tightly fitting manner after being inserted into the through hole. A clamping mechanism may also be provided on the radiator 120 to clamp the first end 141 in a clamping manner.
如图4所示，热管140可先结合于散热器120，让U型的开口朝向电路板110的侧边缘，将散热器120放置到发热区112，同时第二端142朝向金属背板130移动，第二端142即可位于金属背板130与电路板110之间。As shown in FIG. 4 , the heat pipe 140 can be combined with the heat sink 120 first, so that the U-shaped opening faces the side edge of the circuit board 110 , and the heat sink 120 is placed in the heating area 112 , while the second end 142 moves toward the metal back plate 130 , the second end 142 can be located between the metal backplane 130 and the circuit board 110 .
如图1、图3与图4所示，压块150位于金属背板130与电路板110之间。热管140的第二端142为扁平状，且具有一第一接触面1421以及一第二接触面1422，分别接触压块150与金属背板130。同时，第一接触面1421与压块150之间设置导热介质144，及/或第二接触面1422与金属背板130之间设置导热介质144。前述的导热介质144包含但不限于导热胶带或导热膏。As shown in FIG. 1 , FIG. 3 and FIG. 4 , the pressing block 150 is located between the metal backplane 130 and the circuit board 110 . The second end 142 of the heat pipe 140 is flat and has a first contact surface 1421 and a second contact surface 1422 respectively contacting the pressing block 150 and the metal back plate 130 . Meanwhile, a heat conduction medium 144 is disposed between the first contact surface 1421 and the pressing block 150 , and/or a heat conduction medium 144 is disposed between the second contact surface 1422 and the metal back plate 130 . The aforementioned heat conduction medium 144 includes but not limited to heat conduction tape or heat conduction paste.
如图1、图3与图4所示，压块150具有一固定部152以及一延伸于固定部152的压制部154，固定部152用于固定于金属背板130，且压制部154用于压制第二端142。固定部152的厚度大于压制部154的厚度，且压制部154与金属背板130之间具有一压制空间，第二端142位于压制空间。As shown in FIGS. 1 , 3 and 4 , the pressing block 150 has a fixing portion 152 and a pressing portion 154 extending from the fixing portion 152 , the fixing portion 152 is used for fixing to the metal back plate 130 , and the pressing portion 154 is used for The second end 142 is pressed. The fixing portion 152 is thicker than the pressing portion 154 , and there is a pressing space between the pressing portion 154 and the metal back plate 130 , and the second end 142 is located in the pressing space.
在如图4所示，于安装时，可预先用螺栓156穿过压块150的固定部152，将压块150结合于金属背板130，但暂时不锁紧螺栓156，以让压制部154与金属背板130之间的压制空间加大。接着将第二端142插入压制部154与金属背板130之间，锁紧螺栓156后就可以固定压块150的固定部152于金属背板130，并以压制部154压制第二端142于金属背板130，使得热管140与金属背板130之间形成热传导路径。压块150与第二端142的位置较佳地为位于金属背板130与电路板110之间，以使金属背板130的外侧面维持不突出的状态；但亦不排除压块150与第二端142位于金属背板130的外侧面。As shown in Figure 4, during installation, the bolt 156 can be used to pass through the fixed part 152 of the pressing block 150 in advance, and the pressing block 150 is combined with the metal back plate 130, but the bolt 156 is temporarily not locked, so that the pressing part 154 The pressing space between the metal back plate 130 is enlarged. Next, the second end 142 is inserted between the pressing part 154 and the metal back plate 130, and the fixing part 152 of the pressing block 150 can be fixed on the metal back plate 130 after locking the bolt 156, and the second end 142 is pressed by the pressing part 154 on the metal back plate 130. The metal back plate 130 forms a heat conduction path between the heat pipe 140 and the metal back plate 130 . The positions of the pressing block 150 and the second end 142 are preferably located between the metal back plate 130 and the circuit board 110, so that the outer surface of the metal back plate 130 remains in a non-protruding state; The two ends 142 are located on the outer surface of the metal backplane 130 .
此外，如如图1、图2、图3与图4所示，电路板110具有一缺口槽114，位于电路板110的侧边缘，且缺口槽114于侧边缘为开放式的。于安装时，弯折段143可以水平地移动进入缺口槽114，使得弯折段143穿过缺口槽114，并且不会让弯折段143突出于侧边缘之外。因此，弯折段143可以安排于电路板110的任一边缘，例如位于连接埠总成旁，而不会因为突出的结构导致弯折段143所在位置受到限制。同时，缺口槽114相较于单一孔洞，也较容易安装热管140，且不会限制热管140的第一端141以及第二端142的长度。若以单一孔洞让U型热管140穿过，第一端141以及第二端142的长度势必会受到限制，否则于装配时，势必无法让热管140穿过而形成第一端141以及第二端142分设于电路板110两侧面的配置。In addition, as shown in FIG. 1 , FIG. 2 , FIG. 3 and FIG. 4 , the circuit board 110 has a notch 114 located at the side edge of the circuit board 110 , and the notch 114 is open at the side edge. During installation, the bent section 143 can move horizontally into the notch slot 114 so that the bent section 143 passes through the notch slot 114 without protruding from the side edge. Therefore, the bent section 143 can be arranged on any edge of the circuit board 110 , for example, next to the connection port assembly, and the location of the bent section 143 will not be restricted due to the protruding structure. At the same time, compared with a single hole, the notch 114 is easier to install the heat pipe 140 and does not limit the lengths of the first end 141 and the second end 142 of the heat pipe 140 . If the U-shaped heat pipe 140 passes through a single hole, the lengths of the first end 141 and the second end 142 must be limited; otherwise, the heat pipe 140 cannot pass through to form the first end 141 and the second end during assembly. 142 are respectively disposed on two sides of the circuit board 110 .
