技术领域technical field
本公开涉及散热冷却技术领域，特别涉及一种微槽群热沉补液装置，可应用于电子电器元器件和其它光电子器件高热流密度下散热与热控制系统。The present disclosure relates to the technical field of heat dissipation and cooling, and in particular to a microgroove group heat sink fluid replacement device, which can be applied to heat dissipation and thermal control systems of electronic and electrical components and other optoelectronic devices under high heat flux density.
背景技术Background technique
随着电子器件小型化、大功率化和大规模集成电路的高速发展，单位容积电子器件的发热量大幅增加，如果发热不能及时排除将对电子器件的使用造成很大影响，甚至是毁灭性的损坏。而传统的散热方式如风冷、水冷等由于自身效率低、不安全等因素渐渐不能适应愈发严苛的散热要求。因此，高效率的散热技术的发展迫在眉睫。With the rapid development of miniaturization, high power and large-scale integrated circuits of electronic devices, the heat generation of electronic devices per unit volume has increased significantly. If the heat generation cannot be eliminated in time, it will have a great impact on the use of electronic devices, and even be devastating. damage. However, traditional heat dissipation methods such as air cooling and water cooling are gradually unable to meet the increasingly stringent heat dissipation requirements due to factors such as low efficiency and unsafety. Therefore, the development of high-efficiency heat dissipation technology is imminent.
微槽群复合相变换热技术以其换热系数高、工作稳定等特点成为当前的新型散热手段。以开放式矩形毛细微槽热沉为例，它利用微槽中三相接触线附近蒸发薄液膜区域的高强度蒸发和厚液膜区域液态工质核态沸腾的复合相变机理，可以实现很高的换热能力。Micro-groove complex phase-change heat technology has become a new heat dissipation method due to its high heat transfer coefficient and stable operation. Taking the open rectangular capillary micro-groove heat sink as an example, it can realize High heat transfer capacity.
专利200720103514.5给出了一种热控制系统，在传统蒸发-冷凝换热系统中，在蒸发器和冷凝器中都布置了微槽群，利用微槽群相变换热技术换热强度高的特点使工质的蒸发换热以及冷凝都更加高效，从而强化系统换热。Patent 200720103514.5 provides a thermal control system. In the traditional evaporation-condensation heat exchange system, micro-groove groups are arranged in both the evaporator and the condenser, and the characteristics of high heat transfer intensity of the phase-change heat technology of the micro-groove groups are used. The evaporation heat transfer and condensation of the working fluid are more efficient, thereby enhancing the system heat transfer.
专利201310111572.2公开了一种微槽群复合相变散热器，在内腔中的散热面上设置有由多条微米数量级的微槽道构成的微槽群结构。Patent 201310111572.2 discloses a micro-groove complex phase-change heat sink, in which a micro-groove structure consisting of a plurality of micro-grooves on the order of microns is provided on the heat dissipation surface in the inner cavity.
但是，上述微槽群散热器在较高热流密度下容易发生干涸导致换热情况恶化。However, the above-mentioned micro-groove group heat sink is prone to drying out under high heat flux density, which leads to deterioration of heat exchange.
实用新型内容Utility model content
(一)要解决的技术问题(1) Technical problems to be solved
鉴于上述技术问题，本公开提供了一种微槽群热沉补液装置，避免了微槽群热沉内过早干涸导致的传热恶化，结构简单，稳定可靠、加工安装方便，成本较低，有着很好的应用价值。In view of the above technical problems, the present disclosure provides a micro-groove group heat sink rehydration device, which avoids heat transfer deterioration caused by premature drying of the micro-groove group heat sink, and has a simple structure, stability and reliability, convenient processing and installation, and low cost. It has very good application value.
(二)技术方案(2) Technical solution
本公开提供了一种微槽群热沉补液装置，包括：蒸发微槽群热沉，包括多个微槽道，位于一散热器或蒸发器的腔体结构的侧面或底面上，且各所述微槽道在所述腔体结构的侧面或底面上按一延伸方向延伸；以及多个电极，包括高压电极和接地电极，用于为微槽道内的液体施加沿所述延伸方向的定向驱动力，以增加所述微槽道内液体润湿长度。The present disclosure provides a micro-groove group heat sink liquid replenishing device, comprising: an evaporating micro-groove group heat sink, including a plurality of micro-channels, located on the side or bottom surface of a cavity structure of a radiator or evaporator, and each The micro-channel extends in an extension direction on the side or bottom surface of the cavity structure; and a plurality of electrodes, including a high-voltage electrode and a ground electrode, are used to apply a directional drive along the extension direction to the liquid in the micro-channel force to increase the liquid wetting length in the microchannel.
