技术领域technical field
本申请涉及一种LED封装模组，属于LED显示屏封装技术领域。The application relates to an LED packaging module, which belongs to the technical field of LED display packaging.
背景技术Background technique
随着LED显示技术的快速发展，LED显示屏的应用越来越广泛。With the rapid development of LED display technology, the application of LED display is becoming more and more extensive.
现有技术中，主要的LED显示模块封装方式包括：SMD(表面贴装型，SurfaceMounted Devices)封装，COB(板上芯片封装，Chip on Board)封装。SMD封装热阻大，并且散热性差，有眩光问题，在应用时需要将器件贴到固定的基板上，只能应用于对产品性能要求不高的显示领域。COB封装相对于SMD封装，性能大幅提升，省略了支架、回流焊、贴片工序等步骤，同时还可以有效避免眩光问题。性价比非常突出。In the prior art, the main LED display module packaging methods include: SMD (Surface Mounted Devices, Surface Mounted Devices) packaging, and COB (Chip on Board) packaging. SMD packages have large thermal resistance, poor heat dissipation, and glare problems. In application, the device needs to be attached to a fixed substrate, and it can only be used in the display field that does not require high product performance. Compared with SMD package, COB package has greatly improved performance, omits steps such as bracket, reflow soldering, and patch process, and can also effectively avoid glare problems. Value for money is outstanding.
CN102386312A公开了现有LED封装一般采用如下工艺：将LED芯片固定在支架上；用金线将芯片正负极分别连接到支架的电路中；将环氧树脂混合搅拌均匀，抽气泡；用点胶机或手动对固晶焊线完的支架进行点胶；烘烤固化。如图1所示，支架11上固定有LED芯片12，LED芯片12外罩设有远程荧光透镜13，支架11和远程荧光透镜13之间注有粘结剂14，每个LED芯片12为一个独立的点胶单元。CN102386312A discloses that the existing LED packaging generally adopts the following process: fixing the LED chip on the bracket; connecting the positive and negative electrodes of the chip to the circuit of the bracket respectively with gold wires; mixing and stirring epoxy resin evenly, sucking air bubbles; dispensing glue Machine or manually to dispense glue to the bracket after the bonding wire is finished; bake and solidify. As shown in FIG. 1 , an LED chip 12 is fixed on the bracket 11 , a remote fluorescent lens 13 is provided on the outer cover of the LED chip 12 , an adhesive 14 is injected between the bracket 11 and the remote fluorescent lens 13 , and each LED chip 12 is an independent dispensing unit.
CN103943756A，在该现有技术中，先在基板上设置有注胶孔；在基板上进行固晶焊线；将所述基板固定至注胶底模上；通过精准注胶针头向所述注胶孔进行注胶；待胶体凝固后，对所述基板进行离模成型。如图2所示，注胶针头18位于基板17的上方，胶体通过注胶孔15进入底模上的注胶腔室16中，从而完成胶体封装。CN103943756A, in the prior art, firstly, a glue injection hole is provided on the substrate; die bonding wire is performed on the substrate; the substrate is fixed on the glue injection bottom mold; The hole is injected with glue; after the colloid is solidified, the substrate is released from the mold. As shown in FIG. 2 , the glue injection needle 18 is located above the substrate 17 , and the glue enters the glue injection chamber 16 on the bottom mold through the glue injection hole 15 , thereby completing the glue packaging.