于本实施例中，金属背板130的形状大致等同于电路板110的形状，也就是说金属背板130遮盖电路板110的背面110b的全部。此一大尺寸的金属背板130可以提供最大的气冷表面积。In this embodiment, the shape of the metal back plate 130 is substantially equal to the shape of the circuit board 110 , that is to say, the metal back plate 130 covers the entire back surface 110 b of the circuit board 110 . The large size metal back plate 130 can provide the largest surface area for air cooling.
如图5所示，于另一实施例中，金属背板130的面积小于电路板110的面积，使得金属背板130只遮盖电路板110之背面110b的局部。在这种情况下，散热器120与金属背板130可以是相对应的配置，使得金属背板130于电路板110的投影，重叠于散热器120于电路板110的投影。在这种情况下，可以简化热管140的设计，使得热管140的形态成为较常见的U型，且第一端141与第二端142等长。As shown in FIG. 5 , in another embodiment, the area of the metal back plate 130 is smaller than that of the circuit board 110 , so that the metal back plate 130 only covers part of the back side 110 b of the circuit board 110 . In this case, the heat sink 120 and the metal back plate 130 can be arranged correspondingly, so that the projection of the metal back plate 130 on the circuit board 110 overlaps the projection of the heat sink 120 on the circuit board 110 . In this case, the design of the heat pipe 140 can be simplified, so that the shape of the heat pipe 140 becomes a common U-shape, and the first end 141 and the second end 142 are equal in length.
如图6所示，于又一实施例中，金属背板130的面积小于电路板110的面积，但金属背板130于电路板110的投影，不必然完全重叠于散热器120于电路板110的投影。特别是金属背板130可以是不规则型态，具有凹缺口以及开孔。凹缺口以及开孔可以暴露电路板110的背面110b的局部，使得电路板110的背面110b上的发热点不会被金属背板130遮盖。此外，金属背板130或散热器120也不限于一个，电路板散热总成100可以配置多个金属背板130或多个散热器120，多个金属背板130之间或多个散热器120之间，可以用热管140互相连接，然后在多个金属背板130或多个散热器120分别择一以热管140连接即可。As shown in FIG. 6, in another embodiment, the area of the metal backplane 130 is smaller than the area of the circuit board 110, but the projection of the metal backplane 130 on the circuit board 110 does not necessarily completely overlap the radiator 120 on the circuit board 110. projection. In particular, the metal back plate 130 may be irregular, with notches and holes. The notch and the opening can expose a part of the back surface 110 b of the circuit board 110 , so that the heat spots on the back surface 110 b of the circuit board 110 will not be covered by the metal back plate 130 . In addition, the metal backplane 130 or the heat sink 120 is not limited to one, the circuit board heat dissipation assembly 100 can be equipped with multiple metal backplanes 130 or multiple heat sinks 120, between the multiple metal backplanes 130 or between the multiple heat sinks 120 Between them, heat pipes 140 can be used to connect each other, and then one of the plurality of metal backplanes 130 or the plurality of heat sinks 120 can be connected with the heat pipe 140 .
当散热器120于发热区112吸热之后，除了利用散热效能进行散热之外，也可以通过热管140传递热能至金属背板130，以让金属背板130利用大表面积进行气冷散热，而加强散热效果。此外，利用压块150结合金属背板130以及热管140，也可以让安装过程简化，并且压块150结合于金属背板130的可靠性。After the heat sink 120 absorbs heat in the heating area 112, in addition to using the heat dissipation performance to dissipate heat, it can also transfer heat energy to the metal backplane 130 through the heat pipe 140, so that the metal backplane 130 can use a large surface area for air cooling and heat dissipation, thereby strengthening heat radiation. In addition, the combination of the pressing block 150 with the metal backplane 130 and the heat pipe 140 can also simplify the installation process and increase the reliability of the combination of the pressing block 150 and the metal backplane 130 .
当然，本实用新型还可有其它多种实施例，在不背离本实用新型精神及其实质的情况下，熟悉本领域的技术人员可根据本实用新型作出各种相应的改变和变形，但这些相应的改变和变形都应属于本实用新型权利要求的保护范围。Certainly, the utility model also can have other various embodiments, under the situation of not departing from the spirit and essence of the utility model, those skilled in the art can make various corresponding changes and distortions according to the utility model, but these Corresponding changes and deformations should all belong to the protection scope of the claims of the present invention.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920309393.2UCN209882215U (en) | 2019-03-12 | 2019-03-12 | Circuit board heat dissipation assembly |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920309393.2UCN209882215U (en) | 2019-03-12 | 2019-03-12 | Circuit board heat dissipation assembly |
| Publication Number | Publication Date |
|---|---|
| CN209882215Utrue CN209882215U (en) | 2019-12-31 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920309393.2UActiveCN209882215U (en) | 2019-03-12 | 2019-03-12 | Circuit board heat dissipation assembly |
| Country | Link |
|---|---|
| CN (1) | CN209882215U (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119556779A (en)* | 2025-01-24 | 2025-03-04 | 深圳市极摩客科技有限公司 | Passive heat radiation structure of miniature host |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119556779A (en)* | 2025-01-24 | 2025-03-04 | 深圳市极摩客科技有限公司 | Passive heat radiation structure of miniature host |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |