技术领域technical field
本实用新型是有关于无线充电装置的散热结构,特别是一种无线充电装置的辐射散热结构。The utility model relates to a heat dissipation structure of a wireless charging device, in particular to a radiation heat dissipation structure of a wireless charging device.
背景技术Background technique
现代人的生活中充满了各种行动电子装置,为了减少线材的使用,无线化是必然的趋势。现有的行动电子装置几乎皆已配备无线传输数据的功能,而且数据的传输速度也日益增进。目前行动电子装置的无线充电技术当在普及中,以往的无线充电装置输出功率不高,但随着无线充电技术逐渐发展成熟,无线充电装置可输出的功率也日渐增加。以往的无线充电装置输出功率低,故充电中发热量不高,多数借由自然流散热即足够,但随着无线充电装置可输出的功率日渐增加,充电中发热量也增加,额外的散热手段也成为必要配备。但是,无线充电装置有携带的需求,故目前无线充电装置的大多体积不大。现有的强制对流散热构件体积多大于无线充电装置本身体积,因此并不适合作为无线充电装置的散热手段。再者,强制对流散热构件一般需要使用控制器搭配风扇或者泵及水冷头来实现,因此其成本也较高。Modern life is full of various mobile electronic devices. In order to reduce the use of wires, wireless is an inevitable trend. Almost all existing mobile electronic devices are equipped with the function of wirelessly transmitting data, and the data transmission speed is also increasing day by day. At present, the wireless charging technology of mobile electronic devices is popular, and the output power of the wireless charging device in the past is not high, but as the wireless charging technology gradually develops and matures, the output power of the wireless charging device is also increasing day by day. In the past, the output power of wireless charging devices was low, so the heat generated during charging was not high, and most of them were sufficient to dissipate heat by natural flow. However, as the output power of wireless charging devices increased, the heat generated during charging also increased. also become necessary equipment. However, the wireless charging device needs to be carried, so most of the current wireless charging devices are small in size. The volume of the existing forced convection heat dissipation member is mostly larger than the volume of the wireless charging device itself, so it is not suitable as a heat dissipation means for the wireless charging device. Furthermore, the forced convection heat dissipation component generally needs to be realized by using a controller, a fan or a pump and a water-cooling head, so the cost is also relatively high.
有鉴于此,本发明人遂针对上述现有技术,特潜心研究并配合学理的运用,尽力解决上述之问题点,即成为本发明人改良目标。In view of this, the inventor of the present invention has devoted himself to the research of the above-mentioned prior art and cooperated with the application of the theory, and tried his best to solve the above-mentioned problems, which is the goal of the present inventor's improvement.
发明内容SUMMARY OF THE INVENTION
本实用新型提供一种无线充电装置的辐射散热结构。The utility model provides a radiation heat dissipation structure of a wireless charging device.
本实用新型提供一种无线充电装置的辐射散热结构,其包含一外壳、一基板一感应线圈及一热辐射涂层。外壳具有一热辐射穿透区,且外壳形成热辐射穿透区的部分为非金属制。基板容置在外壳内,基板的其中一面形成一散热面,散热面朝向热辐射穿透区配置。感应线圈设置在基板的散热面。热辐射涂层覆盖基板的散热面且覆盖感应线圈。The utility model provides a radiation heat dissipation structure of a wireless charging device, which comprises a casing, a substrate, an induction coil and a heat radiation coating. The casing has a heat radiation penetration area, and the part of the casing forming the heat radiation penetration area is made of non-metal. The base plate is accommodated in the casing, and one side of the base plate forms a heat dissipation surface, and the heat dissipation surface is disposed toward the heat radiation penetration area. The induction coil is arranged on the heat dissipation surface of the substrate. The thermal radiation coating covers the heat dissipation surface of the substrate and covers the induction coil.
本实用新型的无线充电装置的辐射散热结构,其基板为铁氧体板。感应线圈可以为印刷在该基板上的印刷电路。感应线圈也可以包含卷绕配置的金属导线。外壳为非金属制。外壳的内侧面上对应该热辐射穿透区的位置设置有一热辐射层。热辐射层可以包含涂布在该外壳的载体以及分散在该载体内的复数热辐射颗粒。热辐射层的载体也可以为贴片,且载体分布设置有复数热辐射颗粒。热辐射涂层包含涂布在该基板的载体以及分散在该载体内的复数热辐射颗粒。热辐射颗粒为石墨烯碎片或是奈米碳球。In the radiation heat dissipation structure of the wireless charging device of the utility model, the base plate is a ferrite plate. The induction coil may be a printed circuit printed on the substrate. The induction coil may also contain metal wires in a coiled configuration. The housing is non-metallic. A heat radiation layer is provided on the inner side of the casing at a position corresponding to the heat radiation penetration area. The heat radiation layer may include a carrier coated on the outer shell and a plurality of heat radiation particles dispersed in the carrier. The carrier of the heat radiation layer can also be a patch, and the carrier is distributed with a plurality of heat radiation particles. The thermal radiation coating comprises a carrier coated on the substrate and a plurality of thermal radiation particles dispersed in the carrier. The thermal radiation particles are graphene fragments or carbon nanospheres.
本实用新型的无线充电装置的辐射散热结构,其外壳可以为热辐射材料制成。热辐射材料可以为聚酮、尼龙及石墨的混合物或含有热辐射成分的塑料。热辐射成分可以为为石墨烯或奈米碳球。In the radiation heat dissipation structure of the wireless charging device of the present invention, the shell can be made of heat radiation material. The heat radiation material can be a mixture of polyketone, nylon and graphite or a plastic containing heat radiation components. The thermal radiation component can be graphene or carbon nanospheres.
本实用新型的无线充电装置的辐射散热结构借由感应线圈上涂布的热辐射涂层以热辐射的方式移除感应线圈工作时产生的热能。因此不会因设置散热手段而导致无线充电装置的体积增大,且成本低廉。The radiation heat dissipation structure of the wireless charging device of the present invention removes the heat energy generated when the induction coil works by means of the heat radiation coating coated on the induction coil in the form of heat radiation. Therefore, the volume of the wireless charging device will not be increased due to the provision of heat dissipation means, and the cost is low.
优选地,上述基板为铁氧体板。Preferably, the above-mentioned substrate is a ferrite plate.
优选地,上述感应线圈为印刷在该基板上的印刷电路。Preferably, the above-mentioned induction coil is a printed circuit printed on the substrate.
优选地,上述感应线圈包含卷绕配置的金属导线。Preferably, the above-mentioned induction coil comprises a metal wire in a wound configuration.
优选地,上述外壳为非金属制。Preferably, the above-mentioned casing is made of non-metal.
优选地,上述外壳的内侧面上对应该热辐射穿透区之位置设置有一热辐射层。Preferably, a heat radiation layer is provided on the inner side of the casing at a position corresponding to the heat radiation penetration area.
优选地,上述热辐射层包含涂布在该外壳的载体以及分散在该载体内的复数热辐射颗粒。Preferably, the above-mentioned heat radiation layer comprises a carrier coated on the outer shell and a plurality of heat radiation particles dispersed in the carrier.
优选地,上述热辐射层的该载体为贴片,且该载体分布设置有复数热辐射颗粒。Preferably, the carrier of the heat radiation layer is a patch, and a plurality of heat radiation particles are distributed on the carrier.
优选地,上述热辐射涂层包含涂布在该基板的载体以及分散在该载体内的复数热辐射颗粒。Preferably, the above-mentioned thermal radiation coating comprises a carrier coated on the substrate and a plurality of thermal radiation particles dispersed in the carrier.
优选地,上述热辐射颗粒为石墨烯碎片或是奈米碳球。Preferably, the above-mentioned thermal radiation particles are graphene fragments or carbon nanospheres.
优选地,上述外壳为热辐射材料制成。Preferably, the above-mentioned housing is made of heat radiation material.
优选地,上述热辐射材料为聚酮、尼龙及石墨的混合物或含有热辐射成分的塑料。Preferably, the above-mentioned heat radiation material is a mixture of polyketone, nylon and graphite or a plastic containing heat radiation components.
优选地,上述热辐射成分为石墨烯或奈米碳球。Preferably, the above-mentioned thermal radiation component is graphene or carbon nanospheres.
优选地,上述基板与散热面相对的另一面上设置有一热辐射层。Preferably, a heat radiation layer is provided on the other surface of the substrate opposite to the heat dissipation surface.
优选地,上述外壳上对应基板与散热面相对的另一面之部分设置有另一热辐射层。Preferably, another heat radiation layer is provided on a portion of the above-mentioned casing corresponding to the other side of the base plate opposite to the heat dissipation surface.
附图说明Description of drawings
图1为本实用新型较佳实施例的无线充电装置的辐射散热结构之立体示意图。FIG. 1 is a three-dimensional schematic diagram of a radiation heat dissipation structure of a wireless charging device according to a preferred embodiment of the present invention.
图2为本实用新型较佳实施例的无线充电装置的辐射散热结构之立体分解示意图。2 is a perspective exploded schematic diagram of a radiation heat dissipation structure of a wireless charging device according to a preferred embodiment of the present invention.
图3为本实用新型较佳实施例的无线充电装置的辐射散热结构之中的基板及感应线圈配置示意图。3 is a schematic diagram of the configuration of the substrate and the induction coil in the radiation heat dissipation structure of the wireless charging device according to the preferred embodiment of the present invention.
图4为本实用新型较佳实施例的无线充电装置的辐射散热结构之中的热辐射涂层配置示意图。4 is a schematic diagram of the configuration of the thermal radiation coating in the radiation heat dissipation structure of the wireless charging device according to the preferred embodiment of the present invention.
图5为本实用新型较佳实施例的无线充电装置的辐射散热结构剖视图。5 is a cross-sectional view of a radiation heat dissipation structure of a wireless charging device according to a preferred embodiment of the present invention.
图6为图5中A区域的局部放大图。FIG. 6 is a partial enlarged view of the area A in FIG. 5 .
图7至图9为本实用新型较佳实施例的无线充电装置的其他变化态样示意图。7 to 9 are schematic diagrams of other variations of the wireless charging device according to the preferred embodiment of the present invention.
【主要部件符号说明】【Description of symbols of main components】
100 外壳100 shells
101 热辐射穿透区101 Thermal radiation penetration zone
200 基板200 substrates
201 散热面201 cooling surface
300 感应线圈300 induction coils
400 热辐射涂层400 Thermal Radiant Coating
410 载体410 Carrier
420 热辐射颗粒420 Thermal Radiation Particles
500 热辐射层500 Thermal Radiation Layer
510 载体510 Carrier
520 热辐射颗粒。520 Thermal Radiation Particles.
具体实施方式Detailed ways
参阅图1至图4,本实用新型较佳实施例提供一种无线充电装置的辐射散热结构,包含一外壳100、一基板200、一感应线圈300及一热辐射涂层400。Referring to FIGS. 1 to 4 , a preferred embodiment of the present invention provides a radiation heat dissipation structure for a wireless charging device, which includes a casing 100 , a substrate 200 , an induction coil 300 and a heat radiation coating 400 .
外壳100具有一热辐射穿透区101,由于金属具由反射热能辐射的特性,故外壳100形成热辐射穿透区101的部分为非金属制。于本实施例中,较佳地,外壳100整体皆为非金属制成(例如塑料),因此能够供热能以辐射的方式穿透。The casing 100 has a heat radiation penetration area 101 . Since the metal has the property of reflecting thermal energy radiation, the part of the casing 100 forming the heat radiation penetration area 101 is made of non-metal. In this embodiment, preferably, the entire casing 100 is made of non-metal (eg, plastic), so that heat energy can be penetrated by radiation.
基板200容置在该外壳100内,于本实施例中,基板200较佳地为铁氧体板(Ferrite)。基板200的其中一面形成一散热面201,散热面201朝向热辐射穿透区101配置。The substrate 200 is accommodated in the casing 100 . In this embodiment, the substrate 200 is preferably a ferrite plate. A heat dissipation surface 201 is formed on one side of the substrate 200 , and the heat dissipation surface 201 is disposed toward the heat radiation penetration area 101 .
参阅图3至图6,感应线圈300贴附设置在基板200的散热面201上,感应线圈300可以为印刷在该基板200上的印刷电路,感应线圈300也包含卷绕配置且贴附在基板200的散热面201上的金属导线,金属导线较佳地螺旋卷绕呈平面配置但本实用新型不限定金属导线卷绕的形式。Referring to FIGS. 3 to 6 , the induction coil 300 is attached to the heat dissipation surface 201 of the substrate 200 . The induction coil 300 may be a printed circuit printed on the substrate 200 . The induction coil 300 also includes a winding configuration and is attached to the substrate. The metal wires on the heat dissipation surface 201 of the 200 are preferably spirally wound in a plane configuration, but the present invention does not limit the form of the metal wires.
热辐射涂层400覆盖基板200的散热面201且覆盖感应线圈300。热辐射涂层400可以包含涂布在基板200的载体410(例如硅、橡胶、树脂或是漆)以及分散在载体410内的复数热辐射颗粒420,其热辐射颗粒420为石墨烯碎片或是奈米碳球。The thermal radiation coating 400 covers the heat dissipation surface 201 of the substrate 200 and covers the induction coil 300 . The thermal radiation coating 400 may include a carrier 410 (such as silicon, rubber, resin or paint) coated on the substrate 200 and a plurality of thermal radiation particles 420 dispersed in the carrier 410, and the thermal radiation particles 420 are graphene fragments or Carbon Nanospheres.
感应线圈300可以另电性连接至电源或是负载(例如电池或是电子装置内的各功能模块),当感应线圈300电性连接至电源时,通电的感应线圈300能够产生磁场。当感应线圈300电性连接至负载时,未通电的感应线圈300置入场时能够感应磁场而在其内生成电流以供电至负载。因此,借由在电源与负载之间配置一对感应线圈300而能够将电源以无线方式供电至负载。The induction coil 300 can be electrically connected to a power source or a load (eg, a battery or various functional modules in an electronic device). When the induction coil 300 is electrically connected to the power source, the energized induction coil 300 can generate a magnetic field. When the induction coil 300 is electrically connected to the load, the non-energized induction coil 300 can induce a magnetic field and generate a current therein to supply power to the load when placed in the field. Therefore, by arranging a pair of induction coils 300 between the power source and the load, the power source can be wirelessly supplied to the load.
供电时电流通过感应线圈300所产生的热能能够被吸收至热辐射涂层400而辐射发散,辐射发散的热能能够穿过外壳100的热辐射穿透区101而排出外壳100。The thermal energy generated by the current passing through the induction coil 300 during power supply can be absorbed into the thermal radiation coating 400 and radiated and dissipated.
参图2、图5及图6,可选择地,外壳100的内侧面上对应热辐射穿透区101的位置可以选择性地增加设置有一热辐射层500。特别是当外壳100只有一部分为非金属制成而构成热辐射穿透区101时,热辐射无法穿透金属制部分,故增加设置热辐射层500以辅助热辐射传传递。热辐射层500包含涂布在外壳100的载体510(例如硅、橡胶、树脂或是漆)以及分散在载体510内的复数热辐射颗粒520,但本实用新型不以此为限,例如热辐射层500的载体510也可以为贴附在外壳100的内侧面上的贴片,且载体510内部或者载体510的表面分布设置有复数热辐射颗粒520,其热辐射颗粒520为石墨烯碎片或是奈米碳球。热辐射层500吸收热辐射涂层400辐射发散的热能,并且进一步向外辐射而排出外壳100。Referring to FIG. 2 , FIG. 5 and FIG. 6 , optionally, a heat radiation layer 500 may be selectively added at a position corresponding to the heat radiation penetration region 101 on the inner surface of the casing 100 . Especially when only a part of the casing 100 is made of non-metal to form the heat radiation penetration area 101, the heat radiation cannot penetrate the metal part, so the heat radiation layer 500 is added to assist the heat radiation transfer. The heat radiation layer 500 includes a carrier 510 (such as silicon, rubber, resin or paint) coated on the housing 100 and a plurality of heat radiation particles 520 dispersed in the carrier 510, but the present invention is not limited to this, for example, heat radiation The carrier 510 of the layer 500 can also be a patch attached to the inner side of the housing 100, and a plurality of heat radiation particles 520 are distributed inside the carrier 510 or on the surface of the carrier 510, and the heat radiation particles 520 are graphene fragments or Carbon Nanospheres. The heat radiation layer 500 absorbs the heat energy radiated and dissipated by the heat radiation coating 400 , and further radiates outward to be discharged out of the housing 100 .
参阅图7,若要在整体皆为非金属制的外壳100配置热辐射层500,由于外壳100整体皆为非金属制成故皆可以作为热辐射穿透区101,因此热辐射层500较佳地也可以布满外壳100的内侧面。Referring to FIG. 7 , if the heat radiation layer 500 is to be disposed on the casing 100 which is made of non-metal as a whole, the casing 100 can be used as the heat radiation penetration area 101 because the casing 100 is made of non-metal as a whole, so the heat radiation layer 500 is preferable The ground may also cover the inner side of the housing 100 .
参阅图8,当外壳100整体皆为非金属制成时则可以选择不设置热辐射层500。非金属制的外壳100可选用热辐射材料制成,例如:改质的聚酮( Polyketone);尼龙及石墨的混合物;或者具热辐射成分(石墨烯、奈米碳球)的塑料,因此可以借由外壳100本身热辐射吸收感应线圈发射的热辐射,再由壳体向外热辐射发散。相较于一般的塑料只能被热辐射穿透,前述热辐射材料制的外壳100 更能够吸收热辐射以增进散热效率。Referring to FIG. 8 , when the entire casing 100 is made of non-metal, the heat radiation layer 500 may not be provided. The non-metallic shell 100 can be made of heat radiation materials, such as: modified polyketone (Polyketone); a mixture of nylon and graphite; The heat radiation emitted by the induction coil is absorbed by the heat radiation of the casing 100 itself, and then the heat radiation is radiated to the outside by the casing. Compared with ordinary plastics that can only be penetrated by thermal radiation, the housing 100 made of the aforementioned thermal radiation material can absorb thermal radiation to improve heat dissipation efficiency.
参阅图9,基板200上与散热面201相对的另一面上也可以选择性地增加设置有一热辐射层600,此辐射层600可用于辅助发散感应线圈300工作时产生的热能。再者,外壳100上对应于前述基板200的另一面之部分也可以选择性地设置热辐射层500以吸收前述基板200上的热辐射层600发散的热能并且进一步发散至外壳100外侧。 在此,热辐射层500/600可以涂布设置在外壳100或基板200上。热辐射层500/600也可以是贴片的形式,其贴附固定于外壳100或基板200上。Referring to FIG. 9 , a heat radiation layer 600 can also be selectively disposed on the other surface of the substrate 200 opposite to the heat dissipation surface 201 , and the radiation layer 600 can be used to assist in dissipating the heat energy generated by the induction coil 300 during operation. Furthermore, a portion of the casing 100 corresponding to the other side of the substrate 200 can also be selectively provided with a thermal radiation layer 500 to absorb the thermal energy emitted by the thermal radiation layer 600 on the substrate 200 and further dissipate to the outside of the casing 100 . Here, the heat radiation layer 500 / 600 may be coated on the housing 100 or the substrate 200 . The heat radiation layer 500 / 600 may also be in the form of a patch, which is attached and fixed on the housing 100 or the substrate 200 .
本实用新型的无线充电装置的辐射散热结构借由感应线圈300上涂布的热辐射涂层400以热辐射的方式移除感应线圈300工作时产生的热能。因此不会因设置散热手段而导致无线充电装置的体积增大,而且热辐射涂层400的配置成本也相当低廉。The radiation heat dissipation structure of the wireless charging device of the present invention removes the heat energy generated when the induction coil 300 works by means of the heat radiation coating 400 coated on the induction coil 300 in the form of heat radiation. Therefore, the volume of the wireless charging device will not be increased due to the provision of heat dissipation means, and the configuration cost of the heat radiation coating 400 is also quite low.
以上所述仅为本实用新型较佳实施例,非用以限定本实用新型专利范围,其他运用本实用新型的专利精神等效变化,均应属本实用新型专利范围。The above descriptions are only preferred embodiments of the present invention and are not intended to limit the scope of the patent of the present invention. Other equivalent changes in the patent spirit of the present invention shall belong to the scope of the patent of the present invention.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821456182 | 2018-09-06 | ||
| CN2018214561823 | 2018-09-06 |
| Publication Number | Publication Date |
|---|---|
| CN209168894Utrue CN209168894U (en) | 2019-07-26 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821636455.2UExpired - Fee RelatedCN209168894U (en) | 2018-09-06 | 2018-10-09 | Radiation heat dissipation structure of wireless charging device |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee | Granted publication date:20190726 Termination date:20211009 |