在一些实施例中，所述腔体结构为圆柱体，所述多个微槽道位于所述腔体结构的侧面上，各微槽道的延伸方向与所述腔体结构的轴向平行；所述高压电极设置在所述腔体结构的顶面，所述接地电极设置在所述腔体结构底面；或所述高压电极设置在所述腔体结构的侧面上、且位于微槽道与所述顶面之间的区域，所述接地电极设置在所述腔体结构的侧面上、且位于微槽道与所述底面之间的区域。In some embodiments, the cavity structure is a cylinder, the plurality of microchannels are located on the side of the cavity structure, and the extension direction of each microchannel is parallel to the axial direction of the cavity structure; The high-voltage electrode is arranged on the top surface of the cavity structure, and the ground electrode is arranged on the bottom surface of the cavity structure; or the high-voltage electrode is arranged on the side of the cavity structure, and is located between the microchannel and the In the area between the top surfaces, the ground electrode is disposed on the side of the cavity structure and located in the area between the microchannel and the bottom surface.
在一些实施例中，所述腔体结构为圆柱体，所述多个微槽道位于所述腔体结构的底面上，各微槽道的延伸方向与所述腔体结构的轴向垂直，所述高压电极设置在所述腔体结构的底面上且位于微槽道一端，所述接地电极设置在所述腔体结构的底面上且位于所述微槽道的另一端。In some embodiments, the cavity structure is a cylinder, the plurality of microchannels are located on the bottom surface of the cavity structure, and the extension direction of each microchannel is perpendicular to the axial direction of the cavity structure, The high-voltage electrode is arranged on the bottom surface of the cavity structure and is located at one end of the microchannel, and the ground electrode is arranged on the bottom surface of the cavity structure and is located at the other end of the microchannel.
在一些实施例中，所述微槽道的截面为三角形、矩形、梯形或U型；所述微槽道的宽度和深度均在0.01-10mm范围内，相邻微槽道之间的间距在0.01-10mm范围内。In some embodiments, the cross-section of the micro-channel is triangular, rectangular, trapezoidal or U-shaped; the width and depth of the micro-channel are in the range of 0.01-10 mm, and the distance between adjacent micro-channels is between In the range of 0.01-10mm.
在一些实施例中，所述高压电极与微槽道靠近高压电极一端的距离在1-100mm的范围内，所述接地电极与微槽道靠近接地电极一端的距离在1-100mm的范围内。In some embodiments, the distance between the high-voltage electrode and the end of the microchannel near the high-voltage electrode is in the range of 1-100 mm, and the distance between the ground electrode and the end of the microchannel near the ground electrode is in the range of 1-100 mm.
在一些实施例中，所述高压电极为平板电极、柱形电极、针状电极或线状电极，作为正极，所述接地电极为平板电极、柱形电极、针状电极或线状电极，作为负极。In some embodiments, the high-voltage electrode is a plate electrode, a cylindrical electrode, a needle electrode or a linear electrode as a positive electrode, and the ground electrode is a plate electrode, a cylindrical electrode, a needle electrode or a linear electrode as a positive electrode. negative electrode.
在一些实施例中，所述平板电极长和宽均在1-100mm范围内，厚度在0.1-10mm范围内；所述柱形电极半径在1-50mm范围内；所述针状电极针尖曲率半径在0.01-5mm范围内；所述线状电极半径在0.01-1mm范围内，长度在1-500mm范围内。In some embodiments, the length and width of the flat electrode are both within the range of 1-100 mm, and the thickness is within the range of 0.1-10 mm; the radius of the cylindrical electrode is within the range of 1-50 mm; the radius of curvature of the tip of the needle electrode is in the range of 0.01-5mm; the radius of the linear electrode is in the range of 0.01-1mm, and the length is in the range of 1-500mm.
在一些实施例中，所述的微槽群热沉补液装置还包括绝缘器件；其中所述高压电极通过该绝缘器件与所述腔体结构绝缘。In some embodiments, the microgroove group heat sink fluid replenishment device further includes an insulating device; wherein the high-voltage electrode is insulated from the cavity structure through the insulating device.
在一些实施例中，所述的微槽群热沉补液装置还包括高压设备，其与所述高压电极连接，用于提供高压。In some embodiments, the microgroove group heat sink fluid replenishment device further includes a high-voltage device connected to the high-voltage electrode for providing high voltage.
在一些实施例中，所述的绝缘器件的材质为陶瓷或有机塑料；所述的高压设备为高压电源或变压器。In some embodiments, the insulation device is made of ceramics or organic plastics; the high-voltage equipment is a high-voltage power supply or a transformer.
(三)有益效果(3) Beneficial effects
从上述技术方案可以看出，本公开微槽群热沉补液装置至少具有以下有益效果其中之一：From the above technical solutions, it can be seen that the microgroove group heat sink replenishment device of the present disclosure has at least one of the following beneficial effects:
(1)本公开微槽群热沉补液装置，能够防止较高热流密度时微槽群热沉内液体流动受阻而逐渐干涸，提高了高热流密度下的微槽群热沉的蒸发换热能力，有效避免了蒸发干涸引起的换热不稳定和换热情况恶化。(1) The micro-groove group heat sink liquid replenishment device of the present disclosure can prevent the flow of liquid in the micro-groove group heat sink from being blocked and gradually dry up when the heat flux is high, and improve the evaporation heat transfer capacity of the micro-groove group heat sink under high heat flux , effectively avoiding the instability of heat exchange and the deterioration of heat exchange caused by evaporation drying up.
(2)本公开微槽群热沉补液装置，轻便简单、安全可靠，成本较低。(2) The micro-groove group heat sink fluid replenishment device of the present disclosure is light, simple, safe, reliable, and low in cost.
附图说明Description of drawings
通过附图所示，本公开的上述及其它目的、特征和优势将更加清晰。在全部附图中相同的附图标记指示相同的部分，并未刻意按实际尺寸等比例缩放绘制附图，重点在于示出本公开的主旨。The above and other objects, features and advantages of the present disclosure will be more clearly illustrated by the accompanying drawings. The same reference numerals designate the same parts throughout the drawings, and the drawings are not intentionally scaled to actual size, and the emphasis is on illustrating the gist of the present disclosure.
图1为依据本公开一实施例补液装置结构示意图。FIG. 1 is a schematic structural diagram of a fluid replacement device according to an embodiment of the present disclosure.
图2为依据本公开另一实施例补液装置结构示意图。Fig. 2 is a schematic structural diagram of a fluid replacement device according to another embodiment of the present disclosure.
图3为依据本公开另一实施例补液装置结构示意图。Fig. 3 is a schematic structural diagram of a fluid replacement device according to another embodiment of the present disclosure.
<符号说明><Description of symbols>
1-散热器的腔体结构，2-接地电极，3-微槽群热沉，4-微槽道，5-高压电极，6-保温软管，7-冷凝器，8-冷凝回水管，9-微止回阀，10-蒸发器的腔体结构。1-cavity structure of radiator, 2-ground electrode, 3-micro-groove group heat sink, 4-micro-groove, 5-high voltage electrode, 6-insulation hose, 7-condenser, 8-condensation return pipe, 9-micro check valve, 10-cavity structure of evaporator.
具体实施方式Detailed ways
为使本公开的目的、技术方案和优点更加清楚明白，以下结合具体实施例，并参照附图，对本公开进一步详细说明。In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.
需要说明的是，在附图或说明书描述中，相似或相同的部分都使用相同的图号。附图中未绘示或描述的实现方式，为所属技术领域中普通技术人员所知的形式。另外，虽然本文可提供包含特定值的参数的示范，但应了解，参数无需确切等于相应的值，而是可在可接受的误差容限或设计约束内近似于相应的值。实施例中提到的方向用语，例如“上”、“下”、“前”、“后”、“左”、“右”等，仅是参考附图的方向。因此，使用的方向用语是用来说明并非用来限制本公开的保护范围。It should be noted that, in the drawings or descriptions of the specification, similar or identical parts all use the same figure numbers. Implementations not shown or described in the accompanying drawings are forms known to those of ordinary skill in the art. Additionally, while illustrations of parameters including particular values may be provided herein, it should be understood that the parameters need not be exactly equal to the corresponding values, but rather may approximate the corresponding values within acceptable error margins or design constraints. The directional terms mentioned in the embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the drawings. Therefore, the directional terms used are for illustration and not for limiting the protection scope of the present disclosure.
本公开提供一种微槽群热沉补液装置，避免了微槽群热沉内过早干涸导致的传热恶化的情形，结构简单，稳定可靠、加工安装方便，成本较低，有着很好的应用价值。The disclosure provides a micro-groove group heat sink liquid replenishing device, which avoids the deterioration of heat transfer caused by premature drying of the micro-groove group heat sink, has a simple structure, is stable and reliable, is convenient to process and install, and has a low cost. Value.
具体的，本公开微槽群热沉补液装置，包括：蒸发微槽群热沉，包括多个微槽道，位于一散热器或蒸发器的腔体结构的侧面或底面上，且各所述微槽道在所述腔体结构的侧面或底面上按一延伸方向延伸；以及多个电极，包括高压电极和接地电极，用于为微槽道内的液体施加沿所述延伸方向的定向驱动力，以增加所述微槽道内液体润湿长度。Specifically, the microgroove group heat sink liquid replenishment device of the present disclosure includes: an evaporation microgroove group heat sink, including a plurality of microchannels, located on the side or bottom surface of a radiator or evaporator cavity structure, and each of the The micro channel extends in an extension direction on the side or bottom surface of the cavity structure; and a plurality of electrodes, including a high voltage electrode and a ground electrode, are used to apply a directional driving force along the extension direction to the liquid in the micro channel , to increase the liquid wetting length in the microchannel.
采用本公开的补液装置，其电场强化微槽群热沉内补液的机理具体为：在发热元器件的发热功率较大时，施加在微槽群热沉受热面上的热流密度较大，微槽道内液体受热蒸发加剧，液膜逐渐变薄，流动阻力增加，润湿长度降低，散热能力下降。在施加与微槽群热沉延伸方向平行的定向电场后，电场为微槽道内液体施加了定向驱动力，使得相同热流密度下微槽热沉内液体工质润湿长度增加，液体工资源源不断的及时补充，蒸发换热强度提高。With the liquid replenishment device of the present disclosure, the mechanism of the electric field strengthening the liquid replenishment in the heat sink of the micro-groove group is specifically: when the heating power of the heating element is large, the heat flux applied to the heat-receiving surface of the heat sink of the micro-groove group is relatively large, and the micro-groove group The heating and evaporation of the liquid in the channel intensifies, the liquid film gradually becomes thinner, the flow resistance increases, the wetted length decreases, and the heat dissipation capacity decreases. After applying a directional electric field parallel to the extension direction of the heat sink of the micro-groove group, the electric field exerts a directional driving force on the liquid in the micro-groove, so that the wetting length of the liquid working medium in the heat sink of the micro-groove increases under the same heat flux, and the liquid industrial resources continue to flow Timely replenishment, the evaporation heat transfer intensity is improved.
更具体而言，所述腔体结构可为圆柱体，所述多个微槽道可位于所述腔体结构的侧面上，各微槽道的延伸方向与所述腔体结构的轴向平行；所述高压电极设置在所述腔体结构的顶面，所述接地电极设置在所述腔体结构底面；或所述高压电极设置在所述腔体结构的侧面上、且位于微槽道与所述顶面之间的区域，所述接地电极设置在所述腔体结构的侧面上、且位于微槽道与所述底面之间的区域。另外，所述多个微槽道也可位于所述腔体结构的底面上，各微槽道的延伸方向与所述腔体结构的轴向垂直，所述高压电极设置在所述腔体结构的底面上且位于微槽道一端，所述接地电极设置在所述腔体结构的底面上且位于所述微槽道的另一端。本公开通过在微槽群热沉附近施加定向高压电场，利用电场力作用使微槽群热沉内液体工质在较高热流密度下仍能源源不断的补充，从而增强微槽群热沉应对更高热流密度时的蒸发散热能力。More specifically, the cavity structure can be a cylinder, the plurality of microchannels can be located on the side of the cavity structure, and the extension direction of each microchannel is parallel to the axial direction of the cavity structure The high-voltage electrode is arranged on the top surface of the cavity structure, and the ground electrode is arranged on the bottom surface of the cavity structure; or the high-voltage electrode is arranged on the side of the cavity structure and is located in the micro channel and the area between the top surface, the ground electrode is disposed on the side of the cavity structure and is located in the area between the microchannel and the bottom surface. In addition, the plurality of micro-channels can also be located on the bottom surface of the cavity structure, the extension direction of each micro-channel is perpendicular to the axial direction of the cavity structure, and the high-voltage electrode is arranged on the cavity structure The bottom surface of the cavity structure is located at one end of the micro channel, and the ground electrode is arranged on the bottom surface of the cavity structure and located at the other end of the micro channel. The disclosure applies a directional high-voltage electric field near the heat sink of the micro-groove group, and utilizes the electric field force to make the liquid working fluid in the heat sink of the micro-groove group continuously replenished at a relatively high heat flux density, thereby enhancing the heat sink of the micro-groove group. Evaporative cooling capacity at higher heat flux.
需要说明的是，所述腔体结构也可以为长方体或立方体，此时微槽道及电极的设置方式可与腔体结构为圆柱体时类似，也可以适当调整，此处不再赘述。It should be noted that the cavity structure can also be a cuboid or a cube. At this time, the arrangement of the microchannels and electrodes can be similar to when the cavity structure is a cylinder, and can also be adjusted appropriately, which will not be repeated here.
当液体处于沸腾情形时，虽然换热系数相对较高，但却具有不稳定性，例如液体沸腾很多情形下会导致突然干涸，对换热产生很大热阻而使换热条件极度恶劣。本公开提出了一种在纯蒸发情形下能承受更高热流密度的散热方式，使换热过程处于所能控制的范围之内。在热流密度加大后，液膜逐渐变薄，热阻增大，润湿长度降低。但加上电场后，为流体施加了定向驱动力，增大了质量流量，减小热阻，从而使得微槽群热沉内润湿长度增加，起到提高纯蒸发换热强度的作用。When the liquid is boiling, although the heat transfer coefficient is relatively high, it is unstable. For example, in many cases, the boiling of the liquid will cause sudden dryness, which will cause a large thermal resistance to heat transfer and make the heat transfer conditions extremely bad. The present disclosure proposes a heat dissipation method that can withstand a higher heat flux density under pure evaporation, so that the heat exchange process is within a controllable range. After the heat flux increases, the liquid film gradually becomes thinner, the thermal resistance increases, and the wetted length decreases. However, after the electric field is added, a directional driving force is applied to the fluid, the mass flow rate is increased, and the thermal resistance is reduced, so that the wetting length in the heat sink of the microgroove group increases, which plays a role in improving the pure evaporation heat transfer intensity.
具体的，发热元器件的外表面与微槽群热沉的一个外表面紧密贴合或者直接作为该表面的一部分，在该微槽群热沉受热面的内壁面上设有微槽道，并在微槽群热沉受热面的两端布置一个或两个电极。其中，两个电极分别与其靠近的微槽群的一端部的距离在1-100mm的范围内。Specifically, the outer surface of the heating element is closely attached to an outer surface of the heat sink of the micro-groove group or directly as a part of the surface, and a micro-groove is provided on the inner wall surface of the heat-receiving surface of the heat sink of the micro-groove group, and One or two electrodes are arranged at both ends of the heating surface of the microgroove group heat sink. Wherein, the distance between the two electrodes and one end of the adjacent microgroove group is in the range of 1-100 mm.
所述的微槽群热沉受热面上的微槽道截面为三角形、矩形、梯形或者U形，槽道纵向平行分布排列，槽道的宽度和深度以及微槽间距均在0.01-10mm范围内。The cross-section of the micro-channels on the heating surface of the micro-groove group heat sink is triangular, rectangular, trapezoidal or U-shaped, and the channels are distributed and arranged in parallel longitudinally. The width and depth of the channels and the distance between the micro-grooves are all in the range of 0.01-10mm .
所述微槽受热面的材料是金属及其合金等导热性较好的材质。The material of the heating surface of the microgroove is a material with good thermal conductivity such as metal and its alloy.
所述的电极由高压正极或者高压负极和接地电极组成。电极为平板电极或柱形电极或针状电极或线状电极。其中，平板电极长宽在1-100mm范围内，厚度在0.5-10mm范围内；针状电极针尖曲率半径在0.01-5mm范围内；柱形电极半径在1-50mm范围内；线状电极半径在0.01-1mm范围内，长度在1-500mm范围内。The electrodes are composed of a high-voltage positive pole or a high-voltage negative pole and a ground electrode. The electrode is a plate electrode or a cylindrical electrode or a needle electrode or a wire electrode. Among them, the length and width of the flat electrode are in the range of 1-100mm, and the thickness is in the range of 0.5-10mm; the radius of curvature of the tip of the needle electrode is in the range of 0.01-5mm; the radius of the cylindrical electrode is in the range of 1-50mm; In the range of 0.01-1mm, the length is in the range of 1-500mm.
所述的高压电极通过焊接或者机械连接或者粘接固定在散热器上，并通过绝缘器件与散热器外表面绝缘，从散热器引出后连接高压设备。The high-voltage electrode is fixed on the radiator by welding or mechanical connection or bonding, and is insulated from the outer surface of the radiator by an insulating device, and connected to high-voltage equipment after being led out from the radiator.
所述的接地电极与散热器腔体相连，通过接地线接地。The ground electrode is connected to the cavity of the radiator and grounded through the ground wire.
所述的绝缘器件材料为陶瓷或者有机塑料等绝缘性较好的材料。The insulating device material is a material with better insulating properties such as ceramics or organic plastics.
所述的高压设备是高压电源或者变压器等可以提供高压的设备。The high-voltage equipment is equipment that can provide high voltage, such as a high-voltage power supply or a transformer.
下面结合附图和实施例对本公开进一步详细说明：Below in conjunction with accompanying drawing and embodiment the present disclosure is described in further detail:
实施例1Example 1
如图1所示，散热器的腔体结构1近似为圆柱体，其侧面上设置有蒸发微槽群热沉3(蒸发微槽群热沉3所在的侧面区域为平面)；具体的，补液装置侧面作为微槽群热沉受热面和发热元器件紧密连接，在受热内表面上开有矩形微槽道，形成蒸发微槽群热沉3，槽道尺寸为：槽宽0.3mm，槽深0.7mm，槽间距0.4mm。在微槽群热沉受热面3的上下各距离微槽道两端5mm处布置平板高压电极5和接地电极2，其中高压电极5连接高压电源，接地电极与高压电源负极共地，两电极之间产生沿微槽道轴向的高压电场。当发热元器件发热时，液体工质在电场力和毛细力的驱动下在微槽道4内爬升，形成一定润湿高度，随着加热功率的增加，蒸发愈加强烈，液体工质在电场力的作用下源源不断的补充因受热蒸发导致的蒸发段的干涸，并在高强度蒸发下变成蒸汽。蒸汽在非受热面的内壁面上冷凝，冷凝液流回液体工质中。蒸汽冷凝的热量通过自然对流或者风冷散失到外界中。As shown in Figure 1, the cavity structure 1 of the radiator is approximately a cylinder, and its side is provided with an evaporation microgroove group heat sink 3 (the side area where the evaporation microgroove group heat sink 3 is located is a plane); The side of the device is used as the heating surface of the micro-groove group and is closely connected with the heating components. There are rectangular micro-grooves on the inner surface of the heating surface to form the heat sink 3 of the evaporation micro-groove group. The channel size is: groove width 0.3mm, groove depth 0.7mm, groove spacing 0.4mm. A flat high-voltage electrode 5 and a grounding electrode 2 are arranged on the upper and lower sides of the heat sink surface 3 of the micro-groove group at a distance of 5 mm from both ends of the micro-groove, wherein the high-voltage electrode 5 is connected to a high-voltage power supply, and the ground electrode and the negative pole of the high-voltage power supply share the same ground. A high-voltage electric field is generated along the axis of the microchannel. When the heating element generates heat, the liquid working medium climbs up in the micro channel 4 driven by the electric field force and capillary force, forming a certain wetting height. Under the action of continuous replenishment of the drying up of the evaporation section caused by heated evaporation, it becomes steam under high-intensity evaporation. The steam condenses on the inner wall of the non-heated surface, and the condensate flows back into the liquid working fluid. The heat of steam condensation is lost to the outside world through natural convection or air cooling.
实施例2Example 2
如图2所示，散热器的腔体结构1为圆柱体，其底面上设置有蒸发微槽群热沉3；具体的，发热元器件与底面受热面外表面紧密贴合，受热面内表面布置矩形微槽道4，形成蒸发微槽群热沉3蒸发面，槽道尺寸为：槽宽0.3mm，槽深0.6mm，槽间距0.4mm。微槽群热沉受热面的同一面上沿着微槽道轴向开口两侧各距离微槽道两端5mm处分别布置高压电极和接地电极，使得微槽群热沉受热面完全处在两电极之间的电场范围内。注入少量液体，当发热元器件发热时，液体工质在槽道内受电场力的驱动流动，强化蒸发和沸腾，蒸汽在侧面内壁面上冷凝，冷凝液流回工质中。蒸汽冷凝的热量通过自然对流或者风冷散失到外界中。As shown in Figure 2, the cavity structure 1 of the radiator is a cylinder, and an evaporation microgroove group heat sink 3 is arranged on the bottom surface; specifically, the heating element is closely attached to the outer surface of the heating surface of the bottom surface, and the inner surface of the heating surface Rectangular micro-channels 4 are arranged to form the evaporation surface of heat sink 3 of evaporation micro-grooves group. The channel dimensions are: slot width 0.3 mm, slot depth 0.6 mm, and slot spacing 0.4 mm. On the same surface of the heating surface of the micro-groove group heat sink, a high-voltage electrode and a grounding electrode are respectively arranged along both sides of the axial opening of the micro-channel at a distance of 5 mm from both ends of the micro-channel, so that the heating surface of the micro-groove group heat sink is completely in the two sides. within the electric field between the electrodes. A small amount of liquid is injected. When the heating element generates heat, the liquid working medium flows in the channel driven by the electric field force, and the evaporation and boiling are strengthened. The steam condenses on the side inner wall, and the condensate flows back into the working medium. The heat of steam condensation is lost to the outside world through natural convection or air cooling.
实施例3Example 3
如图3所示，用不锈钢制成一长方体空腔构成蒸发器的腔体结构10，在腔体内部一个侧面受热面上开有矩形微槽道，形成蒸发微槽群热沉3，槽道尺寸为：槽宽0.3mm，槽深0.7mm，槽间距0.4mm。在微槽群热沉3受热面的上下各距离微槽群热沉两端5mm处布置平板高压电极5和接地电极2，其中高压电极5通过布置在蒸发器上的真空电极连接高压电源，并通过陶瓷绝热元件与蒸发器金属腔体隔绝；接地电极2焊接在蒸发器腔体上，并与高压电极负极共地，两电极之间产生与微槽道平行的高压电场。腔体内抽真空，液体工质为R123。当发热元器件发热时，液体工质在电场力和毛细力的驱动下在微槽道内爬升，形成一定润湿高度，并在高强度蒸发和沸腾下变成蒸汽。1根内径为10mm的聚氨酯保温软管6的一端与蒸发器蒸汽出口相接，另一端与冷凝器蒸汽进口相接。蒸汽顺着保温软管6经由冷凝器蒸汽进口进入到冷凝器7中进行冷凝。冷凝液流出冷凝器7后进入冷凝回水管8，并经由微止回阀9回到蒸发器的腔体结构10的进液口，如此循环往复。As shown in Figure 3, a cuboid cavity is made of stainless steel to form the cavity structure 10 of the evaporator, and a rectangular micro-channel is opened on a side heating surface inside the cavity to form an evaporation micro-groove group heat sink 3, the channel The dimensions are: groove width 0.3mm, groove depth 0.7mm, groove spacing 0.4mm. Arrange flat plate high-voltage electrodes 5 and ground electrodes 2 at the upper and lower sides of the micro-groove group heat sink 3 heating surfaces, 5 mm from the two ends of the micro-groove group heat sink, wherein the high-voltage electrodes 5 are connected to the high-voltage power supply through the vacuum electrodes arranged on the evaporator, and It is isolated from the metal cavity of the evaporator by a ceramic thermal insulation element; the ground electrode 2 is welded on the cavity of the evaporator, and shares the ground with the negative electrode of the high-voltage electrode, and a high-voltage electric field parallel to the micro-channel is generated between the two electrodes. The cavity is vacuumed, and the liquid working medium is R123. When the heating element generates heat, the liquid working medium climbs up in the microchannel driven by the electric field force and capillary force, forming a certain wetting height, and turns into steam under high-intensity evaporation and boiling. One end of a polyurethane insulation hose 6 with an inner diameter of 10 mm is connected to the steam outlet of the evaporator, and the other end is connected to the steam inlet of the condenser. The steam enters the condenser 7 along the insulation hose 6 through the steam inlet of the condenser to be condensed. After the condensate flows out of the condenser 7, it enters the condensate return pipe 8, and returns to the liquid inlet of the cavity structure 10 of the evaporator through the micro check valve 9, and so on.
综上，本公开微槽群热沉补液装置，高效、安全可靠、功耗小、占地小，解决了现有散热器存在的蒸发换热能力不足、沸腾突然干涸、换热过程不稳定等问题。To sum up, the micro-groove group heat sink replenishment device of the present disclosure is efficient, safe and reliable, has low power consumption, and occupies a small area. question.
至此，已经结合附图对本公开实施例进行了详细描述。依据以上描述，本领域技术人员应当对本公开微槽群热沉补液装置有了清楚的认识。So far, the embodiments of the present disclosure have been described in detail with reference to the accompanying drawings. Based on the above description, those skilled in the art should have a clear understanding of the microgroove group heat sink fluid replacement device of the present disclosure.
需要说明的是，在附图或说明书正文中，未绘示或描述的实现方式，均为所属技术领域中普通技术人员所知的形式，并未进行详细说明。此外，上述对各元件和方法的定义并不仅限于实施例中提到的各种具体结构、形状或方式，本领域普通技术人员可对其进行简单地更改或替换。It should be noted that, in the accompanying drawings or in the text of the specification, implementations that are not shown or described are forms known to those of ordinary skill in the art, and are not described in detail. In addition, the above definitions of each element and method are not limited to the various specific structures, shapes or methods mentioned in the embodiments, and those skilled in the art can easily modify or replace them.