CN105810801A，在该现有技术中，先将发光器件安装在电路基板上；然后在电路基板的四周用锡膏贴上电源器件，做成光源与电源一体化的COB模组；在一体化的COB模组上以压塑成型的方法压塑透明外壳，所述透明外壳与电路基板之间形成两个空腔体，其中一个空腔体位于透明外壳的中部为中部空腔体，另一个空腔体围绕在中部空腔体的四周为外部空腔体，所述发光器件位于中部空腔体中，所述电源器件位于外部空腔体中；在透明外壳上开设一注胶孔，通过注胶孔将填充胶注入外部空腔体中。CN105810801A, in the prior art, the light-emitting device is first installed on the circuit substrate; then the power supply device is pasted with solder paste around the circuit substrate to make a COB module integrating the light source and the power supply; in the integrated COB The transparent casing is compression-molded on the module, and two cavities are formed between the transparent casing and the circuit substrate, one of which is located in the middle of the transparent casing, and the other is a central cavity. The body surrounding the middle cavity body is an outer cavity body, the light emitting device is located in the middle cavity body, and the power supply device is located in the outer cavity body; a glue injection hole is opened on the transparent shell, and the glue injection The hole injects the filler glue into the outer cavity body.
可见，在现有的LED封装模组，普遍采用点胶或注胶孔灌胶的方式进行封装。但是这些LED封装模组，存在良品率难于控制的问题，以及LED显示模块COB的封装制造成本高等问题。It can be seen that, in the existing LED packaging modules, the method of dispensing glue or glue injection hole filling is generally used for packaging. However, these LED packaging modules have problems that the yield rate is difficult to control, and the packaging and manufacturing cost of the LED display module COB is high.
此外，按照现有的封装工艺制成的LED显示模块，由于胶封方式的限制，导致对像素单元的保护不利，在存在多种静电来源的情况下(如人手上的静电)，如果静电来源接触到LED显示模块，会造成像素单元被击穿，使得LED显示模块使用寿命较低。In addition, the LED display module made according to the existing packaging process is not good for the protection of the pixel unit due to the limitation of the glue sealing method. The contact with the LED display module will cause the pixel unit to be broken down, which makes the LED display module have a low service life.
而且，由于现有的胶封方式的限制，导致很难制作点间距为1mm或者小于1mm规模的LED显示模块。Moreover, due to the limitation of the existing glue sealing method, it is difficult to manufacture an LED display module with a dot pitch of 1 mm or less.
综上所述，如何提供一种具有较长使用寿命，且生产效率和良品率较高的COB封装结构是本领域技术人员亟需解决的问题。In summary, how to provide a COB package structure with a long service life and high production efficiency and yield is an urgent problem for those skilled in the art to solve.
实用新型内容Utility model content
根据本申请提供的LED封装模组，该封装模组可以有效地防止LED发光晶片被击穿，具有较高的使用寿命；并且具有较高的生产效率和成品率；同时LED显示屏可以达到点间距为≤1mm规模。According to the LED packaging module provided by the present application, the packaging module can effectively prevent the breakdown of the LED light-emitting chip, has a high service life, and has high production efficiency and yield; at the same time, the LED display screen can reach the point Spacing is ≤1mm scale.
一种LED封装模组，包括：PCB板、多个LED发光晶片以及胶体层；An LED packaging module, comprising: a PCB board, a plurality of LED light-emitting chips and a colloid layer;
所述多个LED发光晶片固定在所述PCB板的正面上，每个LED发光晶片通过导线与所述PCB板连接；The plurality of LED light-emitting chips are fixed on the front surface of the PCB board, and each LED light-emitting chip is connected to the PCB board through wires;
所述胶体层通过淋胶灌封的方式覆盖在所述PCB板的正面以使所述每个LED发光晶片以及PCB板正面整面均埋设在所述胶体层内。The colloid layer is covered on the front surface of the PCB board by means of pouring and encapsulation, so that each LED light-emitting chip and the entire front surface of the PCB board are embedded in the colloid layer.
可选地，所述LED发光晶片包括红光LED晶片、绿光LED晶片以及蓝光LED晶片；Optionally, the LED light-emitting chips include red LED chips, green LED chips and blue LED chips;
所述红光LED晶片通过导线与所述PCB板上的焊盘连通；The red LED chip is communicated with the pads on the PCB through wires;
所述绿光LED晶片通过导线与所述PCB板上的焊盘连通；The green LED chip is communicated with the pads on the PCB through wires;
所述蓝光LED晶片通过导线与所述PCB板上的焊盘连通。The blue LED chips are communicated with the pads on the PCB through wires.
可选地，所述红光LED晶片通过导线与所述PCB板上的第一焊盘连通；所述绿光LED晶片通过导线分别与所述PCB板上的第一焊盘、第二焊盘连通；所述蓝光LED晶片通过导线分别与所述PCB板上的第一焊盘、第三焊盘连通。Optionally, the red LED chip is connected to the first pad on the PCB through wires; the green LED chip is connected to the first pad and the second pad on the PCB through wires respectively. Connected; the blue LED chip is respectively connected with the first pad and the third pad on the PCB board through wires.
可选地，所述红光LED晶片的上方为绿光LED晶片，红光LED晶片的下方为蓝光LED晶片，红光LED晶片的右方为第一焊盘，红光LED晶片的左方为第二焊盘，红光LED晶片的右下方为第三焊盘。Optionally, the top of the red LED chip is a green LED chip, the bottom of the red LED chip is a blue LED chip, the right side of the red LED chip is the first pad, and the left side of the red LED chip is a The second pad, the lower right of the red LED chip is the third pad.
可选地，所述红光LED晶片的上方为蓝光LED晶片，红光LED晶片的下方为绿光LED晶片，红光LED晶片的右方为第一焊盘，红光LED晶片的左方为第二焊盘，红光LED晶片的右下方为第三焊盘。Optionally, the top of the red LED chip is a blue LED chip, the bottom of the red LED chip is a green LED chip, the right side of the red LED chip is the first pad, and the left side of the red LED chip is a The second pad, the lower right of the red LED chip is the third pad.
可选地，所述PCB板为矩形平板，所述多个LED发光晶片沿所述PCB板的横向、纵向均匀分布。Optionally, the PCB board is a rectangular flat plate, and the plurality of LED light-emitting chips are evenly distributed along the lateral and longitudinal directions of the PCB board.
可选地，所述LED发光晶片之间的间距选自P0.9375、P1.25、P1.5625、P1.875、P0.9495、P1.266、P1.5825、P1.9、P1.17中的任意一种。Optionally, the spacing between the LED light-emitting chips is selected from P0.9375, P1.25, P1.5625, P1.875, P0.9495, P1.266, P1.5825, P1.9, P1.17 any of the .
可选地，所述PCB板为圆形板、菱形板、三角形板、不规则形板中的任意一种。Optionally, the PCB board is any one of a circular board, a diamond-shaped board, a triangular board, and an irregular-shaped board.
可选地，所述胶体层的上表面水平。Optionally, the upper surface of the colloid layer is level.
本申请能产生的有益效果包括：The beneficial effects that this application can produce include:
1)本申请所提供的LED封装模组，该封装模组中的胶体层大面积地覆盖LED发光晶片，因此可以有效地防止LED发光晶片被击穿，使得该封装模组具有较高的使用寿命。1) In the LED packaging module provided by this application, the colloid layer in the packaging module covers the LED light-emitting chip in a large area, so it can effectively prevent the LED light-emitting chip from being broken down, so that the packaging module has a higher usage rate. life.
2)本申请所提供的LED封装模组，制作过程简单，具有较高的生产效率和成品率，并且具有较低的生产成本。2) The LED packaging module provided by the present application has a simple manufacturing process, high production efficiency and yield, and low production cost.
3)根据本申请所提供的LED封装模组，可以非常容易地制作点间距为≤1mm的LED显示屏。3) According to the LED packaging module provided by the present application, an LED display screen with a dot pitch of ≤1mm can be easily fabricated.
附图说明Description of drawings
图1为现有技术中的LED点胶过程图；Fig. 1 is the LED dispensing process diagram in the prior art;
图2为现有技术中的LED注胶过程图；Fig. 2 is the LED glue injection process diagram in the prior art;
图3为实施例1提供的LED封装模组的纵向剖面结构示意图；3 is a schematic diagram of a longitudinal cross-sectional structure of the LED packaging module provided in Embodiment 1;
图4为实施例1提供的LED封装模组的俯视图；4 is a top view of the LED packaging module provided in Embodiment 1;
图5为实施例1提供的LED封装模组的局部示意图。FIG. 5 is a partial schematic diagram of the LED packaging module provided in Embodiment 1. FIG.
部件和附图标记列表：List of parts and reference numbers:
100 PCB板； 101 第一端； 102 第二端100 PCB board; 101 first end; 102 second end
200 LED发光晶片； 201 红光LED晶片；200 LED light-emitting chip; 201 red LED chip;
202 绿光LED晶片； 203 蓝光LED晶片； 300 胶体层；202 green LED chip; 203 blue LED chip; 300 colloid layer;
400 导线； 501 第一焊盘； 502 第二焊盘；400 wire; 501 first pad; 502 second pad;
503 第三焊盘。503 Third pad.
具体实施方式Detailed ways
下面结合实施例详述本申请，但本申请并不局限于这些实施例。The present application will be described in detail below with reference to the examples, but the present application is not limited to these examples.
实施例1Example 1
图3为本实施例提供的LED封装模组的纵向剖面结构示意图，图4为本实施例提供的LED封装模组的俯视图，图5为本实施例提供的LED封装模组的局部示意图，下面结合图3～5具体说明本实施例。FIG. 3 is a schematic diagram of a longitudinal cross-sectional structure of the LED packaging module provided by the present embodiment, FIG. 4 is a top view of the LED packaging module provided by the present embodiment, and FIG. 5 is a partial schematic diagram of the LED packaging module provided by the present embodiment. This embodiment is described in detail with reference to FIGS. 3 to 5 .
如图3所示，根据上述实施例所述的LED的COB封装方法所制备的LED封装模组，包括：PCB板100、多个LED发光晶片200以及胶体层300；As shown in FIG. 3 , the LED packaging module prepared according to the COB packaging method for LEDs described in the above embodiments includes: a PCB board 100 , a plurality of LED light-emitting chips 200 and a colloid layer 300 ;
多个LED发光晶片200固定在PCB板100的正面上，每个LED发光晶片200通过导线400与PCB板100连接；A plurality of LED light-emitting chips 200 are fixed on the front surface of the PCB board 100, and each LED light-emitting chip 200 is connected to the PCB board 100 through wires 400;
胶体层300通过淋胶灌封的方式覆盖在PCB板100的正面以使每个LED发光晶片200以及PCB板100正面整面均埋设在胶体层300内。The colloidal layer 300 is covered on the front surface of the PCB board 100 by means of pouring and encapsulation, so that each LED light-emitting chip 200 and the entire front surface of the PCB board 100 are embedded in the colloidal layer 300 .
本申请提供的LED封装模组，采用淋胶灌封的方式将胶体层覆盖到LED发光晶片PCB板100正面整面上，能够实现对LED发光晶片的大面积保护，有效得防止发光单元被击穿；并且LED封装模组的制作过程简单、成品率高；生产效率也很高。The LED packaging module provided by the present application adopts the method of pouring and potting to cover the colloid layer on the entire front surface of the LED light-emitting chip PCB board 100, which can realize large-area protection for the LED light-emitting chip and effectively prevent the light-emitting unit from being struck. And the production process of the LED package module is simple, the yield is high, and the production efficiency is also high.
具体地，如图4所示，PCB板为矩形平板，LED发光晶片200沿横向、纵向等间距均匀排布在PCB板100的正面。胶体层300均匀淋满并固化在PCB板100正面的整个面上。由于PCB板100的正面整面上充满胶体，使得每个LED发光晶片200得到充分均匀封装，以及各个LED发光晶片彼此之间得到充分均匀封装，即胶体层300充分完整地覆盖了PCB板100以及安装在其上的LED发光晶片200，从而使得LED发光晶片200全部被胶体层300覆盖。Specifically, as shown in FIG. 4 , the PCB board is a rectangular flat plate, and the LED light-emitting chips 200 are evenly arranged on the front surface of the PCB board 100 at equal intervals in the horizontal and vertical directions. The colloid layer 300 is evenly poured and cured on the entire surface of the front surface of the PCB board 100 . Since the entire front surface of the PCB board 100 is filled with colloid, each LED light-emitting chip 200 is fully and uniformly packaged, and the LED light-emitting chips are fully uniformly packaged with each other, that is, the colloid layer 300 fully and completely covers the PCB board 100 and The LED light-emitting chip 200 is mounted thereon, so that the LED light-emitting chip 200 is completely covered by the colloid layer 300 .
可选地，LED发光晶片200包括红光LED晶片201、绿光LED晶片202以及蓝光LED晶片203；Optionally, the LED light-emitting chip 200 includes a red LED chip 201, a green LED chip 202 and a blue LED chip 203;
红光LED晶片201通过导线400与PCB板100上的焊盘连通；The red LED chip 201 is communicated with the pads on the PCB board 100 through the wires 400;
绿光LED晶片202通过导线400与PCB板100上的焊盘连通；The green LED chip 202 is communicated with the pads on the PCB board 100 through the wires 400;
蓝光LED晶片203通过导线400与PCB板100上的焊盘连通。The blue LED chip 203 is communicated with the pads on the PCB board 100 through the wires 400 .
可选地，红光LED晶片201通过导线400与PCB板100上的第一焊盘501连通；绿光LED晶片202通过导线400分别与PCB板100上的第一焊盘501、第二焊盘502连通；蓝光LED晶片203通过导线400分别与PCB板100上的第一焊盘501、第三焊盘503连通。Optionally, the red LED chip 201 is connected to the first pad 501 on the PCB board 100 through the wire 400; the green LED chip 202 is connected to the first pad 501 and the second pad on the PCB board 100 through the wire 400 respectively. 502 is connected; the blue LED chip 203 is connected with the first pad 501 and the third pad 503 on the PCB board 100 through the wires 400 respectively.
可选地，红光LED晶片201的上方为绿光LED晶片202，红光LED晶片201的下方为蓝光LED晶片203，红光LED晶片201的右方为第一焊盘501，红光LED晶片201的左方为第二焊盘502，红光LED晶片201的右下方为第三焊盘503。Optionally, above the red LED chip 201 is the green LED chip 202 , below the red LED chip 201 is the blue LED chip 203 , on the right of the red LED chip 201 is the first pad 501 , and the red LED chip 201 The left side of 201 is the second pad 502 , and the lower right side of the red LED chip 201 is the third pad 503 .
可选地，红光LED晶片201的上方为蓝光LED晶片203，红光LED晶片201的下方为绿光LED晶片202，红光LED晶片201的右方为第一焊盘501，红光LED晶片201的左方为第二焊盘502，红光LED晶片201的右下方为第三焊盘503。Optionally, the top of the red LED chip 201 is the blue LED chip 203 , the bottom of the red LED chip 201 is the green LED chip 202 , the right side of the red LED chip 201 is the first pad 501 , and the red LED chip 201 The left side of 201 is the second pad 502 , and the lower right side of the red LED chip 201 is the third pad 503 .
在一个具体的示例中，如图5所示，红光LED晶片201位于中间位置，红光LED晶片201上方为绿光LED晶片202，红光LED晶片201下方为蓝光LED晶片203，红光LED晶片201的右方为第一焊盘501，红光LED晶片201的左方为第二焊盘502，红光LED晶片201的右下方为第三焊盘503。红光LED晶片201、绿光LED晶片202、蓝光LED晶片203分别通过导线400连接在第一焊盘501上，绿光LED晶片202通过导线400连接在第二焊盘502上，蓝光LED晶片203通过导线400连接在第三焊盘503上。红光LED晶片201的底面为负极，因此无需再连接焊盘。本实施例中的焊盘为铜箔。In a specific example, as shown in FIG. 5 , the red LED chip 201 is in the middle position, the green LED chip 202 is located above the red LED chip 201 , the blue LED chip 203 is located below the red LED chip 201 , and the red LED The right side of the chip 201 is the first pad 501 , the left side of the red LED chip 201 is the second pad 502 , and the lower right side of the red LED chip 201 is the third pad 503 . The red LED chip 201 , the green LED chip 202 , and the blue LED chip 203 are respectively connected to the first pad 501 through the wire 400 , the green LED chip 202 is connected to the second pad 502 through the wire 400 , and the blue LED chip 203 It is connected to the third pad 503 through the wire 400 . The bottom surface of the red LED chip 201 is the negative electrode, so there is no need to connect the pads. The pads in this embodiment are copper foils.
当然，红光LED晶片201、绿光LED晶片202、蓝光LED晶片203以及焊盘之间的排列方式不限于本实施例中所列举的排列方式，本领域技术人员可根据需要自行调整LED晶体之间的排列方式。Of course, the arrangement among the red LED chips 201 , the green LED chips 202 , the blue LED chips 203 and the pads is not limited to the arrangement listed in this embodiment, and those skilled in the art can adjust the LED crystals according to their needs. arrangement between.
可选地，在PCB板100的背面还固定有电子元器件和芯片。Optionally, electronic components and chips are also fixed on the back of the PCB board 100 .
可选地，LED发光晶片200之间的点间距选自P0.9375、P1.25、P1.5625、P1.875、P0.9495、P1.266、P1.5825、P1.9、P1.17中的任意一种。Optionally, the dot pitch between the LED light-emitting chips 200 is selected from P0.9375, P1.25, P1.5625, P1.875, P0.9495, P1.266, P1.5825, P1.9, P1.17 any of the .
可选地，PCB板100为平板。当然还可以为其它的形状，例如圆形板、菱形板、三角形板、不规则形板等等。Optionally, the PCB board 100 is a flat plate. Of course, other shapes are also possible, such as circular plates, diamond-shaped plates, triangular plates, irregular-shaped plates and so on.
可选地，胶体层300的上表面水平，厚度均匀的胶体层有利于更好地保护LED发光晶片200。Optionally, the upper surface of the colloidal layer 300 is level, and the colloidal layer with uniform thickness is beneficial to better protect the LED light-emitting chip 200 .
实施例2Example 2
本实施例提供了一种制备上述实施例中的LED封装模组的方法，至少包括步骤：This embodiment provides a method for preparing the LED packaging module in the above embodiment, which at least includes the steps:
将多个LED发光晶片200均匀固定到PCB板100的正面；用导线400将每个LED发光晶片200与PCB板100导通；将胶水按照预设的淋涂方式淋胶灌封PCB板100的正面，以使每个LED发光晶片200和PCB板100正面整面被胶水均匀完整覆盖；将淋胶灌封后的PCB板100静置，待胶水凝固后，烘烤固化。A plurality of LED light-emitting chips 200 are evenly fixed to the front side of the PCB board 100; each LED light-emitting chip 200 is connected to the PCB board 100 with wires 400; glue is poured according to a preset flow coating method to encapsulate the surface of the PCB board 100. The front side of each LED chip 200 and the PCB board 100 is evenly and completely covered with glue; the PCB board 100 after being poured and encapsulated is left to stand, and after the glue is solidified, it is baked and cured.
在一个具体的示例中，预设的淋涂方式可以为：In a specific example, the preset flow coating method can be:
将连续均匀流出的胶水从PCB板100正面的第一端101的上方沿第一直线方向连续淋涂至PCB板100正面的第二端102；Continuously and uniformly flow out the glue from the top of the first end 101 on the front side of the PCB board 100 to the second end 102 on the front side of the PCB board 100 continuously along the first linear direction;
控制PCB板100沿第二直线方向移动预设距离；controlling the PCB board 100 to move a preset distance along the second linear direction;
将胶水从PCB板100正面的第二端102沿与第一直线方向相反的方向连续淋涂至PCB板100正面的第一端101；The glue is continuously sprayed from the second end 102 on the front side of the PCB board 100 to the first end 101 on the front side of the PCB board 100 in a direction opposite to the direction of the first straight line;
控制PCB板100沿第二直线方向移动预设距离；controlling the PCB board 100 to move a preset distance along the second linear direction;
重复上述过程，直到胶水将LED发光晶片200以及PCB板100正面整面全部连续覆盖；Repeat the above process until the glue continuously covers the LED chip 200 and the entire front surface of the PCB board 100;
其中，如图4和图5所示，PCB板的第一端101和第二端102为相对的两端，第一直线方向和第二直线方向相互垂直。Wherein, as shown in FIG. 4 and FIG. 5 , the first end 101 and the second end 102 of the PCB are opposite ends, and the first linear direction and the second linear direction are perpendicular to each other.
预设距离可以为胶水在所述PCB板上的淋涂宽度，或者也可以为LED发光晶片的间距。The preset distance may be the width of the glue coating on the PCB board, or may be the spacing of the LED light-emitting chips.
本申请中采用行走的方式将胶体连续淋涂至PCB板正面，从而实现了对LED发光晶片以及PCB板的正面整面被胶水均匀完整覆盖效果，也就是说LED发光晶片埋设在胶体层中。In this application, the colloid is continuously sprayed onto the front of the PCB board by walking, so that the LED light-emitting chip and the entire front surface of the PCB board are uniformly and completely covered by the glue, that is, the LED light-emitting chip is embedded in the colloid layer.
以上所述，仅是本申请的几个实施例，并非对本申请做任何形式的限制，虽然本申请以较佳实施例揭示如上，然而并非用以限制本申请，任何熟悉本专业的技术人员，在不脱离本申请技术方案的范围内，利用上述揭示的技术内容做出些许的变动或修饰均等同于等效实施案例，均属于技术方案范围内。The above are only a few embodiments of the present application, and are not intended to limit the present application in any form. Although the present application is disclosed as above with preferred embodiments, it is not intended to limit the present application. Without departing from the scope of the technical solution of the present application, any changes or modifications made by using the technical content disclosed above are equivalent to equivalent implementation cases and fall within the scope of the technical solution.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821929108.9UCN209133532U (en) | 2018-11-22 | 2018-11-22 | LED package module |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821929108.9UCN209133532U (en) | 2018-11-22 | 2018-11-22 | LED package module |
| Publication Number | Publication Date |
|---|---|
| CN209133532Utrue CN209133532U (en) | 2019-07-19 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821929108.9UExpired - Fee RelatedCN209133532U (en) | 2018-11-22 | 2018-11-22 | LED package module |
| Country | Link |
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| CN (1) | CN209133532U (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109509826A (en)* | 2018-11-22 | 2019-03-22 | 深圳市新光台显示应用有限公司 | The COB packaging method and LED encapsulation module of LED |
| CN110456574A (en)* | 2019-09-20 | 2019-11-15 | 青岛海信电器股份有限公司 | Display device and backlight module |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109509826A (en)* | 2018-11-22 | 2019-03-22 | 深圳市新光台显示应用有限公司 | The COB packaging method and LED encapsulation module of LED |
| CN110456574A (en)* | 2019-09-20 | 2019-11-15 | 青岛海信电器股份有限公司 | Display device and backlight module |
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| CF01 | Termination of patent right due to non-payment of annual fee | Granted publication date:20190719 |