类似地，应当理解，为了精简本公开并帮助理解各个公开方面中的一个或多个，在上面对本公开的示例性实施例的描述中，本公开的各个特征有时被一起分组到单个实施例、图、或者对其的描述中。然而，并不应将该公开的方法解释成反映如下意图：即所要求保护的本公开要求比在每个权利要求中所明确记载的特征更多的特征。更确切地说，如下面的权利要求书所反映的那样，公开方面在于少于前面公开的单个实施例的所有特征。因此，遵循具体实施方式的权利要求书由此明确地并入该具体实施方式，其中每个权利要求本身都作为本公开的单独实施例。Similarly, it should be appreciated that in the above description of exemplary embodiments of the disclosure, in order to streamline the disclosure and to facilitate an understanding of one or more of the various disclosed aspects, various features of the disclosure are sometimes grouped together into a single embodiment, figure, or its description. This method of disclosure, however, is not to be interpreted as reflecting an intention that the claimed disclosure requires more features than are expressly recited in each claim. Rather, as the following claims reflect, disclosed aspects lie in less than all features of a single foregoing disclosed embodiment. Thus the claims following the Detailed Description are hereby expressly incorporated into this Detailed Description, with each claim standing on its own as a separate embodiment of this disclosure.
以上所述的具体实施例，对本公开的目的、技术方案和有益效果进行了进一步详细说明，所应理解的是，以上所述仅为本公开的具体实施例而已，并不用于限制本公开，凡在本公开的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本公开的保护范围之内。The specific embodiments described above further describe the purpose, technical solutions and beneficial effects of the present disclosure in detail. It should be understood that the above descriptions are only specific embodiments of the present disclosure, and are not intended to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present disclosure shall be included within the protection scope of the present disclosure.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820249184.9UCN207884061U (en) | 2018-02-11 | 2018-02-11 | Microflute group is heat sink liquid supply device |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820249184.9UCN207884061U (en) | 2018-02-11 | 2018-02-11 | Microflute group is heat sink liquid supply device |
| Publication Number | Publication Date |
|---|---|
| CN207884061Utrue CN207884061U (en) | 2018-09-18 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820249184.9UActiveCN207884061U (en) | 2018-02-11 | 2018-02-11 | Microflute group is heat sink liquid supply device |
| Country | Link |
|---|---|
| CN (1) | CN207884061U (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108134309A (en)* | 2018-02-11 | 2018-06-08 | 中国科学院工程热物理研究所 | Microflute group is heat sink liquid supply device |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108134309A (en)* | 2018-02-11 | 2018-06-08 | 中国科学院工程热物理研究所 | Microflute group is heat sink liquid supply device |
| CN108134309B (en)* | 2018-02-11 | 2024-04-26 | 中国科学院工程热物理研究所 | Micro-groove group heat sink fluid supplementing device |
| Publication | Publication Date | Title |
|---|---|---|
| CN103759563B (en) | A microchannel cooling device that utilizes the phase change cycle motion of working fluid to transfer heat | |
| CN102691999B (en) | Plate-type pulsating heat pipe used in large power LED heat radiation | |
| CN109979900B (en) | Micro-channel-nano porous composite structure evaporator of GaN HEMT device substrate level | |
| CN101500394A (en) | Straight-fin heat expansion reinforced structure minuteness scale composite phase-change heat fetching apparatus | |
| CN209822624U (en) | Microchannel-nano porous composite structure evaporator | |
| CN103307579B (en) | Improve method and the integral heat radiator of LED illumination light source radiating efficiency | |
| CN209045535U (en) | Micropin rib cluster array microchannel micro heat exchanger | |
| CN105004204A (en) | Flat-plate type loop heat pipe evaporator experiment system | |
| CN103442541A (en) | Micro cooling device of silicon-substrate capillary pump loop | |
| CN110455106A (en) | A heat dissipation device with a three-dimensional pulsating heat pipe | |
| CN104406440A (en) | Silicon-based miniature loop heat pipe cooler | |
| CN106885485A (en) | Hot end variable cross-section multi-pulsation cold end heat pipe radiator | |
| CN105161473A (en) | Micro silicon-based capillary pump loop cooler | |
| CN112113450A (en) | Oscillation composite capillary core soaking plate structure for aerospace electronic heat dissipation | |
| CN101252822A (en) | A kind of EHD strengthened miniature cooling device | |
| CN110146956A (en) | An internal heat transport microstructure of an optical module | |
| CN109729701A (en) | A special pulsating heat pipe radiator for high power density servo drives | |
| CN106643243A (en) | Silicon-based micro pulse heat pipe with micro/nano composite structures | |
| CN207884061U (en) | Microflute group is heat sink liquid supply device | |
| CN204286182U (en) | A kind of silicon-base miniature loop circuit heat pipe cooler | |
| CN115297695A (en) | A micro-channel radiator with integrated pump and radiator | |
| CN108134309A (en) | Microflute group is heat sink liquid supply device | |
| CN103824825B (en) | Micro-channel phase change heat exchange device | |
| CN203690286U (en) | Silicon-based micro-channel heat exchanger with electrohydrodynamic micropump | |
| CN112696961A (en) | Three-stage phase change heat exchanger |
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |